CN114546071A - Motherboard assembly and heat dissipation module - Google Patents
Motherboard assembly and heat dissipation module Download PDFInfo
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- CN114546071A CN114546071A CN202110045596.7A CN202110045596A CN114546071A CN 114546071 A CN114546071 A CN 114546071A CN 202110045596 A CN202110045596 A CN 202110045596A CN 114546071 A CN114546071 A CN 114546071A
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- heat dissipation
- base
- circuit board
- air outlet
- air
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a mainboard assembly and a heat dissipation module. The mainboard assembly comprises a circuit board, a first processing chip, a second processing chip, an electronic element and a heat dissipation module. The electronic element, the first processing chip and the second processing chip are sequentially arranged on the circuit board from the first side to the second side of the circuit board. The heat dissipation module comprises a base and heat dissipation fins. The base is in thermal contact with the first processing chip and has a side edge adjacent the electronic component proximate the first side. The heat dissipation fins are arranged and in thermal contact with the base. The heat dissipation fins are provided with opposite air inlet sides and air outlet sides. The air inlet side is positioned between the air outlet side and the second side of the circuit board and is used for supplying air flow to blow into the radiating fins. The air outlet side is positioned between the electronic element and the second side and keeps a distance with the side edge of the base.
Description
Technical Field
The present invention relates to a heat dissipation module and a motherboard assembly, and more particularly, to a heat dissipation module having heat dissipation fins spaced apart from the air outlet side of the heat dissipation fins and the side edge of the base, and a motherboard assembly including the same.
Background
With the advancement of technology, computers are becoming smaller and more popular with consumers. In conjunction, the computer motherboard is being densely configured, and the distances between the electronic components are relatively close to each other, so as to save the space of the motherboard. In addition, in order to avoid the problem that the waste heat generated by the operation of the electronic components is not easy to be dissipated due to the narrow space, the heat dissipation fins are also arranged to provide air flow so as to increase the heat exchange to the ambient air.
However, the area adjacent to the air outlet side of the heat dissipation fins directly receives the hot air brought by the wind flow, so that the hot air is easily accumulated in the area and is not easy to exchange heat with the surrounding air. If the electronic device is disposed in the region, the waste heat generated by the electronic device during operation may multiply the hot air caused by the wind flow, so that the electronic device is liable to exceed the upper limit of the tolerable temperature.
Disclosure of Invention
The invention aims to provide a main board assembly and a heat dissipation module so as to solve the problem that hot air is easy to accumulate in an area adjacent to the air outlet side of a heat dissipation fin.
The invention discloses a mainboard assembly, which comprises a circuit board, a first processing chip, a second processing chip, a first electronic element and a first heat dissipation module. The circuit board has a first side and a second side opposite to each other. The first processing chip is arranged on the circuit board. The second processing chip is arranged on the circuit board and is positioned between the first processing chip and the second side of the circuit board. The first electronic element is arranged on the circuit board and is positioned between the first processing chip and the first side of the circuit board. The first heat dissipation module comprises a first base and a first heat dissipation fin. The first base is in thermal contact with the first processing chip, and one side of the first base, which is close to the first side of the circuit board, is provided with a side edge. The side edge is adjacent to the first electronic component. The first heat dissipation fins are arranged and in thermal contact with the first base. The first heat dissipation fins are provided with a first air inlet side and a first air outlet side which are opposite. The first air inlet side is positioned between the first air outlet side and the second side of the circuit board and is used for blowing an air flow into the first heat dissipation fins. The first air outlet side is positioned between the first electronic element and the second side and keeps a distance with the side edge of the first base.
The heat dissipation module disclosed in another embodiment of the present invention includes a base and a heat dissipation fin. The base is used for thermally contacting a heat source and is provided with a side edge at one side. The heat dissipation fins are arranged and in thermal contact with the base. The heat dissipation fins are provided with an air inlet side and an air outlet side which are opposite. The air inlet side is used for blowing an air flow into the first radiating fins. The air outlet side is positioned between the lateral edge and the air inlet side and keeps a distance with the lateral edge of the base.
According to the motherboard assembly and the heat dissipation module disclosed in the above embodiments, by the arrangement of the first heat dissipation fins with the space between the first air outlet side and the side edge of the first base, the waste heat brought to the first air outlet side by the air flow can be dissipated towards the left and right sides in the space between the first air outlet side and the side edge, and can exchange heat with the air blown by the system air flow, without accumulating the waste heat on the components (such as the first electronic components in the motherboard assembly) adjacent to the side edge.
