US20120318481A1

US20120318481A1 - Heat dissipation device

Info

Publication number: US20120318481A1
Application number: US13/197,775
Authority: US
Inventors: Yuan Yuan; Min Li; Meng Fu
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Foxconn Technology Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Foxconn Technology Co Ltd
Priority date: 2011-06-15
Filing date: 2011-08-04
Publication date: 2012-12-20
Also published as: CN102830772A

Abstract

An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a first base, a second base placed on the first base, a fin set placed on the second base, a first heat pipe and a second heat pipe. The first heat pipe includes a first evaporating section sandwiched between the first base and the second base, a first condensing section sandwiched between the second base and the fin set, and a first connecting section interconnecting the first evaporating section and the first condensing section. The second heat pipe includes a second evaporating section located adjacent to a bottom end of the fin set, a second condensing section located adjacent to a top end of the fin set, and a second connecting section interconnecting the second evaporating section and the second condensing section.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to heat dissipation devices, and more particularly to a heat dissipation device incorporating heat pipes.
2. Description of Related Art
Some electronic components, such as central processing units (CPUs) and integrated circuit (IC) packages, comprise numerous circuits operating at high speed and generating substantial heat. Under most circumstances, it is necessary to cool the electronic components in order to maintain safe operating conditions and assure that the electronic components function properly and reliably. Typically, a finned metal heat dissipation device is attached to an outer surface of the electronic component to remove the heat therefrom. The heat absorbed by the heat dissipation device is then dissipated to ambient air.
However, as the operating speed of electronic components has been continually upgraded, these kinds of conventional heat sinks are increasingly no longer able to meet the heat dissipation requirements of modern electronic components.
What is needed, therefore, is a heat dissipation device which can overcome the above-described problems.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present heat dissipation device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat dissipation device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with an exemplary embodiment of the disclosure.

FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.

FIG. 3 is an inverted, exploded view of the heat dissipation device of FIG. 1.

FIG. 4 is a front plan view of the heat dissipation device of FIG. 1.

