CN102645957A - Back plate system - Google Patents
Back plate system Download PDFInfo
- Publication number
- CN102645957A CN102645957A CN201210061907XA CN201210061907A CN102645957A CN 102645957 A CN102645957 A CN 102645957A CN 201210061907X A CN201210061907X A CN 201210061907XA CN 201210061907 A CN201210061907 A CN 201210061907A CN 102645957 A CN102645957 A CN 102645957A
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- China
- Prior art keywords
- power supply
- backplane
- signal
- integrated circuit
- board
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/189—Power distribution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention relates to a back plate system. The back plate system comprises one or more service plate cards, a power supply module, a signal back plate and a power supply back plate, wherein the service plate cards are arranged on one side of the signal back plate and used for processing services; the signal back plate is used for signal interconnection between the service plate cards or signal interconnection between the service plate cards and other modules; the power supply module is arranged on the other side of the signal back plate and used for connecting with the service plate cards through the power supply back plate and supplying power to the service plate cards through the power supply back plate; a ventilation area is formed between the power supply back plate and the signal back plate or ventilation holes are formed in the signal back plate; the ventilation area and the ventilation holes are used for forming an air channel from one side to the other side of the signal back plate so as to cool the system; the plane on which the power supply back plate is arranged is parallel to the ventilation direction of the air channel; and the signal back plate is vertical to the plane on which the power supply back plate is arranged, and is vertical to the ventilation direction of the air channel.
Description
Technical field
The present invention relates to the communications field, relate in particular to a kind of back board system.
Background technology
In the IT server field, along with continuous lifting of semiconductor integrated level and business demand continue to increase, the power consumption of individual system is increasingly high.With the blade server is example, and the high single device power consumption of 10U has reached 7200W, and to 10000W evolution, system's power supply and heat-sinking capability become one of critical bottleneck of system design gradually.How the contradiction that continues to increase of resolution system performance boost thing followed power ascension and system radiating and power supply design difficulty has become the technical barrier that each equipment vendors need constantly capture.
Figure 1A is a kind of perspective view of existing backboard communication system, and Figure 1B is a kind of cut-open view of existing backboard communication system.Shown in Figure 1A and 1B, this system adopts the modular construction design, comprises power module 101, business module 102 and rear panel module 103.Internal system is general to adopt mid-mode to realize rear panel module 103, and this rear panel module 103 also need be realized the through-flow function of power supply except accomplishing the signal communication of 102 of each business modules.Usually internal system adopts the 12V power bus, therefore will realize the internal system power supply of 7200W, and rear panel module 103 need be realized the galvanization ability that 800A is above, if the equipment of 10000W then need be realized the galvanization ability that 800A is above.
This existing communication system directly realizes that through a backboard signal connects and the through-flow function of power supply.Shown in Figure 1A, this communication system realizes depth direction, horizontal and vertical power supply galvanization function by backboard.For another example shown in Figure 1B.Under this single backboard scheme; One-board power supply connector 104, single board signals connector 105 need be put in the front of backboard; System power supply connector 106 need be put in the backboard back side, and the necessary staggered positions of the connector of backboard pros and cons, but finally causes the backboard opening area limited.The backboard opening area is very little, and system wind resistance is just very big, directly causes the system radiating ability not high, is difficult to support high-power business module heat radiation.And when there was a plurality of power module in system, the electric current between power module converged the number of plies that can take backboard and the clearance spaces of backboard, thereby further reduced the backboard opening area and increase the backboard cost.Frame electric equipments such as for example existing blade server, switch, router are in order to realize highly dense professional ability, and system power constantly promotes, thereby causes system's power supply and heat radiation to realize the problem of difficulty.
Summary of the invention
The embodiment of the invention provides a kind of back board system, to solve the power supply and the heat dissipation problem of high-power server and communication system.
The embodiment of the invention provides a kind of back board system.This system comprises: one or more professional integrated circuit boards, power module, signal backplane and power supply backplane;
Said professional integrated circuit board is arranged on a side of said signal backplane, is used for professional processing;
Said signal backplane is used for signal interconnection or said professional integrated circuit board and the signal interconnection between other modules between said professional integrated circuit board;
Said power module is arranged on the opposite side of said signal backplane, is used for being connected with said professional integrated circuit board through said power supply backplane, and being used for through said power supply backplane is said professional integrated circuit board power supply;
Wherein, form aerated area between said power supply backplane and the said signal backplane and perhaps have air vent on the said signal backplane; Said aerated area and said air vent are used to form by the air channel of said signal backplane one side to opposite side, so that said system is dispelled the heat;
The plane at said power supply backplane place is parallel with the direction of ventilation in said air channel; Said signal backplane is vertical with the plane at said power supply backplane place, and vertical with the direction of ventilation in said air channel.
