CN102131366B - Heat dissipating device and system - Google Patents
Heat dissipating device and system Download PDFInfo
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- CN102131366B CN102131366B CN201010000725.2A CN201010000725A CN102131366B CN 102131366 B CN102131366 B CN 102131366B CN 201010000725 A CN201010000725 A CN 201010000725A CN 102131366 B CN102131366 B CN 102131366B
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- bearing part
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Abstract
The invention relates to a heat dissipating device comprising a bearing element arranged on a circuit board, a plurality of heat dissipating components and a plurality of elastic components; a plurality of holes are arranged in the bearing element; the plurality of heat dissipating components are respectively arranged at one end of the bearing element and installed in the holes and are respectively used for dissipating heat generated by a plurality of heat sources arranged at the other side of the bearing element; and the plurality of elastic components are respectively used for downwards pressing the plurality of heat dissipating components to enable the heat dissipating components to be respectively and tightly in contact with the plurality of heat sources.
Description
Technical field
The invention provides a kind of heat abstractor and cooling system, be particularly a kind ofly used for loose heat abstractor and cooling system except heat that a plurality of thermal source produces.
Background technology
Along with scientific and technological progress, the function of consumption electronic products is more and more abundanter, therefore also more and more higher to the requirement of usefulness.Yet high-effectly mean highly energy-consuming, even may cause the problems such as resonance, noise, heat radiation.For instance, usefulness improves the related also relatively increase of heat energy that each element is supervened when carrying out various function, if the heat energy that the inner member of electronic product produces cannot efficiently be got rid of, can have influence on running stability and the operational paradigm of electronic product, even may cause mechanical breakdown, cause user's loss.At present the conventional settling mode of industry is for to add cooling system at element thermal source place, as fan, radiating groove, heat pipe, fin, or cooling chip etc., so as to attenuating component temperature, and make electronic product be able to normal operation.
Owing to can be provided with many process chip on the motherboard of computer system simultaneously, for the cooling mechanism of these process chip, often adopt at present the radiating module of air cooling heat radiation, and the fixed form of these radiating modules often utilizes the snap fit of radiating module to catch on the anchor shape works on motherboard, or utilize Spring screws that radiating module is locked on motherboard.Yet on motherboard, be provided with many process chip simultaneously and respectively process the distance of chip chamber when very near, in the structure of fixing radiating module, just have different designs.For instance, if the heat that falls apart and produce except each process chip with a plurality of radiators simultaneously, each radiator all needs to use the fixed mechanisms such as snap fit or Spring screws to be assembled on motherboard, therefore on motherboard, just need to there be many corresponding anchor shape works or position, hole, and cause on motherboard, there are many restriction blocks cannot place other parts, more can cause the problem of circuit layout, motherboard needs the more number of plies to carry out cabling, therefore can increase cost.On the other hand, if the heat that falls apart simultaneously and produce except each process chip with single large-scale radiator, although it can overcome the problem that needs to be provided with a plurality of anchor shape works or position, hole on above-mentioned motherboard, but can produce assembling tolerance while being loaded on motherboard due to each processing chipset, and the height that causes each process chip has the offset of a little, and then make single radiator and each processing chip chamber can cause the bad problem of contact, therefore need on the contact-making surface of radiator, do the processing of offset, or need overcome with expensive fin the bad problem of contact, and then increase cost.Therefore how designing the good heat radiating that can simultaneously fall apart except heat that a plurality of thermal source produces machine-processed, is just cooling mechanism design is made great efforts now problem.
Summary of the invention
The invention provides a kind of be used for loose heat abstractor and cooling system except heat that a plurality of thermal source produces, to solve the above problems.
The present invention discloses a kind of heat abstractor, and it includes a bearing part, and it is arranged on a circuit board, and this bearing part is provided with a plurality of perforates; A plurality of heat dissipation elements, it is separately positioned on a side of this bearing part and is arranged in the plurality of perforate, and the plurality of heat dissipation element is used for respectively the heat that a plurality of thermals source of the loose opposite side except this bearing part produce; And a plurality of flexible members, it is used for respectively pressing down the plurality of heat dissipation element, so that the plurality of heat dissipation element difference close contact is to the plurality of thermal source.
The present invention separately discloses this bearing part for locking to this circuit board.
The two ends that the present invention separately discloses this flexible member are respectively fixed to the both sides of this bearing part, and the mid portion of this flexible member fastens to this heat dissipation element.