The foregoing summary of the invention, as well as the following detailed description of the embodiments, is provided to illustrate and explain principles of the invention and to provide further explanation of the invention as claimed.
Drawings
Fig. 1 is a schematic configuration diagram of a motherboard assembly according to an embodiment of the present invention.
FIG. 2 is a partially exploded schematic view of the motherboard assembly of FIG. 1.
The reference numbers are as follows:
10 … motherboard component
100 … circuit board
101 … first side
102 … second side
200 … first processing chip
300 … second processing chip
400 … first electronic component
500 … first heat dissipation module
510 … first base
511 … side edge
520 … first cooling fin
521 … first wind inlet side
522 … first air outlet side
530 … radiating pipe
531 … condensation section
532 … evaporation section
600 … system wind current generating device
700 … first module wind flow generating device
800 … second electronic component
900 … heat transfer module
1000 … second heat dissipation module
1010 … second base
1011 … side edge
1020 … second cooling fin
1021 … second wind inlet side
1022 … second air outlet side
1100 … second module wind flow generating device
AF0 … system wind flow
AF1, AF2 … wind current
Distance D …
DF … arrow direction
Detailed Description
Referring to fig. 1 and 2, fig. 1 is a schematic diagram illustrating a configuration of a motherboard assembly 10 according to an embodiment of the invention, and fig. 2 is a partially exploded schematic diagram of the motherboard assembly 10 of fig. 1. In the present embodiment, the motherboard assembly 10 includes a circuit board 100, a first processing chip 200, a second processing chip 300, a first electronic component 400, and a first heat dissipation module 500. The circuit board 100 is disposed on a housing (not shown), and the circuit board 100 has a first side 101 and a second side 102 opposite to each other. A system airflow AF0 is blown from the second side 102 of the circuit board 100 to the first side 101, where the first side 101 is generally the rear of the motherboard assembly 10 and the second side 102 is generally the front of the motherboard assembly 10.
The first processing chip 200 is a heat source such as a Central Processing Unit (CPU), and generates a large amount of waste heat during operation. The first processing chip 200 is disposed on the circuit board 100. The second processing chip 300 is, for example, another cpu, and is disposed on the circuit board 100. The second processing chip 300 is located between the first processing chip 200 and the second side 102 of the circuit board 100. The motherboard assembly 10 is provided with the first processing chip 200 and the second processing chip 300 to form a dual-CPU system, for example. The first electronic component 400 is, for example, a Choke coil (Choke), and is disposed on the circuit board 100. The first electronic component 400 is located between the first processing chip 200 and the first side 101 of the circuit board 100. The second processing chip 300, the first processing chip 200 and the first electronic component 400 are sequentially disposed in a blowing direction of the system air flow AF0 from the second side 102 to the first side 101 of the circuit board 100.
The first heat dissipation module 500 includes a first base 510 and a first heat dissipation fin 520. The first pedestal 510 is in thermal contact with the first processing chip 200 to absorb waste heat generated during operation of the first processing chip 200. The first base 510 has a side edge 511 at a side close to the first side 101 of the circuit board 100. The side edge 511 is adjacent to the first electronic component 400. The first heat sink fins 520 are disposed and thermally contacted to the first base 510 to absorb the waste heat transferred to the first base 510. The first heat dissipation fins 520 have a first air inlet side 521 and a first air outlet side 522 opposite to each other. The first air inlet side 521 is located between the first air outlet side 522 and the second side 102 of the circuit board 100, and is used for blowing an air flow AF1 into the first heat dissipation fins 520. The wind flow AF1 blows from the first wind inlet side 521 to the first wind outlet side 522, and carries away the waste heat absorbed by the first heat dissipation fins 520, thereby achieving the effect of dissipating heat from the first processing chip 200.
The first air-out side 522 is located between the first electronic component 400 and the second side 102 of the circuit board 100, and the first air-out side 522 maintains a distance D with the side edge 511 of the first base 510. The distance D is, for example, between 10 mm and 20 mm.
In this embodiment and some embodiments of the present invention, the motherboard assembly 10 further includes three system airflow generating devices 600, for example. The system airflow generating device 600 is disposed on the casing and located on the second side 102 of the circuit board 100. The system air flow generating device 600 blows from the second side 102 to the first side 101 to generate the system air flow AF0 to the motherboard assembly 10, and the system air flow AF0 includes the air flow AF1 blown to the first air inlet side 521.
