CN210899459U

CN210899459U - BBU cooling arrangement

Info

Publication number: CN210899459U
Application number: CN201921569886.6U
Authority: CN
Inventors: 谢罗福
Original assignee: Guangzhou Weifeng Technology Co ltd
Current assignee: Guangdong Xijiang Data Technology Co.,Ltd.
Priority date: 2019-09-20
Filing date: 2019-09-20
Publication date: 2020-06-30
Anticipated expiration: 2029-09-20

Abstract

The utility model discloses BBU cooling equipment, which comprises a box body and a spraying plate which is arranged in the box body and is used for erecting elements and is internally provided with a cavity; the spraying plate is provided with a plurality of spraying holes communicated with the cavity and a liquid inlet pipe communicated with the cavity, and the box body is provided with a liquid return port for outputting cooling liquid. The utility model discloses a BBU cooling arrangement can realize the heat dissipation to baseband processing unit.

Description

BBU cooling arrangement

Technical Field

The utility model relates to a BBU cooling arrangement.

Background

At present, the core of the 5G technology lies in that high-frequency millimeter waves (26.5-300 Hz) are adopted to increase the frequency spectrum bandwidth to improve the network speed, and the millimeter waves are characterized by poor penetration force and large attenuation, so that the setting number of 5G base stations is required to be more than 10 times of that of the current 4G base stations, the power consumption of each base station is up to 5KW, which is equal to more than 2 times of that of the current 4G base stations, because the data volume processed in the 5G base stations is increased sharply, the working temperature of base station devices is maintained at a proper temperature, the use requirements of the 5G base stations are met, and particularly in hot areas in the south, proper measures are required to be adopted to ensure that the temperature inside the base stations is not too high to.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a BBU cooling arrangement realizes the heat dissipation to baseband processing unit.

In order to achieve the purpose, the utility model provides a BBU cooling device, which comprises a box body and a spraying plate which is arranged in the box body and is internally provided with a cavity; the spraying plate is provided with a plurality of spraying holes communicated with the cavity and a liquid inlet pipe communicated with the cavity, and the box body is provided with a liquid return port for outputting cooling liquid.

In the BBU cooling apparatus, the spray plate includes a bottom plate horizontally disposed and a plurality of support plates vertically disposed on the bottom plate at intervals; the cavity comprises a cavity arranged on the bottom plate and a cavity arranged on the supporting plate, and the cavity of the bottom plate is communicated with the cavity of the supporting plate.

In the BBU cooling apparatus, the plurality of spray holes are formed in the support plate on a side thereof facing the erection element and communicated with the cavity of the support plate.

In the BBU cooling apparatus, the tank body is provided with an opening through which the liquid inlet pipe passes, and the liquid inlet pipe passes through the opening and extends from the outside of the tank body.

In the above BBU cooling apparatus, the number of the support plates is 2 to 6.

In the BBU cooling device, the support plates are arranged at equal intervals.

In the BBU cooling device, the BBU cooling device further comprises a cover plate covering the upper end of the spray plate.

Compared with the prior art, the BBU cooling device provided by the technical scheme has the beneficial effects that: the integrated circuit boards of the baseband processing units are respectively arranged on one side of the spraying plate, cooling liquid is input through the liquid inlet pipe, the cooling liquid is sprayed onto the integrated circuit boards through the spraying holes, the integrated circuit boards are directly subjected to contact heat exchange, meanwhile, the cooling liquid flows into the cavity of the spraying plate to cool the spraying plate, the spraying plate is cooled through the contact of the spraying plate and the integrated circuit boards, the cooling liquid after heat exchange flows to the outside through the liquid return port, and therefore heat dissipation of the integrated circuit boards of the baseband processing units in the box is achieved.

Drawings

FIG. 1 is one of the schematic partial structural views of a BBU cooling apparatus of the present invention;

FIG. 2 is a second schematic view of a partial structure of the BBU cooling apparatus of the present invention;

fig. 3 is one of application schematic diagrams of the shower plate of the present invention;

fig. 4 is a second schematic view of the application of the shower plate of the present invention;

fig. 5 is a schematic view of a partial structure of the shower plate of the present invention.

