CN2519320Y - Combination of radiator device - Google Patents
Combination of radiator device Download PDFInfo
- Publication number
- CN2519320Y CN2519320Y CN 01258654 CN01258654U CN2519320Y CN 2519320 Y CN2519320 Y CN 2519320Y CN 01258654 CN01258654 CN 01258654 CN 01258654 U CN01258654 U CN 01258654U CN 2519320 Y CN2519320 Y CN 2519320Y
- Authority
- CN
- China
- Prior art keywords
- screw
- backboard
- fixed orifice
- heat abstractor
- heating radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
A heat dissipating device combination comprises a radiator, a backplane, and a plurality of fixing elements, the radiator comprises a base and a heat radiation fin tablet stretching vertically upward from the base, the proper positions of the four corners of the base are separately provided with a fixed hole, a placing area is formed above the fixing hole, a locating area is formed under the fixing hole, while a screwing area is formed in the middle of the fixing hole, the positions of the four corners of the backplane corresponding to the four fixed holes of the radiator base are separately provided with a convex column the top of which is provided with a screw, the fixing element consists of a screw, a gasket and a spring, which can be arranged in the fixed hole of the radiator in advance, the convex column of the backplane can pass through the corresponding communication hole on a circuit board, be held on in the locating area of the fixed hole of the base, and be fixedly locked inside the screw hole of the convex column via the screw of the fixing element, so that the radiator can be fixedly compacted on the crystal surface of the circuit board.
Description
[technical field]
The utility model is about the combination of a kind of heat abstractor, refer in particular to a kind of can be pre-aligned, in conjunction with equalization of pressure, and heat abstractor easy to assembly combination.
[background technology]
Central processing unit is the nerve center of computer treatmenting information, and can the overall performance of computing machine promote, and depends on the performance of central processing unit to a great extent, so the release of high-frequency high-speed central processing unit just becomes inevitable trend.But, the heat that high-frequency high-speed will cause central processing unit to produce is more and more, further make the computer-internal temperature more and more higher, serious prestige is being assisted the stability of central processing unit operation, for guaranteeing central processing unit energy operate as normal, the heat that it produced must in time be discharged, for this reason, the be everlasting surface of central processing unit of industry installs heat abstractor combination additional, with the heat of timely its generation of discharge.
Fixing structure of radiator has two kinds usually: a kind of is that heating radiator is placed in the storage tank with the fixedly module of its corresponding cooperation, relend help fastener with heating radiator and fixedly the module one be fastened on the connector that is equiped with central processing unit, but, in this fixed form, the overall weight of heating radiator all concentrates on the central processing unit, not only is difficult to pass through vibration-testing, and, very easily cause the adhesion inequality, cause the surface local loose contact, thereby influence radiating effect; Another kind of radiating mode is to establish screw on foot of radiator, and on the connector of mainboard or installing central processing unit, be provided with screw corresponding with it, relend help screw directly with heating radiator locking on mainboard or connector, but, there is the problem of location difficulty in this fixed form when assembling, and because this fixed form is rigidly connected, cause the pressure inequality easily, cause a plurality of binding site imbalance of pressure on the heating radiator after the assembling, both influenced radiating effect, and made circuit board produce mechanically deform again easily.
[summary of the invention]
The purpose of this utility model be to provide a kind of can be pre-aligned, easy to assembly, and can guarantee to combine between heating radiator and the heater element heat abstractor combination of equalization of pressure.
The purpose of this utility model realizes by following technical proposal: the combination of the utility model heat abstractor comprises a heating radiator, a backboard and several fixtures, this heating radiator comprises a pedestal and the radiating fin that extends vertically upward of this pedestal certainly, four jiaos of appropriate positions of this pedestal are established a fixed orifice respectively, one disposal area is formed at this fixed orifice top, one positioning area is formed at the bottom, and the middle part then is a threaded area; This backboard comprises a main part, and four corners are provided with a projection respectively corresponding to the fixed orifice place of radiator base on it, and the top of each projection is provided with a screw; This fixture is made up of screw, pad and spring, can be installed in the fixed orifice of heating radiator in advance, the projection of this backboard can pass on the circuit board corresponding through hole and be contained in the positioning area of this pedestal fixed orifice, screw locking by these fixtures makes heating radiator be close to the wafer surface of circuit board in the screw of these projections.