In this embodiment and some embodiments of the present invention, the motherboard assembly 10 further includes a first module airflow generating device 700. The first module airflow generating device 700 is disposed on the first air inlet side 521 of the first heat sink fins 520, so as to generate the airflow AF1 to the first air inlet side 521 together with the system airflow generating device 600, thereby further enhancing the effect of directing the waste heat to the first air outlet side 522.
It should be noted that the wind flow AF1 is provided by the system wind flow generating device 600 and the first module wind flow generating device 700, but the invention is not limited thereto. In some embodiments, the system wind flow generating device 600 and the first module wind flow generating device 700 may be alternatively disposed, such that the wind flow AF1 is provided only by the system wind flow generating device 600 or the first module wind flow generating device 700. In addition, the number of the system wind flow generating devices 600 is not limited to three. In some embodiments, only one or two system wind flow generation devices 600 may be provided, or more than four system wind flow generation devices 600 may be provided.
In this embodiment and some embodiments of the present invention, the motherboard assembly 10 may further include a second electronic component 800 and a heat transfer module 900. The second electronic component 800 is, for example, a Metal Oxide Semiconductor Field Effect Transistor (MOSFET), and is disposed on the circuit board 100. The second electronic component 800 is located between the first electronic component 400 and the first side 101 of the circuit board 100, and is adjacent to the first electronic component 400. The heat transfer module 900 is, for example, a heat transfer fin, and thermally contacts the second electronic component 800 to absorb waste heat generated by the second electronic component 800 during operation and exchange heat with ambient air.
In this embodiment and some embodiments of the present invention, in order to achieve the effect of dissipating heat from the second processing chip 300, the motherboard assembly 10 may further include a second heat dissipation module 1000 and a second module airflow generating device 1100. The second heat dissipation module 1000 includes a second base 1010 and a second heat dissipation fin 1020. The second pedestal 1010 is in thermal contact with the second processing chip 300 to absorb waste heat generated during operation of the second processing chip 300. The second heat sink fins 1020 are disposed on and in thermal contact with the second base 1010 to absorb the waste heat transferred to the second base 1010. The second heat dissipation fin 1020 has a second air inlet side 1021 and a second air outlet side 1022 opposite to each other. The second air inlet side 1021 is located between the second air outlet side 1022 and the second side 102 of the circuit board 100. The second module airflow generating device 1100 generates another airflow AF2 toward the second air outlet 1022 to remove the waste heat absorbed by the second heat dissipating fins 1020, thereby achieving the effect of dissipating heat from the second processing chip 300.
In this embodiment and some embodiments of the present invention, the second base 1010 has a side edge 1011 on a side close to the first side 101 of the circuit board 100. The second air-out side 1022 of the second radiator fin 1020 is located between the side edge 1011 and the second side 102, and the second air-out side 1022 and the side edge 1011 of the second base 1010 keep the same distance as the distance D. Therefore, the structure of the second heat dissipation module 1000 is substantially the same as that of the first heat dissipation module 500, and when the first heat dissipation module 500 and the second heat dissipation module 1000 are assembled, the time for sorting parts can be saved, thereby speeding up the overall manufacturing process. However, the invention is not limited thereto. In some embodiments, the second air outlet side of the second heat dissipation fins may also be aligned with the side edge of the second base, so as to fully extend the heat dissipation area of the second heat dissipation fins.
With the arrangement of the first heat dissipation fins 520 with the distance D between the first air-out side 522 and the side edge 511 of the first chassis 510, the waste heat from the first air-out side 522 due to the air flow AF1 can escape to the left and right (as indicated by the arrow DF in fig. 1) in the space between the first air-out side 522 and the side edge 511, and can exchange heat with the air blown by the system air flow AF0, without accumulating the waste heat on the first electronic component 400. In this way, the first electronic device 400 can be maintained below the critical temperature during the system operation, so as to operate normally, wherein the critical temperature of the first electronic device 400 is, for example, 90 ℃. If the temperature of the first electronic component 400 exceeds its critical temperature, the efficiency may be reduced or even damaged.
Between the heat transfer module 900 and the first air-out side 522 of the first heat dissipation fin 520, in addition to the space where the first electronic component 400 is originally disposed, there is also a space where the first air-out side 522 is retracted by a distance D, so that the distance between the first air-out side 522 and the first air-out side is increased. In this way, the system air flow AF0 can be blown into the space between the heat transfer module 900 and the first heat dissipation fins 520 more easily, so that not only is the waste heat from the first air outlet side 522 brought by the air flow AF1 not easily accumulated between the heat transfer module 900 and the first heat dissipation fins 520 ensured, but also the heat transfer module 900 can be caused to exchange heat with the air blown by the system air flow AF0, and further the heat dissipation capabilities of the heat transfer module 900 and the first heat dissipation fins 520 are ensured.
