TWI742942B - Motherboard assembly and heat dissipation module - Google Patents

Abstract

A motherboard assembly includes a circuit board, a first processing chip, a second processing chip, an electronic component and a heat dissipation module. The electronic component, the first processing chip and the second processing chip are sequentially disposed on the circuit board from a first side to a second side of the circuit board. The heat dissipation module includes a base and a heat sink. The base is in thermal contact with the first processing chip and has a side edge adjacent to the electronic component at a side thereof close to the first side. The heat sink is disposed on and in thermal contact with the base. The heat sink has an inhale side and an exhale side that are opposite to each other. The inhale side is located between the exhale side and the second side of the circuit board and is configured for an airflow to flow into the heat sink. The exhale side is located between the electronic component and the second side and is spaced apart from the side edge of the base.

Description

Motherboard components and cooling modules

The present invention relates to a main board assembly and a heat dissipation module, in particular to a heat dissipation module with a distance between the air outlet side of the heat dissipation fin and the side edge of the base, and a main board assembly containing the same.

With the advancement of science and technology, computers tend to be miniaturized in order to gain the favor of consumers. Incidentally, computer motherboards tend to be densely arranged, and the distances between various electronic components are quite close to save the use space of the motherboard. In addition, in order to avoid the problem that the waste heat generated by the operation of the electronic components is not easily dissipated due to the narrow configuration space, heat dissipation fins are also provided and air flow is provided to increase the heat exchange to the surrounding air.

However, in the area adjacent to the air outlet side of the radiating fins, because it is directly exposed to the heat brought by the wind flow, the hot air is easy to accumulate in this area, and it is difficult to exchange heat with the surrounding air. If this area is equipped with electronic components, the waste heat generated during the operation of the electronic components may be multiplied by the heat generated by the wind current, which may cause the electronic components to easily exceed the upper limit of the temperature that they can withstand.

The present invention is to provide a motherboard assembly and a heat dissipation module, so as to solve the problem of heat accumulation in the area adjacent to the air outlet side of the heat dissipation fin.

The motherboard assembly disclosed in an embodiment of the present invention includes a circuit board, a first processing chip, a second processing chip, a first electronic component, and a first heat dissipation module. The circuit board has a first side and a second side opposite to each other. The first processing chip is arranged on the circuit board. The second processing wafer is arranged on the circuit board, and the second processing wafer is located between the first processing wafer and the second side of the circuit board. The first electronic component is arranged on the circuit board, and the first electronic component is located between the first processing chip and the first side of the circuit board. The first heat dissipation module includes a first base and a first heat dissipation fin. The first base is in thermal contact with the first processing chip, and the first base has a side edge on a side close to the first side of the circuit board. The side edge is adjacent to the first electronic component. The first heat dissipation fins are arranged and are in thermal contact with the first base. The first heat dissipation fin has a first wind inlet side and a first wind outlet side opposite to each other. The first air inlet side is located between the first air outlet side and the second side of the circuit board and is used for blowing an air current into the first heat dissipation fins. The first air outlet side is located between the first electronic component and the second side and maintains a distance from the side edge of the first base.

The heat dissipation module disclosed in another embodiment of the present invention includes a base and a heat dissipation fin. The base is used for thermally contacting a heat source, and the base has a side edge on one side. The heat dissipation fins are arranged and are in thermal contact with the base. The radiating fin has an opposite wind inlet side and a wind outlet side. The air inlet side is used for a wind flow to blow into the first heat dissipation fin. The air outlet side is located between the side edge and the air inlet side and keeps a distance from the side edge of the base.

According to the motherboard assembly and the heat dissipation module disclosed in the above embodiments, the space between the first air outlet side of the first heat dissipation fin and the side edge of the first base is kept at a distance, which is brought to the first outlet by the air current. The waste heat on the wind side can escape to the left and right sides in the space between the first air outlet side and the side edges, and exchange heat with the air blown by the system wind flow, instead of accumulating waste heat on the adjacent side edges On the components (such as the first electronic component in the motherboard assembly).

