CN103793030A - Electronic device - Google Patents
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- CN103793030A CN103793030A CN201210422976.9A CN201210422976A CN103793030A CN 103793030 A CN103793030 A CN 103793030A CN 201210422976 A CN201210422976 A CN 201210422976A CN 103793030 A CN103793030 A CN 103793030A
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- motherboard
- processor module
- wind scooper
- memory module
- radiating fin
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Abstract
The invention provides an electronic device. The electronic device comprises a mainboard, a first processor module, a second processor module, a first memory module, a second memory module, a plurality of fans and an air director. The first processor module and the second processor module are arranged on the mainboard. The first memory module and the second memory module are located at the two sides of the first processor module. The air director comprises three air flow channels adjacent to one another and communicated with the fans, respectively, the first processor module and the second processor module are located in one air flow channel in back-and-forth arrangement, the first memory module and the second memory module are located in the other two air flow channels, respectively, and the fans corresponding to the air flow channel where the first processor module and the second processor module are located are more than the fans corresponding to the other two air flow channels.
Description
Technical field
The invention relates to a kind of electronic installation, and relate to especially a kind of electronic installation that disposes a wind scooper.
Background technology
Along with the advancing by leaps and bounds of computer technology, the running speed of computer is constantly improved in recent years, and the heating power of the electronic component of host computer inside is also constantly soaring.In order to prevent the electronic component of inside of host computer overheated, and cause electronic component that temporary or permanent inefficacy occurs, the enough heat dissipation electronic component to computer inside must be provided.Therefore,, for the thermal source of high heating power, such as CPU (central processing unit), drawing wafer, north bridge wafer and south bridge wafer etc., can install radiating fin group additional and reduce the temperature of these thermals source conventionally.And for heat that radiating fin group absorbs can be shed maturely outside casing, the thermal convection efficiency of casing inside just seems important extraordinarily.
With server, because server must possess enough degree of stability and fiduciary level, can avoid provided service disruption especially.Therefore, at the inner flow-guiding structure that conventionally also can dispose auxiliary heat dissipation of casing of server, to increase the efficiency of thermal convection.For instance, one wind scooper can be disposed on the motherboard of server, fan arrangement is in a side of motherboard and be communicated in wind scooper, the air-flow that blows out from fan is through wind scooper inside, and the air-flow that the heat production of electronic component on motherboard is guided along with wind scooper and dissipation goes out outside casing.Thus, the temperature of server is minimized, and just can stablize running.
In order to increase the heat interchange between radiating fin group and thermal source, under a constant volume, the quantity of radiating fin makes area of dissipation larger and can take away more heats more.But, because radiating fin is overstocked, for air-flow close to a barrier, most air-flow can be walked around this radiating fin group, only there is a fraction of air-flow to pass through between radiating fin, so, may cause the thermal source that radiating fin group contacts that the bad situation of heat radiation occurs.
Summary of the invention
The invention provides a kind of electronic installation, can reduce the bad probability of heat radiation occurs.
The present invention proposes a kind of electronic installation, comprises a motherboard, a first processor module, one second processor module, a first memory module, a second memory module, multiple fan and a wind scooper.First processor module and the second processor module are arranged on motherboard.First memory module is arranged on motherboard and is positioned at one first side of first processor module.Second memory module is arranged on motherboard and is positioned at one second side with respect to the first side of first processor module.Multiple fans are arranged at a side of motherboard.Wind scooper is arranged on motherboard, wind scooper comprises three adjacent gas channels, three gas channels are communicated in respectively these fans of part, first processor module and the second processor module are positioned at one of them gas channel in tandem, first memory module and second memory module lay respectively in two other gas channel, and the quantity that first processor module and the second processor module are positioned at the corresponding fan of gas channel is greater than the quantity of the corresponding fan of two other gas channel.
In one embodiment of this invention, electronic installation more comprises one the 3rd memory module and one the 4th memory module.The 3rd memory module is arranged on motherboard and is positioned at one first side of the second processor module, and the 3rd memory module local or be all positioned at same this gas channel with first memory module.The 4th memory module is arranged on motherboard and is positioned at one second side with respect to the first side of the second processor module, and the 4th memory module local or be all positioned at same gas channel with second memory module.
