CN201181696Y - Heat radiating device of chip module - Google Patents

Heat radiating device of chip module Download PDF

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Publication number
CN201181696Y
CN201181696Y CNU2008200062597U CN200820006259U CN201181696Y CN 201181696 Y CN201181696 Y CN 201181696Y CN U2008200062597 U CNU2008200062597 U CN U2008200062597U CN 200820006259 U CN200820006259 U CN 200820006259U CN 201181696 Y CN201181696 Y CN 201181696Y
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China
Prior art keywords
circuit board
chip module
sub
heat abstractor
holding parts
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Expired - Lifetime
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CNU2008200062597U
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Chinese (zh)
Inventor
郭世家
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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Priority to CNU2008200062597U priority Critical patent/CN201181696Y/en
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Abstract

The utility model relates to a heat radiator of a core module which can be arranged on a main circuit board by being inserted on an electric connector. The heat radiator includes a sub-circuit board; one surface of the sub-circuit board is provided with a plurality of core modules; at least two through holes are arranged on the sub-circuit board; the heat radiator also includes a pedestal which is provided with a first surface and a second surface; the first surface is stuck on the core module and the second surface is provided with a plurality of heat radiating fins in an extending way; the utility model includes a fastener which includes two body boards; at least one treadle bar is arranged between the two body boards; the treadle bar is arranged between the heat radiating fins to support the whole heat radiator. The two body boards are respectively provided with at least one first fixing part which penetrates the through holes in an extending way. The heat radiator is easily dismounted; besides, when the circuit board is the specification of soddr, the through holes can be fully utilized, thus reducing the working procedure of punching and avoiding from re-designing the wiring on the circuit board caused by the arrangement of the hole.

