CN114546071B - Motherboard assembly and heat dissipation module - Google Patents
Motherboard assembly and heat dissipation module Download PDFInfo
- Publication number
- CN114546071B CN114546071B CN202110045596.7A CN202110045596A CN114546071B CN 114546071 B CN114546071 B CN 114546071B CN 202110045596 A CN202110045596 A CN 202110045596A CN 114546071 B CN114546071 B CN 114546071B
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- Prior art keywords
- base
- circuit board
- heat dissipation
- air outlet
- module
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Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 58
- 238000001704 evaporation Methods 0.000 claims description 6
- 239000003570 air Substances 0.000 description 79
- 239000002918 waste heat Substances 0.000 description 22
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a motherboard assembly and a heat dissipation module. The motherboard assembly comprises a circuit board, a first processing chip, a second processing chip, an electronic element and a heat dissipation module. The electronic element, the first processing chip and the second processing chip are sequentially arranged on the circuit board from the first side to the second side of the circuit board. The heat dissipation module comprises a base and heat dissipation fins. The base is in thermal contact with the first processing chip, and a side edge of the base, which is close to the first side, is adjacent to the electronic component. The heat dissipation fins are arranged and thermally contacted with the base. The heat dissipation fins are provided with opposite air inlet sides and air outlet sides. The air inlet side is positioned between the air outlet side and the second side of the circuit board and is used for supplying air flow to blow into the radiating fins. The air outlet side is positioned between the electronic element and the second side and keeps a distance from the side edge of the base.
Description
Technical Field
The present invention relates to a motherboard assembly and a heat dissipating module, and more particularly to a heat dissipating module with a space between an air outlet side of a heat dissipating fin and a side edge of a base, and a motherboard assembly including the same.
Background
With the progress of technology, computers have been miniaturized, and consumer favor is expected. In connection with this, computer mainboards are moving toward a dense arrangement, and the distances between the electronic components are relatively close to each other, so as to save the usage space of the mainboards. In order to avoid the problem that waste heat generated by the operation of the electronic element is not easy to be dissipated due to the narrow configuration space, the heat dissipation fins are also arranged to provide air flow so as to increase heat exchange to surrounding air.
However, in the area adjacent to the air outlet side of the heat dissipation fins, the hot air is directly received by the air flow, so that the hot air is easily accumulated in the area and is not easy to exchange heat with the surrounding air. If the electronic component is disposed in the area, the waste heat generated during operation of the electronic component may multiply with the hot air caused by the wind flow, so that the electronic component easily exceeds the upper limit of the bearable temperature.
Disclosure of Invention
The invention aims to provide a motherboard assembly and a heat dissipation module, which are used for solving the problem that hot air is easy to accumulate in a region adjacent to the air outlet side of a heat dissipation fin.
The invention discloses a motherboard assembly, which comprises a circuit board, a first processing chip, a second processing chip, a first electronic element and a first heat dissipation module. The circuit board is provided with a first side and a second side which are opposite. The first processing chip is arranged on the circuit board. The second processing chip is arranged on the circuit board and is positioned between the first processing chip and the second side of the circuit board. The first electronic element is arranged on the circuit board and is positioned between the first processing chip and the first side of the circuit board. The first heat dissipation module comprises a first base and a first heat dissipation fin. The first base is in thermal contact with the first processing chip, and has a side edge at a side close to the first side of the circuit board. The side edge is adjacent to the first electronic component. The first heat dissipation fins are arranged and thermally contacted with the first base. The first radiating fins are provided with a first air inlet side and a first air outlet side which are opposite. The first air inlet side is positioned between the first air outlet side and the second side of the circuit board and is used for supplying an air flow to blow into the first radiating fins. The first air outlet side is positioned between the first electronic element and the second side and keeps a certain distance with the side edge of the first base.