In one embodiment of this invention, above-mentioned wind scooper comprises one first relative side and one second side, and the first side of wind scooper is adjacent to these fans, and the width of the first side of wind scooper is greater than the width of the second side of wind scooper.
In one embodiment of this invention, above-mentioned wind scooper comprises multiple fins and a cover plate, and these fins are connected in cover plate, and wind scooper is divided into three gas channels by these fins.
In one embodiment of this invention, above-mentioned wind scooper comprises at least one location division, and each location division is arranged at fin or cover plate, in order to between motherboard or these fans.
In one embodiment of this invention, above-mentioned motherboard comprises at least one electronic component, one of them projection on motherboard that the projection of electronic component on motherboard is overlapped in these fins, and the fin of part is suspended on motherboard to avoid electronic component.
In one embodiment of this invention, electronic installation more comprises multiple storage devices, is positioned at least one side of motherboard, is not communicated in the air-flow that these fans of this three gas channels blow out and is suitable for through these storage devices.
In one embodiment of this invention, electronic installation more comprises one first radiating fin group and one second radiating fin group.The first radiating fin group thermo-contact is in first processor module, and the first radiating fin group is positioned at the central gas channel of being positioned at of wind scooper.The second radiating fin group thermo-contact is in the second processor module, the second radiating fin group local or be all positioned at the central gas channel of being positioned at of wind scooper.
In one embodiment of this invention, the air-flow that fan produces second processor module of flowing through again after first processor module of first flowing through, and the spacing of the radiating fin of the first radiating fin group is greater than the spacing of the radiating fin of the second radiating fin group.
Based on above-mentioned, wind scooper is divided into three gas channels by electronic installation of the present invention, collocation fan is communicated in this three gas channels, and make the first radiating fin group, first memory module and second memory module lay respectively in three gas channels, the air-flow that enters these three gas channels to force is flowed through respectively and is positioned at the first radiating fin group of these three gas channels, first memory module and second memory module, can effectively avoid because of the fin between the first radiating fin group overstocked, make air-flow walk around the first radiating fin group, and cause the bad situation of first processor module heat dissipating.In addition, it is one of main thermal source in electronic installation due to first processor module, first memory module and second memory module are secondary heat source, in order to make the assigned air quantity of the first radiating fin group can enough make first processor module heat dissipating, the quantity that is positioned at central these fans that gas channel is communicated in of wind scooper is greater than respectively the quantity of these fans that gas channel is communicated in that are positioned at both sides of wind scooper, fabricator can determine for the heat production number of each thermal source of electronic installation inside the number of fans that each gas channel of wind scooper is communicated with, to avoid the bad situation of the local heat radiation of generation in electronic installation.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended graphic being described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic diagram according to a kind of electronic installation of one embodiment of the invention.
Fig. 2 is the schematic diagram that the wind scooper of the electronic installation of Fig. 1 separates with motherboard.
Fig. 3 is the front schematic perspective view of the wind scooper of the electronic installation of Fig. 1.
Fig. 4 is the reverse side schematic perspective view of the wind scooper of the electronic installation of Fig. 1.
[main element symbol description]
C: gas channel
100: electronic installation
110: motherboard
112: electronic component
120: first processor module
122: the first sides
124: the second sides
130: first memory module
135: second memory module
140: fan
1 50: wind scooper
The 1 52: first side
The 1 54: second side
1 56: fin
1 56a: breach
1 58: cover plate
1 59: location division
160: the second processor modules
162: the first sides
164: the second sides
170: the three memory modules
175: the four memory modules
180: storage device
190: the first radiating fin groups
195: the second radiating fin groups
Embodiment
Fig. 1 is the schematic diagram according to a kind of electronic installation of one embodiment of the invention.Fig. 2 is the schematic diagram that the wind scooper of the electronic installation of Fig. 1 separates with motherboard.Refer to Fig. 1 and Fig. 2, the electronic installation 100 of the present embodiment comprises a motherboard 1 10, a first processor module 120, a first memory module 130, a second memory module 135, multiple fan 140, a wind scooper 150, one second processor module 160 and one first radiating fin group 190.