Description

The heat abstractor of chip module
[technical field]
The utility model relates to a kind of heat abstractor of chip module.
[background technology]
Development along with Information technology, the for example enhancing of computer function, deposit the expansion of Chu device energy etc., the function of various chip modules is also in continuous enhancing, the processing mode that is chip module just develops towards the direction of high-frequency high-speed, yet the heat that high-frequency high-speed will make chip module produce when work is more and more, temperature is also more and more higher, the stability of chip module operation in serious threat, for guaranteeing the normal operation of chip module energy, needs dispel the heat to it.
And the heat abstractor of original chip module, a kind of calculator memory bar fin (referring to this patent Fig. 1 and Fig. 2) is disclosed as Chinese patent CN200520068258 number, comprise a slim heat sink body 1, at least one fastener 2, wherein, the joint end 3 of this fastener 2 is " T " font, then be provided with and be somebody's turn to do the open slot 4 that " T " font joint end is complementary on the described heat sink body 1, this open slot 4 is made of two boss 5 on the described heat sink body 1, this two boss 5 forms a shoulder 6 that extends in opposite directions respectively with an end of described fastener 2 clampings, described " T " font joint end 3 is provided with a neck 7, the opening that this neck 7 just can place described two shoulders 6 to form.The shoulder 6 that " T " font joint end 3 of described fastener can effectively be extended by described two boss 5 in opposite directions blocks, and unlikely coming off can be described as the method for reverse deduction of circling round, load onto memory bar after, described heat sink body 1 is not rebounded with tight contact of described memory bar.
But now, continuous enhancing along with the chip module function, the heat that produces during its work is more and more, temperature is also just more and more higher, requirement to radiating effect is also more and more higher, disclose a kind of heat abstractor 200 (referring to this patent Fig. 1 and Fig. 2) of electronic installation for No. 5969946 as U.S. Pat, comprised an electric connector 10, a sub-circuit board 20, a radiator 30 and at least one fixation kit 40.Wherein, this fixation kit 40 comprises a support column 41 and two bolts 43,44, described electric connector 10 is installed on the substrate 99, which is provided with an inserting groove 11, can peg graft for above-mentioned sub-circuit board 20, this sub-circuit board 20 is provided with a plurality of electronic installations 21, above-mentioned radiator 30 is installed on this electronic installation 21, this radiator 30 also has a plurality of fin 34,35, and wherein at least one described fin 35 is provided with a fixed part 36, described support column 41 is arranged between described substrate 99 and the described fixed part 36, described support column 41 locks on substrate 99 by described bolt 44, described radiator 30 locks on described support column 41 by described bolt 43 by its fixed part 36, and then is fixed on the described substrate 99, because this support column 41 can support the weight of described radiator 30, and described radiator 30 locks on described support column 41 by described bolt 43, therefore, the weight of described radiator 30 can not cause turning moment or cause vibrations, and described sub-circuit board 20 is become flexible.
So, the heat abstractor 200 of the electronic installation of this structure during installation, needs earlier described sub-circuit board 20 to be inserted in the described electric connector 10, then need described radiator 30 be locked on described substrate 99 by described bolt 43,44 and described support column 41; When described sub-circuit board 20 needs to remove installation, certainly will described radiator 30 must be disassembled from described substrate 99 earlier, this sub-circuit board 20 could be extracted from described electric connector 10, make dismounting very inconvenient; And be the described heat abstractor 200 of locking, described substrate 99 need offer at least one through hole separately, thereby increased the operation of punching, and needs to redesign wiring on the circuit board for the setting of mating holes, so brought inconvenience for design and manufacturing, the operation and the cost that have increased design and made.
Therefore, be necessary to design a kind of heat abstractor of new chip module, to overcome above-mentioned defective.
[utility model content]
The purpose of this utility model is to provide a kind of easy accessibility, and has reduced the operation and heat abstractor that needing because of the setting in hole to avoid the chip module of the wiring on the redesign circuit board of punching.
The heat abstractor of the utility model chip module can be arranged on the main circuit board by being plugged on the electric connector, comprising: a sub-circuit board, and a surface of this sub-circuit board is provided with a plurality of chip modules, offers two through hole at least on this sub-circuit board; One radiator comprises a pedestal, and this pedestal has a first surface and a second surface, and this first surface is attached at the said chip module, and this second surface extension is provided with a plurality of radiating fins; One fastener comprises two main boards, is connected with at least one press strip between described two main boards, and described batten seat is located at and is supported whole described radiator between above-mentioned radiating fin, and described two main boards extension downwards respectively are provided with at least one first holding parts through above-mentioned through hole.
The heat abstractor of the utility model chip module, its fastener, comprise two main boards, be connected with at least one press strip between described two main boards, described batten seat is located at and is supported whole described radiator between above-mentioned radiating fin, described two main boards extension downwards respectively are provided with at least one first holding parts through above-mentioned through hole, make the sub-circuit board of this heat abstractor, radiator and fastener can closely be detained and be held in together, but being plugged on the electric connector, this heat abstractor one is arranged on the main circuit board, need not on this main circuit board, to be provided with again auxiliary holding unit, remove when installing, also but one is directly extracted from described electric connector and is got final product, and to described sub-circuit board when described radiator and described fastener separate, also described first holding parts need only be withdrawed from getting final product from described through hole, so this heat abstractor dismounting is simple and easy; And when described sub-circuit board is a soddr specification etc., through hole on it is on the described sub-circuit board during the former through hole that has been provided with but has not used as yet at present, described first holding parts is held on the described sub-circuit board in the existing through hole, can make full use of these existing through holes, need not again on described sub-circuit board or other corresponding mechanism (as main circuit board) goes up punching, reduced the operation of punching and avoided setting because of the hole to need to redesign wiring on the circuit board.
[description of drawings]
Fig. 1 is the schematic perspective view of the utility model chip module heat abstractor;
Fig. 2 is the perspective exploded view of chip module heat abstractor shown in Figure 1;
Fig. 3 is the schematic perspective view of the sub-circuit board of chip module heat abstractor shown in Figure 1;
Fig. 4 is the schematic perspective view that the radiator of chip module heat abstractor shown in Figure 1 combines with fastener;
Fig. 5 is the schematic perspective view of the radiator of chip module heat abstractor shown in Figure 1;
