CN101098611B - Rear panel module for heat radiator - Google Patents
Rear panel module for heat radiator Download PDFInfo
- Publication number
- CN101098611B CN101098611B CN2006100901662A CN200610090166A CN101098611B CN 101098611 B CN101098611 B CN 101098611B CN 2006100901662 A CN2006100901662 A CN 2006100901662A CN 200610090166 A CN200610090166 A CN 200610090166A CN 101098611 B CN101098611 B CN 101098611B
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- rear panel
- panel module
- heat radiator
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- motherboard
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Abstract
A heat radiator back board module can be used for heat resource which heat radiator is fixed on host board, wherein the heat resource is provided with a plurality of positioning holes around. The back board module comprises a plate and a plurality of positioning posts, wherein the plate is under a host board, provided with a plurality of locking holes, while each locking hole is provided with an internal screw inside. Part of the locking holes is relative to a plurality of positioning holes on the host board. And the positioning posts are assembled in part of the locking holes relative to the positioning holes. One end of each positioning post is provided with an external screw to be locked on the internal screw of relative locking hole.
Description
Technical field
The present invention relates to a kind of rear panel module (Backing Plate Module), and be particularly related to a kind of rear panel module for heat radiator (Heat Sink Backing Plate Module).
Background technology
Along with developing rapidly of electronic industry, as central processing unit (Central Processing Unit, the arithmetic speed of electronic component CPU) significantly improves, the heat that it produced also increases severely thereupon.Therefore, industry often is provided with a heating radiator (Heat Sink) on the central processor among motherboard (Mother Board) is gone up, to reduce the working temperature of central processing unit inside.In order to satisfy the radiating requirements of central processing unit, the size and the weight that are arranged at the heating radiator on the central processing unit have the trend that increases gradually.
Be in for a long time under the condition of high temperature for fear of motherboard, because of downward pulling force that heatsink weight produced causes the motherboard distortion, and then make motherboard easily because of vibrations etc. unpredictable outside power rupture.Industry is often assembled a radiator rear panel in the motherboard back side at present, with the structural strength of raising motherboard, and makes that the heating radiator bottom can be more tight with the CPU surface engagement.
What deserves to be mentioned is, the design specification of number radiator rear panel only meets the motherboard specification that it is arranged in pairs or groups on the market, that is the backboard that has the guide pillar function at present on the market all is single specification backboards, and can't be common to function more than second kind of specification, for example: the Intel holder has corresponding backboard, the K8 holder has corresponding backboard, and the backboard that is applicable to the Intel holder can't be applicable to the backboard of K8 holder.Therefore, (for example being to change motherboard to LGA775 by the motherboard of Socket478) needs additionally to buy the backboard that meets another motherboard specification again when the user desires to change the motherboard of different size, caused waste.In addition, the guide pillar that has the backboard of guide pillar function at present on the market is fixed, and its guide pillar normally utilizes riveted or is embedded in the backboard, and this kind design concept can't be common to the motherboard of other specification.
Summary of the invention
The present invention's purpose provides a kind of rear panel module for heat radiator, and it can be common to multiple motherboard specification.
Another object of the present invention provides a kind of rear panel module for heat radiator, and it has positioning function to shorten the time that rear panel module for heat radiator is assembled in motherboard.
For reaching above-mentioned or other purpose, the present invention proposes a kind of rear panel module for heat radiator, and it is suitable for heating radiator is fixed in pyrotoxin on the motherboard, wherein is provided with a plurality of pilot holes around the pyrotoxin.This rear panel module for heat radiator comprises plate body and a plurality of positioning guide column.Plate body is arranged at the motherboard below, and has a plurality of locking holes, and is provided with first internal screw thread in each locking holes.Wherein, a pilot hole more than on the part locking holes respective hosts plate.In addition, a plurality of positioning guide column are assembled in the part locking holes of corresponding pilot hole, and wherein one of each positioning guide column end is provided with external screw teeth.Thread is locked in first internal screw thread of part locking holes outside the positioning guide column.