DETAILED DESCRIPTION

Referring to FIGS. 1 and 2, a heat dissipation device in accordance with an exemplary embodiment of the disclosure is used for dissipating heat generated by an electronic component (not shown) mounted on a printed circuit board (not shown). The heat dissipation device comprises a first base 10 for thermally contacting the electronic component, a second base 20 disposed on the first base 10, a fin set 30 disposed on the second base 20, and a first heat pipe 40 and two second heat pipes 50 thermally connecting the first base 10 and the second base 20 with the fin set 30.
The first base 10 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The first base 10 has a rectangular profile. A plurality of elongated first receiving grooves 12 are defined in a top face of the first base 10. In this embodiment, there are three first receiving grooves 12. The first receiving grooves 12 are spaced from and parallel to each other. Two first recessed portions 14 are defined in the top face of the first base 10. The two first recessed portions 14 are located at two opposite lateral sides of the first base 10. In this embodiment, the first receiving grooves 12 extend along a lengthwise direction of the first base 10.
The second base 20 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The second base 20 has a rectangular profile. Two first cutouts 22 are defined at two opposite lateral sides of the second base 20, respectively. The first cutouts 22 are located corresponding to the recessed portions 14 of the first base 10. In other words, the first cutouts 22 correspondingly face the recessed portions 14. Two second cutouts 24 are defined at the two opposite lateral sides of the second base 20, respectively. The second cutouts 24 are spaced from the first cutouts 22. The two second cutouts 24 are located corresponding to two opposite outmost first receiving grooves 12 of the first base 10. A bottom face of the second base 20 thermally contacts the top face of the first base 10. An area of the second base 20 is larger than that of the first base 10. In this embodiment, a width of the second base 20 is equal to a length of the first base 10.
Referring to FIGS. 3 and 4 also, the fin set 30 comprises a plurality of parallel fins 31. A passage (not labeled) is defined between every two adjacent fins 31 to allow airflow therethrough. Each of the fins 31 comprises an upright sheet body and a pair of flanges bent horizontally from a top of the sheet body and engaging the sheet body of an adjacent fin 31. A bottom face of the fin set 30 thermally contacts a top face of the second base 20. Two elongated second receiving grooves 32 are defined in the bottom face of the fin set 30. The two second receiving grooves 32 are spaced from and parallel to each other. Two second recessed portions 34 are defined in the bottom face of the fin set 30. The two second recessed portions 34 are located at two opposite lateral sides of the fin set 30. The two second recessed portions 34 are correspondingly located adjacent to ends of the two second receiving grooves 32. The two second recessed portions 34 are correspondingly communicated with the two first cutouts 22 of the second base 20 and the two first recessed portions 14 of the first base 10. Each second recessed portion 34 cooperates with a corresponding first cutout 22 and a corresponding first recessed portion 14 to form a receiving space.
Two elongated through holes 36 are defined in the fin set 30. The through holes 36 extend transversely through the fin set 30. The through holes 36 are located adjacent a top end of the fin set 30. Two receiving slots 38 are respectively defined at two opposite lateral sides of the fin set 30. Each receiving slot 38 extends from the bottom face of the fin set 30 to a corresponding through hole 36, whereby the receiving slot 38 defines two openings (not labeled) respectively in the bottom face of the fin set 30 and a corresponding lateral side of the fine set 30. The openings defined in the bottom face of the fin set 30 are correspondingly communicated with the two second cutouts 24 of the second base 20.
The first heat pipe 40 comprises a first evaporating section 42, two first condensing sections 44 spaced from the first evaporating section 42, and two first connecting sections 46 respectively interconnecting the first evaporating section 42 and the first condensing sections 44. The first evaporating section 42 is S-shaped. The first evaporating section 42 is parallel to the first condensing sections 44. The first evaporating section 42 and the first condensing sections 44 each have a semicircular cross section. The two first condensing sections 44 are respectively located at two lateral sides of the first evaporating section 42. The first evaporating section 42 of the first heat pipe 40 is received in a corresponding first receiving groove 12 of the first base 10. The first evaporating section 42 of the first heat pipe 40 is sandwiched between the first base 10 and the second base 20. A top face of the first evaporating section 42 is coplanar with the top face of the first base 10. The first condensing sections 44 of the first heat pipe 40 are respectively received in the two second receiving grooves 32 of the fin set 30. The first condensing sections 44 of the first heat pipe 40 are sandwiched between the second base 20 and the fin set 30. Bottom faces of the first condensing sections 44 of the first heat pipe 40 are coplanar with the bottom face of the fin set 30. The first condensing sections 44 of the first heat pipe 40 are spaced from the top face of the first base 10. Each first connecting section 46 of the first heat pipe 40 is accommodated in a corresponding receiving space.
Each of the second heat pipes 50 comprises a second evaporating section 52, a second condensing section 54 spaced from the second evaporating section 52, and a second connecting section 56 interconnecting the second evaporating section 52 and the second condensing section 54. Each second heat pipe 50 is U-shaped. The second evaporating section 52 is parallel to the second condensing section 54 of each second heat pipe 50. In this embodiment, there are two second heat pipes 50 juxtaposed with each other. The second evaporating section 52 of each second heat pipe 50 is received in a corresponding first receiving groove 12 of the first base 10. The second evaporating sections 52 of the second heat pipes 50 are sandwiched between the first base 10 and the second base 20. Top faces of the second evaporating sections 52 of the second heat pipes 50 are coplanar with the top face of the first base 10. The second condensing section 54 of each second heat pipe 50 is fittedly received in a corresponding through hole 36 of the fin set 30. The second connecting section 56 of each second heat pipe 50 is accommodated in a corresponding receiving slot 38.
In use of the heat dissipation device, heat absorbed by the first base 10 is transferred to the second base 20 and then distributed to the fin set 30. The heat dissipates into the ambient from the fin set 30. A thermal conductive capability between the first base 10 and the fin set 30 is enhanced via the first heat pipe 40 and the second heat pipes 50. The first evaporating section 42 of the first heat pipe 40 is sandwiched between the first base 10 and the second base 20, and the first condensing sections 44 of the first heat pipe 40 are sandwiched between the second base 20 and the fin set 30. The second evaporating section 52 of the second heat pipe 50 is sandwiched between the first base 10 and the second base 20, and the second condensing section 54 of the second heat pipe 50 is inserted into the through hole 36 of the fin set 30 and located adjacent to the top end of the fin set 30. Thus, heat accumulated in the first base 10 is more quickly conducted to the fin set 30, and the heat dissipation efficiency of the heat dissipation device is thus greatly improved.
Additionally, besides the electronic component mounted on the printed circuit board, there may be other electronic components nearby. In a typical application, the area of the first base 10 is limited to a certain extent, in order to avoid interference with such other electronic components. However, as the first base 10, the second base 20 and the fin set 30 are separate components, the area of the second base 20 positioned on the first base 10 is adaptable, and the size of the fin set 30 positioned on the second base 20 is likewise adaptable. Hence, the area of the second base 20 can be configured to be quite large, and the size of the fin set 30 can be configured to be correspondingly large. Thus the heat dissipation device can provide a large heat dissipation area for efficient heat dissipation, without interfering with the other electronic components mounted on the printed circuit board.
It is to be understood, however, that even though numerous characteristics and advantages of the present embodiment(s) have been set forth in the foregoing description, together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation device comprising:

a first base;

a second base attached on the first base;

a fin set attached on the second base;

a first heat pipe comprising a first evaporating section sandwiched between the first base and the second base, two first condensing sections sandwiched between the second base and the fin set, and two first connecting sections respectively interconnecting the first evaporating section and the first condensing sections; and

a second heat pipe comprising a second evaporating section sandwiched between the first base and the second base, a second condensing section inserted into the fin set, and a second connecting section interconnecting the second evaporating section and the second condensing section.

2. The heat dissipation device of claim 1, wherein a plurality of first receiving grooves are defined in a top face of the first base, and the first evaporating section and the second evaporating section are respectively received in the first receiving grooves.

3. The heat dissipation device of claim 2, wherein a top face of the first evaporating section is coplanar with a top face of the second evaporating section and the top face of the first base.

4. The heat dissipation device of claim 1, wherein two second receiving grooves are defined in a bottom face of the fin set, and the first condensing sections are respectively received in the second receiving grooves.

5. The heat dissipation device of claim 4, wherein bottom faces of the condensing sections are coplanar with a bottom face of the fin set.

6. The heat dissipation device of claim 1, wherein two first recessed portions are defined in a top face of the first base, two first cutouts are defined in the second base, two second recessed portions are defined in a bottom face of the fin set, and the first recessed portions correspondingly communicated with the first cutouts and the second recessed portions, thereby forming two receiving space.

7. The heat dissipation device of claim 6, wherein each first connecting section is accommodated in a corresponding receiving space.

8. The heat dissipation device of claim 1, wherein a through hole is defined in the fin set for receiving the second condensing section therein, and the through hole extends transversely through the fin set.

9. The heat dissipation device of claim 8, wherein the through hole is located adjacent a top end of the fin set.

10. The heat dissipation device of claim 8, wherein a receiving slot is defined at a lateral side of the fin set for accommodating the second connecting section therein, and the receiving slot extends from a bottom face of the fin set to the through hole

11. The heat dissipation device of claim 1, wherein an area of the second base is larger than that of the first base.

12. The heat dissipation device of claim 11, wherein the first base and the second base are both rectangular, and a width of the second base is equal to a length of the first base.

13. The heat dissipation device of claim 1, wherein the first heat pipe is S-shaped, the first evaporating section is parallel to the first condensing sections, and the two first condensing sections are respectively located at two opposite lateral sides of the first evaporating section.

14. The heat dissipation device of claim 1, wherein the second heat pipe is U-shaped, and the second evaporating section is parallel to the second condensing section.

15. The heat dissipation device of claim 1, wherein the fin set comprises a plurality of parallel fins engaging with each other.

16. A heat dissipation device comprising:

a first base;

a second base attached on the first base;

a fin set attached on the second base;

a first heat pipe comprising a first evaporating section sandwiched between the first base and the second base, a first condensing section sandwiched between the second base and the fin set, and a first connecting section interconnecting the first evaporating section and the first condensing section; and

a second heat pipe comprising a second evaporating section located adjacent to a bottom end of the fin set, a second condensing section located adjacent to a top end of the fin set, and a second connecting section interconnecting the second evaporating section and the second condensing section.

17. The heat dissipation device of claim 16, wherein the second evaporating section is sandwiched between the first base and the second base.

18. The heat dissipation device of claim 17, wherein a plurality of first receiving grooves are defined in a top face of the first base, and the first evaporating section and the second evaporating section are respectively received in the first receiving grooves.

19. The heat dissipation device of claim 16, wherein a second receiving groove is defined in a bottom face of the fin set, and the first condensing section is received in the second receiving groove.

20. The heat dissipation device of claim 16, wherein a through hole is defined in the fin set for receiving the second condensing section therein, and the through hole extends transversely through the fin set.