Fig. 6 is the schematic perspective view of the fastener of chip module heat abstractor shown in Figure 1;
Fig. 7 is the schematic perspective view of another angle of the fastener of chip module heat abstractor shown in Figure 1.
The drawing reference numeral explanation:
The heat abstractor 1 of chip module
Sub-circuit board 2 heating electronic component 20 inserted terminals 21
Opposite end 22 through holes, 210 short slots 220
Radiator 3 pedestals 30 first surfaces 301
Second surface 302 radiating fins 31 first radiating fins 311
Second radiating fin, 312 hook parts 3120
Fastener 4 main boards 40 press strips 41
Kink 410 first holding parts 42 first hooks 420
Monitoring holes 43 second holding parts 44 second hooks 440
Stop block 441 buckling partss 45 trips 450
Stop section 46 ribs 47
[embodiment]
Be described further below in conjunction with the heat abstractor of the drawings and specific embodiments the utility model chip module.
See also Fig. 1 and Fig. 2, the heat abstractor 1 of the utility model chip module, can (not shown) be arranged on the main circuit board (not shown) on the electric connector by being plugged in, be used for distributing the heat that chip module produces, it comprises a sub-circuit board (as the sub-circuit board of soddr specification) 2, one radiator 3 and a fastener 4.
See also Fig. 3, sub-circuit board 2 as the sub-circuit board of soddr specification, can be plugged in the inserting groove (not shown) of an electric connector (not shown), and electrically connect with a main circuit board (not icon).One surface of described sub-circuit board 2 is provided with a plurality of chip modules 20, described sub-circuit board 2 has an inserted terminal 21 and an opposite end 22, described inserted terminal 21 is provided with a through hole 210 respectively near the both side edges place, and described opposite end 22 both side edges are respectively equipped with a semicircle short slot 220.
See also Fig. 5, radiator 3 comprises a pedestal 30 and is arranged at a plurality of radiating fins 31 on this pedestal 30.This pedestal 30 is by the good metal material of heat conductivility, makes as copper, aluminium etc., roughly becomes long plate shape, this pedestal 30 has a first surface 301 and a second surface 302, wherein, this first surface 301 is sticked mutually with described chip module 20, is used for absorbing the heat that described chip module 20 distributes.Described radiating fin 31 forms from the second surface 302 outside vertical extent of described pedestal 30 respectively, and is the array arrangement.Described radiating fin 31 comprises a plurality of first radiating fin 311 and at least two second radiating fins 312 that lay respectively at described second surface 302 two ends, and these second radiating fin, 312 ends are provided with a hook part 3120.In the present embodiment, described radiator 3 is provided with two rows and is spaced and symmetrically arranged second radiating fin 312, and ranked first radiating fin 311 more.
See also Fig. 6 and Fig. 7, fastener 4 comprises two main boards 40,40 of described two main boards are connected with at least one press strip 41, in the present embodiment, described fastener 4 is to be made of one piece by two main boards 40 and two press strips 41, and this two press strip 41 lies in these two main boards, 40 two ends lateral margins this two main board 40 is linked into an integrated entity.Described each press strip 41 is provided with at least two kinks 410, and when these press strip 41 length were longer, the setting of a plurality of described kinks 410 can increase the intensity and the dynamics of this press strip 41.One end of described two main boards 40, extension is provided with one first holding parts 42 downwards respectively, and described each first holding parts, 42 end are provided with one first hook 420.The position of described two main parts, 40 adjacent these first holding parts 42 is respectively equipped with a monitoring holes 43.The other end of described two main boards 40, extension is provided with one second holding parts 44 downwards respectively, and described each second holding parts, 44 end are provided with one second hook 440 and a stop block 441.Described main part 40 hook part 3120 that is provided with all right one way or the other and described second radiating fin 312 that extends internally respectively holds the buckling parts 45 that cooperates, in the present embodiment, described buckling parts 45 ends are provided with a trip 450, and described trip 450 holds with the hook part 3120 of described second radiating fin 312 and cooperates.Described main board 40 extends internally respectively and is provided with a stop section 46.Described each place, main part 40 centre positions extension respectively is provided with a ribs 47, to increase the intensity of described main board 40.
See also Fig. 1-2 and Fig. 4, during assembling, the one side that described radiator 3 is provided with radiating fin 31 is provided with holding parts 42 with described fastener 4,44 one side correspondence compresses fastening, wherein, described press strip 41 is set up in 31 of described radiating fins, and can be pressed on the second surface 302 of described pedestal 30, to produce a power of pointing to the second surface 302 of this pedestal 30, to prevent that described radiator 3 from detaching from the top, and described buckling parts 45 holds with the hook part 3120 of described second radiating fin 312 and cooperates, can produce the direction opposite effect power with the power of the second surface 302 that points to this pedestal 30, to prevent that described radiator 3 from dropping out from the below, so, utilizing these two reverse power that described radiator 3 and described fastener 4 are detained on orthogonal direction is held in together, though the cooperation that described radiator 3 and described fastener 4 can become flexible, but can not break away from mutually, therefore described radiator 3 can be assembled jointly with described fastener 4, transportation is less reached gradually in transportation, built-up time and the effect of saving cost.Described stop section 46 is held in described radiator 3 two ends, in the present embodiment, described stop section 46 is held on the radiating fin 31 at described radiator 3 two ends, so that described radiator 3 two ends are produced an inside chucking power respectively, can prevent that described radiator 3 from moving to arbitrary end wherein.
And then, the described radiator 3 that is retained on together can be fastened on the described sub-circuit board 2 with described fastener 4, can finish assembling.This moment, first holding parts 42 of described fastener 4 can put in the through hole 210 on the described sub-circuit board 2, first hook, 420 hooks of this first holding parts 42 are on described sub-circuit board 2, preventing that the relative described sub-circuit board of described radiator 3 and described fastener 42 from withdrawing from from vertical direction, or rock in the horizontal direction.In the present embodiment, described sub-circuit board 2 is the sub-circuit board 2 of soddr specification, described through hole 210 is the former through hole 210 that has been provided with but has not used as yet at present on this sub-circuit board 2, described first holding parts 42 is held in these sub-circuit board 2 existing through holes 210, can make full use of these existing through holes 210, make heat abstractor 1 dismounting simple and easy, and because need not punching on the sub-circuit board 2 or on the main circuit board again, reduced the operation of punching and avoided setting because of the hole to need to redesign wiring on the circuit board.Whether utilize described monitoring holes 43 can monitor described first holding parts 42 colludes and blocks described sub-circuit board 2, thereby guaranteeing that described radiator 3, described fastener 4 and described sub-circuit board (as the sub-circuit board of soddr specification) 2 can be remained valid holds, and conveniently gives the chip module on the described sub-circuit board (as the sub-circuit board of soddr specification) 2 20 heat radiations.Each second holding parts, 44 end of described fastener 4 are respectively equipped with second hook 440 that inwardly is provided with, described two second hooks, 440 hooks are in the opposite end 22 of described sub-circuit board 2, make this heat abstractor 1 more stably to be retained on together, and each second holding parts, 44 end of this fastener 4 are respectively equipped with a stop block 441, described two stop blocks 441 blocks respectively can prevent that in the both side edges of described sub-circuit board 2 described radiator 3 and described fastener 4 from moving to either side relative to described sub-circuit board 2.If described sub-circuit board 2 separately the time, need only will be withdrawed from described first holding parts 42 getting final product in described radiator 3 and described fastener 4 from described through hole 210.