In one of the present invention embodiment, the other end of above-mentioned positioning guide column is provided with second internal screw thread, and heating radiator comprises a plurality of locking parts, and these locking parts are locked in second internal screw thread, make heating radiator be fixed on the pyrotoxin.
In one of the present invention embodiment, the material of above-mentioned plate body is a metal.
In one of the present invention embodiment, the material of above-mentioned plate body is plastics, and the material of first internal screw thread is a metal, and first internal screw thread is embedded in the locking holes.
In one of the present invention embodiment, above-mentioned rear panel module for heat radiator also comprises glued membrane, is arranged at the surface that plate body contacts with motherboard.
In the present invention's rear panel module for heat radiator, because plate body is provided with a plurality of locking holes, and a plurality of positioning guide column is assembled in the part locking holes of corresponding pilot hole.Therefore, rear panel module for heat radiator can promptly be installed in the pilot hole by positioning guide column, and the lock solid structure of heating radiator can be successfully and the positioning guide column contraposition, and be assembled in second internal screw thread of positioning guide column, makes heating radiator can closely fit in the pyrotoxin surface.On the other hand, when the user desires to change the motherboard of different size, the user only needs positioning guide column is assembled in the part locking holes of corresponding another motherboard pilot hole, can make rear panel module for heat radiator meet the specification of this kind of motherboard, and then allow rear panel module for heat radiator successfully be assembled on the motherboard.
For above and other objects of the present invention, feature and advantage can be become apparent, the present invention's cited below particularly preferred embodiment, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A is a kind of rear panel module for heat radiator of preferred embodiment of the present invention and the synoptic diagram of heating radiator and motherboard combination.
Figure 1B is the exploded view of rear panel module for heat radiator, heating radiator and the motherboard of Figure 1A.
Fig. 2 is the exploded view of the rear panel module for heat radiator of Figure 1B.
Fig. 3 is along the sectional view of A-A ' line among Fig. 2.
The main element description of symbols
10: motherboard
10a: the back side
12: pyrotoxin
14: pilot hole
20: heating radiator
22: locking holes
30: locking part
100: rear panel module for heat radiator
110: plate body
112,112 ', 112 ": locking holes
114: the first internal screw threads
120: positioning guide column
122: external screw teeth
124: the second internal screw threads
Embodiment
The explanation of relevant preferred embodiment of the present invention, please be with reference to Figure 1A and Figure 1B, wherein Figure 1A is a kind of rear panel module for heat radiator of preferred embodiment of the present invention and the synoptic diagram of heating radiator and motherboard combination, and Figure 1B is the exploded view of rear panel module for heat radiator, heating radiator and the motherboard of Figure 1A.Please be simultaneously with reference to Figure 1A and Figure 1B, the rear panel module for heat radiator 100 of present embodiment for example is the back side 10a that is arranged at motherboard 10, rear panel module for heat radiator 100 is suitable for heating radiator 20 is fixed in pyrotoxin 12 on the motherboard 10.In the present embodiment, be provided with a plurality of pilot holes 14 around the pyrotoxin 12, and heating radiator 20 is firmly to be arranged on the pyrotoxin 12 by a plurality of locking parts 30, and then solves the heat dissipation problem of pyrotoxin 12.
Above-mentioned locking part 30 for example is the locking holes 22 of passing on the heating radiator 20, and is locked on the rear panel module for heat radiator 100, makes heating radiator 20 closely to fit with pyrotoxin 12 surfaces.In addition because rear panel module for heat radiator 100 is arranged at the back side 10a of motherboard 10, and be suitable for and the heating radiator 20 that is arranged on the pyrotoxin 12 affixed, so rear panel module for heat radiator 100 can improve the structural strength of motherboard 10 significantly.Hereinafter will explain the rear panel module for heat radiator 100 of present embodiment.