Because first processor module 120 is one of main thermal source in electronic installation 100, first memory module 130 and second memory module 135 are secondary heat source, in order to make the assigned air quantity of the first radiating fin group 190 can enough make first processor module 120 dispel the heat, the quantity that is positioned at the gas channel C that is positioned at both sides that quantity that central gas channel C is communicated in these fans 140 is greater than respectively wind scooper 150 and is communicated in these fans 140 of wind scooper 1 50.As shown in Figure 1, the gas channel C that is positioned at drawing left is communicated in a fan 140 of drawing leftmost, be positioned at central gas channel C and be communicated in second to four fan 140 of drawing from left, and be positioned at right-hand gas channel C of drawing and be communicated in five fan 140 of drawing from left.Fabricator can determine for the heat production number of each thermal source of electronic installation 100 inside fan 140 quantity that each gas channel C of wind scooper 150 is communicated with, so that the heat production of the each thermal source in electronic installation 100 all can be carried out heat interchange with enough air quantity.
In the present embodiment, first memory module 130 and second memory module 135 are arranged in and first processor module 120 and the different gas channel C of the second processor module 160, and just the required air quantity of visual each gas channel C is to control corresponding fan 140 operation conditionss.For example, first processor module 120 and the second processor module 160 be positioned at the corresponding fan 140 of gas channel C and can have larger rotating speed, to promote radiating effect.
In the present embodiment, wind scooper 150 comprises one first relative side 152 and one second side 154, and the first side 1 52 of wind scooper 150 is adjacent to these fans 140, so that the air-flow blowing out from fan 140 flows in gas channel C.In the present embodiment, the width of the first side 1 52 of wind scooper 1 50 is greater than the width of the second side 1 54 of wind scooper 1 50, this is more owing to being positioned at fan 140 quantity that central gas channel C is communicated with, and being therefore positioned at central gas channel C has wider opening to receive the air quantity of three fans 140 simultaneously in the first side 1 52.Certainly, in other embodiments, the first side 1 52 of wind scooper 1 50 and the width relation of the second side 1 54 can be as restrictions.
Fig. 3 is the front schematic perspective view of the wind scooper of the electronic installation of Fig. 1.Fig. 4 is the reverse side schematic perspective view of the wind scooper of the electronic installation of Fig. 1.Refer to Fig. 3 and Fig. 4, wind scooper 1 50 comprises multiple fins 1 56, a cover plate 158 and at least one location division 159, and these fins 156 are connected in cover plate 158, and wind scooper 150 is divided into this three gas channel C by these fins 156.Wind scooper 150 comprises at least one location division 159, and each location division 159 can be arranged at fin 1 56 or cover plate 1 58, in order to between motherboard 110 or these fans 140.In the present embodiment, the quantity of location division 159 is two, is arranged at respectively on cover plate 158, and in the time that wind scooper 150 is installed on motherboard 110, location division 1 59 is fastened in the space between fan 140, so that wind scooper 1 50 location.
In addition, because motherboard 110 comprises at least one electronic component 112, electronic component 112 can be the element such as electric capacity or resistance, but the kind of electronic component 112 is not as restriction.In the time that wind scooper 1 50 is installed on motherboard 110, one of them projection on motherboard 110 that the projection of electronic component 112 on motherboard 110 may be overlapped in these fins 156.That is to say, fin 156 may be snapped into and cannot firmly erect on motherboard 110 by these electronic components 112.For fear of above-mentioned condition, the fin 156 of part is suspended on motherboard 110 to avoid electronic component 112, in the present embodiment, fin 156 comprises a breach 156a in the position of wanting to be suspended on motherboard 110, fin 156 sees through breach 156a to avoid electronic component 112, and fin 156 still can erect on motherboard 110 by other parts.
In addition, in the present embodiment, electronic installation 100 more, one the 3rd memory module 170, one the 4th memory module 175 and one second radiating fin group 195.The second radiating fin group 195 thermo-contacts are positioned at the central gas channel C of being positioned at of wind scooper 1 50 in the part of the second processor module 160, the second radiating fin groups 195.As shown in Figure 1, in the present embodiment, after second to the 5th air-flow that fan 140 blows out of drawing left can be first through the first radiating fin group 190 again through the second radiating fin group 195.