And this sub-circuit board 2 is electrically connected to a main circuit board (not icon) by an electric connector (not shown), this sub-circuit board 2 can be as required be arranged on the described main circuit board (not icon) with vertical type, horizontal or other any form, promptly this heat abstractor 1 can directly be gone up and electrically connect with a main circuit board (not icon) by being inserted in an electric connector (not shown), need not on described main circuit board, to be provided with again auxiliary holding unit, remove when installing, also but one is directly extracted from described electric connector and is got final product, and makes that this heat abstractor 1 dismounting is simple and easy.And this heat abstractor 1 can be as required be arranged on the described main circuit board (not icon) with vertical type, horizontal or other any form, in the present embodiment, described sub-circuit board 2 is arranged on the main circuit board (not icon) with horizontal form, and promptly described heat abstractor 1 is arranged on the described main circuit board (not icon) with horizontal form.
In the utility model heat abstractor 1, described radiator 3 also can be used for the heat radiation of chip modules (not icon) such as other chip module such as the last north and south of calculator motherboard (not icon) bridge with described fastener 4, when described radiator 3 is used for the heat radiation of chips such as described north and south bridge with described fastener 4, the setting of described each second holding parts 44 should be the same with described each first holding parts 42, be that described each second holding parts 44 is identical with the shape of described each first holding parts 42, during installation, will get final product in the respective through hole on described each second holding parts 44 and the described motherboard of described each first holding parts, 42 insertion.It also can reach and prevent that described radiator 3 from withdrawing from from vertical direction with described fastener 4 relative described motherboards (not icon), or the technique effect that rocks in the horizontal direction.
In sum, this creation has following advantage:
1, the heat abstractor 1 of the utility model chip module, described each press strip 41 is provided with at least two kinks 410, and when these press strip 41 length were longer, the setting of a plurality of described kinks 410 can increase the intensity and the dynamics of this press strip 41.
2, the heat abstractor 1 of the utility model chip module, described press strip 41 is set up in 31 of described radiating fins, and can be pressed on the second surface 302 of described pedestal 30, to produce a power of pointing to the second surface 302 of this pedestal 30, to prevent that described radiator 3 from detaching from the top, and described buckling parts 45 holds with the hook part 3120 of described second radiating fin 312 and cooperates, can produce the direction opposite effect power with the power of the second surface 302 that points to this pedestal 30, to prevent that described radiator 3 from dropping out from the below, so, utilizing these two reverse power that described radiator 3 and described fastener 4 are detained on orthogonal direction is held in together, though the cooperation that described radiator 3 and described fastener 4 can become flexible, but can not break away from mutually, therefore described radiator 3 can be assembled jointly with described fastener 4, transportation is less reached gradually in transportation, built-up time and the effect of saving cost.
3, the heat abstractor 1 of the utility model chip module, described stop section 46 are held on the radiating fin 31 at described radiator 3 two ends, so that described radiator 3 two ends are produced an inside chucking power respectively, can prevent that described radiator 3 from moving to arbitrary end wherein.
4, the heat abstractor 1 of the utility model chip module, after finishing assembling, first holding parts 42 of described fastener 4 can put in the through hole 210 on the described sub-circuit board 2, first hook, 420 hooks of this first holding parts 42 are on described sub-circuit board 2, preventing that the relative described sub-circuit board of described radiator 3 and described fastener 42 from withdrawing from from vertical direction, or rock in the horizontal direction.In the present embodiment, described sub-circuit board 2 is the sub-circuit board 2 of soddr specification, described through hole 210 is the former through hole 210 that has been provided with but has not used as yet at present on this sub-circuit board 2, described first holding parts 42 is held in these sub-circuit board 2 existing through holes 210, can make full use of these existing through holes 210, make heat abstractor 1 dismounting simple and easy, and because need not punching on the sub-circuit board 2 or on the main circuit board again, reduced the operation of punching and avoided setting because of the hole to need to redesign wiring on the circuit board.Each second holding parts, 44 end of described fastener 4 are respectively equipped with second hook 440 that inwardly is provided with, described two second hooks, 440 hooks are in the opposite end 22 of described sub-circuit board 2, make this heat abstractor 1 more stably to be retained on together, and each second holding parts, 44 end of this fastener 4 are respectively equipped with a stop block 441, described two stop blocks 441 blocks respectively can prevent that in the both side edges of described sub-circuit board 2 described radiator 3 and described fastener 4 from moving to either side relative to described sub-circuit board 2.
5, the heat abstractor 1 of the utility model chip module, whether utilize described monitoring holes 43 can monitor described first holding parts 42 colludes and blocks described sub-circuit board 2, thereby guaranteeing that described radiator 3, described fastener 4 and described sub-circuit board (as the sub-circuit board of soddr specification) 2 can be remained valid holds, and conveniently gives the chip module on the described sub-circuit board (as the sub-circuit board of soddr specification) 2 20 heat radiations.
6, the heat abstractor 1 of the utility model chip module, it can directly be gone up and electrically connect with a main circuit board (not icon) by being inserted in an electric connector (not shown), need not on described main circuit board, to be provided with again auxiliary holding unit, remove when installing, also but one is directly extracted from described electric connector and is got final product, and makes that this heat abstractor 1 dismounting is simple and easy.
Above-mentioned explanation is the detailed description at the preferable possible embodiments of the utility model, but embodiment is not in order to limit patent claim of the present utility model, all equal variation or modification changes of finishing according to the technical spirit that the utility model disclosed all should belong to claim that the utility model is contained.