The back board system of the embodiment of the invention; Adopting power supply backplane and signal backplane to carry out electric current respectively transmits and data interconnect; The electric current of directly having accomplished a plurality of power modules by power supply backplane closes the road and to the through-flow function of professional integrated circuit board, makes signal backplane no longer participate in function of supplying power, thereby promoted the heat-sinking capability of system and the power supply capacity of system; And reduced and be used for alive printed circuit board (PCB) (PCB) number of plies and PCB space on the signal backplane; But further promoted the area and the cost that has reduced signal backplane of signal backplane perforate, and power supply and not mutual interference mutually of signal, make system more stable.
Description of drawings
Figure 1A is a kind of perspective view of existing backboard communication system;
Figure 1B is a kind of cut-open view of existing backboard communication system;
Fig. 2 A is the perspective view of back board system of the present invention;
Fig. 2 B is the cut-open view of back board system of the present invention.
Embodiment
Through accompanying drawing and embodiment, technical scheme of the present invention is done further detailed description below.
The present invention adopts the combination back plate design scheme with solid, has increased the perforated area of mid-backboard, has promoted the heat-sinking capability of system.
Fig. 2 A is the perspective view of the back board system of the embodiment of the invention, and Fig. 2 B is the cut-open view of back board system of the present invention.Shown in Fig. 2 A and 2B, this back board system comprises: power module 201, professional integrated circuit board 202, power supply backplane 203 and signal backplane 204.
Professional integrated circuit board 202 is arranged on a side of said signal backplane 204, is used for integrated service, accomplishes professional processing, can be provided with one or more.Signal backplane 204 is used for the signal interconnection of 202 of professional integrated circuit boards or the signal interconnection between professional integrated circuit board 202 and other modules.Power module 201 is arranged on arbitrary position or its combination of signal backplane 204 opposite side power supply areas, is used for being connected with professional integrated circuit board 202 through power supply backplane 203, is used for being professional integrated circuit board 202 power supplies through power supply backplane 203.Form aerated area between power supply backplane 203 and the signal backplane 204, when perhaps on signal backplane 204, having air vent, form by a side of signal backplane 204 air channel, so that system is dispelled the heat to opposite side.Power supply backplane 203 is used to insert power module 201 and transmits electric current, and it is parallel to the system radiating air channel and is provided with, and satisfies certain included angle with being provided with of signal backplane 204.Particularly; Power supply backplane 203 place plane approximations are perpendicular to plane, signal backplane 204 place; Be that power supply backplane 203 can level of approximation be arranged at arbitrary position or its combination between power module 201 and the professional integrated circuit board 202; Also can be similar to and be parallel to professional integrated circuit board plane, 202 place and be provided with, make power supply backplane 203 take the space of minimum air channel like this, just help improving the ventilation and the heat-sinking capability of system.This shows that the position relation between power supply backplane 203, signal backplane 204 and the air channel direction of ventilation three is: the plane at power supply backplane 203 places is parallel with the direction of ventilation in air channel; Signal backplane 204 is vertical with the plane at power supply backplane 203 places, and vertical with the direction of ventilation in air channel." parallel " in the relation of above-mentioned position all is not absolute with " vertical ", allows less deviation.That is to say, when power supply backplane 203 is set with signal backplane 204,, can reaches better radiating effect and get final product as long as accomplish to make it to take less draught area as far as possible.Preferably, in embodiments of the present invention, power supply backplane 203 level of approximation are arranged at the above and below of signal backplane 204.
This back board system also comprises system power supply connector 205, one-board power supply connector 206 and single board signals connector 207.System power supply connector 205 is positioned at the air channel with one-board power supply connector 206, can be arranged at the power supply backplane 203 corresponding power zone of one side arbitrarily, and be connected with the rear and front end of power supply backplane 203 respectively, to realize the access and the transmission of power module 201.System power supply connector 205 also is connected with power module 201, and promptly power module 201 is connected with power supply backplane 203 through system power supply connector 205, to accomplish power supply by access and the transmission of power module 201 to power supply backplane 203.One-board power supply connector 206 also is connected with professional integrated circuit board 202, and promptly professional integrated circuit board 202 is connected with power supply backplane 203 through one-board power supply connector 206, to accomplish power supply by access and the transmission of power supply backplane 203 to professional integrated circuit board 202.And system power supply connector 205 is overlapping in the view field on plane, signal backplane 204 place with one-board power supply connector 206; The multiplexing space of power connector of signal backplane 204 pros and cons like this; The outer backboard space of occupying volume more not; But the area of perforate on the signal backplane is increased, promptly increased the area of air vent, and then improved the ventilation and the heat-sinking capability of system.Single board signals connector 207 is connected with professional integrated circuit board 202 with signal backplane 204 respectively; Be that professional integrated circuit board 202 is connected with signal backplane 204 through single board signals connector 207, be used for realizing of the transmission of the business datum of professional integrated circuit board 202 to signal backplane 204.
