CN220983851U - Motherboard power supply system - Google Patents
Motherboard power supply system Download PDFInfo
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- CN220983851U CN220983851U CN202322610120.0U CN202322610120U CN220983851U CN 220983851 U CN220983851 U CN 220983851U CN 202322610120 U CN202322610120 U CN 202322610120U CN 220983851 U CN220983851 U CN 220983851U
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- 210000001503 joint Anatomy 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Abstract
The embodiment of the disclosure discloses a motherboard power supply system. The specific embodiment of the system comprises: the first power supply groove is arranged at the rear end of the main board; the first power supply module is connected with the first power supply groove; the power connector female seat of the power distribution board buckle card is placed on the main board. This embodiment solves the heat dissipation problem of the power module. And the modular design is realized, and the expansibility is high. According to the system configuration requirement, a single power supply mode or a double power supply mode is selected, so that the cost is reduced.
Description
Technical Field
The embodiment of the disclosure relates to the technical field of computers, in particular to a motherboard power supply system.
Background
In the current main motherboard power supply scheme of the server system in industry, the motherboard is horizontally arranged in the chassis, and the motherboard power supply backboard PDB (Power Distribution Board) is a square board and is fixed perpendicular to the chassis. The PDB backboard is connected with the main board in a cable connection or soft copper bar connection mode.
Behind the power back plate is a power module which is inserted with the power back plate. A whole vertical backboard scheme in the prior art can prevent system wind from flowing to the power module, and the heat dissipation efficiency of the power module is affected.
The number of common power supply modules of the server is 1 or 2, and the PDB scheme supports 2 power supply modules, and has more and expensive selected components. When the system only needs one power module, the scheme causes cost waste, and the system is winded and has low heat dissipation efficiency.
Disclosure of utility model
The embodiment of the disclosure provides a motherboard power supply system.
In a first aspect, an embodiment of the present disclosure provides a motherboard power supply system, including: the first power supply groove is arranged at the rear end of the main board; the first power supply module is connected with the first power supply groove; the power connector female seat of the power distribution board buckle card is placed on the main board.
In some embodiments, the system further comprises: the power distribution board is buckled, the power connector male head is mounted on the lower surface of the power distribution board, the power connector male head is in butt joint with the power connector female seat, and the second power supply groove is mounted on the upper surface of the power distribution board.
In some embodiments, the system further comprises: and the second power supply module is connected with the second power supply groove.
In some embodiments, the power board clasp is parallel to the motherboard plane.
In some embodiments, the power connector female seat is located at a front end of the first power supply slot, and a rear end of the first power supply slot is connected to the first power module.
In some embodiments, the second power supply slot is located directly above the first power supply slot.
In some embodiments, the system includes a housing of a power module mounted on the motherboard at a rear end of the first power supply slot.
In some embodiments, the housing is divided into upper and lower layers, each layer housing a power module.
In some embodiments, the power distribution board buckle is provided with a screw hole, and is connected with the main board through the screw hole through a bolt.
In some embodiments, the power board buckle is rectangular, the second power supply slot is installed on the long side, and the length of the power board buckle is greater than the length of the second power supply slot.
The motherboard power supply system provided by the embodiment of the application adopts a motherboard+PDB buckling scheme.
1) And a power supply slot, such as a CRPS (Common Redundant Power Supplies, common redundant power supply) slot, is arranged at the rear end of the main board and is directly inserted with the power supply conversion module. And a PDB buckling power connector female seat is reserved on the main board.
2) The PDB buckle is provided with a power connector male head on the lower surface, and is in butt joint with a main board upper female seat; a CRPS slot is placed on the upper surface.
The embodiment of the application has high expansibility through modularized design. PDB buckling scheme, flexible matching. According to the system configuration requirement, when the double CRPS configuration is required, the single CRPS or similar scenes (such as nodes of the whole cabinet) are not selected.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the disclosure, nor is it intended to be used to limit the scope of the disclosure. Other features of the present disclosure will become apparent from the following specification.
Drawings
Other features, objects and advantages of the present disclosure will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings:
FIG. 1 is a system block diagram of a prior art motherboard power scheme;
FIG. 2 is a chassis and motherboard layout diagram of a motherboard power supply system according to the present disclosure;
FIG. 3 is a schematic diagram of a single power scheme of a motherboard power supply system according to the present disclosure;
FIGS. 4a-4b are schematic diagrams of a power distribution board clasp of a motherboard power supply system according to the present disclosure;
FIG. 5 is a PDB snap assembly diagram of a motherboard power supply system according to the present disclosure;
Fig. 6a is a schematic diagram of an application scenario in which a PDB fob is not required for a single CRPS model of a motherboard power supply system according to the present disclosure;
Fig. 6b is a schematic diagram of an application scenario in which a PDB buckle card is adopted, according to the dual CRPS model of the motherboard power supply system of the present disclosure.