Claims (10)

1. the heat abstractor of a chip module is characterized in that, can be arranged on the main circuit board by being plugged on the electric connector, comprising:
One sub-circuit board, a surface of this sub-circuit board is provided with a plurality of chip modules, offers two through hole at least on this sub-circuit board;
One radiator comprises a pedestal, and this pedestal has a first surface and a second surface, and this first surface is attached at the said chip module, and this second surface extension is provided with a plurality of radiating fins;
One fastener comprises two main boards, is connected with at least one press strip between described two main boards, and described batten seat is located at and is supported whole described radiator between described radiating fin, and described two main boards extension downwards respectively are provided with at least one first holding parts through above-mentioned through hole.
2. the heat abstractor of chip module as claimed in claim 1, it is characterized in that: described sub-circuit board is the soddr specification.
3. the heat abstractor of chip module as claimed in claim 1, it is characterized in that: the described first holding parts end is provided with one first fastener.
4. the heat abstractor of chip module as claimed in claim 1, it is characterized in that: the position of adjacent described first holding parts of described two main boards is respectively equipped with a monitoring holes.
5. the heat abstractor of chip module as claimed in claim 1 is characterized in that: extend downwards respectively on described two main boards and be provided with one second holding parts, described each second holding parts end is provided with one second fastener.
6. the heat abstractor of chip module as claimed in claim 5, it is characterized in that: described each second holding parts end also is provided with a stop block.
7. the heat abstractor of chip module as claimed in claim 1, it is characterized in that: described two main boards extend internally respectively and are provided with at least one buckling parts.
8. the heat abstractor of chip module as claimed in claim 1, it is characterized in that: described two main boards extend internally respectively and are provided with a stop section.
9. the heat abstractor of chip module as claimed in claim 1, it is characterized in that: described each press strip is provided with at least two kinks.
10. the heat abstractor of chip module as claimed in claim 1, it is characterized in that: described radiating fin comprises a plurality of first radiating fins and a plurality of second radiating fin, this second radiating fin end is provided with a pothook.
CNU2008200062597U 2008-02-06 2008-02-06 Heat radiating device of chip module Expired - Lifetime CN201181696Y (en)