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

The following will describe an embodiment of the present invention, please refer to FIG. 1 and FIG. 2, where FIG. 1 is a schematic diagram of the configuration of the motherboard assembly 10 according to an embodiment of the present invention, and FIG. 2 is FIG. 1 A partial exploded schematic diagram of the motherboard assembly 10 of FIG. In this embodiment, the motherboard assembly 10 includes a circuit board 100, a first processing chip 200, a second processing chip 300, a first electronic component 400 and a first heat dissipation module 500. The circuit board 100 is configured to be disposed in a casing (not shown separately), and the circuit board 100 has a first side 101 and a second side 102 opposite to each other. There is a system air flow AF0 in the casing blowing from the second side 102 of the circuit board 100 to the first side 101. Generally speaking, the first side 101 is, for example, behind the motherboard assembly 10, and the second side 102 is, for example, the motherboard assembly. 10 ahead.

The first processing wafer 200 is, for example, a heat source such as a central processing unit (CPU), which generates a lot of waste heat during operation. The first processing wafer 200 is disposed on the circuit board 100. The second processing chip 300 is, for example, another central processing unit, and is disposed on the circuit board 100. The second processing wafer 300 is located between the first processing wafer 200 and the second side 102 of the circuit board 100. Since the motherboard assembly 10 is provided with the first processing wafer 200 and the second processing wafer 300, for example, a dual CPU system is formed. The first electronic component 400 is, for example, a choke and is disposed on the circuit board 100. The first electronic component 400 is located between the first processing wafer 200 and the first side 101 of the circuit board 100. The second processing wafer 300, the first processing wafer 200 and the first electronic component 400 are sequentially arranged in the blowing direction of the system air flow AF0 from the second side 102 to the first side 101 of the circuit board 100.

The first heat dissipation module 500 includes a first base 510 and a first heat dissipation fin 520. The first base 510 thermally contacts the first processing wafer 200 to absorb waste heat generated during the operation of the first processing wafer 200. The first base 510 has a side edge 511 on a side close to the first side 101 of the circuit board 100. The side edge 511 is adjacent to the first electronic component 400. The first heat dissipation fins 520 are arranged and thermally contact the first base 510 to absorb the waste heat transferred to the first base 510. The first heat dissipation fin 520 has a first air inlet side 521 and a first air outlet side 522 opposite to each other. The first air inlet side 521 is located between the first air outlet side 522 and the second side 102 of the circuit board 100 and is used for blowing an air flow AF1 into the first heat dissipation fin 520. The air flow AF1 blows from the first air inlet side 521 to the first air outlet side 522, and also takes away the waste heat absorbed by the first heat dissipation fins 520, so as to achieve the effect of dissipating heat to the first processing chip 200.

The first air outlet side 522 is located between the first electronic component 400 and the second side 102 of the circuit board 100, and the first air outlet side 522 and the side edge 511 of the first base 510 maintain a distance D. The distance D is, for example, between 10 mm and 20 mm.

In this embodiment and some embodiments of the present invention, the motherboard assembly 10 may further include three system airflow generating devices 600, for example. The system air flow generating device 600 is configured to be installed in the casing and located on the second side 102 of the circuit board 100. The system air flow generating device 600 blows from the second side 102 to the first side 101 to generate the aforementioned system air flow AF0 to the main board assembly 10, and the system air flow AF0 includes the aforementioned air flow AF1 blowing to the first air inlet side 521.

In this embodiment and some embodiments of the present invention, the motherboard assembly 10 may further include a first module airflow generating device 700. The first modular airflow generating device 700 is disposed on the first air inlet side 521 of the first heat dissipation fin 520, so as to generate the airflow AF1 on the first airflow side 521 together with the system airflow generating device 600, thereby further strengthening the waste The effect of the tropics towards the first wind side 522.

It is worth noting that the above-mentioned air flow AF1 is provided by the system air flow generating device 600 and the first modular air flow generating device 700 together, but the present invention is not limited to this. In some embodiments, one of the system airflow generating device 600 and the first modular airflow generating device 700 can be selected, so that the airflow AF1 is only provided by the system airflow generating device 600 or the first modular airflow generating device 700 alone. In addition, the number of system wind flow generating devices 600 is not limited to three. In some embodiments, only one or two system wind flow generating devices 600 may be configured, or more than four system wind flow generating devices 600 may be configured.

In this embodiment and some embodiments of the present invention, the motherboard assembly 10 may further include a second electronic component 800 and a heat transfer module 900. The second electronic component 800 is, for example, a metal oxide half field effect transistor (MOSFET), and is disposed on the circuit board 100. The second electronic component 800 is located between the first electronic component 400 and the first side 101 of the circuit board 100 and is adjacent to the first electronic component 400. The heat transfer module 900 is, for example, a heat transfer fin, and thermally contacts the second electronic component 800 to absorb waste heat generated during the operation of the second electronic component 800 and exchange heat with the surrounding air.