The present invention separately discloses this bearing part and includes a base plate, which is provided with the plurality of perforate; And a plurality of side walls, it is connected respectively to this base plate, and the two ends of this flexible member are respectively fixed to the plurality of side wall, and the mid portion of this flexible member fastens to this heat dissipation element.
The present invention separately discloses the side that the plurality of side wall is arranged on this base plate.
The present invention separately discloses the mid portion that the plurality of side wall is arranged on this base plate.
One end that the present invention separately discloses this flexible member is fixed to this bearing part and the other end is fixed to this circuit board, and the mid portion of this flexible member fastens to this heat dissipation element.
The present invention separately discloses and on this heat dissipation element, is formed with a groove, and it is used for accommodating this flexible member and is depressed into the part of this heat dissipation element.
The present invention separately discloses a kind of cooling system, and it includes a circuit board; A plurality of thermals source, it is arranged on respectively on this circuit board; And a heat abstractor, it is used for loose except heat that the plurality of thermal source produces.This heat abstractor includes a bearing part, and it is arranged on this circuit board, and this bearing part is provided with a plurality of perforates; A plurality of heat dissipation elements, it is separately positioned on a side of this bearing part and is arranged in the plurality of perforate, and the plurality of heat dissipation element is used for respectively the heat that a plurality of thermals source of the loose opposite side except this bearing part produce; And a plurality of flexible members, it is used for respectively pressing down the plurality of heat dissipation element, so that the plurality of heat dissipation element difference close contact is to the plurality of thermal source.
Accompanying drawing explanation
Fig. 1 is the element schematic exploded perspective view of first embodiment of the invention cooling system.
Fig. 2 is the assembling schematic diagram of first embodiment of the invention cooling system.
Fig. 3 is the top view of first embodiment of the invention cooling system.
Fig. 4 is the end view of first embodiment of the invention cooling system.
Fig. 5 is the element schematic exploded perspective view of second embodiment of the invention cooling system.
Fig. 6 is the assembling schematic diagram of second embodiment of the invention cooling system.
Fig. 7 is the top view of second embodiment of the invention cooling system.
Fig. 8 is the end view of second embodiment of the invention cooling system.
Fig. 9 is the element schematic exploded perspective view of third embodiment of the invention cooling system.
Figure 10 is the assembling schematic diagram of third embodiment of the invention cooling system.
Figure 11 is the top view of third embodiment of the invention cooling system.
Figure 12 is the end view of third embodiment of the invention cooling system.
Main element symbol description
50 cooling system 52 circuit boards
54 thermal source 56 heat abstractors
58 bearing part 581 perforates
582 base plate 5,821 first grooves
60 heat dissipation element 601 grooves
62 flexible members
100 cooling system 102 circuit boards
104 thermal source 106 heat abstractors
108 bearing part 1081 side walls
10811 second groove 1082 base plates
1083 perforate 110 heat dissipation elements
1101 groove 112 flexible members
150 cooling system 152 circuit boards
154 thermal source 156 heat abstractors
158 bearing part 1581 base plates
1582 side walls 15821 the 3rd groove
1583 perforate 160 heat dissipation elements
1601 groove 162 flexible members
Embodiment
Refer to Fig. 1 to Fig. 4, Fig. 1 is the element schematic exploded perspective view of first embodiment of the invention one cooling system 50, Fig. 2 is the assembling schematic diagram of first embodiment of the invention cooling system 50, Fig. 3 is the top view of first embodiment of the invention cooling system 50, and Fig. 4 is the end view of first embodiment of the invention cooling system 50.Cooling system 50 can be applicable to a host computer, and cooling system 50 includes a circuit board 52, and it can be a motherboard; Cooling system 50 separately includes a plurality of thermals source 54, and it is arranged on respectively on circuit board 52, and thermal source 54 can be a process chip etc.; Cooling system 50 separately includes a heat abstractor 56, and it is used for loose except a plurality of thermal source 54 heats that produce.Heat abstractor 56 includes a bearing part 58, and it is arranged on circuit board 52, and for example bearing part 58 can lock on circuit board 52, bearing part 58 is provided with a plurality of perforates 581, bearing part 58 can be the works that comprises base plate and side wall, or is only slab construction thing, looks closely actual design demand and determines; Heat abstractor 56 separately includes a plurality of heat dissipation elements 60, it is separately positioned on a side of bearing part 58 and is arranged on respectively in a plurality of perforates 581, a plurality of heat dissipation elements 60 pass respectively a plurality of perforates 581 and touch respectively a plurality of thermals source 54, the heat that a plurality of thermals source 54 of the opposite side that removes bearing part 58 so as to being used for faling apart produce, wherein heat dissipation element 60 can be a radiating fin, and on each heat dissipation element 60, can be formed with respectively a groove 601; Heat abstractor 56 separately includes a plurality of flexible members 62, it is used for respectively pressing down a plurality of heat dissipation elements 60, so that a plurality of heat dissipation elements 60 difference close contacts are to a plurality of thermals source 54, and flexible member 62 is depressed in the groove 601 that the part of heat dissipation element 60 can be contained in heat dissipation element 60, wherein flexible member 62 can be a geometrical clamp or is other flexible fastening elements.
