CN102375508A - Electronic device and heat dissipation device thereof - Google Patents
Electronic device and heat dissipation device thereof Download PDFInfo
- Publication number
- CN102375508A CN102375508A CN2010102543377A CN201010254337A CN102375508A CN 102375508 A CN102375508 A CN 102375508A CN 2010102543377 A CN2010102543377 A CN 2010102543377A CN 201010254337 A CN201010254337 A CN 201010254337A CN 102375508 A CN102375508 A CN 102375508A
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- CN
- China
- Prior art keywords
- mainboard
- radiating fin
- integrated circuit
- circuit board
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to an electronic device and a heat dissipation device thereof. The electronic device comprises a case and a mainboard arranged in the case. The heat dissipation device is arranged on the mainboard, and a heating element and slots adjacent to the heating element are arranged on the mainboard. The heat dissipation device comprises a heat dissipation block adhered to the heating element, a heat dissipation fin, a board card and heat pipes, wherein the heat dissipation fin and the board card are fixed, and the heat pipes are connected between the heat dissipation block and the heat dissipation fin; and the board card comprises a plugging part for being plugged into the slots of the mainboard. Compared with the prior art, in the electronic device and the heat dissipation device thereof, the board card being plugged into the slots of the mainboard is utilized to reinforce the heat dissipation fin, so that the larger-size heat dissipation fin can be fixed, and thus the heat dissipation is favorable.
Description
Technical field
The present invention relates to a kind of electronic equipment and heat abstractor thereof.
Background technology
Present electronic equipment is like computer, server etc., operated by rotary motion one mainboard; Install several heating elements on the mainboard,, be employed in the mode that installs radiating fin on the central processing unit additional to the heat radiation of central processing unit and carry out such as central processing unit, internal memory etc.; Radiating fin directly is installed at the central processing unit top, locks on mainboard then, if but the radiating fin Tai Gao that adopts this mode to install is perhaps oversize; Will influence stable installation property, be unfavorable for heat radiation.
Summary of the invention
In view of above content, be necessary to provide a kind of electronic equipment and heat abstractor thereof that is beneficial to heat radiation more.
A kind of heat abstractor; Be installed in that the heater element to mainboard dispels the heat on the mainboard; Contiguous heater element place is provided with slot on the mainboard; Heat abstractor comprise one be attached at heater element radiating block, a radiating fin, one and the integrated circuit board that fixes of radiating fin and be connected in radiating block and radiating fin between heat pipe, integrated circuit board comprises that one is used to be plugged in the Plug Division of the slot of mainboard.
A kind of electronic equipment; Comprise that the mainboard and that a cabinet, is installed in the cabinet is installed in the heat abstractor on the mainboard; Mainboard is provided with the slot of a heater element and contiguous heater element; Heat abstractor comprise one be attached at heater element radiating block, a radiating fin, one and the integrated circuit board that fixes of radiating fin and be connected in radiating block and radiating fin between heat pipe, integrated circuit board comprises that one is used to be plugged in the Plug Division of the slot of mainboard.
Compare prior art, electronic equipment of the present invention and heat abstractor thereof utilize one be plugged in host slot integrated circuit board reinforce radiating fin, can fix larger sized radiating fin, be beneficial to heat radiation.
Description of drawings
Combine embodiment that the present invention is done further description with reference to the accompanying drawings.
Fig. 1 is the mainboard of electronic equipment preferred embodiments of the present invention and the three-dimensional exploded view of heat abstractor.
Fig. 2 is the mainboard of electronic equipment preferred embodiments of the present invention and the three-dimensional assembly diagram of heat abstractor.
Fig. 3 is the three-dimensional assembly diagram of electronic equipment preferred embodiments of the present invention.
The main element symbol description
Heat abstractor 20
Radiating block 22
Radiating fin 24
Embodiment
See also Fig. 1 to Fig. 3, electronic equipment of the present invention comprises that a cabinet 100, is installed in a mainboard 10 and the heat abstractor 20 in the cabinet 100.
Be laid with a heater element 12 and some slots 14 on this mainboard 10.In this embodiment, heater element 12 is central processing units, and slot 14 is an expansion card slot.
This heat abstractor 20 comprise a radiating block 22, a radiating fin 24, one and the integrated circuit board 26 that fixes of radiating fin 24 and be connected in radiating block 22 and radiating fin 24 between heat pipe 28.Radiating fin 24 comprises that one is attached at the substrate 242 of integrated circuit board 26 and the some fins 244 that vertically extend to form from substrate 242.Integrated circuit board 26 comprises a Plug Division 262.Can adopt screws or bonding mode to fix between integrated circuit board 26 and the radiating fin 24.Integrated circuit board 26 can be an expansion board or the fixed head that is used for fixing radiating fin separately, if integrated circuit board 26 is expansion boards, then radiating fin 24 also can dispel the heat to expansion board.