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Application Number Priority Date Filing Date Title
CNU2008200062597U CN201181696Y (en) 2008-02-06 2008-02-06 Heat radiating device of chip module

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Application Number Priority Date Filing Date Title
CNU2008200062597U CN201181696Y (en) 2008-02-06 2008-02-06 Heat radiating device of chip module

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Publication Number Publication Date
CN201181696Y true CN201181696Y (en) 2009-01-14

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CNU2008200062597U Expired - Lifetime CN201181696Y (en) 2008-02-06 2008-02-06 Heat radiating device of chip module

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101959393A (en) * 2010-09-21 2011-01-26 深圳创维数字技术股份有限公司 Main board radiation device and set-top box with same
CN107422804A (en) * 2017-06-08 2017-12-01 得意精密电子(苏州)有限公司 Main frame board component
CN107666820A (en) * 2017-09-18 2018-02-06 通鼎互联信息股份有限公司 Line card and communication machine box

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101959393A (en) * 2010-09-21 2011-01-26 深圳创维数字技术股份有限公司 Main board radiation device and set-top box with same
CN107422804A (en) * 2017-06-08 2017-12-01 得意精密电子(苏州)有限公司 Main frame board component
CN107422804B (en) * 2017-06-08 2021-02-26 得意精密电子(苏州)有限公司 Main board assembly
CN107666820A (en) * 2017-09-18 2018-02-06 通鼎互联信息股份有限公司 Line card and communication machine box
CN107666820B (en) * 2017-09-18 2019-09-10 通鼎互联信息股份有限公司 Line card and communication machine box

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Granted publication date: 20090114