In this embodiment, the two ends of each flexible member 62 are respectively fixed to the both sides of bearing part 58, as fasten in a plurality of first grooves 5821 in both sides of a base plate 582 of bearing part 58, and the mid portion of each flexible member 62 fastens to respectively each heat dissipation element 60, the pressing strength producing by the rotary torsion of flexible member 62 can press down heat dissipation element 60, and can by heat dissipation element 60 closely pressing touch thermal source 54, the just loose radiating efficiency except thermal source 54 heat that produces of heat radiation element 60 effectively thus.Moreover, can be by changing the shape of each flexible member 62 or reaching the object of adjusting the pressing strength that presses down heat dissipation element 60 with the locking position of bearing part 58, thus just can be for the actual contact condition of indivedual thermals source 54 and each heat dissipation element 60, utilize the configuration of adjusting corresponding flexible member 62 to reach best engagement state, and improve the bad problem of contact.In addition, by the position configuration of adjusting flexible member 62, can reach the effect of using one species flexible member 62 to fix each heat dissipation element 60, just can save thus assembly cost and promote assembling convenience.In the present embodiment, bearing part 58 can lock on circuit board 52 and the two ends of each flexible member 62 are respectively fixed to the both sides of bearing part 58, in addition one end that also can design flexibility element 62 is fixed to bearing part 58 and the other end is fixed to circuit board 52, and the mid portion of flexible member 62 also fastens to heat dissipation element 60, just can bearing part 58 be fixed on circuit board 52 by flexible member 62 thus, and need not additionally use other fixed mechanisms that bearing part 58 is fixed on circuit board 52.
Refer to Fig. 5 to Fig. 8, Fig. 5 is the element schematic exploded perspective view of second embodiment of the invention one cooling system 100, Fig. 6 is the assembling schematic diagram of second embodiment of the invention cooling system 100, Fig. 7 is the top view of second embodiment of the invention cooling system 100, and Fig. 8 is the end view of second embodiment of the invention cooling system 100.Cooling system 100 also may be used on a host computer, and cooling system 100 includes a circuit board 102, and it can be a motherboard; Cooling system 100 separately includes a plurality of thermals source 104, and it is arranged on respectively on circuit board 102, and thermal source 104 can be a process chip etc.; Cooling system 100 separately includes a heat abstractor 106, and it is used for loose except a plurality of thermal source 104 heats that produce.Heat abstractor 106 includes a bearing part 108, it is arranged on circuit board 102, for example bearing part 108 can lock on circuit board 102, bearing part 108 includes both walls 1081, an and base plate 1082, it is connected to both walls 1081, and both walls 1081 is arranged on the side of base plate 1082, and base plate 1082 is provided with a plurality of perforates 1083; Heat abstractor 106 separately includes a plurality of heat dissipation elements 110, it is separately positioned on a side of bearing part 108 and is arranged on respectively in a plurality of perforates 1083, a plurality of heat dissipation elements 110 pass respectively a plurality of perforates 1083 and are contacted with respectively a plurality of thermals source 104, the heat that a plurality of thermals source 104 of the opposite side that removes bearing part 108 so as to being used for faling apart produce, wherein heat dissipation element 110 can be a radiating fin, and on each heat dissipation element 110, can be formed with respectively a groove 1101; Heat abstractor 106 separately includes a plurality of flexible members 112, it is used for respectively pressing down a plurality of heat dissipation elements 110, so that a plurality of heat dissipation elements 110 difference close contacts are to a plurality of thermals source 104, and flexible member 112 is depressed in the groove 1101 that the part of heat dissipation element 110 can be contained in heat dissipation element 110, wherein flexible member 112 can be a geometrical clamp or is other flexible fastening elements.The two ends that are flexible member 112 with previous embodiment difference are respectively fixed to both walls 1081, as fasten in a plurality of second grooves 10811 of both walls 1081, and the mid portion of flexible member 112 fastens to heat dissipation element 110, the pressing strength producing by the rotary torsion of flexible member 112 can press down heat dissipation element 110, and can by heat dissipation element 110 closely pressing be contacted with thermal source 104, the just loose radiating efficiency except thermal source 104 heat that produces of heat radiation element 110 effectively thus.Other action principles as for the second embodiment are same as the first embodiment, at this, just no longer describe in detail.