Detailed Description
Exemplary embodiments of the present application will now be described with reference to the accompanying drawings, in which various details of the embodiments of the present application are included to facilitate understanding, and are to be considered merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the application. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.
In this disclosure, unless expressly stated or limited otherwise, a first feature being "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.
The above disclosure provides many different embodiments or examples for implementing different structures of the disclosure. The components and arrangements of specific examples are described above in order to simplify the disclosure of this disclosure. Of course, they are merely examples and are not intended to limit the present disclosure. Furthermore, the present disclosure may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.
The main motherboard power scheme of the current in-industry server system is shown in fig. 1.
In fig. 1, the motherboard is disposed horizontally in the chassis, and the motherboard power supply back plate PDB (Power Distribution Board) is a square plate and is fixed perpendicular to the chassis. The PDB backboard is connected with the main board in a cable connection or soft copper bar connection mode.
Behind the power back plate is a power module which is inserted with the power back plate. The whole vertical backboard scheme can prevent system wind from flowing to the power module, and influences the heat dissipation efficiency of the power module.
The number of common power supply modules of the server is 1 or 2, and the PDB scheme supports 2 power supply modules, and has more and expensive selected components. When the system only needs one power module, the scheme causes cost waste, and the system is winded and has low heat dissipation efficiency. Therefore, the application provides a main board power supply system, which adopts a main board+PDB buckling system power supply scheme. The heat dissipation problem of the power module of the server system is solved. The PDB buckle card is parallel to the plane of the main board, so that the problem of system wind shielding is avoided. And the modular design is realized, and the expansibility is high. PDB buckling scheme, flexible matching. According to the system configuration requirement, when the double CRPS is needed, the single CRPS or similar scenes (such as nodes of the whole cabinet) are not selected. Compared with the traditional double-output PDB scheme, the PDB buckling scheme has low component cost, and when buckling is not needed, the whole machine saves more power supply component cost.
Referring specifically to fig. 2-5, block diagrams of components of the motherboard power supply system are shown, respectively.
In this embodiment, as shown in fig. 2 and 3, the motherboard power supply system may include: a first power supply groove 201 disposed at the rear end of the main board; a first power module 202 connected to the first power supply slot; the power connector female base 203 of the power distribution board buckle card is placed on the main board. The first power supply slot may be a CRPS slot. Other power slots may be used if applied to non-server power, such as USB, type C, etc. The back end of the main board is a normal position for placing a power supply and is connected with a power line outside the case. Because the present application supports dual power modes, two power supply slots and two power modules are required. The necessary power supply slot is named as a first power supply slot, and the selected power supply slot is named as a second power supply slot. The power module with the necessary configuration is named as a first power module, and the power module with the selected configuration is named as a second power module. The first power supply slot 201 may be fixedly installed at the rear end of the main board, and may be fixed by welding, bolting, or the like. The first power module 202 may be directly plugged into the first power supply tank 201, or may be connected to the first power supply tank 201 by using a cable connection or a soft copper bar. The power connector female seat 203 of the power distribution board buckle card is fixedly arranged on the main board and is fixed by means of welding, bolt connection and the like. For inserting selected distribution board connectors (PDB connectors).
As shown in fig. 3, in a scenario where only one power module is needed, for example, a node server of a complete machine cabinet, only a power line needs to be connected to the first power module 202 to supply power to the motherboard. The resulting single source power scheme is shown in fig. 6 a.
If two power modules are required, for example, a single node server. The two power supply scheme is shown in fig. 6b by simply inserting the panel snap 204 shown in fig. 4a-4b into the panel snap power connector female receptacle 203.
In some optional implementations of this embodiment, the system further comprises: the power distribution board buckle 204, the power connector male head 205 is installed on the lower surface of the power distribution board buckle, the power connector male head 205 is in butt joint with the power connector female seat 203, and the second power supply groove 206 is installed on the upper surface of the power distribution board buckle 204. The power connector male head 205 forms a current path with the second power supply groove 206 after being docked with the power connector female seat 203. The panel card 204 is selected for use in situations where dual power mode is desired. So that hardware costs can be reduced. The power distribution board buckle card 204 can be directly inserted into the power connector female base 203 of the main board, so that the power distribution board buckle card is convenient to assemble and disassemble and convenient for upgrading a power supply of a server. The second power slot 206 to which the distribution board clasp 204 is connected may also be enabled to connect the first power module when the first power slot 201 fails.
In some optional implementations of this embodiment, the system further comprises: and a second power module 207 connected to the second power supply tank 206. Thus, two power supply modules can supply power. The switching to the second power supply module 207 may be performed upon failure of the first power supply module 202, or vice versa. The motherboard may also be powered by both the first power module 202 and the second power module 207.
