CN104582435A

CN104582435A - Intensive structure for heat transmission of heat flow in remote space

Info

Publication number: CN104582435A
Application number: CN201410811427.XA
Authority: CN
Inventors: 向广超; 刘继鹏
Original assignee: Xian Electronic Engineering Research Institute
Current assignee: Xian Electronic Engineering Research Institute
Priority date: 2014-12-23
Filing date: 2014-12-23
Publication date: 2015-04-29
Anticipated expiration: 2034-12-23
Also published as: CN104582435B

Abstract

The invention relates to an intensive structure for the heat transmission of a heat flow in a remote space. A plurality of heat pipes are used for relay transmission and torsion by 90 degrees in the space, the dissipative heat of a high-power device is guided outside electronic equipment in a remote manner, so that the heat control efficiency is improved, the temperature rise in the equipment is effectively reduced, and the reliability of the electronic equipment is improved.

Description

A kind of heat transfer structure of intensive hot-fluid remote space

Technical field

The invention belongs to the Evolution of Thermal Control Technique field of electronic equipment, be specifically related to a kind of heat transfer structure of intensive hot-fluid remote space, be applied to and the device of electronic equipment internal high power density, the heat dissipation of unit are directly discharged to device external, reach the object of high efficiency and heat radiation.

Background technology

The thermal control of electronic equipment is exactly adopt necessary measure, for equipment and system provide good thermal environment, ensures that they are under the thermal environment of regulation, normally, reliably can work by predetermined parameter.First thermal control will determine the cooling means of components and parts and equipment, and the selection of cooling means directly affects the assembling design of components and parts and equipment, reliability, weight and cost etc.Now widely used cooling means has: naturally cooling, forced air cooling, force liquid cooling etc.Along with the development of technology, hot pipe technique is also more and more commonly used.

Electronic equipment and components and parts small, and function and complexity growing, this makes the volumetric power density of the power cell of device interior increasing, causes the local heat flux density of equipment sharply to rise, affect the normal work of electronic equipment, its reliability is reduced.So how to adopt simple and reliable cooling technology, efficient heat dissipation of deriving high-density power device, module is one of most important task of electronic equipment Evolution of Thermal Control Technique.

The cooling measure of usual electronic equipment high-density power device is: one is adopt liquid cooling, utilizes liquid cold plate thermal conductance to be gone out, is generally used on the electronic equipment of air-cooled insurmountable multiple unit ultrahigh heat density.Advantage is that efficiency is high, and shortcoming is that liquid cooling equipment volume is huge, Heavy Weight, cost are high; Two is for the relatively less electronic equipment of high power element number, and high-power component heat dissipation is led cabinet inside by radiator or heat pipe etc., then derives cabinet by blower fan, cold drawing etc.Advantage is simple, reliable.Shortcoming is: one is cause electronic equipment bulk temperature to raise, and impacts other functional units; Two is the risings considering device interior temperature, can affect the derivation of high-power component heat dissipation, and then can increase the volume weight etc. of heat radiation link.

T/R assembly in radar equipment is typical small-sized high density power device, usually with the intensive back being arranged on the antenna element being in confined space of mode of multiple T/R assembly townhouse, produce rapidly a large amount of caloric requirements during T/R component operation and distribute immediately.The present invention considers the deficiency of the conventional Evolution of Thermal Control Technique of electronic equipment internal high-power component, overcome the shortcoming that hot pipe conducting distance is shorter, propose a kind of use some heat pipes to deliver in relays and carry out in space 90 ° reverse structures, export to electronic device exterior by long-range for the heat dissipation of high-power component.

Summary of the invention

The technical problem solved

In order to avoid the deficiencies in the prior art part, the present invention proposes a kind of heat transfer structure of intensive hot-fluid remote space.

