Heat radiation assembly fastener and heat abstractor
Technical field
The present invention is a kind of heat radiation assembly fastener and heat abstractor, particularly a kind of heat radiation assembly fastener and heat abstractor that is used in the pedestal (Socket) of different size.
Background technology
Along with vigorously developing rapidly of electronic industry, the transistor density of central processing unit (CPU) increases day by day, though running frequency is more and more high, the power that consumes and the heat of generation also more and more increase.In order to allow central processing unit can stablize running, the fin of being made up of a plurality of fins is set on central processing unit, and fan can be set on fin, most of heat that central processing unit is produced when computing can be absorbed by fin, and can start the radiating effect of fan running enhance heat sheet simultaneously.
The surface of circuit board is welded in advance and is provided with central processing unit, for fin is made up on central processing unit, the quadripolar corners symmetry of the surperficial corresponding central processing unit of fin offers perforation, the relative position that circuit board is then bored a hole in the relative fin of quadripolar corners of central processing unit, correspondence is provided with the open-work of same apertures, again inserting column is inserted perforation and open-work and fin is stable on the surface of central processing unit.
In addition, difference along with the central processing unit specification, the position, hole that circuit board cooperates various pedestals (Socket) and radiator mounting to formulate is also inequality, for example the pedestal (Socket) that is suitable for of Intel Core2 Duo processor has 1,366 three kinds of socket 775, socket 1160 and socket, also is to be suitable for different pedestals (Socket) as for K8 or other processor.Therefore, the dealer must have different radiator mountings at the central processing unit of different size, not only quite bothers, and also causes the problem of the overstock of getting the raw materials ready easily.
Summary of the invention
In view of this, the present invention proposes a kind of heat radiation assembly fastener, cooperates a plurality of locked assemblies and the circuit board that is provided with a plurality of perforation, holds radiating subassembly in circuit board with button, and heat radiation assembly fastener comprises: framework, in order to sheathed radiating subassembly; A plurality of keepers are positioned at the side of framework, and each keeper comprises a location hole, and position of positioning hole comprises a plurality of location divisions of diverse location corresponding to a plurality of punch positions of circuit board in each location hole; And a plurality of positioning sets, respectively by a plurality of location holes and be sticked in a plurality of location divisions one of them, wear this perforation that corresponding location hole is fixed in circuit board for a plurality of locked assemblies, and button is held radiating subassembly in circuit board.
The present invention also proposes a kind of heat abstractor, cooperates a plurality of locked assemblies and is fixed in the circuit board that is provided with a plurality of perforation, and heat abstractor comprises: radiating subassembly is positioned on the circuit board; And heat radiation assembly fastener, hold radiating subassembly in circuit board in order to button, comprise; Framework is in order to sheathed radiating subassembly; A plurality of keepers are positioned at the side of framework, and each keeper comprises a location hole, and position of positioning hole comprises a plurality of location divisions of diverse location corresponding to a plurality of punch positions of circuit board in each location hole; And a plurality of positioning sets, respectively by a plurality of location holes and be sticked in a plurality of location divisions one of them, wear corresponding location hole for a plurality of locked assemblies and be fixed in the perforation of circuit board, and make the heat radiation assembly fastener button hold radiating subassembly in circuit board.
The present invention is provided with the location hole of location usefulness in heat radiation assembly fastener, and make positioning set by location hole and be sticked in a plurality of location divisions one of them, only need make locked assembly wear the perforation that corresponding location hole is fixed in circuit board during use, can make the heat radiation assembly fastener button hold radiating subassembly and be positioned on the circuit board, can make heat radiation assembly fastener be common to various electronic building brick and pedestal (Socket) thus, and must not adopt different fasteners in response to the electronic building brick and the pedestal of different size, not only make the stock control of fastener more easy, and the problem of getting the raw materials ready that can exempt multiple fastener.