In another embodiment of the present invention, a heat dissipating module includes a base and a heat dissipating fin. The base is used for thermally contacting a heat source, and has a side edge at one side. The heat dissipation fins are arranged and thermally contacted with the base. The heat dissipation fins are provided with opposite air inlet sides and air outlet sides. The air inlet side is used for supplying an air flow to blow into the first radiating fins. The air outlet side is positioned between the side edge and the air inlet side and keeps a certain distance with the side edge of the base.
According to the motherboard assembly and the heat dissipation module disclosed in the embodiments, by the arrangement that the space between the first air outlet side of the first heat dissipation fin and the side edge of the first base is kept, the waste heat brought by the air flow to the first air outlet side can escape towards the left and right sides in the space between the first air outlet side and the side edge and exchange heat with the air blown by the system air flow, and the waste heat cannot be accumulated on the element adjacent to the side edge (such as the first electronic element in the motherboard assembly).
The foregoing description of the invention and the following description of embodiments are presented to illustrate and explain the principles of the invention and to provide a further explanation of the invention as claimed.
Drawings
Fig. 1 is a schematic configuration diagram of a motherboard assembly according to an embodiment of the invention.
Fig. 2 is a partially exploded view of the motherboard assembly of fig. 1.
The reference numerals are as follows:
10 … motherboard assembly
100 … circuit board
101 … first side
102 … second side
200 … first processing chip
300 … second processing chip
400 … first electronic component
500 … first radiating module
510 … first base
511 … side edge
520 … first radiating fin
521 … first wind inlet side
522 … first air outlet side
530 … radiating pipe
531 … condensing section
532 … evaporation section
600 … system wind flow generating device
700 … first module wind flow generating device
800 … second electronic component
900 … heat transfer module
1000 … second radiating module
1010 … second base
1011 … side edges
1020 … second radiating fin
1021 … second wind inlet side
1022 and … second air outlet side
1100 … second module wind flow generating device
AF0 … system air current
AF1, AF2 … air current
D … distance
DF … arrow direction
Detailed Description
In the following, referring to fig. 1 and 2, fig. 1 is a schematic configuration diagram of a motherboard assembly 10 according to an embodiment of the present invention, and fig. 2 is a partially exploded schematic diagram of the motherboard assembly 10 of fig. 1. In the present embodiment, the motherboard assembly 10 includes a circuit board 100, a first processing chip 200, a second processing chip 300, a first electronic component 400, and a first heat dissipation module 500. The circuit board 100 is disposed on a chassis (not shown), and the circuit board 100 has a first side 101 and a second side 102 opposite to the first side. The enclosure has a system airflow AF0 blowing from the second side 102 of the circuit board 100 to the first side 101. Generally, the first side 101 is, for example, the rear of the motherboard assembly 10, and the second side 102 is, for example, the front of the motherboard assembly 10.
The first processing chip 200 is a heat source such as a Central Processing Unit (CPU), and generates a lot of waste heat during operation. The first processing chip 200 is disposed on the circuit board 100. The second processing chip 300 is, for example, another cpu and is disposed on the circuit board 100. The second processing chip 300 is located between the first processing chip 200 and the second side 102 of the circuit board 100. The motherboard assembly 10 forms a dual CPU system due to the first processing chip 200 and the second processing chip 300. The first electronic component 400 is, for example, a Choke coil (Choke), and is disposed on the circuit board 100. The first electronic component 400 is located between the first processing chip 200 and the first side 101 of the circuit board 100. The second processing chip 300, the first processing chip 200 and the first electronic component 400 are sequentially disposed in a blowing direction of the system airflow AF0 from the second side 102 to the first side 101 of the circuit board 100.
