M40019.4 五、新型說明： 【新型所屬之技術領域】 本創作係一種具有雙中央處理器之電腦設備及其散熱架構，其係一種 將具有雙中央處理器之電腦設備所產生之熱源作有效之散熱處理，而不使 熱源滯留在該等中央處理器及主機板上相關電子元件周園，而能迅速排放 至外界，進而達到極佳之散熱效率者。 【先前技術】 按，現今工業電腦市場，越來越追求高效能的應用，PICMG架構的雙中 • 央處理器（Dual CPU)之單板電腦，已為特定需求之應用。在市場上有許多 相關的產品，也因為主機板上搭載高效能的雙中央處理器，而讓其系統散 熱更成為一大瓶頸。M40019.4 V. New Description: [New Technology Field] This is a computer device with dual central processing unit and its heat dissipation architecture, which is a kind of heat source generated by computer equipment with dual central processing unit. The heat dissipation process does not cause the heat source to stay in the central electronic device and the related electronic components on the motherboard, and can be quickly discharged to the outside world, thereby achieving excellent heat dissipation efficiency. [Prior Art] According to the current industrial computer market, more and more high-performance applications are being pursued. The single-chip computer of the dual CPU of the PICMG architecture has been applied for specific needs. There are many related products on the market, and because the high-performance dual-central processor is mounted on the motherboard, the heat dissipation of the system becomes a major bottleneck.
Intel於去年開始陸續發佈了新架構的晶片組，以處理器（中央處理 器Η晶片（Chipset)的架構取代過去北橋(North Bridget南橋(South BridgeH處理器（中央處理器）的架構。intei將記憶體(Mem〇ry)與繪圖晶片 (Graphic)整合至處理器（令央處理器）中，這也讓處理器（中央處理器）的尺 寸較以往來的大許多，以致PICMG雙中央處理器架構的單板電腦，已無法 φ 如同過去的設計上下兩兩並排，並使用2合1的散熱器(Cooler)» 現今一般習知雙中央處理器之散熱架構，請参照第1圖所示，係將該 等雙中央處理器200分別獨立安裝在一主機板1〇〇上，該等中央處理器2〇〇 並在同一直線上’且該等中央處理器2〇〇上分別設置有散熱模組3〇〇，該等 散熱模組300上分別設置一風扇4〇〇，此種裝置構造，因該等中央處理器 200併列在同一直線上，如此在安裝散熱模組300時，會因安裝位置間距離 較小，而產生礙手現象，非常不便，且在散熱時，因同時吸入相同週遭空 間之冷空風，產生相互干擾，而造成散熱效果不彰。 参照第2圖所示’為另一種習用裝置示意圖，其主要係將雙中央處理 器200併列在一主機板600上，並使用連續式之散熱模組5⑽一起搁置在 3 M400194 個別的中央處理器200上，如此，雖減少一些安裝時之礙手現象，但對於 散熱時，會同時吸入相同週遭空間之冷空風，而產生相互干擾之問題仍無 法有效解決’而且該等中央處理器200係併列在一起，所以，會有偏重主 機板600某塊區域的問題產生，造成主機板6〇〇重量不平均，且會讓熱源 集中在某一區域上，造成散熱效果不好。 【新型内容】 為改進上述習用裝置、構造之各種缺點，創作人經過長久努力研究與 實驗，终於開發設計出本創作之雙中央處理器及其散熱架構。 本創作之一目的’在使該等中央處理器所產生之熱源能有效向外界排 本創作之再一目的，在使該主機板保持一定平衡，不致發生失重之情 形。 本創作為達到上述目的所採用之技術手段包括：一主機板，該主機板 上設有兩個互相交錯之排列方式之中央處理器，且該等中央處理器間保持 一定距離，使主機板保持一定平衡，不致發生失重之情形，且該等中央處 理器上分別設有散熱模組；如此，可因該等散熱模組係呈互相交錯排列方 式，使外界之冷空氣較不會互相干擾，而能迅速將該雙中央處理器所產生 之熱源向外傳導散發至外界去，且因雙中央處理器間有保持一定距離，而 使安裝容易，且能得到較習知更大的有效散熱面積。 本創作之進一步手段包括：其散熱模組一側安裝有風扇，該風扇係將 外界之冷空氣以與該主機板平行延伸方向吹向該散熱模組，並藉由該外殼 形成一散熱風道，再者，該等外殼中設有排列整齊之散熱鰭片，該等散熱 鰭片係與該風扇所產生之風流動方向呈平行狀排列且保持一定間隙，使熱 源在該外殼限制下，可以水平方向移動。 【實施方式】 為使能對本創作之目的、形狀、構造、裝置、特徵及其功效，作更進Intel began to release a new architecture chipset last year, replacing the North Bridge (South BridgeH processor (Central Processing Unit) architecture with a processor (Chipset) architecture. Intei will remember The integration of the body (Mem〇ry) and the graphics chip (Graphic) into the processor (the central processor), which also makes the size of the processor (central processing unit) much larger than before, so that the PICMG dual central processor architecture The single board computer can't be φ like the past design side by side, and use 2 in 1 radiator (Cooler)» Today's general known dual CPU cooling structure, please refer to Figure 1, the system The dual central processing units 200 are separately mounted on a motherboard 1 , and the central processing units are disposed on the same line and the central processing units 2 are respectively provided with heat dissipation modules. 