Technical scheme

A heat transfer structure for intensive hot-fluid remote space, comprises substrate E1, the first intensive fin, heat pipe A, heat pipe B, heat pipe F, substrate E2, the second intensive fin, substrate E3, the 3rd intensive fin, heat pipe C, heat pipe G, substrate E4 and the 4th intensive fin; It is characterized in that substrate E1 and substrate E3 is fastened on the T/R assembly of antenna element, substrate E2 and substrate E4 is positioned at below T/R assembly, and substrate E2 and substrate E1 are 90 ° of vertical, substrate E4 with substrate E3 be 90 ° vertical; The one side that substrate E1 is relative with T/R assembly is welded with the first intensive fin, the evaporation section adjacent solder of heat pipe A, heat pipe B is on the another side top of substrate E1, and condensation segment is welded in the middle part of the another side of substrate E1; The evaporation section of heat pipe F is welded on the region, condensation segment place of heat pipe A, heat pipe B, and the condensation segment of heat pipe F is welded on the one side of substrate E2, and the another side of substrate E2 is welded with the second intensive fin; The one side that substrate E3 is relative with T/R assembly is welded with the 3rd intensive fin, the evaporation section of heat pipe C is welded on the another side top of substrate E3, and the evaporation section of Opposite direction connection heat pipe A; The condensation segment of heat pipe C is welded in the middle part of the another side of substrate E3; The evaporation section of heat pipe G is in the region, condensation segment place of heat pipe C, and the condensation segment of heat pipe G is welded on the one side of substrate E4, and the another side of substrate E4 is welded with the 4th intensive fin.

Beneficial effect

The heat transfer structure of a kind of intensive hot-fluid remote space that the present invention proposes, improves thermal control efficiency, effectively reduces the temperature rise of device interior, improves the reliability of electronic equipment.

Accompanying drawing explanation

The heat transfer structure schematic diagram of the intensive hot-fluid remote space of Fig. 1 the present invention

The position assumption diagram of heat transfer structure in products application of the intensive hot-fluid remote space of Fig. 2 the present invention: (a) front view; (b) upward view; IA enlarged drawing in (c) figure a

1-substrate E1; The intensive fin of 2-first; 3-heat pipe A; 4-heat pipe B; 5-heat pipe F; 6-substrate E2; The intensive fin of 7-second; 8-substrate E3; The intensive fin of 9-the 3rd; 10-heat pipe C; 11-heat pipe G; 12-substrate E4; The intensive fin of 13-the 4th; 14-antenna element; 15-electronic unit; 16-T/R assembly; 17-screw.

Embodiment

Now in conjunction with the embodiments, the invention will be further described for accompanying drawing:

The object of the invention is to propose the some heat pipes of a kind of use deliver in relays and carry out 90 ° of torsions in space, realize the remote space transmission of intensive hot-fluid.When the high-density power device heat conduction for intensive installation, the back side on substrate E1 top is welded with intensive fin, and with the heating face compact siro spinning technology of townhouse high-density power device; Heat pipe A and heat pipe B is welded on the top front face of substrate E1, and the evaporation section of heat pipe A is connected with the evaporation section of heat pipe B, the condensation segment of heat pipe A, heat pipe B is welded on the front, middle part of substrate E1; Heat pipe F is welded on the front of substrate E1, and make the evaporating section of F in the region, condensation segment place of heat pipe A, heat pipe B, the condensing zone of heat pipe A, B is made to become the evaporating area of heat pipe F, the condensation segment of heat pipe F is welded on substrate E1 the front of the substrate E2 being vertical 90 °, the back side of substrate E2 is welded with on intensive fin, make hot-fluid be delivered to the intensive fin of the substrate E2 of far-end from the top of interposer substrate E1 always, extend the operating distance of heat pipe, thus achieve the transmission of the remote space to intensive hot-fluid.

See Fig. 1, when the span of high power density device arrangement is larger, at the constructive interference for avoiding other electronic unit and device in electronic equipment, apparatus of the present invention can be divided into left and right two parts, realize conducting the branch of the hot-fluid compared with large span heating region.

