CN201017871Y - Auxiliary heat radiator of central processing unit of host board - Google Patents
Auxiliary heat radiator of central processing unit of host board Download PDFInfo
- Publication number
- CN201017871Y CN201017871Y CNU2007200028074U CN200720002807U CN201017871Y CN 201017871 Y CN201017871 Y CN 201017871Y CN U2007200028074 U CNU2007200028074 U CN U2007200028074U CN 200720002807 U CN200720002807 U CN 200720002807U CN 201017871 Y CN201017871 Y CN 201017871Y
- Authority
- CN
- China
- Prior art keywords
- processing unit
- central processing
- heat
- motherboard
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an auxiliary radiator of the central processing unit of a main machine board. The utility model comprises a seat body, a heat guiding block, a heating pipe and a heat radiating fin, the seat body is stuck to the other side surface of the main machine board and is located at position opposite to the central processing unit, the heat guiding block is arranged on one side surface of the seat body, one end of the heating pipe is mutually connected with the heat guiding block, the other end is extended toward the direction away from the heat guiding block, the extended end is located on one side of the main machine board, the heat radiating fin is mutually connected with the extended end of the heating pipe, when partial high temperature generated from the central processing unit is transmitted to the other side surface of the main machine board, and the high temperature can be transmitted to the heat radiating fin via the seat body, the heat guiding block and the heating pipe in sequence, and is diverged into the air by the heat radiating fin, therefore to enable the other side surface of the main machine board to maintain a certain temperature.
Description
Technical field
This creation is a kind of additional cooler of central processing unit of motherboard, provides a kind of another side that is arranged at motherboard, and the high temperature that central processing unit produced can be distributed to airborne radiator structure.
Background technology
Computer application is day by day popularized, computer is made up of suitable electronic component, most important in these electronic components is central processing unit, the data that but central processing unit is computing to be imported, and export one and can supply the employed data of people, along with making rapid progress of electronics technology, the arithmetic speed of central processing unit also speeds thereupon, yet be accompanied by speeding of arithmetic speed, the working temperature of central processing unit also promotes thereupon, for avoiding central processing unit too high, and its arithmetic speed is slowed down or, therefore a heat abstractor can be set in the central processing unit place because of overheated damage because of working temperature.
Existing heat abstractor, it has heat-conducting block and radiating fin, and heat-conducting block is the place, a side that adhere well to central processing unit, and this central processing unit is a side that is arranged at a motherboard, radiating fin is to be fixed in the heat-conducting block place, is connected with radiator fan in the radiating fin place in addition.
When the working temperature of central processing unit is too high, the high temperature that it produced will conduct to heat-conducting block and radiating fin place in regular turn via heat conduction, and blow by radiator fan, and the high temperature that conducts to the radiating fin place is dissipated in the air, reach cool effect thus.
Yet the high temperature that still has small part can conduct to the another side of motherboard, and this side there is no and is provided with any heat abstractor, so high temperature can be gathered in this place, side, so after use after a while, the high temperature of this gathering can be to the influence of central processing unit and the electronic component that around it is generation certain degree.
Summary of the invention
Because the inconvenience on the aforesaid prior art, this creation is the additional cooler of the central processing unit of a kind of motherboard of design, provide and a kind ofly be arranged at the another side of motherboard and, and the high temperature that conducts to the motherboard another side can be distributed to airborne heat radiation structure with respect to the central processing unit position.
For reaching above-mentioned creation purpose, the technological means that this creation is adopted is the additional cooler of the central processing unit of a kind of motherboard of design, it is to be arranged at a motherboard place, one side of motherboard is provided with central processing unit, this additional cooler has a pedestal, one heat-conducting block, one heat pipe and a radiating fin, pedestal is to be attached at the another side of motherboard and with respect to the central processing unit position, heat-conducting block is a side that is arranged at pedestal, one end of heat pipe is to interconnect with heat-conducting block, end extends towards the direction away from heat-conducting block in addition, this elongated end is a side that is positioned at motherboard, and radiating fin is that the elongated end with heat pipe interconnects.
The high temperature that is produced when the part central processing unit conducts to the another side of motherboard and during the position of handling with respect to central authorities, this high temperature can conduct to pedestal and heat-conducting block, and conduct to the radiating fin place via heat pipe, be dissipated in the air by radiating fin again, so make motherboard the another side and with respect to the temperature of central processing unit position can remain in central processing unit and around it by the receptible scope of electronic component in, aforesaid member can be maintained under the normal operating state.
Description of drawings
Fig. 1 is the three-dimensional exploded view of this creation.
Fig. 2 is the stereo appearance figure of this creation.