The first heat dissipation module 500 includes a first base 510 and a first heat dissipation fin 520. The first pedestal 510 is in thermal contact with the first processing chip 200 to absorb waste heat generated during operation of the first processing chip 200. The first base 510 has a side edge 511 at a side near the first side 101 of the circuit board 100. The side edge 511 is adjacent to the first electronic element 400. The first heat sink fins 520 are disposed and thermally contacted with the first base 510 to absorb waste heat transferred to the first base 510. The first heat sink fin 520 has a first air inlet side 521 and a first air outlet side 522 opposite to each other. The first air inlet side 521 is located between the first air outlet side 522 and the second side 102 of the circuit board 100, and is used for supplying an air flow AF1 to blow into the first heat dissipation fins 520. The air flow AF1 blows from the first air inlet side 521 to the first air outlet side 522, and takes away the waste heat absorbed by the first heat dissipation fins 520, so as to achieve the effect of dissipating heat from the first processing chip 200.
The first air-out side 522 is located between the first electronic component 400 and the second side 102 of the circuit board 100, and the first air-out side 522 maintains a distance D from the side edge 511 of the first base 510. The distance D is, for example, between 10 and 20 mm.
In the present embodiment and some embodiments of the present invention, the motherboard assembly 10 may further include a number of system wind flow generating devices 600, such as three. The system airflow generating device 600 is disposed on the housing and located on the second side 102 of the circuit board 100. The system airflow generating device 600 blows from the second side 102 to the first side 101 to generate the system airflow AF0 to the motherboard assembly 10, and the system airflow AF0 includes the airflow AF1 blown to the first air inlet side 521.
In this embodiment and some embodiments of the present invention, the motherboard assembly 10 further includes a first module airflow generating device 700. The first module airflow generating device 700 is disposed on the first air inlet side 521 of the first heat dissipating fin 520, and together with the system airflow generating device 600, the first module airflow generating device 521 generates the airflow AF1 to further enhance the effect of directing the waste heat to the first air outlet side 522.
It should be noted that the wind flow AF1 is provided by the system wind flow generating device 600 and the first module wind flow generating device 700, but the invention is not limited thereto. In some embodiments, the system airflow generating device 600 and the first module airflow generating device 700 may be alternatively arranged, such that the airflow AF1 is solely provided by the system airflow generating device 600 or the first module airflow generating device 700. In addition, the number of the system wind flow generating devices 600 is not limited to three. In some embodiments, only one or two system wind flow generating devices 600 may be configured, or more than four system wind flow generating devices 600 may be configured.
In the present embodiment and some embodiments of the present invention, the motherboard assembly 10 may further include a second electronic component 800 and a heat transfer module 900. The second electronic component 800 is, for example, a Metal Oxide Semiconductor Field Effect Transistor (MOSFET), and is disposed on the circuit board 100. The second electronic component 800 is located between the first electronic component 400 and the first side 101 of the circuit board 100 and is adjacent to the first electronic component 400. The heat transfer module 900 is, for example, a heat transfer fin, and thermally contacts the second electronic component 800 to absorb waste heat generated during operation of the second electronic component 800 and exchange heat with ambient air.
In this embodiment and some embodiments of the present invention, in order to achieve the effect of dissipating heat from the second processing chip 300, the motherboard assembly 10 may further include a second heat dissipating module 1000 and a second module airflow generating device 1100. The second heat dissipation module 1000 includes a second base 1010 and a second heat dissipation fin 1020. The second mount 1010 is in thermal contact with the second processing chip 300 to absorb waste heat generated during operation of the second processing chip 300. The second heat sink fins 1020 are disposed and thermally contacted with the second base 1010 to absorb waste heat transferred to the second base 1010. The second heat sink 1020 has a second air inlet side 1021 and a second air outlet side 1022. The second wind inlet side 1021 is located between the second wind outlet side 1022 and the second side 102 of the circuit board 100. The second module airflow generating device 1100 generates another airflow AF2 to the second air outlet side 1022 to take away the waste heat absorbed by the second heat dissipation fins 1020, so as to achieve the effect of dissipating heat from the second processing chip 300.