Left half, the back side on substrate E11 top is welded with the first intensive fin 2, and with the heating face compact siro spinning technology of townhouse high-density power device; Heat pipe A3 and heat pipe B4 is welded on the top front face of substrate E11, and the evaporation section of heat pipe A3 is connected with the evaporation section of heat pipe B4, the condensation segment of heat pipe A3, heat pipe B4 is welded on the front, middle part of substrate E11; Heat pipe F5 is welded on the front of substrate E11, and make the evaporation section of heat pipe F5 be in the region, condensation segment place of heat pipe A3, heat pipe B4, make heat pipe A3, evaporating area that the condensing zone of heat pipe B4 becomes heat pipe F5, the condensation segment of heat pipe F5 is welded on the front of substrate E26, its back side is welded with the second intensive fin 7, and with substrate E11 be vertical 90 ° vertical.On top from interposer substrate E11 is delivered to the substrate E26 of far-end by hot-fluid step by step intensive fin by heat pipe A3, heat pipe B4 and heat pipe F5 7, thus realize the transmission to the remote space of intensive hot-fluid.

Right half and left half principle similar.The back side on substrate E38 top is welded with the 3rd intensive fin 9, and with the heating face compact siro spinning technology of townhouse high-density power device; Heat pipe C10 is welded on the top front face of substrate E38, and makes the evaporation ends of the evaporation section Opposite direction connection heat pipe A3 of heat pipe C10, condensation segment is welded on the front, middle part of substrate E38; Heat pipe G11 is welded on the front of substrate E38, and makes the evaporation section of heat pipe G11 be in the region, condensation segment place of heat pipe C10, make the condensing zone of heat pipe C10 become the evaporating area of heat pipe G11; The condensation segment of heat pipe G11 is welded on the front of substrate E412, and its back side is welded with the 4th intensive fin 13, and with substrate E38 be vertical 90 ° vertical.Top from interposer substrate E38 is delivered to by heat pipe C10 and heat pipe G11 on the 4th intensive fin 13 of the substrate E412 of far-end by hot-fluid step by step, thus realizes the transmission to the remote space of intensive hot-fluid.

See Fig. 2 (a) and Fig. 2 (b), be the application of the present invention in certain Radar Products.This radar is installed on the bottom of certain airtight optoelectronic device, is mainly divided into antenna element 14 and electronic unit 15 two parts.Antenna element (14) at right angle setting, back close installation has townhouse T/R assembly 16, is divided into two rows, see Fig. 2 (c).By apparatus of the present invention as shown in Figure 1, be fastened on the two row T/R assemblies 16 at antenna back with the screw 17 of M2.5, the second radiating fin 7 and the 4th radiating fin 13 can expose from the special square hole below optoelectronic device.So just achieve the transmission of the intensive hot-fluid of generation on townhouse T/R assembly 16 to the equipment external space.

Claims

1. a heat transfer structure for intensive hot-fluid remote space, comprises substrate E1 (1), the first intensive fin (2), heat pipe A (3), heat pipe B (4), heat pipe F (5), substrate E2 (6), the second intensive fin (7), substrate E3 (8), the 3rd intensive fin (9), heat pipe C (10), heat pipe G (11), substrate E4 (12) and the 4th intensive fin (13); It is characterized in that substrate E1 (1) and substrate E3 (8) is fastened on the T/R assembly of antenna element, substrate E2 (6) and substrate E4 (12) are positioned at below T/R assembly, and substrate E2 (6) and substrate E1 (1) in 90 ° vertical, substrate E4 (12) is vertical in 90 ° with substrate E3 (8); The one side that substrate E1 (1) is relative with T/R assembly is welded with the first intensive fin (2), the evaporation section adjacent solder of heat pipe A (3), heat pipe B (4) is on the another side top of substrate E1 (1), and condensation segment is welded in the middle part of the another side of substrate E1 (1); The evaporation section of heat pipe F (5) is welded on the region, condensation segment place of heat pipe A (3), heat pipe B (4), the condensation segment of heat pipe F (5) is welded on the one side of substrate E2 (6), and the another side of substrate E2 (6) is welded with the second intensive fin (7); The one side that substrate E3 (8) is relative with T/R assembly is welded with the 3rd intensive fin (9), the evaporation section of heat pipe C (10) is welded on the another side top of substrate E3 (8), and the evaporation section of Opposite direction connection heat pipe A (3); The condensation segment of heat pipe C (10) is welded in the middle part of the another side of substrate E3 (8); The evaporation section of heat pipe G (11) is in the region, condensation segment place of heat pipe C (10), the condensation segment of heat pipe G (11) is welded on the one side of substrate E4 (12), and the another side of substrate E4 (12) is welded with the 4th intensive fin (13).