Below in execution mode, be described in detail detailed features of the present invention and advantage, its content is enough to make any related art techniques person of haveing the knack of to understand technology contents of the present invention and implements according to this, and according to the disclosed content of this specification, claims and graphic, any related art techniques person of haveing the knack of can understand purpose and the advantage that the present invention is correlated with easily.
Description of drawings
Fig. 1 is the decomposing schematic representation of first embodiment of the invention.
Fig. 2 is the schematic appearance of first embodiment of the invention.
Fig. 3 is the schematic diagram () of the fastener of first embodiment of the invention.
Fig. 4 A is the schematic diagram () of the positioning set of first embodiment of the invention.
Fig. 4 B is the schematic diagram (two) of the positioning set of first embodiment of the invention.
Fig. 5 A is the schematic diagram () that first embodiment of the invention is adjusted the locked assembly position.
Fig. 5 B is the schematic diagram (two) that first embodiment of the invention is adjusted the locked assembly position.
Fig. 5 C is the schematic diagram (three) that first embodiment of the invention is adjusted the locked assembly position.
Fig. 6 A is the schematic diagram () of the locked assembly of first embodiment of the invention.
Fig. 6 B is the schematic diagram (two) of the locked assembly of first embodiment of the invention.
Fig. 7 is the decomposing schematic representation of second embodiment of the invention.
Fig. 8 A is the schematic diagram () of second embodiment of the invention assembling fan.
Fig. 8 B is the schematic diagram (two) of second embodiment of the invention assembling fan.
Embodiment
See also shown in Fig. 1 to Fig. 6 B, be the disclosed heat abstractor of first embodiment of the invention, heat abstractor 1 is arranged on the circuit board 5 with electronic building brick 51, circuit board 5 is provided with a plurality of perforation 52 in the side that electronic building brick 51 is set, at this, electronic building brick 51 can be central processing unit (CPU), right non-as limit, the present invention also can be arranged on the electronic building brick of other heating and the usefulness of heat radiation is provided, in addition, electronic building brick 51 can weld in advance and be located on the circuit board 5, or is installed on the pedestal (Socket) 55 of circuit board 5.Heat abstractor 1 includes radiating subassembly 11, heat radiation assembly fastener 12, a plurality of locked assembly 15, a plurality of positioning set 16.
Radiating subassembly 11 is positioned on the electronic building brick 51, and in order to the heat that conduction electron assembly 51 is produced, at this, radiating subassembly 11 preferably can be the radiating fin group of being made up of a plurality of fins 111, but the invention is not restricted to this.
Heat radiation assembly fastener 12, holding radiating subassembly 11 in order to button makes it can be adjacent to the surface of electronic building brick 51, and heat radiation assembly fastener 12 mainly can be made up of framework 121, a plurality of linking arm 124 and a plurality of keeper 125, wherein, the preferably general rounded shape of framework 121 and on the sheathed radiating subassembly 11, but framework 121 also can adopt other suitable shape according to actual design or topology requirement, moreover, framework 121 can the symmetric mode extension be provided with a plurality of linking arms 124, and in the end extension of each linking arm 124 keeper 125 is set.In addition, keeper 125 is equipped with microscler location hole 126, and wherein, a plurality of location holes 126 positions are corresponding to a plurality of perforation 52 positions of circuit board 5, and location hole 126 is provided with a plurality of location divisions 1261 (as shown in Figure 3) of diverse location.
In above stated specification, framework 121 is extensible to be provided with a plurality of sheets 122 that compress, and compresses radiating subassembly 11 with a plurality of sheets 122 that compress in the time of on framework 121 sheathed radiating subassemblies 11.At this, a plurality of sheets 122 that compress can be provided with by corresponding a plurality of linking arms 124, or can be arranged at framework 121 and the strength that compresses radiating subassembly 11 is evenly distributed by symmetric mode.
A plurality of locked assemblies 15, the perforation 52 that is arranged in circuit board 5 is to be fixed in the location hole 126 of corresponding perforation 52, heat radiation assembly fastener 12 is positioned on the circuit board 5, at this, locked assembly 15 can be press fastening type locking bolt (push pin) (as shown in Figure 6A), or can be Spring screws (shown in Fig. 6 B), but the invention is not restricted to this.