In the present embodiment and some embodiments of the present invention, the second base 1010 has a side edge 1011 at a side close to the first side 101 of the circuit board 100. The second air-out side 1022 of the second heat sink 1020 is located between the side edge 1011 and the second side 102, and the second air-out side 1022 and the side edge 1011 of the second base 1010 maintain the same pitch as the pitch D. Therefore, the structure of the second heat dissipation module 1000 is substantially the same as that of the first heat dissipation module 500, and when assembling the first heat dissipation module 500 and the second heat dissipation module 1000, the time for classifying the parts can be saved, and the overall manufacturing process can be quickened. However, the invention is not limited thereto. In some embodiments, the second air outlet side of the second heat dissipating fin may be aligned with a side edge of the second base to fully extend the heat dissipating area of the second heat dissipating fin.
By the arrangement that the distance D is maintained between the first air outlet side 522 of the first heat dissipation fin 520 and the side edge 511 of the first base 510, the waste heat brought to the first air outlet side 522 by the air flow AF1 can escape to the left and right sides (as indicated by the arrow direction DF in fig. 1) in the space between the first air outlet side 522 and the side edge 511, and exchange heat with the air blown by the system air flow AF0, without accumulating the waste heat on the first electronic component 400. In this way, the first electronic device 400 can be maintained below the critical temperature during the system operation, so as to perform normally, wherein the critical temperature of the first electronic device 400 is, for example, 90 ℃. If the temperature of the first electronic component 400 exceeds the critical temperature, efficiency may be reduced or even damaged.
Between the heat transfer module 900 and the first air outlet side 522 of the first heat dissipating fin 520, the space between the first air outlet side 522 and the first electronic component 400 is increased by the space between the first air outlet side 522 and the first air outlet side 522. In this way, the system air flow AF0 can be blown into the space between the heat transfer module 900 and the first heat dissipation fins 520 more easily, so that not only is the waste heat brought to the first air outlet side 522 by the air flow AF1 not easily accumulated between the heat transfer module 900 and the first heat dissipation fins 520 ensured, but also the heat transfer module 900 can be promoted to exchange heat with the air blown by the system air flow AF0, and further the respective heat dissipation capacities of the heat transfer module 900 and the first heat dissipation fins 520 are ensured.
The following table shows temperature measurement data for three configurations when the first heat dissipating module 500 employs the same pitch as the pitch D and the second heat dissipating module 1000 employs the same pitch as the pitch D at 35 degrees celsius of the system ambient temperature. It can be seen from the table that the operating temperatures of the first electronic device 400 and the second electronic device 800 are both reduced, and in particular, the operating temperature of the first electronic device 400 is reduced below the critical temperature (90 degrees celsius).
In this embodiment and some embodiments of the present invention, the first heat dissipation module 500 may further include a number of heat dissipation tubes 530, such as four. Each radiating pipe 530 includes a condensing section 531 and an evaporating section 532 connected to each other. The condensing section 531 passes through and is in thermal contact with the first heat sink fins 520, and the evaporating section 532 passes through and is in thermal contact with the first base 510. Therefore, the heat dissipating tube 530 can absorb the waste heat transferred to the first base 510 through the evaporation section 532, and transfer the waste heat to the condensation section 531 and then be carried away by the first heat dissipating fins 520, so as to enhance the effect of transferring the waste heat from the first base 510 to the first heat dissipating fins 520.
According to the motherboard assembly and the heat dissipation module of the embodiments, by the arrangement that the space between the first air outlet side of the first heat dissipation fin and the side edge of the first base is kept, the waste heat brought by the air flow to the first air outlet side can escape towards the left and right sides in the space between the first air outlet side and the side edge and exchange heat with the air blown by the system air flow, and the waste heat cannot be accumulated on the element adjacent to the side edge (such as the first electronic element in the motherboard assembly).