Fig. 3 is that this creation mutually combines with a motherboard, and is arranged at the stereo appearance figure in the casing.
Fig. 4 is that this creation mutually combines with motherboard, and is arranged at the end view in the casing.
The primary clustering symbol description
(10) pedestal (101) joint pin
(102) tank (11) heat-conducting block
(12) heat pipe (121) bending end
(13) radiating fin (20) motherboard
(21) central processing unit (22) fan
(23) casing
Embodiment
This creation is a kind of additional cooler of central processing unit of motherboard, please cooperate with reference to shown in the figure 1,2,3, it is to be arranged at a motherboard (20) to locate, one side of motherboard (20) is provided with central processing unit (21), be provided with fixing hole in motherboard (20) and with respect to the edge of central processing unit (21), additional cooler has a pedestal (10), a heat-conducting block (11), a heat pipe (12) and a radiating fin (13);
Pedestal (10), be to be attached at the another side of motherboard (20) and with respect to central processing unit (21) position, the corner of pedestal (10) and be formed with perforation with respect to fixing hole position place, be equipped with the joint pin (101) that can interfix with fixing hole in perforation place, one side of pedestal (10) is formed with tank (102), pedestal (10) but be insulator for heat conduction;
Heat-conducting block (11), it is that the tank (102) that is fixed in pedestal (10) is located;
Heat pipe (12), one end are to interconnect with heat-conducting block (11), and in addition end extends towards the direction away from heat-conducting block (11), and this end bends and then be formed with bending end (121), and heat pipe (12) is for being the body of flat;
Radiating fin (13), its run through by the bending end of heat pipe (12) (121) fixing.
Please cooperate with reference to shown in the 3rd and four figure, motherboard (20) is the inside that is arranged at a casing (23), and be provided with the heat abstractor (not shown) in the top of central processing unit (21), locate to be provided with fan (22) in casing (23) and adjacent to central processing unit (21) in addition, and pedestal (10) is arranged at the another side of motherboard (20) and with respect to central processing unit (21) position, heat pipe (12) is the side extension towards motherboard (20), and makes radiating fin (13) be positioned at the relative position place of fan (22).
When central processing unit (21) when beginning to use computing, the high temperature that it produced can be distributed in the air by heat abstractor, and the high temperature of part can be gathered in the another side of motherboard (20) and with respect to central processing unit (21) position, this high temperature can conduct to pedestal (10) and locate with heat-conducting block (11), and via heat pipe (12), locate and be passed to radiating fin (13), blowing via aforesaid fan (22) again, this high temperature is distributed in the air, by this radiating mode, make motherboard (20) the another side and with respect to the temperature of central processing unit (21) position can remain in central processing unit (21) with around it by the receptible scope of electronic component in, so can make aforesaid member be able to normal operation.
Claims (4)
1. the additional cooler of the central processing unit of a motherboard is characterized in that it is to be arranged at a side of motherboard and with respect to its central processing unit position, this additional cooler has:
One pedestal;
One heat-conducting block, it is a side that is arranged at pedestal;
One heat pipe, one end are to interconnect with heat-conducting block, and end extends towards the direction away from heat-conducting block in addition;
One radiating fin, it is that elongated end with heat pipe interconnects.
2. the additional cooler of the central processing unit of motherboard as claimed in claim 1, it is characterized in that: wherein the edge of pedestal is formed with perforation, is equipped with fixing hole in perforation place.
3. the additional cooler of the central processing unit of motherboard as claimed in claim 1 or 2, it is characterized in that: wherein the elongated end of heat pipe has been bent to form bending end, and bending end is to wear to be fixed in the radiating fin place.
4. the additional cooler of the central processing unit of motherboard as claimed in claim 3 is characterized in that: wherein a side of pedestal is formed with the tank that can be provided with for heat-conducting block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200028074U CN201017871Y (en) | 2007-01-26 | 2007-01-26 | Auxiliary heat radiator of central processing unit of host board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200028074U CN201017871Y (en) | 2007-01-26 | 2007-01-26 | Auxiliary heat radiator of central processing unit of host board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201017871Y true CN201017871Y (en) | 2008-02-06 |
Family
ID=39058370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200028074U Expired - Fee Related CN201017871Y (en) | 2007-01-26 | 2007-01-26 | Auxiliary heat radiator of central processing unit of host board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201017871Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102375508A (en) * | 2010-08-16 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and heat dissipation device thereof |
-
2007
- 2007-01-26 CN CNU2007200028074U patent/CN201017871Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102375508A (en) * | 2010-08-16 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and heat dissipation device thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080206 Termination date: 20100228 |