In some alternative implementations of the present embodiment, the panel buckle 204 is parallel to the motherboard plane. Unlike the conventional PDB board perpendicular to the motherboard, the PDB buckle 204 of the present application is parallel to the motherboard plane, so that the flow of the wind is not blocked, and the heat dissipation speed can be increased.
In some alternative implementations of this embodiment, the power connector female socket 203 is located at a front end of the first power supply slot 201, and a rear end of the first power supply slot 201 is connected to the first power module 203. Therefore, the two power supply modules can be concentrated at one place, and management is convenient. In addition, the fan may be disposed in front of the power connector female housing 203 to blow directly toward the power, which may improve heat dissipation efficiency.
In some alternative implementations of this embodiment, the second power supply tank 206 is located directly above the first power supply tank 201. The dimensions of the second power supply slot 206 and the first power supply slot 201 may be identical, and the projection of the second power supply slot 206 on the main board and the projection of the first power supply slot 201 on the main board completely coincide. This facilitates hardware assembly and saves space.
In some alternative implementations of this embodiment, the system includes a housing 208 of the power module mounted on the motherboard at the rear end of the first power supply slot 201. Mounting the first power module 202 and/or the second power module 207 into the housing 208 may protect the power modules. The housing 208 may also be made of metal, which may shield electromagnetic signals and reduce electromagnetic interference.
In some alternative implementations of this embodiment, the housing is divided into upper and lower layers, each layer housing a power module. The two power supply modules are respectively placed in different cavities of the shell, so that the protection strength of the power supply modules can be improved, and mutual interference can be prevented. When any one of the power supply modules is damaged, the normal use of the other power supply module is not affected.
In some alternative implementations of this embodiment, the panel clip 204 is provided with a screw hole 209, and is connected to the motherboard by a bolt through the screw hole 209. The connection between the power board buckling card 204 and the main board is reinforced by bolts, so that poor contact between the power connector female base 203 of the power board buckling card and the power connector male head 205 is prevented.
In some alternative implementations of this embodiment, the panel clip 204 is rectangular, the second power supply slot 206 is mounted on a long side, and the length of the panel clip 204 is greater than the length of the second power supply slot 206. Only slightly longer, which ensures that the second power slot 206 is securely mounted to the panel clip 204. Installation space and manufacturing costs of the panel buckle 204 can also be saved.
The above description is only illustrative of the preferred embodiments of the present utility model and of the principles of the technology employed. It will be appreciated by persons skilled in the art that the scope of the utility model referred to in the present utility model is not limited to the specific combinations of the technical features described above, but also covers other technical features formed by any combination of the technical features described above or their equivalents without departing from the inventive concept. Such as the above-mentioned features and the technical features disclosed in the present utility model (but not limited to) having similar functions are replaced with each other.
Claims (10)
1. A motherboard power supply system, comprising:
The first power supply groove is arranged at the rear end of the main board;
The first power supply module is connected with the first power supply groove;
The power connector female seat of the power distribution board buckle card is placed on the main board.
2. The system of claim 1, wherein the system further comprises:
The power distribution board is buckled, the power connector male head is mounted on the lower surface of the power distribution board, the power connector male head is in butt joint with the power connector female seat, and the second power supply groove is mounted on the upper surface of the power distribution board.
3. The system of claim 2, wherein the system further comprises:
and the second power supply module is connected with the second power supply groove.
4. The system of claim 2, wherein the panel snap is parallel to a motherboard plane.
5. The system of claim 1, wherein the power connector female is located at a front end of the first power supply slot, and wherein a rear end of the first power supply slot is connected to the first power module.
6. The system of claim 2, wherein the second power supply tank is located directly above the first power supply tank.
7. The system of claim 1, comprising a housing of a power module mounted on the motherboard at a rear end of the first power supply slot.
8. The system of claim 7, wherein the housing is divided into upper and lower layers, each layer housing a power module.
9. The system of claim 2, wherein the panel clip is provided with screw holes through which the panel clip is bolted to the main panel.
10. The system of claim 2, wherein the panel snap is rectangular, the second power slot is mounted on a long side, and the length of the panel snap is greater than the length of the second power slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322610120.0U CN220983851U (en) | 2023-09-25 | 2023-09-25 | Motherboard power supply system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322610120.0U CN220983851U (en) | 2023-09-25 | 2023-09-25 | Motherboard power supply system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220983851U true CN220983851U (en) | 2024-05-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322610120.0U Active CN220983851U (en) | 2023-09-25 | 2023-09-25 | Motherboard power supply system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220983851U (en) |
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2023
- 2023-09-25 CN CN202322610120.0U patent/CN220983851U/en active Active
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