The advantage of the utility model heat abstractor combination is: can be pre-aligned, assembling easily, and combine equalization of pressure between fixing back heater element and the heat abstractor, both avoided to guarantee better heat radiating effect again owing to the uneven circuit board mechanically deform that causes of adhesion.
The utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of combination of the utility model heat abstractor and circuit board.
Fig. 2 is the part sectioned view of the fixed orifice of the utility model heat abstractor combined heat radiator.
Fig. 3 is the three-dimensional combination figure of combination of the utility model heat abstractor and circuit board.
[embodiment]
Please consult Fig. 1 and Fig. 2 simultaneously, the combination of the utility model heat abstractor comprises a heating radiator 10, a backboard 30 and several fixtures 40, be used for fixing on circuit board 50 and assist wafer 60 heat radiation, this circuit board 50 respectively is provided with a through hole 52 at wafer 60 4 corners.
This heating radiator 10 comprises a pedestal 12 and the upwardly extending radiating fin 14 of these pedestal 12 end faces certainly, the through hole 52 of this 12 4 jiaos of appropriate positions of pedestal corresponding circuits plate 50 is respectively equipped with a fixed orifice 16, one disposal area 18 is formed at the top of this fixed orifice 16, one positioning area 22 is formed at the bottom, and its middle part then is a threaded area 24.
This backboard 30 comprises that one is criss-cross main part 32, these main part 32 central authorities run through and offer a through hole 34, and its four jiaos places all upwards protrude out a projection 36, can corresponding pass the through hole 52 of circuit board 50 and be contained in the fixed orifice 16 of this heating radiator 10, these projection 36 tops are provided with a screw 38, and the reach of this screw 38 is a certain value.In addition, this backboard 30 around through hole 34 and projection 36 bottoms all be equiped with cushion pad 39, be used for preventing damage circuit board 50 when this backboard 30 combines with this circuit board 50.
This fixture 40 is made up of screw 42, pad 44 and spring 46 etc., this spring 46 can partly be housed in the disposal area 18 of these heating radiator 10 fixed orifices 16 in advance, and this screw 42 can pass this pad 44 and spring 46 back screw locks successively in the threaded area 24 of the fixed orifice 16 of this heating radiator 10, thereby these fixtures 40 tentatively are fixed on this heating radiator 10.
Please consult Fig. 3 simultaneously, during assembling, earlier projection 36 correspondences of backboard 30 are passed the through hole 52 of circuit board 50, assembly with this heating radiator 10 and fixture 40 is placed on the wafer 60 of this circuit board 50 again, and the projection 36 that makes this backboard 30 is contained in the positioning area 22 of these heating radiator 10 fixed orifices 16, at last, by means of screw 42 screw locks of fixture 40 in the screw 38 of these backboard 30 projections 36, thereby this heat abstractor combination is fixed on this circuit board 50, and makes this heating radiator 10 be close to the surface of wafer 60.At this moment, 46 on this spring is housed in the disposal area 18 of this fixed orifice 16 fully, and, because the reach of these projection 36 screws 38 is a certain value, so after this screw 42 screws in fully the pressure of 10 4 jiaos in this heating radiator is kept in balance.
Claims (6)
1. heat abstractor combination, comprise a heating radiator, a backboard and several fixtures, this heating radiator comprises a pedestal and the upwardly extending radiating fin of this base top surface certainly, it is characterized in that: the appropriate location of this pedestal is provided with several fixed orifices, and this fixed orifice comprises a positioning area and a threaded area; This backboard comprises a main part, and fixed orifice of corresponding heating radiator upwards protrudes out several projections on it, and each projection top is provided with a screw; And each fixture comprises a screw at least, and these fixtures can be installed in the fixed orifice of heating radiator in advance, and further in the screw of screw lock on the projection of backboard.
2. heat abstractor combination as claimed in claim 1, it is characterized in that: this fixed orifice also comprises a disposal area, this disposal area, threaded area and positioning area lay respectively at the upper, middle and lower of this fixed orifice.
3. heat abstractor combination as claimed in claim 1, it is characterized in that: the reach of the screw of this projection is a certain value.
4. heat abstractor combination as claimed in claim 1 or 2, it is characterized in that: this fixture also comprises a spring and a pad, and this spring can be housed in the disposal area of this fixed orifice.
5. heat abstractor combination as claimed in claim 1 is characterized in that: be provided with several through holes around the wafer of this circuit board, the projection of this backboard can corresponding pass this through hole and be housed in the positioning area of this heating radiator fixed orifice.
