CN101312632A

CN101312632A - Heat radiating device

Info

Publication number: CN101312632A
Application number: CNA2007100745917A
Authority: CN
Inventors: 郑东波; 符猛; 陈俊吉
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 2007-05-25
Filing date: 2007-05-25
Publication date: 2008-11-26
Anticipated expiration: 2027-05-25
Also published as: CN101312632B

Abstract

A heat dissipating device can dissipate the heat of at least two electronic elements, comprising a baseboard, a first radiating fin group, a second radiating fin group and at least one heat pipe between the baseboard and the two radiating fin groups, wherein the first and second radiating fin groups both comprise a plurality of radiating fins, the adjacent radiating fins of the first and second radiating fin groups form an airflow channel, the second radiating fin group is provided with an air channel for flowing airflow to the first radiating fin group, the air channel is wider than the airflow channel between two adjacent radiating fins. One radiating fin group is provided with an air channel for flowing air, to reduce the resistance baffling airflow to another radiating fin group and directly flow airflow into another radiating fin group without preheated by the second radiating fin, thereby effectively eliminating the temperature difference generated by the spatial position difference of the two radiating fin groups relative to the airflow.

Description

Heat abstractor

Technical field

The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is used for cooling electronic components.

Background technology

Along with the develop rapidly of electronic industry, the continuous lifting of electronic component (as the central processing unit) speed of service produces a large amount of heats during operation, and itself and system temperature are raise, and influences the stability of its system then.For guaranteeing that electronic component can normally move, heat abstractor is installed usually thereon, discharge the heat that it produces.

The traditional solution of electronic element radiating problem is normally installed a radiator on each heat-generating electronic elements, this radiator comprises the base plate that closely contacts with electronic component, is located at the some radiating fins on the base plate.Along with the electronic component arithmetic speed grows with each passing day, for further satisfying radiating requirements, also can in radiator, wear heat pipe, a fan is installed at one side or top is distributed to promote air flows to accelerate heat, simultaneously such heat abstractor combination is except that radiating efficiency has greatly improved on than original radiator basis, and dimension volume also increases much.But along with the arrival in digital code information epoch, the compact main trend that becomes current electronic product, its manufacturing process be also constantly towards the development of high-density packages and multifunctional direction, and the distance of each electronic component such as chip is more and more littler and caloric value is increasing.Therefore in actual applications, very little and when highly not waiting when distance between a plurality of heat-generating electronic elements, if adopting independently respectively, heat abstractor dispels the heat to keep the normal operation of system to it, not only can make the radiator structure of system disperse complexity to cause the system space waste, and because the very little size that also can limit independent heat abstractor of spacing between electronic component, and influence the heat efficiency.For example, current popular two CPU computers utilize a radiator that two CPU are dispelled the heat, this radiator comprises a base plate that contacts with two CPU simultaneously and some radiating fins along distribution of floor length direction and parallel interval, in addition, also can one fan be set in this radiator one side provides forced draft or utilizes the forced draft of system fan generation to enter from one end entrance of the runner between radiating fin, thereby promotes that heat distributes.Yet, this base plate of radiator and radiating fin that is used for two CPU is longer, make the runner windage that forms between radiating fin bigger, so, near the runner inlet blast will be much larger than near the blast the runner exit, it is inconsistent to make the heat at radiating fin two ends distribute speed, thereby causes two CPU heat radiation uneven, and then influences the stability of their operations.

Summary of the invention

In view of this, be necessary to provide the heat abstractor of a kind of adaptive two or more electronic components simultaneously and good heat dissipation effect.

A kind of heat abstractor is used for two or more electronic element radiatings, it comprise a substrate, one first groups of fins, one second groups of fins and be located in described substrate and described two groups of fins between at least one heat pipe, this first and second groups of fins includes some fin, and form gas channel between adjacent two fin of first and second groups of fins, this second groups of fins is provided with the air flow channel that air feed stream flows to first groups of fins, and the gas channel between more adjacent two fin of the width of this air flow channel is big.