The following table shows temperature measurement data in three configurations when the first heat dissipation module 500 and the second heat dissipation module 1000 adopt the same distance D at the system environment temperature of 35 ℃. It can be seen from the table that the operating temperatures of the first electronic device 400 and the second electronic device 800 are both decreased, and particularly, the operating temperature of the first electronic device 400 is decreased to be below the critical temperature (90 degrees celsius).
In this embodiment and some embodiments of the present invention, the first heat dissipation module 500 may further include four heat dissipation tubes 530, for example. Each heat pipe 530 includes a condensation section 531 and an evaporation section 532 connected to each other. The condensing section 531 passes through and thermally contacts the first radiator fins 520, and the evaporating section 532 passes through and thermally contacts the first base 510. Therefore, the heat pipe 530 can absorb the waste heat transferred to the first base 510 through the evaporation section 532, transfer the waste heat to the condensation section 531, and then be carried away by the first heat dissipation fins 520, thereby enhancing the effect of transferring the waste heat from the first base 510 to the first heat dissipation fins 520.
According to the motherboard assembly and the heat dissipation module of the above embodiments, by the arrangement of the first heat dissipation fins with the space between the first air outlet side and the side edge of the first base, the waste heat brought to the first air outlet side by the air flow can be dissipated towards the left and right sides in the space between the first air outlet side and the side edge, and can exchange heat with the air blown by the system air flow, without accumulating the waste heat on the components (such as the first electronic components in the motherboard assembly) adjacent to the side edge.
In some embodiments, the distance between the heat transfer module and the first air-out side of the first heat dissipation fin is increased by the space of the receded space of the first air-out side, in addition to the space for the first electronic component to be disposed. Therefore, the system air flow can be blown into the space between the heat transfer module and the first radiating fins more easily, waste heat brought to the first air outlet side by the air flow is not easy to accumulate between the heat transfer module and the first radiating fins, the heat exchange between the heat transfer module and air blown by the system air flow can be promoted, and the respective heat dissipation capacities of the heat transfer module and the first radiating fins are further ensured.
Although the present invention has been described with reference to the foregoing embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. A motherboard assembly, comprising:
the circuit board is provided with a first side and a second side which are opposite;
the first processing chip is arranged on the circuit board;
the second processing chip is arranged on the circuit board and is positioned between the first processing chip and the second side of the circuit board;
the first electronic element is arranged on the circuit board and is positioned between the first processing chip and the first side of the circuit board; and
a first heat dissipation module, comprising:
a first base in thermal contact with the first processing chip, the first base having a side edge on a side thereof adjacent to the first side of the circuit board, the side edge being adjacent to the first electronic component; and
the first heat dissipation fin is arranged and in thermal contact with the first base, the first heat dissipation fin is provided with a first air inlet side and a first air outlet side which are opposite, the first air inlet side is positioned between the first air outlet side and the second side of the circuit board and is used for blowing an air flow into the first heat dissipation fin, and the first air outlet side is positioned between the first electronic element and the second side and keeps a distance with the side edge of the first base.
2. The motherboard assembly of claim 1, wherein the distance between the first air-out side of the first cooling fin and the side edge of the first base is 10 mm to 20 mm.
3. The motherboard assembly of claim 1, further comprising at least one system airflow generating device disposed on the second side of the circuit board, the at least one system airflow generating device generating the airflow to the first side.
4. The motherboard assembly of claim 1, further comprising a first modular airflow generating device disposed on the first air inlet side of the first heat sink fins, the first modular airflow generating device generating the airflow toward the first air outlet side.
5. The motherboard assembly of claim 4, further comprising a second heat dissipation module and a second module airflow generating device, the second heat dissipation module comprising a second base and a second heat dissipation fin, the second base thermally contacting the second processing chip, the second heat dissipation fin disposed and thermally contacting the second base, the second heat dissipation fin having a second air inlet side and a second air outlet side opposite to each other, the second air inlet side being located between the second air outlet side and the second side of the circuit board, the second module airflow generating device disposed on the second air inlet side of the second heat dissipation fin, and the second module airflow generating device generating another airflow to the second air outlet side.