During assembling, the radiating block 22 of heat abstractor 20 is attached on the heater element 12, the Plug Division 262 of integrated circuit board 26 is plugged in a slot 14.So, the heat that heater element 12 sends is passed to radiating fin 24 through heat pipe 28, distributes through radiating fin 24 then.The present invention reinforces radiating fin 24 through the mode that radiating fin 24 is connected with integrated circuit board 26, can make the size of radiating fin 24 bigger, and is highly higher, is beneficial to heat radiation more.
Claims (10)
1. heat abstractor; Be installed in that the heater element to mainboard dispels the heat on the mainboard; Contiguous heater element place is provided with slot on the mainboard; Heat abstractor comprise one be attached at heater element radiating block, a radiating fin, one and the integrated circuit board that fixes of radiating fin and be connected in radiating block and radiating fin between heat pipe, integrated circuit board comprises that one is used to be plugged in the Plug Division of the slot of mainboard.
2. heat abstractor as claimed in claim 1 is characterized in that: radiating fin comprises that one is attached at the substrate of integrated circuit board and the some fins that vertically extend to form from substrate.
3. heat abstractor as claimed in claim 1 is characterized in that: adopt screws or bonding mode to fix between integrated circuit board and the radiating fin.
4. heat abstractor as claimed in claim 1 is characterized in that: integrated circuit board is an expansion board.
5. heat abstractor as claimed in claim 1 is characterized in that: integrated circuit board is one to be used for fixing the fixed head of radiating fin.
6. electronic equipment; Comprise that the mainboard and that a cabinet, is installed in the cabinet is installed in the heat abstractor on the mainboard; Mainboard is provided with the slot of a heater element and contiguous heater element; Heat abstractor comprise one be attached at heater element radiating block, a radiating fin, one and the integrated circuit board that fixes of radiating fin and be connected in radiating block and radiating fin between heat pipe, integrated circuit board comprises that one is used to be plugged in the Plug Division of the slot of mainboard.
7. electronic equipment as claimed in claim 6 is characterized in that: heater element is a central processing unit.
8. electronic equipment as claimed in claim 6 is characterized in that: adopt screws or bonding mode to fix between integrated circuit board and the radiating fin.
9. electronic equipment as claimed in claim 6 is characterized in that: integrated circuit board is an expansion board, and slot is an expansion card slot.
10. electronic equipment as claimed in claim 6 is characterized in that: integrated circuit board is one to be used for fixing the fixed head of radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102543377A CN102375508A (en) | 2010-08-16 | 2010-08-16 | Electronic device and heat dissipation device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102543377A CN102375508A (en) | 2010-08-16 | 2010-08-16 | Electronic device and heat dissipation device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102375508A true CN102375508A (en) | 2012-03-14 |
Family
ID=45794234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102543377A Pending CN102375508A (en) | 2010-08-16 | 2010-08-16 | Electronic device and heat dissipation device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102375508A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108429155A (en) * | 2018-04-03 | 2018-08-21 | 东阳市阳涛电子科技有限公司 | Safety-type outdoor electricity distribution cabinet |
| CN108539000A (en) * | 2018-06-26 | 2018-09-14 | 芜湖纯元光电设备技术有限公司 | A kind of LED circuit board radiator structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2636306Y (en) * | 2003-05-23 | 2004-08-25 | 宝陆科技有限公司 | Heat sink for extended card |
| CN201017871Y (en) * | 2007-01-26 | 2008-02-06 | 利民科技开发有限公司 | Auxiliary heat radiator of central processing unit of host board |
| CN101776941A (en) * | 2009-01-08 | 2010-07-14 | 富准精密工业(深圳)有限公司 | Radiating device |
-
2010
- 2010-08-16 CN CN2010102543377A patent/CN102375508A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2636306Y (en) * | 2003-05-23 | 2004-08-25 | 宝陆科技有限公司 | Heat sink for extended card |
| CN201017871Y (en) * | 2007-01-26 | 2008-02-06 | 利民科技开发有限公司 | Auxiliary heat radiator of central processing unit of host board |
| CN101776941A (en) * | 2009-01-08 | 2010-07-14 | 富准精密工业(深圳)有限公司 | Radiating device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108429155A (en) * | 2018-04-03 | 2018-08-21 | 东阳市阳涛电子科技有限公司 | Safety-type outdoor electricity distribution cabinet |
| CN108539000A (en) * | 2018-06-26 | 2018-09-14 | 芜湖纯元光电设备技术有限公司 | A kind of LED circuit board radiator structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120314 |