In two groups of fins of above-mentioned heat abstractor, there is a groups of fins to offer and is beneficial to the air flow channel that air communication is crossed, arrive the resistance of first groups of fins in addition and air-flow is directly entered in another groups of fins without this second groups of fins preheating to reduce air-flow, remove the temperature difference that two groups of fins produce owing to the differences in spatial location of relative wind thereby effectively imitate.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

Description of drawings

Fig. 1 is the three-dimensional combination figure of a preferred embodiment of heat abstractor of the present invention.

Fig. 2 is the three-dimensional exploded view of heat abstractor among Fig. 1.

Fig. 3 is the vertical view of heat abstractor among Fig. 1.

Embodiment

Heat abstractor of the present invention is to be used for a plurality of heat-generating electronic elements such as CPU (figure does not show) etc. are dispelled the heat.See also Fig. 1 to Fig. 3, heat abstractor in one embodiment of the present invention, it comprises with a substrate 10, the part of two CPU contact the 3rd groups of fins 50 that is embedded in a heat pipe heat 20 in the substrate 10, is spaced first groups of fins 30 and second groups of fins 40 on substrate 10 and heat pipe heat 20, is positioned at substrate 10 and second groups of fins, 40 1 sides and is connected with substrate 10 heat conduction by heat pipe heat 20.

Aforesaid substrate 10 is a rectangular flat, and it is formed by heat conductivility good metal material such as casting such as aluminium, copper.These substrate 10 upper surfaces offer the storage tank of some ccontaining heat pipe heat 20, comprise one first storage tank 12, one second storage tank 14 and one the 3rd storage tank 16 in the present embodiment.This first storage tank 12 is L-shaped, and it comprises and one first parallel-segment 120 of the long edge-perpendicular of substrate 10 and vertical with this first parallel-segment 120 and along one first vertical section 122 of a long edge extension of substrate 10.This first parallel-segment 120 is positioned on the substrate 10 position over against a CPU and first groups of fins, 30 middle parts.This second storage tank 14 takes the shape of the letter U, and it comprises that two parallel-segment 140 reach vertically and connect one second vertical section 142 of two parallel-segment 140.This two second parallel-segment 140 is parallel to each other at interval, and one second parallel-segment, 140 adjacent and parallel first parallel-segment 120 are arranged, another second parallel-segment 140 is over against another CPU and second groups of fins 40, and this second vertical section 142 is parallel and arrange and vertically connect two second parallel-segment 140 by first vertical section 122.The 3rd storage tank 16 is L-shaped, it comprises one the 3rd parallel-segment 160 and one three vertical section 162 vertical with the 3rd parallel-segment 160, the 3rd parallel-segment 160 and first parallel-

segment

120 and 140 parallel and adjacent second parallel-segment 140 extensions of second parallel-segment, the 3rd

vertical section

162 and 122 parallel and adjacent another the substrate 10 long edges extensions of first vertical section away from first vertical section 122.

