US20120312509A1

US20120312509A1 - Heat dissipation device

Info

Publication number: US20120312509A1
Application number: US13/189,589
Authority: US
Inventors: Yuan Yuan; Min Li; Meng Fu
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Foxconn Technology Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Foxconn Technology Co Ltd
Priority date: 2011-06-09
Filing date: 2011-07-25
Publication date: 2012-12-13
Also published as: CN102819302A

Abstract

An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a first base, a second base placed on the first base, a fin set placed on the second base; and a heat pipe including an evaporating section sandwiched between the first base and the second base, a condensing section sandwiched between the second base and the fin set, and a connecting section interconnecting the evaporating section and the condensing section.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to heat dissipation devices, and more particularly to a heat dissipation device incorporating heat pipes.
2. Description of Related Art
Electronic components, such as central processing units (CPUs) and integrated circuit (IC) packages, comprise numerous circuits operating at high speed and generating substantial heat. Under most circumstances, it is necessary to cool the electronic components in order to maintain safe operating conditions and assure that the electronic components function properly and reliably. Typically, a finned metal heat dissipation device is attached to an outer surface of the electronic component to remove the heat therefrom. The heat absorbed by the heat dissipation device is then dissipated to ambient air.
However, as the operating speed of electronic components has been continually upgraded, increasingly, the above-described kind of conventional heat dissipation device can no longer meet the heat dissipation requirements of modern electronic components.
What is needed, therefore, is a heat dissipation device which can overcome the above-described problems.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present heat dissipation device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat dissipation device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with an exemplary embodiment of the disclosure.

FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.

FIG. 3 is an inverted, exploded view of the heat dissipation device of FIG. 1.

FIG. 4 is a front plan view of the heat dissipation device of FIG. 1.

DETAILED DESCRIPTION

Referring to FIGS. 1 and 2, a heat dissipation device in accordance with an exemplary embodiment of the disclosure is used for dissipating heat generated by an electronic component (not shown) mounted on a printed circuit board (not shown). The heat dissipation device comprises a first base 10 for thermally contacting the electronic component, a second base 20 disposed on the first base 10, a fin set 30 disposed on the second base 20, and a plurality of heat pipes 40 thermally connecting the first base 10 and the second base 20 with the fin set 30.
The first base 10 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The first base 10 has a rectangular profile. Two elongated first receiving grooves 12 are defined in a top face of the first base 10. The two first receiving grooves 12 are spaced from and parallel to each other. Two first recessed portions 14 are defined in the top face of the first base 10. The two first recessed portions 14 are located at two opposite lateral sides of the first base 10. The two first recessed portions 14 are correspondingly located adjacent to ends of the two first receiving grooves 12. In this embodiment, the first receiving grooves 12 extend along a lengthwise direction of the first base 10.
The second base 20 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The second base 20 has a rectangular profile. Two cutouts 22 are defined at two opposite lateral sides of the second base 20, respectively. The cutouts 22 are located corresponding to the recessed portions 14 of the first base 10. In other words, the cutouts 22 correspondingly face the recessed portions 14. A bottom face of the second base 20 thermally contacts the top face of the first base 10. An area of the second base 20 is larger than that of the first base 10. In this embodiment, a width of the second base 20 is equal to a length of the first base 10.
Referring to FIGS. 3 and 4 also, the fin set 30 comprises a plurality of parallel fins 32. A passage (not labeled) is defined between every two adjacent fins 32 to allow airflow therethrough. Each of the fins 32 comprises an upright sheet body, and a pair of flanges bent horizontally from a top of the sheet body and engaging the sheet body of an adjacent fin 32. A bottom face of the fin set 30 thermally contacts a top face of the second base 20. Two elongated second receiving grooves 34 are defined in the bottom face of the fin set 30. The two second receiving grooves 34 are spaced from and parallel to each other. Two second recessed portions 36 are defined in the bottom face of the fin set 30. The two second recessed portions 36 are located at two opposite lateral sides of the fin set 30. The two second recessed portions 36 are correspondingly located adjacent to ends of the two second receiving grooves 34. The two second recessed portions 36 are correspondingly communicated with the two cutouts 22 of the second base 20 and the two first recessed portions 14 of the first base 10. Each second recessed portion 36 cooperates with a corresponding cutout 22 and a corresponding first recessed portion 14 to form a receiving space.
Each of the heat pipes 40 comprises an evaporating section 44, a condensing section 46 spaced from the evaporating section 44, and a connecting section 42 interconnecting the evaporating section 44 and the condensing section 46. Each heat pipe 40 is U-shaped. The evaporating section 44 is parallel to the condensing section 46 of each heat pipe 40. Both the evaporating section 44 and the condensing section 46 of each heat pipe 40 have a semicircular transverse cross section. In this embodiment of the disclosure, there are two heat pipes 40 juxtaposed with each other. The evaporating section 44 of each heat pipe 40 is received in a corresponding first receiving groove 12 of the first base 10. The evaporating sections 44 of the heat pipes 40 are sandwiched between the first base 10 and the second base 20. Top faces of the evaporating sections 44 of the heat pipes 40 are coplanar with the top face of the first base 10. The condensing section 46 of each heat pipe 40 is received in a corresponding second receiving groove 34 of the fin set 30. The condensing sections 46 of the heat pipes 40 are sandwiched between the second base 20 and the fin set 30. Bottom faces of the condensing sections 46 of the heat pipes 40 are coplanar with the bottom face of the fin set 30. The condensing sections 46 of the heat pipes 40 are spaced from the top face of the first base 10. The connecting section 42 of each heat pipe 40 is accommodated in a corresponding receiving space.
In use of the heat dissipation device, heat absorbed by the first base 10 is transferred to the second base 20, then distributed to the fin set 30, and finally dissipated into the ambient. A thermal conductive capability between the first base 10 and the fin set 30 is enhanced via the heat pipes 40, whereby heat accumulated in the first base 10 is more quickly conducted and the heat dissipation efficiency of the heat dissipation device is thus greatly improved. Additionally, besides the electronic component mounted on the printed circuit board, there are typically other electronic components mounted on the printed circuit board nearby. The area of the first base 10 is limited to a certain extent, and is therefore able to avoiding interfering with certain other electronic components in certain applications. As the first base 10, the second base 20 and the fin set 30 are separate components, the area of the second base 20 overlapping on the first base 10 can be suitably configured for a particular application, and the size of the fin set 30 placed on the second base 20 can be suitably configured for the particular application, with no need to consider reconfiguring the other electronic components mounted on the printed circuit board.
It can be understood that, in alternative embodiments, the first base 10 can be combined with the second base 20 to form a single unitary (integrated) piece, i.e, a base module 100 (see FIG. 4). In such case, the evaporating sections 44 of the heat pipes 40 are inserted into the base module 100.
It is to be further understood that even though numerous characteristics and advantages of the present embodiment(s) have been set forth in the foregoing description, together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation device comprising:

a first base;

a second base placed on the first base;

a fin set placed on the second base; and

a heat pipe comprising an evaporating section sandwiched between the first base and the second base, a condensing section sandwiched between the second base and the fin set, and a connecting section interconnecting the evaporating section and the condensing section.

2. The heat dissipation device of claim 1, wherein a first receiving groove is defined in a top face of the first base, and the evaporating section is received in the first receiving groove.

3. The heat dissipation device of claim 2, wherein a top face of the evaporating section is coplanar with the top face of the first base.

4. The heat dissipation device of claim 2, wherein a second receiving groove is defined in a bottom face of the fin set, and the condensing section is received in the second receiving groove.

5. The heat dissipation device of claim 4, wherein the bottom face of the condensing section is coplanar with the bottom face of the fin set.

6. The heat dissipation device of claim 1, wherein a first recessed portion is defined in the top face of the first base, a cutout is defined in the second base, a second recessed portion is defined in the bottom face of the fin set, and the first recessed portion communicated with the cutout and the second recessed portion, thereby forming a receiving space.

7. The heat dissipation device of claim 6, wherein the connecting section is accommodated in the receiving space.

8. The heat dissipation device of claim 1, wherein an area of the second base is larger than that of the first base.

9. The heat dissipation device of claim 8, wherein the first base and the second base are both rectangular, and a width of the second base is equal to a length of the first base.

10. The heat dissipation device of claim 1, wherein the heat pipe is U-shaped, and the evaporating section is parallel to the condensing section.

11. The heat dissipation device of claim 1, wherein the fin set comprises a plurality of parallel fins engaging with each other.

12. A heat dissipation device comprising:

a base module, the base module comprising a first base and a second base disposed on the first base;

a fin set placed on the second base of the base module; and

a heat pipe comprising an evaporating section inserted into the base module, a condensing section thermally contacting the fin set, and a connecting section interconnecting the evaporating section and the condensing section.

13. The heat dissipation device of claim 12, wherein the evaporating section is sandwiched between the first base and the second base.

14. The heat dissipation device of claim 13, wherein a first receiving groove is defined in a top face of the first base, and the evaporating section is received in the first receiving groove.

15. The heat dissipation device of claim 13, wherein the condensing section is sandwiched between the second base and the fin set.

16. The heat dissipation device of claim 15, wherein a second receiving groove is defined in a bottom face of the fin set, and the condensing section is received in the second receiving groove.

17. The heat dissipation device of claim 12, wherein a first recessed portion is defined in the top face of the first base, a cutout is defined in the second base, a second recessed portion is defined in the bottom face of the fin set, and the first recessed portion communicated with the cutout and the second recessed portion, thereby forming a receiving space.

18. The heat dissipation device of claim 17, wherein the connecting section is accommodated in the receiving space.

19. The heat dissipation device of claim 12, wherein an area of the second base is larger than that of the first base.

20. The heat dissipation device of claim 12, wherein the heat pipe is U-shaped, and the evaporating section is parallel to the condensing section.