3〇〇, the heat dissipation module 300 is respectively provided with a fan 4〇〇. The device structure is configured such that the central processing unit 200 is juxtaposed on the same line, so that when the heat dissipation module 300 is installed, the installation position is The distance is small, and it is very inconvenient, and when the heat is dissipated, the cold air of the same surrounding space is simultaneously sucked, causing mutual interference, and the heat dissipation effect is not good. Refer to FIG. 2 as another The schematic diagram of the conventional device mainly includes the dual central processing unit 200 juxtaposed on a motherboard 600, and is placed on the 3 M400194 individual central processing unit 200 together with the continuous heat dissipation module 5 (10), thus reducing some installation time. It is a hindrance to the hand phenomenon, but for the heat dissipation, the cold air of the same surrounding space will be inhaled at the same time, and the problem of mutual interference cannot be effectively solved. And the central processing units 200 are juxtaposed together, so there will be a biased host. The problem of a certain area of the board 600 is generated, causing the weight of the motherboard 6 to be uneven, and the heat source is concentrated on a certain area, resulting in poor heat dissipation. [New content] In order to improve various disadvantages of the above-mentioned conventional devices and structures After long-term research and experiment, the creator finally developed and designed the dual CPU and its heat dissipation architecture of the creation. One purpose is to make the main board maintain a certain balance in the purpose of enabling the heat source generated by the central processing units to be effectively copied to the outside world, so that the weight loss is not caused. The technical means comprises: a motherboard having two central processors arranged in an interlaced manner, and maintaining a certain distance between the central processors, so that the motherboard maintains a certain balance, and no weight loss occurs. And the heat dissipation modules are respectively disposed on the central processing units; thus, the heat dissipation modules are arranged in a staggered manner so that the cold air of the outside does not interfere with each other, and the dual central processing can be quickly processed. The heat source generated by the device is radiated to the outside, and because of the distance between the dual central processing units, the installation is easy, and a more effective effective heat dissipation area can be obtained. A further method of the present invention includes: a fan is mounted on one side of the heat dissipation module, and the fan blows cold air outside to the heat dissipation module in a direction parallel to the motherboard, and forms a heat dissipation channel by the outer casing. Furthermore, the housings are provided with neatly arranged heat dissipation fins which are arranged in parallel with the direction of wind flow generated by the fan and maintain a certain gap so that the heat source can be restricted by the outer casing. Move in the horizontal direction. [Embodiment] In order to enable the purpose, shape, structure, device, features and functions of the present creation,