Fig. 2 is the exploded view of the rear panel module for heat radiator of Figure 1B, and Fig. 3 is along the sectional view of A-A ' line among Fig. 2.Please be simultaneously with reference to Figure 1B, Fig. 2 and Fig. 3, the rear panel module for heat radiator 100 of present embodiment mainly comprises plate body 110, and a plurality of positioning guide column 120 of arranging in pairs or groups.Plate body 110 is arranged at motherboard 10 belows, and has a plurality of locking holes 112, and is provided with first internal screw thread 114 in each locking holes 112.In addition, on part locking holes 112 ' the respective hosts plate 10 more than pilot hole 14, and a plurality of positioning guide column 120 is assembled in the part locking holes 112 ' of corresponding pilot hole 14.In the present embodiment, one of each positioning guide column 120 end is provided with external screw teeth 122, and positioning guide column 120 promptly is to be locked in first internal screw thread 114 of part locking holes 112 ' by external screw teeth 122.
In the present embodiment, the material of plate body 110 for example is plastics, and first internal screw thread 114 is a metal material, and it is embedded in the locking holes 112.So, positioning guide column 120 promptly can be locked together in first internal screw thread 114 in the locking holes 112.In other embodiments, plate body 110 can be a metal material, and the dealer only needs can form thread to wall processing (tapping) within the locking holes 112 on wall within the locking holes 112, and is sealed for positioning guide column 120.In addition, when plate body 110 was metal material, the user must be provided with glued membrane on plate body 110 and surface that motherboard 10 contacts, so that rear panel module for heat radiator 100 and motherboard 10 electrical isolations.It should be noted that to making rear panel module for heat radiator 100 that lower cost of products is arranged, so the material of plate body 110 normally adopts plastics, and first internal screw thread 114 of collocation metal material comes for positioning guide column 120 sealed.
In addition, positioning guide column 120 its other ends of present embodiment for example are provided with second internal screw thread 124, and locking part 30 can be locked in second internal screw thread 124, makes heating radiator 20 can be fixed on the pyrotoxin 12.Certainly, the present invention does not limit heating radiator 20 at this and is fixed in mode on the pyrotoxin 12.For instance, in other embodiments, the user can be earlier with fastening module (the Retention Module in order to fixing heating radiator 20, RM) be fixed in motherboard 10 (for example be locking relation by 124 of a plurality of locking parts and second internal screw threads make fasten module be fixed in motherboard 10), and heating radiator 20 can be fixed on the pyrotoxin 12 by fastening module.
What deserves to be mentioned is that owing to positioning guide column 120 is assembled in the part locking holes 112 ' of corresponding pilot hole 14, so rear panel module for heat radiator 100 can promptly be installed in the pilot hole 14 by positioning guide column 120.Heating radiator 20 can closely fit with pyrotoxin 12 surfaces by the locking relation of 100 of locking part 30 and rear panel module for heat radiator.On the other hand, except part locking holes 112 ', also have a plurality of locking holes 112 that meet another motherboard specification on the plate body 110 with corresponding pilot hole 14 ", wherein locking holes 112 " pilot hole on corresponding another motherboard.Specifically, when user's desire is changed motherboard, the positioning guide column 120 that only needs script to be locked in locking holes 112 ' is assembled to locking holes 112 " in; can promptly rear panel module for heat radiator 100 be installed in the pilot hole of another motherboard by positioning guide column 120, that is the rear panel module for heat radiator 100 of present embodiment can be common to the motherboard of different styles.
In sum, in the present invention's rear panel module for heat radiator, owing to have the locking holes of the corresponding different motherboard specifications of many groups on the plate body, and positioning guide column can be filled in the suitable locking holes according to the motherboard set of specifications of being used.Compare with known technology, the present invention has following advantage:
(1) because plate body has the locking holes of the corresponding different motherboard specifications of many groups, so the present invention's rear panel module for heat radiator has the shared property of product widely.In other words, when the user changes motherboard, need not additionally buy again and meet another rear panel module for heat radiator.