In this embodiment and some embodiments of the present invention, in order to achieve the effect of dissipating heat for the second processing chip 300, the motherboard assembly 10 may further include a second heat dissipation module 1000 and a second module airflow generating device 1100. The second heat dissipation module 1000 includes a second base 1010 and a second heat dissipation fin 1020. The second base 1010 thermally contacts the second processing wafer 300 to absorb waste heat generated during the operation of the second processing wafer 300. The second heat dissipation fins 1020 are arranged and thermally contact the second base 1010 to absorb the waste heat transferred to the second base 1010. The second heat dissipation fin 1020 has a second air inlet side 1021 and a second air outlet side 1022 opposite to each other. The second air inlet side 1021 is located between the second air outlet side 1022 and the second side 102 of the circuit board 100. The second module airflow generating device 1100 generates another airflow AF2 to the second air outlet side 1022 to take away the waste heat absorbed by the second heat dissipation fin 1020, so as to achieve the effect of dissipating heat to the second processing chip 300.

In this embodiment and some embodiments of the present invention, the second base 1010 has a side edge 1011 on the side close to the first side 101 of the circuit board 100. The second air outlet side 1022 of the second heat dissipation fin 1020 is located between the side edge 1011 and the second side 102, and the second air outlet side 1022 and the side edge 1011 of the second base 1010 maintain the same distance as the distance D. Thereby, the structure of the second heat dissipation module 1000 can be substantially the same as that of the first heat dissipation module 500. When assembling the first heat dissipation module 500 and the second heat dissipation module 1000, the time for sorting parts can be saved. And speed up the overall manufacturing process. However, the present invention is not limited to this. In some embodiments, the second air outlet side of the second heat dissipation fin can also be aligned with the side edge of the second base to fully extend the heat dissipation area of the second heat dissipation fin.

By maintaining a distance D between the first air outlet side 522 of the first heat dissipation fin 520 and the side edge 511 of the first base 510, the waste heat carried by the air flow AF1 to the first air outlet side 522 can be The space between the first air outlet side 522 and the side edge 511 escapes towards the left and right sides (as shown by the arrow direction DF in Figure 1), and exchanges heat with the air blown by the system air flow AF0, without The waste heat is accumulated on the first electronic component 400. In this way, the first electronic component 400 can be maintained below the critical temperature during the operation of the system and can operate normally. The critical temperature of the first electronic component 400 is, for example, 90 degrees Celsius. If the temperature of the first electronic component 400 exceeds its critical temperature, the efficiency may decrease or even be damaged.

Between the heat transfer module 900 and the first air outlet side 522 of the first heat dissipating fin 520, in addition to the space originally provided for the first electronic component 400, there is also a space where the first air outlet side 522 is retracted by a distance D Space, and increase the distance between each other. In this way, the system air flow AF0 can be more easily blown into the space between the heat transfer module 900 and the first heat dissipation fin 520, which not only ensures that the above-mentioned waste heat brought by the air flow AF1 to the first air outlet side 522 is not easy to accumulate in Between the heat transfer module 900 and the first heat dissipation fin 520, it can also promote the heat transfer module 900 to exchange heat with the air blown by the system air flow AF0, thereby ensuring the heat transfer module 900 and the first heat dissipation fin 520's respective heat dissipation capacity.

The following table shows the temperature measurement data of the three configurations when the first heat dissipation module 500 adopts the interval D and the second heat dissipation module 1000 adopts the same interval as the interval D when the system ambient temperature is 35 degrees Celsius. It can be seen from the table that the working temperature of the first electronic component 400 and the second electronic component 800 both decrease, especially the working temperature of the first electronic component 400 drops below the critical temperature (90 degrees Celsius).