As shown in Figure 1, in the present embodiment, the air-flow that fan 140 produces second processor module 160 of flowing through again after first processor module 120 of first flowing through, and the spacing of the radiating fin of the first radiating fin group 190 is greater than the spacing of the radiating fin of the second radiating fin group 195.Because radiating effect is relevant with the speed of air-flow, if it is overstocked to be positioned at the radiating fin (radiating fin of the first radiating fin group 190) of gas channel C front side, after airflow passes, flow velocity can become slower, can affect the radiating effect of rear side radiating fin (the second radiating fin group 195).Therefore, in the present embodiment, between the radiating fin of the first radiating fin group 190 of close fan 140, apart from wider, can make air-flow through still thering is later very fast flow velocity; On the other hand, after air-flow Rapid Flow is crossed fin, temperature can not become very high yet.
The 3rd memory module 170 is arranged on motherboard 110 and is positioned at one first side 162 of the second processor module 160, and the part of the 3rd memory module 170 and first memory module 130 are positioned at same gas channel C.That is to say, the air-flow blowing out from the leftmost fan 140 of drawing can be first through after first memory module 130 again through the 3rd memory module 170.
The 4th memory module 175 is arranged on motherboard 110 and is positioned at one second side 164 with respect to the first side 162 of the second processor module 160, and the part of the 4th memory module 175 and second memory module 135 are positioned at same gas channel C.That is to say, from the 5th air-flow that fan 140 blows out of drawing left can be first through after second memory module 135 again through the 4th memory module 175.
In the present embodiment, because the second radiating fin group 195, the 3rd memory module 170 and the 4th memory module 175 are only positioned at respectively three gas channel C of wind scooper 150 with part, after just can mixing after air flow stream is for these three gas channel C, flow out again in electronic installation 100.Certainly, in other embodiments, also can lengthen the length of the first side 152 to second sides 154 of wind scooper 150, make whole the second processor module 160 and whole the second radiating fin group 195 be positioned at the central gas channel C of wind scooper 1 50, whole the 3rd memory module 1 70 and first memory module 130 are positioned at the gas channel C of the side of wind scooper 150, whole the 4th memory module 175 and second memory module 135 are positioned at the gas channel C of the opposite side of wind scooper 150, so that these three gas channel C were flowing out before electronic installation 100 all not mixed flow.The length of the first side 152 to second sides 154 of wind scooper 150 is not as restriction.
In addition, as shown in Figure 1, in the present embodiment, electronic installation 100 more comprises multiple storage devices 1 80, is positioned at least one side of motherboard 110.Due to storage device 180 meeting heat production in the time operating, these fans 140(that is not communicated in these three gas channel C is as right-hand first on drawing and second fan 140) can arrange towards these storage devices 180, so that the heat production of the air-flow that it blows out when taking away storage device 180 through storage device 180 and operating.
In sum, wind scooper is divided into three gas channels by electronic installation of the present invention, collocation fan is communicated in this three gas channels, and make the first radiating fin group, first memory module and second memory module lay respectively in three gas channels, the air-flow that enters these three gas channels to force is flowed through respectively and is positioned at the first radiating fin group of these three gas channels, first memory module and second memory module, can effectively avoid because of the fin between the first radiating fin group overstocked, make air-flow walk around the first radiating fin group, and cause the bad situation of first processor module heat dissipating.In addition, it is one of main thermal source in electronic installation due to first processor module, first memory module and second memory module are secondary heat source, in order to make the assigned air quantity of the first radiating fin group can enough make first processor module heat dissipating, the quantity that is positioned at central these fans that gas channel is communicated in of wind scooper is greater than respectively the quantity of these fans that gas channel is communicated in that are positioned at both sides of wind scooper, fabricator can determine for the heat production number of each thermal source of electronic installation inside the number of fans that each gas channel of wind scooper is communicated with, to avoid the bad situation of the local heat radiation of generation in electronic installation.
Although the present invention discloses as above with embodiment; so it is not in order to limit the present invention; under any, in technical field, have and conventionally know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion of defining depending on accompanying claim.
Claims (9)
1. an electronic installation, comprising:
One motherboard;
One first processor module, is arranged on this motherboard;
One second processor module, is arranged on this motherboard;
One first memory module, is arranged on this motherboard and is positioned at one first side of this first processor module;
One second memory module, is arranged on this motherboard and is positioned at one second side with respect to this first side of this first processor module;
Multiple fans, are arranged at a side of this motherboard; And
One wind scooper, be arranged on this motherboard, this wind scooper comprises three adjacent gas channels, these three gas channels are communicated in respectively those fans of part, this first processor module and this second processor module are positioned at one of them this gas channel in tandem, this first memory module and this second memory module lay respectively in two other this gas channel, the quantity that this first processor module and this second processor module are positioned at corresponding those fans of this gas channel is greater than the quantity of corresponding those fans of two other this gas channel.