This back board system can comprise one or more power modules and one or more power supply backplane; A plurality of power modules can be distributed in arbitrary position or its combination of the power supply area of this back board system, are in a plurality of power supply placed adjacent in the plane, corresponding power supply backplane place that is connected with this power module together.A plurality of power supply backplanes can level of approximation be arranged on top, middle part, bottom or its combination of this back board system, and are parallel to each other, and perhaps are similar in the arbitrary plane that is set in parallel in professional integrated circuit board place or its combination.Be in a plurality of power supply backplanes in the same plane together along direction placed adjacent perpendicular to the air channel.For example, the communication system of highly dense complicacy, blade server equipment are because power is bigger, and power supply just need be deployed in a plurality of zones of said system.
This back board system can comprise one or more signal backplanes, and a plurality of signal backplanes can neighbouringly be provided with, the adjacent setting in the left and right sides or adopt the combination of this dual mode to be provided with.
In the present embodiment, shown in Fig. 2 A, this back board system has comprised a plurality of power modules 201, is separately positioned on the top and the bottom of the power supply area that is used to place power module.Accordingly, the backboard power supply area in two positions up and down of this system respectively is provided with the power supply backplane 203 of a level.Between two power supply backplanes, vertically be provided with a signal backplane 204, the sectional view of the back board structure of this back board system is similar to " worker " word at this moment, abbreviates the three-dimensional backboard of " worker " font as.
In addition, the back board system of the back board system of another embodiment of the present invention and a last embodiment different are only to comprise a power supply backplane and a signal backplane.The system of low capacity during this back board system is applicable to perhaps is applicable in the system that the professional groove position of placing professional integrated circuit board need not split.Power module is concentrated and is arranged near a certain zone of power supply backplane, for example is arranged on top, middle part or the bottom of this back board system.Then the power supply of the power supply of power supply backplane access district and professional integrated circuit board inserts top or the bottom that the district is arranged on corresponding power supply backplane.In the present embodiment, power module is concentrated the top that is arranged on this back board system, one-board power supply connector and system power supply connector are separately positioned on the rear and front end on power supply backplane top.This moment, the back board structure sectional view of this back board system was similar to " T " word, abbreviated the three-dimensional backboard of " T " font as.In the present embodiment, if power module is concentrated the bottom that is arranged on this back board system, then the back board structure sectional view of this back board system is similar to inverted " T " word, abbreviates down the three-dimensional backboard of " T " font as.
The back board system of the back board system of another embodiment of the present invention and above two embodiment different are to comprise a power supply backplane and two signal backplanes.Power supply backplane is horizontally placed on the middle part of this communication system, in the upper and lower of power supply backplane a signal backplane is set vertically respectively.Power module is concentrated the middle part that is arranged on this back board system power supply area, and one-board power supply connector and system power supply connector are separately positioned on the rear and front end on power supply backplane top.This moment, the back board structure sectional view of this back board system was similar to "+" word, abbreviated the three-dimensional backboard of "+" font as.
In the back board system of the above embodiment of the present invention, can also comprise bus-bar, shown in Fig. 2 B, bus-bar 208 vertically is arranged between the adjacent power supply backplane for another example.When this back board system has a plurality of power supply backplanes, and need conflux between a plurality of power supply backplane the time, adopt bus-bar 208 to connect between adjacent power supply backplane, be used for realizing that the electric current of a plurality of power modules closes the road.Said bus-bar 208 can adopt conductive components such as copper bar, aluminum strip, copper cable or aluminum steel cable.Though if this back board system include only a power supply backplane or comprise a plurality of power supply backplanes but between do not need then not comprise bus-bar 208 in this back board system when through-flow that each power supply area is independently-powered.
In the back board system of the above embodiment of the present invention, can also comprise blower module 209, be used for ventilation being provided for this back board system through aerated area or through hole.Blower module 209 required power supplys can be provided by the power module 201 that this back board system inside comprises, and also can be provided by the power supply of outer setting.
In the back board system of the above embodiment of the present invention, can also comprise Switching Module 210, it is connected with signal backplane 204 through another single board signals connector 207, is used to realize the connection and the exchange of the business between each professional integrated circuit board 202.