Spacing D 10 mm 15 mm 20 mm 0 mm (control group) Working temperature of second processing wafer 300 77 degrees Celsius 78 degrees Celsius 78 degrees Celsius 76 degrees Celsius 300 power of second processing wafer 204.52 watts 204.63 watts 204.54 watts 204.21 watts Working temperature of the first processing wafer 200 84 degrees Celsius 85 degrees Celsius 88 degrees Celsius 82 degrees Celsius First processing wafer 200 power 204.67 watts 204.28 watts 204.31 watts 204.8 watts 800 working temperature of the second electronic component 74.8 degrees Celsius 72.8 degrees Celsius 73.9 degrees Celsius 75.5 degrees Celsius Operating temperature of the first electronic component 400 89.4 degrees Celsius 86.4 degrees Celsius 84 degrees Celsius 91.4 degrees Celsius System air flow generator 600 air outlet temperature 39.9 degrees Celsius 39.1 degrees Celsius 38.5 degrees Celsius 39.2 degrees Celsius Second air outlet side 1022 temperature 45.5 degrees Celsius 46.5 degrees Celsius 49.5 degrees Celsius 48.1 degrees Celsius The first wind side 522 temperature 54.3 degrees Celsius 54.3 degrees Celsius 61.1 degrees Celsius 52.1 degrees Celsius The second module wind flow generator 1100 speed 9100 rpm 9000 rpm 9000 rpm 9200 rpm 700 speed of the first module wind flow generator 9500 rpm 9500 rpm 9400 rpm 9500 rpm The first system wind flow generator 600 speed 5700 rpm 5700 rpm 5700 rpm 5700 rpm The second system wind flow generator 600 speed 5600 rpm 5600 rpm 5600 rpm 5600 rpm The third system wind flow generator 600 speed 5500 rpm 5500 rpm 5500 rpm 5500 rpm Thermal resistance of the second processing chip 300 0.1814 Celsius/W 0.1901 Celsius/W 0.1931 Celsius/W 0.1802 Celsius/W 200 thermal resistance of the first processing chip 0.1881 Celsius/W 0.1885 Celsius/W 0.1884 Celsius/W 0.1704 Celsius/W

In this embodiment and some embodiments of the present invention, the first heat dissipation module 500 may further include four heat dissipation pipes 530, for example. Each heat dissipation pipe 530 includes a condensing section 531 and an evaporation section 532 connected to each other. The condensing section 531 passes through and thermally contacts the first heat dissipation fin 520, and the evaporation section 532 passes through and thermally contacts the first base 510. Thereby, the radiating pipe 530 can absorb the waste heat transferred to the first base 510 through the evaporation section 532, and transfer the waste heat to the condensing section 531 before being taken away by the first radiating fins 520, thereby enhancing the above-mentioned transfer from the first base 510 The waste heat reaches the effect of the first heat dissipation fin 520.

According to the motherboard assembly and the heat dissipation module of the above-mentioned embodiment, the first air outlet side of the first heat dissipation fin and the side edge of the first base are arranged at a distance between them, which is brought to the first air outlet side by the wind current. The waste heat can be dissipated towards the left and right sides in the space between the first air outlet side and the side edge, and exchange heat with the air blown by the system wind flow, without the waste heat being accumulated on the components adjacent to the side edge On (such as the first electronic component in the motherboard assembly).

In some embodiments, between the heat transfer module and the first air outlet side of the first heat dissipation fin, in addition to the space originally provided for the first electronic component, there is also a space that is retracted by the first air outlet side. Space, and increase the distance between each other. In this way, the system air flow can be more easily blown into the space between the heat transfer module and the first heat dissipation fin, which not only ensures that the above-mentioned waste heat brought by the air flow to the first air outlet side is not easy to accumulate in the heat transfer module and Between the first heat dissipation fins, the heat transfer module can also be promoted to exchange heat with the air blown by the system wind flow, thereby ensuring the respective heat dissipation capabilities of the heat transfer module and the first heat dissipation fins.

Although the present invention is disclosed in the foregoing embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

10: Motherboard components 100: circuit board 101: first side 102: second side 200: first processing wafer 300: second processing wafer 400: The first electronic component 500: The first heat dissipation module 510: The first base 511: Side Edge 520: The first cooling fin 521: first wind side 522: first wind side 530: heat pipe 531: Condensing section 532: Evaporation section 600: System wind flow generator 700: The first module wind flow generating device 800: second electronic component 900: Heat transfer module 1000: The second heat dissipation module 1010: Second base 1011: side edge 1020: second heat sink fin 1021: Second inlet side 1022: second wind side 1100: The second module air flow generating device AF0: System wind flow AF1, AF2: Merry D: spacing DF: arrow direction

FIG. 1 is a schematic diagram showing the configuration of a motherboard assembly according to an embodiment of the present invention. FIG. 2 is a partial exploded schematic diagram of the main board assembly of FIG. 1.