Above-mentioned heat pipe heat 20 comprises some flat hot pipes that all take the shape of the letter U, and it comprises one first heat pipe 22, one second heat pipe 24 and one the 3rd heat pipe 26.This first heat pipe 22 comprises 2 first parallel portion 220 of parallel interval and one first vertical component effect 222 that vertically is connected two first parallel portion 220, wherein one first parallel portion 220 is placed in first parallel-segment 120 of substrate 10 first grooves 12 correspondences, another first parallel portion 220 is positioned at a side of substrate 10 and is inserted in the 3rd groups of fins 50, this first vertical component effect 222 is long than first vertical section 122 of first groove 12, its major part is placed in this first vertical section 122, and fraction extends and connects another first parallel portion 220 that is positioned at these substrate 10 1 sides to substrate 10 outsides.This second heat pipe 24 comprises be parallel to each other two parallel portion 240 and vertical one second vertical component effect 242 that connects these two second parallel portion 240 at interval, this two second parallel portion 240 is placed in respectively in two second parallel-segment 140 of corresponding substrate 10 second grooves 14, and this second vertical component effect 242 is placed in second vertical section 142 of the second corresponding groove 14.The 3rd heat pipe 26 comprises 2 the 3rd parallel portion 260 of parallel interval and one the 3rd vertical component effect 262 that vertically is connected two the 3rd parallel portion 260, wherein one the 3rd parallel portion 260 is placed in the 3rd parallel-segment 160 of substrate 10 the 3rd groove 16, another the 3rd parallel portion 260 is positioned at a side of substrate 10 and is inserted in the 3rd groups of fins 50, the 3rd vertical component effect 222 is long than the 3rd vertical section 162 of the 3rd groove 16, its major part is placed in the 3rd vertical section 162, and fraction extends and connects another the 3rd parallel portion 260 that is positioned at these substrate 10 1 sides to substrate 10 outsides.As seen these first heat pipes 22, second heat pipe 24 and the 3rd heat pipe 26 are placed in respectively in first storage tank 12, second storage tank 14 and the 3rd storage tank 16 of substrate 10 correspondences, and the end face of these heat pipes flushes with the end face of substrate 10 and forms a plane that contacts with groups of

fins

30,40.

Above-mentioned first groups of fins 30 is arranged at substrate 10 1 ends top, it comprises first fin 32 of some parallel and equi-spaced apart, every 32 of adjacent two first fin are formed with gas channel, and the bottom edge of each first fin 32 has flanging 320 to a side vertical extent, and all these flangings 320 abut against the plane that formation together contacts with pedestal 10 and heat pipe heat 20 end faces.This second groups of fins 42 is arranged at pedestal 10 other ends top, it comprises some identical second fin 42 with first fin, 32 structures, every adjacent two second fin 42 form gas channel, and each second fin, 42 bottom edge vertical extent has flanging 420, this second groups of fins 40 is position and offer an air flow channel 44 along second fin, 42 length directions therebetween, the width of this air flow channel 44 is big than the gas channel between two adjacent second fin 42, is beneficial to flow to the air communication mistake of first groups of fins 30.Be provided with passage (not label) vertical with air flow channel 44 and that be communicated with between this first groups of fins 30 and second groups of fins 40.The 3rd groups of fins 50 is arranged at the side of substrate 10 near second groups of fins 40, it comprises the 3rd fin 52 that some parallel interval are arranged, 52 of every adjacent two the 3rd fin form gas channel, the volume of the 3rd fin 52 and quantity are all less than second groups of fins 40, so the interval of this gas channel is greater than the interval of first groups of fins 30 and second groups of fins, 40 gas channels, so that the 3rd groups of fins 50 has littler air drag, each the 3rd fin 52 is offered the perforation 520 at two intervals, these perforation 520 are provided with vertically extending flanging (not label), the perforation 520 of all the 3rd fin 52 and flanging thereof be common form two accommodation spaces and respectively ccontaining these first heat pipe, 22 1 parallel portion 220 and the 3rd heat pipe 1 the 3rd parallel portion 260 in it.Be formed with air flow channel 54 in the middle of the 3rd groups of fins 50 with the 44 corresponding connections of second groups of fins, 40 air flow channels, be beneficial to flow to the air communication mistake of first groups of fins 30, be provided with between this second groups of fins 40 and the 3rd groups of fins 50 and air flow channel 44 and the 54 vertical and passages (not label) that are communicated with.The gas channel that above-mentioned first fin 32, second fin 42, the 3rd fin 52 and their form and air flow channel 44, the 54 all parallel portion of each

heat pipe

22,24,26 interior with being contained in each groove of substrate 10 12,14,16 respectively are vertical.