The device comprises a box body 1, a liquid return port 11, a spray plate 2, spray holes 21, a liquid inlet pipe 22, a bottom plate 23, a support plate 24, a plate clamp 3 and a cover plate 4.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

Referring to fig. 1-5, the BBU cooling apparatus provided by the present invention includes a case 1 and a spray plate 2 disposed in the case 1 and having a cavity therein; the spray plate 2 is provided with a plurality of spray holes 21 communicated with the cavity and a liquid inlet pipe 22 communicated with the cavity, and the box body 1 is provided with a liquid return port 11 for outputting cooling liquid.

Based on above-mentioned technical characteristics, set up respectively in 2 one sides of spraying board through the integrated circuit board 3 with a plurality of baseband processing unit of equipment, import coolant liquid through feed liquor pipe 22, the coolant liquid sprays to integrated circuit board 3 through spraying hole 21 on, directly contact the heat transfer to integrated circuit board 3, coolant liquid after the heat transfer flows to the outside through returning liquid mouth 11, thereby realize the 3 heat dissipations of integrated circuit board to the baseband processing unit in box 1, and the coolant liquid flows into and sprays and cool down to spraying board 2 in the cavity of board 2, cool down to it through the contact that sprays board 2 and integrated circuit board 3.

The spray plate 2 comprises a bottom plate 23 arranged horizontally and a plurality of support plates 24 vertically arranged on the bottom plate 23 at intervals; the cavity comprises a cavity arranged on the bottom plate 23 and a cavity arranged on the support plate 24, and the cavity of the bottom plate 23 is communicated with the cavity of the support plate 24; the cooling of the spraying plates 2 to the erected board cards 3 is realized by erecting the board cards 3 of the plurality of baseband processing units between the adjacent supporting plates 24.

The plurality of spraying holes 21 are all arranged on one side of the supporting plate 24 facing the erection element and communicated with the cavity of the supporting plate 24; the cooling liquid is fully contacted with the erected board card 3 element, the heat dissipation and cooling efficiency is improved, and the cooling liquid can be directly sprayed onto the board card 3 element through the spraying holes 21.

The box 1 is provided with an opening for the liquid inlet pipe 22 to pass through, and the liquid inlet pipe 22 passes through the opening and extends from the outer side of the box 1, and the cooling liquid is conveyed outside the box 1.

The number of the supporting plates 24 is 2-6, preferably, the number of the supporting plates 24 is 3, and the common board cards, the backup board cards and the power supply area are respectively subjected to spray cooling, so that the structure of the equipment is more compact.

The backup pad 24 is the equidistance interval setting, and the convenient integrated circuit board 3 with the model sets up.

The cooling device also comprises a cover plate 4 which covers the upper end of the spray plate 2, and the cooling liquid can not be sprayed to the outer side of the spray plate 2 through the cover of the cover plate 4.

After the cooling liquid flows out through the liquid return port 11, heat exchange can be performed through an external cooling system, and the cooling liquid circulates to the liquid inlet pipe 22 for cooling circulation, and the cooling liquid used in the embodiment is an insulating cooling liquid.

In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. The BBU cooling equipment is characterized by comprising a box body and a spraying plate which is arranged in the box body and is internally provided with a cavity; the spraying plate is provided with a plurality of spraying holes communicated with the cavity and a liquid inlet pipe communicated with the cavity, and the box body is provided with a liquid return port for outputting cooling liquid.

2. The BBU cooling apparatus of claim 1, wherein the spray plate includes a horizontally disposed bottom plate and a plurality of support plates vertically disposed at spaced intervals on the bottom plate; the cavity comprises a cavity arranged on the bottom plate and a cavity arranged on the supporting plate, and the cavity of the bottom plate is communicated with the cavity of the supporting plate.

3. The BBU cooling apparatus of claim 2, wherein a plurality of the spray holes are disposed on a side of the support plate facing the mounting member and in communication with the cavity of the support plate.

4. The BBU cooling apparatus of claim 3, wherein the tank is provided with an opening for passage of the liquid inlet pipe, the liquid inlet pipe passing through the opening and extending from outside the tank.

5. The BBU cooling apparatus of claim 2, wherein the number of support plates is 2-6.

6. The BBU cooling apparatus of claim 5, wherein the support plates are equidistantly spaced apart.

7. The BBU cooling apparatus of any one of claims 1-6, further comprising a cover plate disposed over an upper end of the shower plate.