6. heat abstractor combination as claimed in claim 1 is characterized in that: this backboard middle part and projection bottom all are equiped with the cushion pad that is used for preventing to damage when this backboard from combining with circuit board circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01258654 CN2519320Y (en) | 2001-12-12 | 2001-12-12 | Combination of radiator device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01258654 CN2519320Y (en) | 2001-12-12 | 2001-12-12 | Combination of radiator device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2519320Y true CN2519320Y (en) | 2002-10-30 |
Family
ID=33667215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 01258654 Expired - Lifetime CN2519320Y (en) | 2001-12-12 | 2001-12-12 | Combination of radiator device |
Country Status (1)
Country | Link |
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CN (1) | CN2519320Y (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100347637C (en) * | 2004-10-09 | 2007-11-07 | 华硕电脑股份有限公司 | Auxiliary supporting structure of circuit board |
CN1939108B (en) * | 2004-01-26 | 2010-06-09 | 英特尔公司 | Mounting system for high-mass heatsinks |
CN101098611B (en) * | 2006-06-29 | 2010-11-10 | 华信精密股份有限公司 | Rear panel module for heat radiator |
CN101150943B (en) * | 2006-09-22 | 2011-06-29 | 富准精密工业(深圳)有限公司 | Heat radiation device and its fan fixing part |
CN102418910A (en) * | 2011-11-18 | 2012-04-18 | 深圳市华星光电技术有限公司 | Convex hull for fixing printed circuit board (PCB) on backboard, backboard and backlight module |
CN102705336A (en) * | 2011-03-28 | 2012-10-03 | 富瑞精密组件(昆山)有限公司 | Screw with anti-slip function and electronic device employing same |
CN103389779A (en) * | 2013-08-09 | 2013-11-13 | 昆山新力精密五金有限公司 | Notebook computer CPU (Central Processing Unit) connecting and fixing device |
US8882329B2 (en) | 2011-11-18 | 2014-11-11 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Hillock for fixing PCB on backplane, backplane and backlight module |
CN111148349A (en) * | 2019-12-26 | 2020-05-12 | 海光信息技术有限公司 | Processor installation device and method |
CN111221396A (en) * | 2018-11-23 | 2020-06-02 | 纬颖科技服务股份有限公司 | Adjustable fixing device applied to radiating fins and electronic equipment thereof |
-
2001
- 2001-12-12 CN CN 01258654 patent/CN2519320Y/en not_active Expired - Lifetime
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1939108B (en) * | 2004-01-26 | 2010-06-09 | 英特尔公司 | Mounting system for high-mass heatsinks |
CN100347637C (en) * | 2004-10-09 | 2007-11-07 | 华硕电脑股份有限公司 | Auxiliary supporting structure of circuit board |
CN101098611B (en) * | 2006-06-29 | 2010-11-10 | 华信精密股份有限公司 | Rear panel module for heat radiator |
CN101150943B (en) * | 2006-09-22 | 2011-06-29 | 富准精密工业(深圳)有限公司 | Heat radiation device and its fan fixing part |
CN102705336A (en) * | 2011-03-28 | 2012-10-03 | 富瑞精密组件(昆山)有限公司 | Screw with anti-slip function and electronic device employing same |
CN102418910A (en) * | 2011-11-18 | 2012-04-18 | 深圳市华星光电技术有限公司 | Convex hull for fixing printed circuit board (PCB) on backboard, backboard and backlight module |
US8882329B2 (en) | 2011-11-18 | 2014-11-11 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Hillock for fixing PCB on backplane, backplane and backlight module |
CN103389779A (en) * | 2013-08-09 | 2013-11-13 | 昆山新力精密五金有限公司 | Notebook computer CPU (Central Processing Unit) connecting and fixing device |
CN111221396A (en) * | 2018-11-23 | 2020-06-02 | 纬颖科技服务股份有限公司 | Adjustable fixing device applied to radiating fins and electronic equipment thereof |
CN111221396B (en) * | 2018-11-23 | 2021-08-24 | 纬颖科技服务股份有限公司 | Adjustable fixing device applied to radiating fins and electronic equipment thereof |
CN111148349A (en) * | 2019-12-26 | 2020-05-12 | 海光信息技术有限公司 | Processor installation device and method |
CN111148349B (en) * | 2019-12-26 | 2022-06-24 | 海光信息技术股份有限公司 | Processor installation device and method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20111212 Granted publication date: 20021030 |