When the back board system of the above-described embodiment of the invention was worked, power module was supplied power to total system, and power supply backplane is sent to professional integrated circuit board through connected system power supply connector, one-board power supply connector with the power supply connecting system and with electric current.Make the electric current in a plurality of power modules close the road through bus-bar between the adjacent power supply backplane, realize through-flow.Signal backplane is sent to signal backplane through connected single board signals connector with the data on the professional integrated circuit board, makes to realize interconnection between the business datum signal between the adjacent professional integrated circuit board, and communicates.In system work process, when system wind resistance increases, utilize fan wind speed to be provided, and ventilate through aerated area between power supply backplane and the signal backplane or the through hole on the signal backplane to system, realized the heat radiation of system.
As stated; The having " worker " font, " T " font, fall the three-dimensional back board system of " T " font or "+" font of the above embodiment of the present invention; Because horizontally disposed power supply backplane is parallel to system's air channel; And the one-board power supply connector and the view field of system power supply connector on signal backplane that are used to connect professional integrated circuit board and power module are overlapping, make the zone that can hollow out on the signal backplane increase, and have increased the area of air vent; Reduce the windage of system, thereby promoted the heat-sinking capability of system and the power supply capacity of system.Simultaneously the horizontally disposed power supply backplane electric current of directly having accomplished a plurality of power modules closes the road and to the through-flow function of professional integrated circuit board; Make signal backplane no longer participate in function of supplying power; Reduced and be used for the alive PCB number of plies and PCB space on the signal backplane; But further promoted the area and the cost that has reduced signal backplane of signal backplane perforate, and power supply and not mutual interference mutually of signal, make system more stable.
Above-described embodiment; The object of the invention, technical scheme and beneficial effect have been carried out further explain, and institute it should be understood that the above is merely embodiment of the present invention; And be not used in qualification protection scope of the present invention; All within spirit of the present invention and principle, any modification of being made, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a back board system is characterized in that, said system comprises: one or more professional integrated circuit boards, power module, signal backplane and power supply backplane;
Said professional integrated circuit board is arranged on a side of said signal backplane, is used for professional processing;
Said signal backplane is used for signal interconnection or said professional integrated circuit board and the signal interconnection between other modules between said professional integrated circuit board;
Said power module is arranged on the opposite side of said signal backplane, is used for being connected with said professional integrated circuit board through said power supply backplane, and being used for through said power supply backplane is said professional integrated circuit board power supply;
Wherein, form aerated area between said power supply backplane and the said signal backplane and perhaps have air vent on the said signal backplane; Said aerated area and said air vent are used to form by the air channel of said signal backplane one side to opposite side, so that said system is dispelled the heat;
The plane at said power supply backplane place is parallel with the direction of ventilation in said air channel; Said signal backplane is vertical with the plane at said power supply backplane place, and vertical with the direction of ventilation in said air channel.
2. system according to claim 1 is characterized in that, said system also comprises: the system power supply connector, be positioned at said air channel, and said power module is connected with said power supply backplane through said system power supply connector.
3. system according to claim 1 is characterized in that, said system also comprises: the one-board power supply connector, be positioned at said air channel, and said business board cartoon is crossed said one-board power supply connector and is connected with said power supply backplane.
4. system according to claim 1 is characterized in that, said system also comprises: single board signals connector, said business board cartoon are crossed said single board signals connector and are connected with said signal backplane.
5. system according to claim 4 is characterized in that, said system also comprises: Switching Module, said Switching Module is connected with said signal backplane through said single board signals connector.
6. system according to claim 1 is characterized in that said system also comprises bus-bar, vertically is arranged between the adjacent said power supply backplane, and said a plurality of power modules close the road through said bus-bar with electric current.