Refer to Fig. 9 to Figure 12, Fig. 9 is the element schematic exploded perspective view of third embodiment of the invention one cooling system 150, Figure 10 is the assembling schematic diagram of third embodiment of the invention cooling system 150, Figure 11 is the top view of third embodiment of the invention cooling system 150, and Figure 12 is the end view of third embodiment of the invention cooling system 150.Cooling system 150 also can be applicable to a host computer, and cooling system 150 includes a circuit board 152, and it can be a motherboard; Cooling system 150 separately includes a plurality of thermals source 154, and it is arranged on respectively on circuit board 152, and thermal source 154 can be a process chip etc.; Cooling system 150 separately includes a heat abstractor 156, and it is used for loose except a plurality of thermal source 154 heats that produce.Heat abstractor 156 includes a bearing part 158, it is arranged on circuit board 152, for example bearing part 158 can lock on circuit board 152, bearing part 158 includes a plurality of side walls 1582, an and base plate 1581, it is connected to a plurality of side walls 1582, and a plurality of side walls 1582 are arranged on the mid portion of base plate 1581, and base plate 1581 is provided with a plurality of perforates 1583; Heat abstractor 156 separately includes a plurality of heat dissipation elements 160, it is separately positioned on a side of bearing part 158 and is arranged on respectively in a plurality of perforates 1583, a plurality of heat dissipation elements 160 pass respectively a plurality of perforates 1583 and touch respectively a plurality of thermals source 154, the heat that a plurality of thermals source 154 of the opposite side that removes bearing part 158 so as to being used for faling apart produce, wherein heat dissipation element 160 can be a radiating fin, and on each heat dissipation element 160, can be formed with respectively a groove 1601; Heat abstractor 156 separately includes a plurality of flexible members 162, it is used for respectively pressing down a plurality of heat dissipation elements 160, so that a plurality of heat dissipation elements 160 difference close contacts are in a plurality of thermals source 154, and flexible member is pressed on for 162 times in the groove 1601 that the part of heat dissipation element 160 can be contained in heat dissipation element 160, wherein flexible member 162 can be a geometrical clamp or is other flexible fastening elements.The two ends that are flexible member 162 with previous embodiment difference are respectively fixed to the both walls 1582 of corresponding heat dissipation element 160 both sides, as fasten in a plurality of the 3rd grooves 15821 of both walls 1582, and the mid portion of flexible member 162 fastens to heat dissipation element 160, the pressing strength producing by the rotary torsion of flexible member 162 can press down heat dissipation element 160, and can by heat dissipation element 160 closely pressing be contacted with thermal source 154, the just loose radiating efficiency except thermal source 154 heat that produces of heat radiation element 160 effectively thus.Other action principles as for the 3rd embodiment are same as previous embodiment, at this, just no longer describe in detail.
Compared to prior art, the invention provides heat abstractor and the cooling system that can fall apart except heat that a plurality of thermal source produces simultaneously, it can reach the object of adjusting the pressing strength between heat dissipation element and thermal source by adjusting the shape of flexible member or allocation position, thus just can be for the actual contact condition of indivedual thermals source and each heat dissipation element, utilize the configuration of adjusting corresponding flexible member to reach best engagement state, and improve the bad problem of contact.Moreover, the present invention also can improve needs to have many corresponding anchor shape works or position, hole to fix the shortcoming of a plurality of heat dissipation elements on motherboard, and increase the design flexibility of motherboard, so the present invention one can fall apart simultaneously and remove the good heat radiating mechanism design of heat that a plurality of thermal source produces.