2. electronic installation as claimed in claim 1, is characterized in that, more comprises:
One the 3rd memory module, is arranged on this motherboard and is positioned at one first side of this second processor module, and the 3rd memory module local or be all positioned at same this gas channel with this first memory module; And
One the 4th memory module, is arranged on this motherboard and is positioned at one second side with respect to this first side of this second processor module, and the 4th memory module local or be all positioned at same this gas channel with this second memory module.
3. electronic installation as claimed in claim 1, it is characterized in that, this wind scooper comprises one first relative side and one second side, and this of this wind scooper the first side is adjacent to those fans, and the width of this of this wind scooper the first side is greater than the width of this second side of this wind scooper.
4. electronic installation as claimed in claim 1, is characterized in that, this wind scooper comprises multiple fins and a cover plate, and those fins are connected in this cover plate, and this wind scooper is divided into this three gas channels by those fins.
5. electronic installation as claimed in claim 4, is characterized in that, this wind scooper comprises at least one location division, and respectively this location division is arranged at this fin or this cover plate, in order to between this motherboard or those fans.
6. electronic installation as claimed in claim 4, it is characterized in that, this motherboard comprises at least one electronic component, one of them projection on this motherboard that the projection of this electronic component on this motherboard is overlapped in those fins, this fin of part is suspended on this motherboard to avoid this electronic component.
7. electronic installation as claimed in claim 1, is characterized in that, more comprises:
Multiple storage devices, are positioned at least one side of this motherboard, are not communicated in the air-flow that those fans of this three gas channels blow out and are suitable for through those storage devices.
8. electronic installation as claimed in claim 1, is characterized in that, more comprises:
One first radiating fin group, thermo-contact is in this first processor module, and this first radiating fin group is positioned at this gas channel that is positioned at central authorities of this wind scooper; And
One second radiating fin group, thermo-contact is in this second processor module, this second radiating fin group local or be all positioned at this gas channel that is positioned at central authorities of this wind scooper.
9. electronic installation as claimed in claim 8, it is characterized in that, the air-flow that those fans of part produce this second processor module of flowing through again after this first processor module of first flowing through, and the spacing of the radiating fin of this first radiating fin group is greater than the spacing of the radiating fin of this second radiating fin group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210422976.9A CN103793030A (en) | 2012-10-30 | 2012-10-30 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210422976.9A CN103793030A (en) | 2012-10-30 | 2012-10-30 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103793030A true CN103793030A (en) | 2014-05-14 |
Family
ID=50668799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210422976.9A Pending CN103793030A (en) | 2012-10-30 | 2012-10-30 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103793030A (en) |
Cited By (5)
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| CN104898814A (en) * | 2015-06-29 | 2015-09-09 | 北京百度网讯科技有限公司 | Ventilation device for ventilation source cluster and server |
| CN106155242A (en) * | 2015-04-22 | 2016-11-23 | 华为技术有限公司 | Wind scooper |
| WO2018040363A1 (en) * | 2016-08-29 | 2018-03-08 | 浪潮电子信息产业股份有限公司 | Heat dissipation system and heat dissipation method |
| GB2561988A (en) * | 2017-04-28 | 2018-10-31 | Fujitsu Ltd | Cooling arrangement and air guide shroud |
| CN114546071A (en) * | 2020-11-25 | 2022-05-27 | 恩斯迈电子(深圳)有限公司 | Motherboard assembly and heat dissipation module |
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| CN106155242B (en) * | 2015-04-22 | 2019-05-03 | 华为技术有限公司 | Wind scooper |
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| CN114546071A (en) * | 2020-11-25 | 2022-05-27 | 恩斯迈电子(深圳)有限公司 | Motherboard assembly and heat dissipation module |
| CN114546071B (en) * | 2020-11-25 | 2023-10-03 | 恩斯迈电子(深圳)有限公司 | Motherboard assembly and heat dissipation module |
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Application publication date: 20140514 |