Above-mentioned heat abstractor in use, first groove 12 of this substrate 10, second groove 14 and the 3rd groove 16 respectively corresponding ccontaining first heat pipes 22, second heat pipe 24 and the 3rd heat pipe 26, wherein one the 3rd parallel 260 of one first parallel portion 220 of this first heat pipe 22 and the 3rd heat pipe 26 is positioned at substrate 10 1 sides and is set in the 3rd fin 50, and this first groups of fins 30 and second groups of fins 40 are fixed on substrate 10 and the heat pipe heat 20 by modes such as welding.

This heat abstractor is when work, and substrate 10 bottom surfaces absorb the heat that produces from two CPU, by heat pipe heat 20 heat evenly are sent on each groups of

fins

30,40,50, and are dispersed in the surrounding environment.The air-flow that the system at this heat abstractor place provides enters first groups of fins 30 through the 3rd groups of fins 50, second groups of fins 40, be provided with the wide air flow channel 44 of gas channel of 42,52 of more adjacent two second and third fin in the middle of this second groups of fins 30 and the 3rd groups of

fins

40,54, arrive the resistance of first groups of fins 30 and make air-flow directly enter first groups of fins 30 to reduce air-flow without preheating.In addition, this second heat pipe 24 is embedded in the substrate 10 and this first groups of fins 30 is connected by heat conduction with second groups of fins 40, this first heat pipe 22 is connected the 3rd groups of fins 50 respectively again with the 3rd heat pipe 26 with first groups of

fins

30 and 40 heat conduction of second groups of fins, thereby eliminate the temperature difference that 30,40 and 50 of each groups of fins produce owing to the differences in spatial location of relative wind, with synchronously and equably two CPU are dispelled the heat.

Claims

1. a heat abstractor is used for two or more electronic element radiatings, it comprise a substrate, one first groups of fins, one second groups of fins and be located in described substrate and described two groups of fins between at least one heat pipe, described first and second groups of fins includes some fin, and form gas channel between adjacent two fin of first and second groups of fins, it is characterized in that: described second groups of fins is provided with the air flow channel that air feed stream flows to first groups of fins, and the gas channel between more adjacent two fin of the width of described air flow channel is big.

2. heat abstractor as claimed in claim 1 is characterized in that: described heat pipe comprises two parallel portion and a vertical vertical component effect that connects described parallel portion, and described parallel portion heat conduction respectively connects first groups of fins and second groups of fins.

3. heat abstractor as claimed in claim 2 is characterized in that: described two parallel portion are vertical with described fin and described air flow channel.

4. heat abstractor as claimed in claim 1, it is characterized in that: also comprise one the 3rd groups of fins, described the 3rd groups of fins is positioned at substrate near described second groups of fins, one side, and described the 3rd groups of fins is provided with the air flow channel with the corresponding connection of the second groups of fins air flow channel.

5. heat abstractor as claimed in claim 4 is characterized in that: described the 3rd groups of fins is connected with first groups of fins and the second groups of fins heat conduction respectively by heat pipe.

6. heat abstractor as claimed in claim 5 is characterized in that: described the 3rd groups of fins offers heating tube and places the also accommodation space of vertical air runner.

7. heat abstractor as claimed in claim 4 is characterized in that: described heat pipe connects first groups of fins, the second backing group and the heat conduction in twos of the 3rd groups of fins.

8. heat abstractor as claimed in claim 7 is characterized in that: described heat pipe is three, and each heat pipe takes the shape of the letter U the vertical component effect that it comprises two parallel portion and vertically connects described parallel-segment, all vertical described fin of described parallel portion and described air flow channel.

9. heat abstractor as claimed in claim 6 is characterized in that: form passage vertical with described air flow channel and that be connected between described second groups of fins and the 3rd groups of fins.

10. heat abstractor as claimed in claim 1 is characterized in that: form passage vertical with described air flow channel and that be connected between described first groups of fins and second groups of fins.