The foregoing is only the preferred embodiments of the present invention, all equalizations of doing according to the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (12)
1. a heat abstractor, it is used for loose except heat that a plurality of thermal source produces, and this heat abstractor includes:
One bearing part, it is arranged on a circuit board, and this bearing part is provided with a plurality of perforates;
A plurality of heat dissipation elements, it is separately positioned on a side of this bearing part and is arranged in the plurality of perforate, and the plurality of heat dissipation element is used for respectively the heat that the plurality of thermal source of the loose opposite side except this bearing part produces; And
A plurality of flexible members, the two ends of its each flexible member are respectively fixed on this bearing part, and the mid portion of this flexible member fastens on this heat dissipation element, with the pressing strength that rotary torsion was produced by this flexible member, press down this heat dissipation element, and this heat dissipation element is fixed on this bearing part, so that the plurality of heat dissipation element difference close contact is in the plurality of thermal source.
2. heat abstractor according to claim 1, wherein this bearing part locks to this circuit board.
3. heat abstractor according to claim 1, wherein this bearing part includes:
One base plate, which is provided with the plurality of perforate; And
A plurality of side walls, it is connected respectively to this base plate, and the two ends of this flexible member are respectively fixed to the plurality of side wall, and the mid portion of this flexible member fastens to this heat dissipation element.
4. heat abstractor according to claim 3, wherein the plurality of side wall is arranged on the side of this base plate.
5. heat abstractor according to claim 3, wherein the plurality of side wall is arranged on the mid portion of this base plate.
6. heat abstractor according to claim 1, is wherein formed with a groove on this heat dissipation element, and it is used for accommodating this flexible member and is depressed into the part of this heat dissipation element.
7. a cooling system, it is used for loose except heat that a plurality of thermal source produces, and this cooling system comprises:
One circuit board;
A plurality of thermals source, it is arranged on respectively on this circuit board; And
One heat abstractor, it is used for loose except heat that the plurality of thermal source produces, and this heat abstractor comprises:
One bearing part, it is arranged on this circuit board, and this bearing part is provided with a plurality of perforates;
A plurality of heat dissipation elements, it is separately positioned on a side of this bearing part and is arranged in the plurality of perforate, and the plurality of heat dissipation element is used for respectively the heat that the plurality of thermal source of the loose opposite side except this bearing part produces; And
A plurality of flexible members, described in its each, the two ends of flexible member are respectively fixed on this bearing part, and the mid portion of this flexible member fastens on this heat dissipation element, with the pressing strength that rotary torsion was produced by this flexible member, press down this heat dissipation element, and this heat dissipation element is fixed on this bearing part, so that the plurality of heat dissipation element difference close contact is to the plurality of thermal source.
8. cooling system according to claim 7, wherein this bearing part locks to this circuit board.
9. cooling system according to claim 8, wherein this bearing part includes:
One base plate, which is provided with the plurality of perforate; And
A plurality of side walls, it is connected respectively to this base plate, and the two ends of this flexible member are respectively fixed to the plurality of side wall, and the mid portion of this flexible member fastens to this heat dissipation element.
10. cooling system according to claim 9, wherein the plurality of side wall is arranged on the side of this base plate.
11. cooling systems according to claim 9, wherein the plurality of side wall is arranged on the mid portion of this base plate.
12. cooling systems according to claim 7, are wherein formed with a groove on this heat dissipation element, and it is used for accommodating this flexible member and is depressed into the part of this heat dissipation element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010000725.2A CN102131366B (en) | 2010-01-15 | 2010-01-15 | Heat dissipating device and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010000725.2A CN102131366B (en) | 2010-01-15 | 2010-01-15 | Heat dissipating device and system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102131366A CN102131366A (en) | 2011-07-20 |
| CN102131366B true CN102131366B (en) | 2014-02-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010000725.2A Active CN102131366B (en) | 2010-01-15 | 2010-01-15 | Heat dissipating device and system |
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| Country | Link |
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| CN (1) | CN102131366B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6898162B2 (en) * | 2017-06-23 | 2021-07-07 | 矢崎総業株式会社 | Fixed structure of electronic components |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201230433Y (en) * | 2008-06-11 | 2009-04-29 | 东莞莫仕连接器有限公司 | Heat radiating model set |
| CN201336779Y (en) * | 2008-12-30 | 2009-10-28 | 上海波宝仟赫科技有限公司 | Heat radiating device |
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2010
- 2010-01-15 CN CN201010000725.2A patent/CN102131366B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201230433Y (en) * | 2008-06-11 | 2009-04-29 | 东莞莫仕连接器有限公司 | Heat radiating model set |
| CN201336779Y (en) * | 2008-12-30 | 2009-10-28 | 上海波宝仟赫科技有限公司 | Heat radiating device |
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| Publication number | Publication date |
|---|---|
| CN102131366A (en) | 2011-07-20 |
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