In some embodiments, between the heat transfer module and the first air outlet side of the first heat dissipating fin, besides the space originally provided for the first electronic component, there is a space between the first air outlet side and the first air outlet side, so that the distance between the first air outlet side and the first air outlet side is increased. In this way, the system air flow can be blown into the space between the heat transfer module and the first heat dissipation fins more easily, so that not only is the waste heat brought to the first air outlet side by the air flow not easy to accumulate between the heat transfer module and the first heat dissipation fins ensured, but also the heat transfer module can be promoted to exchange heat with the air blown by the system air flow, and further the heat dissipation capability of the heat transfer module and the heat dissipation capability of the first heat dissipation fins are ensured.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, but rather, may be modified or altered somewhat by persons skilled in the art without departing from the spirit and scope of the invention.
Claims (6)
1. A motherboard assembly, comprising:
a circuit board having a first side and a second side opposite to the first side;
the first processing chip is arranged on the circuit board;
the second processing chip is arranged on the circuit board and is positioned between the first processing chip and the second side of the circuit board;
the first electronic element is arranged on the circuit board and is positioned between the first processing chip and the first side of the circuit board; and
a first heat dissipation module comprising:
a first base thermally contacting the first processing chip, wherein the first base has a side edge at a side close to the first side of the circuit board, and the side edge is adjacent to the first electronic component; and
the first radiating fins are arranged and thermally contacted with the first base, the first radiating fins are provided with a first air inlet side and a first air outlet side which are opposite, the first air inlet side is positioned between the first air outlet side and the second side of the circuit board and is used for supplying air flow to blow into the first radiating fins, and the first air outlet side is positioned between the first electronic element and the second side and keeps a distance with the side edge of the first base; wherein the distance between the first air outlet side of the first radiating fin and the side edge of the first base is 10 mm to 20 mm;
the second heat dissipation module comprises a second base and a second heat dissipation fin, the second base is in thermal contact with the second processing chip, the second heat dissipation fin is arranged and is in thermal contact with the second base, the second heat dissipation fin is provided with a second air inlet side and a second air outlet side which are opposite, the second air inlet side is positioned between the second air outlet side and the second side of the circuit board, the second module air flow generating device is arranged on the second air inlet side of the second heat dissipation fin, and the second module air flow generating device generates another air flow to the second air outlet side;
the second base is provided with a side edge at one side close to the first side of the circuit board, and the second air outlet side of the second radiating fin is positioned between the side edge and the second side and keeps the same distance with the side edge of the second base.
2. The motherboard assembly as recited in claim 1, further comprising at least one system wind flow generating device disposed on the second side of the circuit board, wherein the at least one system wind flow generating device generates the wind flow toward the first side.
3. The motherboard assembly as recited in claim 1, further comprising a first module wind flow generating device disposed on the first wind inlet side of the first heat sink fin, and the first module wind flow generating device generating the wind flow toward the first wind outlet side.
4. The motherboard assembly as recited in claim 1, wherein the first heat dissipating module further comprises at least one heat dissipating tube comprising a condensing section and an evaporating section connected to each other, the condensing section passing through and in thermal contact with the first heat dissipating fins, and the evaporating section passing through and in thermal contact with the first base.
5. The motherboard assembly of claim 1 further comprising a second electronic component disposed on the circuit board and between the first electronic component and the first side of the circuit board, and a heat transfer module in thermal contact with the second electronic component and spaced apart from the first heat sink fins.