10: Motherboard components

100: circuit board

101: first side

102: second side

400: The first electronic component

511: Side Edge

520: The first cooling fin

521: first wind side

522: first wind side

600: System wind flow generator

700: The first module wind flow generating device

900: Heat transfer module

1011: side edge

1020: second heat sink fin

1021: Second inlet side

1022: second wind side

1100: The second module air flow generating device

AF0: System wind flow

AF1, AF2: Merry

D: spacing

DF: arrow direction

Claims (10)

A main board assembly includes: a circuit board having a first side and a second side opposite to each other; a first processing chip arranged on the circuit board; a second processing chip arranged on the circuit board, the first processing chip Two processing chips are located between the first processing chip and the second side of the circuit board; a first electronic component is located on the circuit board, and the first electronic component is located on the first processing chip and the circuit board. Between the first side; and a first heat dissipation module, including: a first base, thermally contacting the first processing chip, the first base having a side edge on a side close to the first side of the circuit board , And the side edge is adjacent to the first electronic component; and a first heat dissipating fin disposed and thermally contacting the first base, the first heat dissipating fin has an opposite first air inlet side and a first outlet On the wind side, the first air inlet side is located between the first air outlet side and the second side of the circuit board and is used for a wind flow to blow into the first heat dissipation fin, and the first air outlet side is located Between the first electronic component and the second side, the length of the first air outlet side of the first heat dissipation fin is less than the length of the side edge of the first base and is kept with the side edge of the first base One pitch. The motherboard assembly according to claim 1, wherein the distance between the first air outlet side of the first heat dissipation fin and the side edge of the first base is 10 mm to 20 mm. The motherboard assembly according to claim 1, further comprising at least one system airflow generating device, the at least one system airflow generating device is disposed on the second side of the circuit board, and the at least one system airflow generating device faces the first The wind flow is generated on the side. The motherboard assembly according to claim 1, further comprising a first modular airflow generating device, the first modular airflow generating device is disposed on the first air inlet side of the first heat dissipation fin, and the first The module air flow generating device generates the air flow to the first air outlet side. The motherboard assembly according to claim 4, further comprising a second heat dissipation module and a second module airflow generating device, the second heat dissipation module includes a second base and a second heat dissipation fin, the second heat dissipation module includes a second base and a second heat dissipation fin. Two bases are in thermal contact with the second processing chip, the second heat dissipating fin is arranged and in thermal contact with the second base, and the second heat dissipating fin has a second air inlet side and a second air outlet side opposite to each other. The second air inlet side is located between the second air outlet side and the second side of the circuit board, the second module airflow generating device is arranged on the second air inlet side of the second heat dissipation fin, and the The second module airflow generating device generates another airflow toward the second air outlet side. The motherboard assembly according to claim 5, wherein the second base has a side edge on a side close to the first side of the circuit board, and the second air outlet side of the second heat dissipation fin is located on the side The distance between the edge and the second side and the side edge of the second base is the same as the distance. The motherboard assembly according to claim 1, wherein the first heat dissipation module further includes at least one heat pipe, and the at least one heat pipe includes a cold A condensation section and an evaporation section, the condensation section passes through and thermally contacts the first heat dissipation fin, and the evaporation section passes through and thermally contacts the first base. The motherboard assembly according to claim 1, further comprising a second electronic component and a heat transfer module, the second electronic component is disposed on the circuit board, and the second electronic component is located between the first electronic component and the circuit Between the first sides of the board, the heat transfer module thermally contacts the second electronic component and keeps a distance from the first heat dissipation fin. A heat dissipation module includes: a base for thermally contacting a heat source, the base having a side edge on one side; and a heat dissipation fin disposed and thermally contacting the base, the heat dissipation fin having an opposite inlet The wind side and an outlet side, the inlet side is used for a wind flow to blow into the radiating fin, the outlet side is located between the side edge and the inlet side, the outlet side of the radiating fin The length is less than the length of the side edge of the base and maintains a distance from the side edge of the base. The heat dissipation module according to claim 9, wherein the distance between the air outlet side of the heat dissipation fin and the side edge of the base is 10 mm to 20 mm.

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