6. The motherboard assembly of claim 5, wherein the second base has a side edge on a side thereof close to the first side of the circuit board, the second air-out side of the second heat sink fins is located between the side edge and the second side and keeps the same distance with the side edge of the second base as the distance.
7. The motherboard assembly of claim 1, wherein the first heat dissipation module further comprises at least one heat dissipation tube, the at least one heat dissipation tube comprising a condensation section and an evaporation section connected, the condensation section passing through and in thermal contact with the first heat dissipation fin, and the evaporation section passing through and in thermal contact with the first base.
8. The motherboard assembly of claim 1 further comprising a second electronic component disposed on the circuit board, the second electronic component being positioned between the first electronic component and the first side of the circuit board, and a heat transfer module in thermal contact with the second electronic component and spaced apart from the first heat fins.
9. A heat dissipation module, comprising:
a base for thermally contacting a heat source, the base having a side edge on one side; and
the heat dissipation fin is arranged and in thermal contact with the base, the heat dissipation fin is provided with an air inlet side and an air outlet side which are opposite, the air inlet side is used for blowing an air flow into the heat dissipation fin, and the air outlet side is positioned between the lateral edge and the air inlet side and keeps a distance with the lateral edge of the base.
10. The heat dissipating module of claim 9, wherein the distance between the air outlet side of the heat dissipating fins and the side edge of the base is 10 mm to 20 mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109141426A TWI742942B (en) | 2020-11-25 | 2020-11-25 | Motherboard assembly and heat dissipation module |
| TW109141426 | 2020-11-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114546071A true CN114546071A (en) | 2022-05-27 |
| CN114546071B CN114546071B (en) | 2023-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110045596.7A Active CN114546071B (en) | 2020-11-25 | 2021-01-13 | Motherboard assembly and heat dissipation module |
Country Status (2)
| Country | Link |
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| CN (1) | CN114546071B (en) |
| TW (1) | TWI742942B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWM298878U (en) * | 2006-04-11 | 2006-10-01 | Golden Sun News Tech Co Ltd | Heat dissipation device having diversion structure |
| TWM400194U (en) * | 2010-09-14 | 2011-03-11 | Portwell Inc | Dual central processing unit and heat dissipating architecture |
| TWM457219U (en) * | 2013-03-25 | 2013-07-11 | Inventec Corp | Heat sink and server using the same |
| CN103793030A (en) * | 2012-10-30 | 2014-05-14 | 英业达科技有限公司 | Electronic device |
| TW201421218A (en) * | 2012-11-28 | 2014-06-01 | Inventec Corp | Thermal dissipating module and electronic device |
| CN104345848A (en) * | 2013-08-09 | 2015-02-11 | 英业达科技有限公司 | Server and radiating system thereof |
| TW201508455A (en) * | 2013-08-28 | 2015-03-01 | Inventec Corp | Server and heat dissipation assembly thereof |
| TWM499745U (en) * | 2014-10-24 | 2015-04-21 | Aic Inc | Heat sink module and heat sink thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5920074B2 (en) * | 2012-07-12 | 2016-05-18 | 富士通株式会社 | Cooling method of electronic equipment and heat generating parts |
-
2020
- 2020-11-25 TW TW109141426A patent/TWI742942B/en active
-
2021
- 2021-01-13 CN CN202110045596.7A patent/CN114546071B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM298878U (en) * | 2006-04-11 | 2006-10-01 | Golden Sun News Tech Co Ltd | Heat dissipation device having diversion structure |
| TWM400194U (en) * | 2010-09-14 | 2011-03-11 | Portwell Inc | Dual central processing unit and heat dissipating architecture |
| CN103793030A (en) * | 2012-10-30 | 2014-05-14 | 英业达科技有限公司 | Electronic device |
| TW201421218A (en) * | 2012-11-28 | 2014-06-01 | Inventec Corp | Thermal dissipating module and electronic device |
| TWM457219U (en) * | 2013-03-25 | 2013-07-11 | Inventec Corp | Heat sink and server using the same |
| CN104345848A (en) * | 2013-08-09 | 2015-02-11 | 英业达科技有限公司 | Server and radiating system thereof |
| TW201508455A (en) * | 2013-08-28 | 2015-03-01 | Inventec Corp | Server and heat dissipation assembly thereof |
| TWM499745U (en) * | 2014-10-24 | 2015-04-21 | Aic Inc | Heat sink module and heat sink thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI742942B (en) | 2021-10-11 |
| TW202221457A (en) | 2022-06-01 |
| CN114546071B (en) | 2023-10-03 |
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