Positioning set 16, has positioning convex point 161, in positioning set 16 was packed location hole 126 into, positioning convex point 161 embedded location division 1261 and positioning set 16 is positioned in the location hole 126, and positioning convex point 161 can utilize and embed the position that different location divisions 1261 change positioning set 16.
Earlier electronic building brick 51 is installed in the pedestal (Socket) 55 of circuit board 5 during use, and radiating subassembly 11 is installed on the electronic building brick 51, again with on the heat radiation assembly fastener 12 sheathed radiating subassemblies 11, compress after sheet 122 compresses radiating subassembly 11 with a plurality of, positioning set 16 is packed in the location hole 126, and utilize the position that embeds different location divisions 1261 adjustment positioning sets 16 to make the perforation 52 of its alignment circuit plate 5, continue with locked assembly 15 and bore a hole 52 to be fixed in by corresponding positioning hole 126, heat radiation assembly fastener 12 firmly is positioned on the circuit board 5, the heat that a plurality of fins 111 conduction electron assemblies 51 of radiating subassembly 11 are produced.Because positioning set 16 can be adjusted its position in location hole 126, therefore when the pedestal (Socket) 55 of electronic building brick 51 and circuit board 5, the specification or the position change of perforation 52, positioning convex point 161 is utilized embed the position that positioning set 16 is adjusted in different location divisions 1261, the perforation 52 of its alignment circuit plate 5 is got final product (shown in Fig. 5 A to Fig. 5 C), effectively promote the sharing of heat radiation assembly fastener 12.
See also shown in Fig. 7, Fig. 8 A and Fig. 8 B, be the disclosed heat abstractor of second embodiment of the invention.In the present embodiment, in order to promote the radiating efficiency of radiating subassembly 11, can install fan 18 additional in radiating subassembly 11 tops.At this, heat radiation assembly fastener 12 can be provided with a plurality of clasps 127 in framework 121 extensions, 18 in fan is provided with a plurality of holding parts 181 of corresponding a plurality of clasp 127, holds holding part 181 corresponding with it with clasp 127 buttons, and fan 18 can firmly be positioned on the framework 121 of heat radiation assembly fastener 12.At this, the structure of assemblies such as radiating subassembly 11, heat radiation assembly fastener 12, a plurality of locked assembly 15, a plurality of positioning set 16 is same as above stated specification, is not repeated at this.
In above stated specification, heat radiation assembly fastener 12 can be provided with a plurality of reference columns 128 in framework 121 extensions, 18 in fan is provided with a plurality of open-works 182 of corresponding a plurality of reference column 128, when fan 18 is installed, reference column 128 is penetrated (shown in Fig. 8 A and Fig. 8 B) in the open-work 182, hold holding part 181 and fan 18 is positioned on the heat radiation assembly fastener 12 with clasp 127 buttons again.
The present invention is with the one-body molded fastener of making, and in heat radiation assembly fastener be provided with the location usefulness location hole, and the appropriate position is provided with positioning set in location hole, because the perforation of the circuit board of the corresponding different size of the positioning set of diverse location, therefore only need wear the perforation and the corresponding positioning hole of locked assembly in use in circuit board, can make the fastener button hold the radiating fin group and be positioned on the circuit board, make heat radiation assembly fastener can be common to various electronic building brick and pedestal (Socket), and the fastener that must not make different size again in response to the electronic building brick and the pedestal of different size, therefore utilize the present invention can make the stock control of fastener more easy, not only solve the problem of getting the raw materials ready of fastener, and can reach the purpose that reduces inventory cost.
Though technology contents of the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; anyly have the knack of this skill person; do not breaking away from spirit of the present invention a little change and the retouching done; all should be covered by in the category of the present invention, so protection scope of the present invention is as the criterion when looking claims person of defining.