6. A heat dissipating module, comprising:
a first heat dissipation module comprising: a first base thermally contacting the first processing chip, wherein the first base has a side edge at a side close to the first side of the circuit board, and the side edge is adjacent to the first electronic component; the first radiating fins are arranged and thermally contacted with the first base, the first radiating fins are provided with a first air inlet side and a first air outlet side which are opposite, the first air inlet side is positioned between the first air outlet side and the second side of the circuit board and is used for supplying air flow to blow into the first radiating fins, and the first air outlet side is positioned between the first electronic element and the second side and keeps a distance with the side edge of the first base; wherein the distance between the first air outlet side of the first radiating fin and the side edge of the first base is 10 mm to 20 mm;
the second heat dissipation module comprises a second base and a second heat dissipation fin, the second base is in thermal contact with the second processing chip, the second heat dissipation fin is arranged and thermally contacted with the second base, the second heat dissipation fin is provided with a second air inlet side and a second air outlet side which are opposite, the second air inlet side is positioned between the second air outlet side and the second side of the circuit board, the second module air flow generating device is arranged on the second air inlet side of the second heat dissipation fin, and the second module air flow generating device generates another air flow to the second air outlet side;
the second base is provided with a side edge at one side close to the first side of the circuit board, and the second air outlet side of the second radiating fin is positioned between the side edge and the second side and keeps the same distance with the side edge of the second base.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109141426A TWI742942B (en) | 2020-11-25 | 2020-11-25 | Motherboard assembly and heat dissipation module |
| TW109141426 | 2020-11-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114546071A CN114546071A (en) | 2022-05-27 |
| CN114546071B true CN114546071B (en) | 2023-10-03 |
Family
ID=80782608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110045596.7A Active CN114546071B (en) | 2020-11-25 | 2021-01-13 | Motherboard assembly and heat dissipation module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114546071B (en) |
| TW (1) | TWI742942B (en) |
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| TWM298878U (en) * | 2006-04-11 | 2006-10-01 | Golden Sun News Tech Co Ltd | Heat dissipation device having diversion structure |
| TWM400194U (en) * | 2010-09-14 | 2011-03-11 | Portwell Inc | Dual central processing unit and heat dissipating architecture |
| TWM457219U (en) * | 2013-03-25 | 2013-07-11 | Inventec Corp | Heat sink and server using the same |
| CN103793030A (en) * | 2012-10-30 | 2014-05-14 | 英业达科技有限公司 | Electronic device |
| TW201421218A (en) * | 2012-11-28 | 2014-06-01 | Inventec Corp | Thermal dissipating module and electronic device |
| CN104345848A (en) * | 2013-08-09 | 2015-02-11 | 英业达科技有限公司 | Server and radiating system thereof |
| TW201508455A (en) * | 2013-08-28 | 2015-03-01 | Inventec Corp | Server and heat dissipation assembly thereof |
| TWM499745U (en) * | 2014-10-24 | 2015-04-21 | Aic Inc | Heat sink module and heat sink thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5920074B2 (en) * | 2012-07-12 | 2016-05-18 | 富士通株式会社 | Cooling method of electronic equipment and heat generating parts |
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2020
- 2020-11-25 TW TW109141426A patent/TWI742942B/en active
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2021
- 2021-01-13 CN CN202110045596.7A patent/CN114546071B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM298878U (en) * | 2006-04-11 | 2006-10-01 | Golden Sun News Tech Co Ltd | Heat dissipation device having diversion structure |
| TWM400194U (en) * | 2010-09-14 | 2011-03-11 | Portwell Inc | Dual central processing unit and heat dissipating architecture |
| CN103793030A (en) * | 2012-10-30 | 2014-05-14 | 英业达科技有限公司 | Electronic device |
| TW201421218A (en) * | 2012-11-28 | 2014-06-01 | Inventec Corp | Thermal dissipating module and electronic device |
| TWM457219U (en) * | 2013-03-25 | 2013-07-11 | Inventec Corp | Heat sink and server using the same |
| CN104345848A (en) * | 2013-08-09 | 2015-02-11 | 英业达科技有限公司 | Server and radiating system thereof |
| TW201508455A (en) * | 2013-08-28 | 2015-03-01 | Inventec Corp | Server and heat dissipation assembly thereof |
| TWM499745U (en) * | 2014-10-24 | 2015-04-21 | Aic Inc | Heat sink module and heat sink thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202221457A (en) | 2022-06-01 |
| CN114546071A (en) | 2022-05-27 |
| TWI742942B (en) | 2021-10-11 |
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