7. system according to claim 6 is characterized in that, said bus-bar is copper bar, aluminum strip, copper cable or aluminum steel cable.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210061907.XA CN102645957B (en) | 2012-03-09 | 2012-03-09 | Back plate system |
| PCT/CN2012/083549 WO2013131374A1 (en) | 2012-03-09 | 2012-10-26 | Backplane system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210061907.XA CN102645957B (en) | 2012-03-09 | 2012-03-09 | Back plate system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102645957A true CN102645957A (en) | 2012-08-22 |
| CN102645957B CN102645957B (en) | 2014-05-07 |
Family
ID=46658811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210061907.XA Active CN102645957B (en) | 2012-03-09 | 2012-03-09 | Back plate system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102645957B (en) |
| WO (1) | WO2013131374A1 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013131374A1 (en) * | 2012-03-09 | 2013-09-12 | 华为技术有限公司 | Backplane system |
| CN104793707A (en) * | 2014-01-20 | 2015-07-22 | 纬创资通股份有限公司 | Computer and power supply rotating plate thereof |
| CN105334929A (en) * | 2015-11-27 | 2016-02-17 | 安徽四创电子股份有限公司 | Multi-modal signal backplane |
| CN106688146A (en) * | 2014-07-11 | 2017-05-17 | 富加宜（亚洲）私人有限公司 | Orthogonal electrical connector system |
| CN107124671A (en) * | 2016-02-24 | 2017-09-01 | 中兴通讯股份有限公司 | The guide frame of veneer in a kind of communication equipment and communication equipment |
| CN108170233A (en) * | 2017-12-13 | 2018-06-15 | 浙江大华技术股份有限公司 | A kind of cabinet |
| CN108235637A (en) * | 2017-12-15 | 2018-06-29 | 深圳市恒扬数据股份有限公司 | A kind of perpendicular quadrature system and communication equipment |
| CN108879150A (en) * | 2017-05-15 | 2018-11-23 | 华为技术有限公司 | A kind of cable backboard and communication apparatus |
| CN111010855A (en) * | 2019-12-31 | 2020-04-14 | 北京信而泰科技股份有限公司 | Heat dissipation system and electronic equipment with same |
| CN112543571A (en) * | 2019-09-20 | 2021-03-23 | 中兴通讯股份有限公司 | Backplate subassembly and subrack |
| CN113075980A (en) * | 2021-03-26 | 2021-07-06 | 山东英信计算机技术有限公司 | Heat dissipation and power supply module and power supply frame |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US9665138B2 (en) | 2014-04-07 | 2017-05-30 | Microsoft Technology Licensing, Llc | Micro-hole vents for device ventilation systems |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013131374A1 (en) * | 2012-03-09 | 2013-09-12 | 华为技术有限公司 | Backplane system |
| CN104793707A (en) * | 2014-01-20 | 2015-07-22 | 纬创资通股份有限公司 | Computer and power supply rotating plate thereof |
| CN106688146A (en) * | 2014-07-11 | 2017-05-17 | 富加宜（亚洲）私人有限公司 | Orthogonal electrical connector system |
| CN105334929A (en) * | 2015-11-27 | 2016-02-17 | 安徽四创电子股份有限公司 | Multi-modal signal backplane |
| CN107124671A (en) * | 2016-02-24 | 2017-09-01 | 中兴通讯股份有限公司 | The guide frame of veneer in a kind of communication equipment and communication equipment |
| CN107124671B (en) * | 2016-02-24 | 2022-01-25 | 中兴通讯股份有限公司 | Communication equipment |
| CN108879150A (en) * | 2017-05-15 | 2018-11-23 | 华为技术有限公司 | A kind of cable backboard and communication apparatus |
| CN108170233B (en) * | 2017-12-13 | 2019-11-19 | 浙江大华技术股份有限公司 | A kind of cabinet |
| CN108170233A (en) * | 2017-12-13 | 2018-06-15 | 浙江大华技术股份有限公司 | A kind of cabinet |
| CN108235637A (en) * | 2017-12-15 | 2018-06-29 | 深圳市恒扬数据股份有限公司 | A kind of perpendicular quadrature system and communication equipment |
| CN112543571A (en) * | 2019-09-20 | 2021-03-23 | 中兴通讯股份有限公司 | Backplate subassembly and subrack |
| WO2021052449A1 (en) * | 2019-09-20 | 2021-03-25 | 中兴通讯股份有限公司 | Backplane assembly and subrack |
| CN111010855A (en) * | 2019-12-31 | 2020-04-14 | 北京信而泰科技股份有限公司 | Heat dissipation system and electronic equipment with same |
| CN111010855B (en) * | 2019-12-31 | 2022-02-25 | 北京信而泰科技股份有限公司 | Heat dissipation system and electronic equipment with same |
| CN113075980A (en) * | 2021-03-26 | 2021-07-06 | 山东英信计算机技术有限公司 | Heat dissipation and power supply module and power supply frame |
| WO2022199329A1 (en) * | 2021-03-26 | 2022-09-29 | 山东英信计算机技术有限公司 | Heat dissipation and power supply module, and power supply frame |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102645957B (en) | 2014-05-07 |
| WO2013131374A1 (en) | 2013-09-12 |
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Effective date of registration: 20211220 Address after: 450046 Floor 9, building 1, Zhengshang Boya Plaza, Longzihu wisdom Island, Zhengdong New Area, Zhengzhou City, Henan Province Patentee after: Super fusion Digital Technology Co.,Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |