CN102645957B - Back plate system - Google Patents
Back plate system Download PDFInfo
- Publication number
- CN102645957B CN102645957B CN201210061907.XA CN201210061907A CN102645957B CN 102645957 B CN102645957 B CN 102645957B CN 201210061907 A CN201210061907 A CN 201210061907A CN 102645957 B CN102645957 B CN 102645957B
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- Prior art keywords
- power supply
- backplane
- signal
- board
- business
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/189—Power distribution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention relates to a back plate system. The back plate system comprises one or more service plate cards, a power supply module, a signal back plate and a power supply back plate, wherein the service plate cards are arranged on one side of the signal back plate and used for processing services; the signal back plate is used for signal interconnection between the service plate cards or signal interconnection between the service plate cards and other modules; the power supply module is arranged on the other side of the signal back plate and used for connecting with the service plate cards through the power supply back plate and supplying power to the service plate cards through the power supply back plate; a ventilation area is formed between the power supply back plate and the signal back plate or ventilation holes are formed in the signal back plate; the ventilation area and the ventilation holes are used for forming an air channel from one side to the other side of the signal back plate so as to cool the system; the plane on which the power supply back plate is arranged is parallel to the ventilation direction of the air channel; and the signal back plate is vertical to the plane on which the power supply back plate is arranged, and is vertical to the ventilation direction of the air channel.
Description
Technical field
The present invention relates to the communications field, relate in particular to a kind of back board system.
Background technology
In IT server field, along with the continuous lifting of semiconductor integrated level and business demand continue to increase, the power consumption of individual system is more and more higher.Take blade server as example, and a high single device power consumption of 10U has reached 7200W, and to 10000W evolution, system power supply and heat-sinking capability become one of critical bottleneck of system gradually.The contradiction how resolution system performance boost thing followed power ascension and system radiating and power supply design difficulty continue to increase, has become the technical barrier that each equipment vendors need to constantly capture.
Figure 1A is a kind of perspective view of existing backboard communication system, and Figure 1B is a kind of cut-open view of existing backboard communication system.As shown in Figure 1A and 1B, this system adopts Modular Structure Design, comprises power module 101, business module 102 and rear panel module 103.Internal system is general adopts mid-mode to realize rear panel module 103, and this rear panel module 103, except completing the signal communication of 102 of each business modules, also needs to realize the through-flow function of power supply.Conventionally internal system adopts 12V power bus, therefore will realize the internal system power supply of 7200W, and rear panel module 103 need to be realized galvanization ability more than 800A, if the equipment of 10000W needs to realize galvanization ability more than 800A.
This existing communication system directly realizes signal by a backboard and connects and the through-flow function of power supply.As shown in Figure 1A, this communication system realizes depth direction, horizontal and vertical power supply galvanization function by backboard.Again as shown in Figure 1B.Under this single backboard scheme, one-board power supply connector 104, single board signals connector 105 need to be put in the front of backboard, system power supply connector 106 need to be put in the backboard back side, and the connector of backboard pros and cons must staggered positions, finally causes backboard can opening area limited.Backboard opening area is very little, and system wind resistance is just very large, directly causes system radiating ability not high, is difficult to support high-power business module heat radiation.And when system has a plurality of power module, the electric current between power module converges and can take the number of plies of backboard and the clearance spaces of backboard, thereby further reduce backboard opening area and increase backboard cost.Frame electric equipments such as existing blade server, switch, router is in order to realize highly dense professional ability, and system power constantly promotes, thereby causes system power supply and heat radiation to realize difficult problem.
Summary of the invention
The embodiment of the present invention provides a kind of back board system, to solve power supply and the heat dissipation problem of high-power server and communication system.
The embodiment of the present invention provides a kind of back board system.This system comprises: one or more business boards, power module, signal backplane and power supply backplane;
Described business board is arranged on a side of described signal backplane, for the processing of business;
Described signal backplane, for the signal interconnection between the signal interconnection between described business board or described business board and other modules;
Described power module, is arranged on the opposite side of described signal backplane, for being connected with described business board by described power supply backplane, for being that described business board is powered by described power supply backplane;
Wherein, between described power supply backplane and described signal backplane, form on aerated area or described signal backplane and there is air vent; Described aerated area and described air vent are used to form the air channel to opposite side by described signal backplane one side, so that described system is dispelled the heat;
The plane at described power supply backplane place is parallel with the direction of ventilation in described air channel; Described signal backplane is vertical with the plane at described power supply backplane place, and vertical with the direction of ventilation in described air channel.
The back board system of the embodiment of the present invention, adopt power supply backplane and signal backplane to carry out respectively electric current transmission and data interconnect, the electric current that has directly completed a plurality of power modules by power supply backplane closes road and to the through-flow function of business board, make signal backplane no longer participate in function of supplying power, thereby the heat-sinking capability of system and the power supply capacity of system have been promoted, and reduced on signal backplane for alive printed circuit board (PCB) (PCB) number of plies and PCB space, further promote the area that signal backplane can perforate and reduced the cost of signal backplane, and power supply and signal can phase mutual interference, make system more stable.
Accompanying drawing explanation
Figure 1A is a kind of perspective view of existing backboard communication system;
Figure 1B is a kind of cut-open view of existing backboard communication system;
Fig. 2 A is the perspective view of back board system of the present invention;
Fig. 2 B is the cut-open view of back board system of the present invention.
Embodiment
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
The present invention adopts three-dimensional combination back plate design scheme, has increased the perforated area of mid-backboard, has promoted the heat-sinking capability of system.
Fig. 2 A is the perspective view of the back board system of the embodiment of the present invention, and Fig. 2 B is the cut-open view of back board system of the present invention.As shown in Figure 2 A and 2B, this back board system comprises: power module 201, business board 202, power supply backplane 203 and signal backplane 204.
This back board system also comprises system power supply connector 205, one-board power supply connector 206 and single board signals connector 207.System power supply connector 205 and one-board power supply connector 206 are positioned at air channel, can be arranged at the power supply backplane 203 corresponding power region of one side arbitrarily, and be connected with the rear and front end of power supply backplane 203 respectively, to realize access and the transmission of power module 201.System power supply connector 205 is also connected with power module 201, and power module 201 is connected with power supply backplane 203 by system power supply connector 205, to complete power supply access and transmission to power supply backplane 203 by power module 201.One-board power supply connector 206 is also connected with business board 202, and business board 202 is connected with power supply backplane 203 by one-board power supply connector 206, to complete power supply access and transmission to business board 202 by power supply backplane 203.And system power supply connector 205 and one-board power supply connector 206 are overlapping in the view field of signal backplane 204 place planes, the multiplexing space of power connector of signal backplane 204 pros and cons like this, the backboard space outside occupying volume more not, make on signal backplane can perforate area increase, increase the area of air vent, and then improved ventilation and the heat-sinking capability of system.Single board signals connector 207 is connected with business board 202 with signal backplane 204 respectively, be that business board 202 is connected with signal backplane 204 by single board signals connector 207, for realizing the business datum of business board 202 to the transmission of signal backplane 204.
This back board system can comprise one or more power modules and one or more power supply backplane, a plurality of power modules can be distributed in arbitrary position of power supply area or its combination of this back board system, be in together the corresponding power supply backplane that is connected with this power module a plurality of power supply placed adjacent planar.A plurality of power supply backplanes can level of approximation be arranged on top, middle part, bottom or its combination of this back board system, and are parallel to each other, or are similar in the arbitrary plane that is set in parallel in business board place or its combination.Be in a plurality of power supply backplanes in same plane together along the direction placed adjacent perpendicular to air channel.For example, the communication system of highly dense complexity, blade server equipment are because power is larger, and power supply just need to be deployed in a plurality of regions of described system.
This back board system can comprise one or more signal backplanes, and a plurality of signal backplanes can neighbouringly arrange, the adjacent setting in left and right or adopt these two kinds of modes to combine setting.
In the present embodiment, as shown in Figure 2 A, this back board system has comprised a plurality of power modules 201, is separately positioned on for placing top and the bottom of the power supply area of power module.Accordingly, the backboard power supply area in two positions up and down of this system, is respectively provided with the power supply backplane 203 of a level.Between two power supply backplanes, be vertically provided with a signal backplane 204, now the sectional view of the back board structure of this back board system is similar to " work " word, referred to as the three-dimensional backboard of " work " font.
In addition, the back board system of the back board system of another embodiment of the present invention and a upper embodiment different are only to comprise a power supply backplane and a signal backplane.This back board system is applicable to the system of Small And Medium Capacity, or is applicable to place in the system that the business groove position of business board do not need to split.Near a certain region of power module concentrated setting power supply backplane, for example, be arranged on top, middle part or the bottom of this back board system.The power supply access area of power supply backplane and the power supply access area of business board are arranged on top or the bottom of corresponding power supply backplane.In the present embodiment, the top by power module concentrated setting at this back board system, one-board power supply connector and system power supply connector are separately positioned on the rear and front end on power supply backplane top.Now the back board structure sectional view of this back board system is similar to " T " word, referred to as the three-dimensional backboard of " T " font.In the present embodiment, if by power module concentrated setting the bottom at this back board system, the back board structure sectional view of this back board system is similar to inverted " T " word, referred to as falling the three-dimensional backboard of " T " font.
The back board system of the back board system of another embodiment of the present invention and above two embodiment different are to comprise a power supply backplane and two signal backplanes.Power supply backplane is horizontally placed on the middle part of this communication system, in the upper and lower of power supply backplane, a signal backplane is vertically set respectively.Middle part by power module concentrated setting at this back board system power supply area, one-board power supply connector and system power supply connector are separately positioned on the rear and front end on power supply backplane top.Now the back board structure sectional view of this back board system is similar to "+" word, referred to as the three-dimensional backboard of "+" font.
In the back board system of the above embodiment of the present invention, can also comprise bus-bar, more as shown in Figure 2 B, bus-bar 208 is vertically arranged between adjacent power supply backplane.When this back board system has a plurality of power supply backplanes, and while needing to conflux between a plurality of power supply backplane, between adjacent power supply backplane, adopt bus-bar 208 to connect, for realizing the electric current of a plurality of power modules, close road.Described bus-bar 208 can adopt the conductive components such as copper bar, aluminum strip, copper cable or aluminum steel cable.Though if this back board system only include a power supply backplane or comprise a plurality of power supply backplanes but between do not need when through-flow, in this back board system, not comprise bus-bar 208, each power supply area is independently-powered.
In the back board system of the above embodiment of the present invention, can also comprise blower module 209, for ventilation being provided to this back board system by aerated area or through hole.The power module 201 that the required power supply of blower module 209 can be comprised by this back board system inside provides, and also can be provided by the power supply of outer setting.
In the back board system of the above embodiment of the present invention, can also comprise Switching Module 210, it is connected with signal backplane 204 by another single board signals connector 207, for realizing connection and the exchange of the business between each business board 202.
When the back board system of the above-described embodiment of the present invention is worked, power module is powered to whole system, and power supply backplane is sent to business board by connected system power supply connector, one-board power supply connector by power supply connecting system and by electric current.Between adjacent power supply backplane, by bus-bar, make the electric current in a plurality of power modules close road, realize through-flow.Signal backplane is sent to signal backplane by connected single board signals connector by the data on business board, makes to realize and interconnecting between the business datum signal between adjacent business board, and communicates.In system work process, when system wind resistance increases, utilize fan to provide wind speed to system, and ventilate by the aerated area between power supply backplane and signal backplane or the through hole on signal backplane, realized the heat radiation of system.
As mentioned above, the thering is " work " font, " T " font, fall the three-dimensional back board system of " T " font or "+" font of the above embodiment of the present invention, because horizontally disposed power supply backplane is parallel to system air channel, and overlapping for connecting one-board power supply connector and the view field of system power supply connector on signal backplane of business board and power module, the region that can hollow out on signal backplane is increased, increased the area of air vent, reduce the windage of system, thereby promoted the heat-sinking capability of system and the power supply capacity of system.The electric current that simultaneously horizontally disposed power supply backplane has directly completed a plurality of power modules closes road and to the through-flow function of business board, make signal backplane no longer participate in function of supplying power, reduced on signal backplane for the alive PCB number of plies and PCB space, further promote the area that signal backplane can perforate and reduced the cost of signal backplane, and power supply and signal can phase mutual interference, make system more stable.
Above-described embodiment; object of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only the specific embodiment of the present invention; the protection domain being not intended to limit the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. a back board system, is characterized in that, described system comprises: one or more business boards, power module, signal backplane and power supply backplane;
Described business board is arranged on a side of described signal backplane, for the processing of business;
Described signal backplane, for the signal interconnection between the signal interconnection between described business board or described business board and other modules;
Described power module, is arranged on the opposite side of described signal backplane, for being connected with described business board by described power supply backplane, for being that described business board is powered by described power supply backplane;
Wherein, between described power supply backplane and described signal backplane, form on aerated area or described signal backplane and there is air vent; Described aerated area or described air vent are used to form the air channel to opposite side by described signal backplane one side, so that described system is dispelled the heat;
The plane at described power supply backplane place is parallel with the direction of ventilation in described air channel; Described signal backplane is vertical with the plane at described power supply backplane place, and vertical with the direction of ventilation in described air channel.
2. system according to claim 1, is characterized in that, described system also comprises: system power supply connector, be positioned at described air channel, and described power module is connected with described power supply backplane by described system power supply connector.
3. system according to claim 1, is characterized in that, described system also comprises: one-board power supply connector, be positioned at described air channel, and described business board cartoon is crossed described one-board power supply connector and is connected with described power supply backplane.
4. system according to claim 1, is characterized in that, described system also comprises: single board signals connector, described business board cartoon is crossed described single board signals connector and is connected with described signal backplane.
5. system according to claim 4, is characterized in that, described system also comprises: Switching Module, described Switching Module is connected with described signal backplane by described single board signals connector.
6. system according to claim 1, is characterized in that, described system also comprises bus-bar, is vertically arranged between adjacent described power supply backplane, and described a plurality of power modules close road by described bus-bar by electric current.
7. system according to claim 6, is characterized in that, described bus-bar is copper bar, aluminum strip, copper cable or aluminum steel cable.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210061907.XA CN102645957B (en) | 2012-03-09 | 2012-03-09 | Back plate system |
PCT/CN2012/083549 WO2013131374A1 (en) | 2012-03-09 | 2012-10-26 | Backplane system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210061907.XA CN102645957B (en) | 2012-03-09 | 2012-03-09 | Back plate system |
Publications (2)
Publication Number | Publication Date |
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CN102645957A CN102645957A (en) | 2012-08-22 |
CN102645957B true CN102645957B (en) | 2014-05-07 |
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Application Number | Title | Priority Date | Filing Date |
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CN201210061907.XA Active CN102645957B (en) | 2012-03-09 | 2012-03-09 | Back plate system |
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CN (1) | CN102645957B (en) |
WO (1) | WO2013131374A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102645957B (en) * | 2012-03-09 | 2014-05-07 | 华为技术有限公司 | Back plate system |
TWI515539B (en) * | 2014-01-20 | 2016-01-01 | 緯創資通股份有限公司 | Computer and power board thereof |
US9665138B2 (en) | 2014-04-07 | 2017-05-30 | Microsoft Technology Licensing, Llc | Micro-hole vents for device ventilation systems |
US10263351B2 (en) * | 2014-07-11 | 2019-04-16 | Fci Usa Llc | Orthogonal electrical connector system |
CN105334929B (en) * | 2015-11-27 | 2020-04-03 | 安徽四创电子股份有限公司 | Multi-mode signal backboard |
CN107124671B (en) * | 2016-02-24 | 2022-01-25 | 中兴通讯股份有限公司 | Communication equipment |
CN108879150B (en) * | 2017-05-15 | 2020-12-15 | 华为技术有限公司 | Cable backboard and communication equipment |
CN108170233B (en) * | 2017-12-13 | 2019-11-19 | 浙江大华技术股份有限公司 | A kind of cabinet |
CN108235637B (en) * | 2017-12-15 | 2020-08-21 | 深圳市恒扬数据股份有限公司 | Vertical orthogonal system for communication equipment and communication equipment |
CN112543571B (en) * | 2019-09-20 | 2023-04-28 | 中兴通讯股份有限公司 | Backboard component and insertion box |
CN111010855B (en) * | 2019-12-31 | 2022-02-25 | 北京信而泰科技股份有限公司 | Heat dissipation system and electronic equipment with same |
CN113075980B (en) * | 2021-03-26 | 2023-03-10 | 山东英信计算机技术有限公司 | Heat dissipation and power supply module and power supply frame |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11110083A (en) * | 1997-10-07 | 1999-04-23 | Hitachi Ltd | Information processor |
US20040141285A1 (en) * | 2002-07-25 | 2004-07-22 | Kontron Communications Inc. | Modular computer system with passive backplane modules |
US7113401B2 (en) * | 2004-10-25 | 2006-09-26 | International Business Machines Corporation | System for airflow management in electronic enclosures |
CN101052275A (en) * | 2006-05-22 | 2007-10-10 | 华为技术有限公司 | Method for design back board and back board |
CN101984599B (en) * | 2010-11-01 | 2013-09-11 | 华为技术有限公司 | Backplane, communication equipment and communication systems |
CN102289253A (en) * | 2011-07-21 | 2011-12-21 | 福建星网锐捷网络有限公司 | Communication system and network equipment |
CN102645957B (en) * | 2012-03-09 | 2014-05-07 | 华为技术有限公司 | Back plate system |
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2012
- 2012-03-09 CN CN201210061907.XA patent/CN102645957B/en active Active
- 2012-10-26 WO PCT/CN2012/083549 patent/WO2013131374A1/en active Application Filing
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WO2013131374A1 (en) | 2013-09-12 |
CN102645957A (en) | 2012-08-22 |
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Effective date of registration: 20211220 Address after: 450046 Floor 9, building 1, Zhengshang Boya Plaza, Longzihu wisdom Island, Zhengdong New Area, Zhengzhou City, Henan Province Patentee after: Super fusion Digital Technology Co.,Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |
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