(2) because the rear panel module for heat radiator of preferred embodiment of the present invention has the positioning guide column of the pilot hole of a plurality of respective hosts plates, so rear panel module for heat radiator can promptly be installed up to motherboard by positioning guide column, and then saves built-up time.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any person of ordinary skill in the field; without departing from the spirit and scope of the present invention; when can doing a little change and improvement, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (5)
1. rear panel module for heat radiator, it is characterized in that, above-mentioned rear panel module for heat radiator is suitable for a plurality of different size motherboards, be used for heating radiator is fixed in pyrotoxin on one of them motherboard, and be respectively equipped with a plurality of pilot holes around the pyrotoxin of variant specification motherboard, above-mentioned rear panel module for heat radiator comprises:
Plate body is arranged at one of them below of these different size motherboards, and above-mentioned plate body has many group locking holes, states these pilot holes on corresponding respectively these different size motherboards, and each is organized and is respectively equipped with first internal screw thread in the locking holes; And
A plurality of positioning guide column, be assembled in above-mentioned many one of them groups of group locking holes, above-mentioned these pilot holes of the corresponding motherboard of being fixed of this group locking holes, wherein respectively one of this positioning guide column end is provided with external screw teeth, and above-mentioned external screw teeth is locked in above-mentioned first internal screw thread of this group locking holes.
2. the rear panel module for heat radiator according to claim 1, it is characterized in that respectively the other end of this positioning guide column is provided with second internal screw thread, this heating radiator comprises a plurality of locking parts, and above-mentioned locking part is locked in above-mentioned second internal screw thread, and this heating radiator is fixed on this pyrotoxin.
3. the rear panel module for heat radiator according to claim 1, the material that it is characterized in that this plate body is a metal.
4. the rear panel module for heat radiator according to claim 1, the material that it is characterized in that this plate body is plastics, the material of above-mentioned first internal screw thread is a metal, and above-mentioned first internal screw thread is embedded in the above-mentioned locking holes.
5. the rear panel module for heat radiator according to claim 1 is characterized in that also comprising glued membrane, is arranged at this plate body and one of them surface that contacts of above-mentioned these different size motherboards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100901662A CN101098611B (en) | 2006-06-29 | 2006-06-29 | Rear panel module for heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100901662A CN101098611B (en) | 2006-06-29 | 2006-06-29 | Rear panel module for heat radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101098611A CN101098611A (en) | 2008-01-02 |
| CN101098611B true CN101098611B (en) | 2010-11-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100901662A Expired - Fee Related CN101098611B (en) | 2006-06-29 | 2006-06-29 | Rear panel module for heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101098611B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101730442B (en) * | 2008-10-31 | 2012-07-04 | 和硕联合科技股份有限公司 | Heat radiation assembly fastener and heat radiation device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2519320Y (en) * | 2001-12-12 | 2002-10-30 | 富准精密工业(深圳)有限公司 | Combination of radiator device |
| CN2538119Y (en) * | 2002-02-22 | 2003-02-26 | 富准精密工业(深圳)有限公司 | Radiator back board combined device |
| CN2558080Y (en) * | 2002-06-04 | 2003-06-25 | 鸿富锦精密工业（深圳）有限公司 | Back board fixing device |
| US6741470B2 (en) * | 2001-06-01 | 2004-05-25 | Intel Corporation | Reusable thermal solution attachment mechanism and methods of using same |
-
2006
- 2006-06-29 CN CN2006100901662A patent/CN101098611B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6741470B2 (en) * | 2001-06-01 | 2004-05-25 | Intel Corporation | Reusable thermal solution attachment mechanism and methods of using same |
| CN2519320Y (en) * | 2001-12-12 | 2002-10-30 | 富准精密工业(深圳)有限公司 | Combination of radiator device |
| CN2538119Y (en) * | 2002-02-22 | 2003-02-26 | 富准精密工业(深圳)有限公司 | Radiator back board combined device |
| CN2558080Y (en) * | 2002-06-04 | 2003-06-25 | 鸿富锦精密工业（深圳）有限公司 | Back board fixing device |
Non-Patent Citations (1)
| Title |
|---|
| 同上. |
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| Publication number | Publication date |
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| CN101098611A (en) | 2008-01-02 |
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Granted publication date: 20101110 Termination date: 20110629 |