CN2710162Y - Integrated heat tube radiator with outside auxiliary guide radiation - Google Patents
Integrated heat tube radiator with outside auxiliary guide radiation Download PDFInfo
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- CN2710162Y CN2710162Y CN 200420048972 CN200420048972U CN2710162Y CN 2710162 Y CN2710162 Y CN 2710162Y CN 200420048972 CN200420048972 CN 200420048972 CN 200420048972 U CN200420048972 U CN 200420048972U CN 2710162 Y CN2710162 Y CN 2710162Y
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- 230000005855 radiation Effects 0.000 title claims abstract description 48
- 238000001816 cooling Methods 0.000 claims abstract description 57
- 239000007788 liquid Substances 0.000 claims abstract description 33
- 239000012809 cooling fluid Substances 0.000 claims abstract description 32
- 238000010438 heat treatment Methods 0.000 claims description 72
- 239000000126 substance Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 13
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 241000293001 Oxytropis besseyi Species 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 11
- 239000003351 stiffener Substances 0.000 claims description 8
- 230000000274 adsorptive effect Effects 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 238000004904 shortening Methods 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 5
- 230000002708 enhancing effect Effects 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 230000000295 complement effect Effects 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 2
- 238000012546 transfer Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000011162 core material Substances 0.000 description 9
- 238000009834 vaporization Methods 0.000 description 9
- 230000008016 vaporization Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000011161 development Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241001124569 Lycaenidae Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The utility model relates to an integrated heat tube radiator with outside auxiliary guide radiation, comprising a vacuum box body, on which surface is provided with erect vacuum cooling plates; an outboard cooling fluid channel is formed between the vacuum cooling plates, on which heat radiating fins are provided. The outer surface of the two vacuum cooling plates on the lateral of the vacuum cooling plates are provided with an 'L' Thomas type bent plate; an outboard positive cooling fluid flow passage is formed between the bent plate and the vacuum cooling plate, auxiliary heat radiating fins are arranged in the outboard positive cooling fluid flow passage; a baffle plate, whose width is smaller than the height of the side end surface, is fixed on the two side ends surface of the outboard and outboard positive cooling fluid flow passage, because the utility model is composed of a controllable cooling fluid direction flow channel through a plurality of vacuum cooling plates and the baffle plate outside the vacuum box body filled with liquid medium, the traditional heat sinking fashion is altered and the heat-transfer efficiency of the radiator is enhanced.
Description
Technical field
The utility model relates to a kind of heat-pipe radiator, especially a kind of based on heat pipe, radiating fin is assisted and strengthened means, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside by the three-dimensional condensation heat radiation of the having of making of the flow direction of guiding cooling fluid network.
Background technology
Along with the fast development of electronics, power technology, particularly the integrated level along with integrated circuit increases substantially, and the heat dissipation problem of electronic devices and components has become one of the speed of service of restriction electronic equipment and major issue of power output.
With the computer CPU chip is example, and its integrated level has improved nearly 20,000 times in 30 years, and the heat flow of its generation has reached 100W/cm
2Degree.
As everyone knows, the reliability of computer operation and life-span and its working temperature have confidential relation, and the integrated level of chip is high more, the heat of its generation is just high more, if can not in time these heats be left, the reliability of computer operation will reduce significantly, even occurs and can't normally move.For computer development research institution,, just can't develop the data processing equipment that speed is faster, power is higher, volume is littler if can not effectively solve the heat that chip and other electronic devices and components produce at work.
At present, the radiating mode of computer and electronic component normally is installed in the pectination heating panel of aluminum alloy materials manufacturing on the body of chip or other electron component, makes a bigger area of dissipation, simultaneously, be equipped with fan heat is scattered, thereby reduce temperature.Though this mode is simple in structure, with low cost, can only be applicable to that arithmetic speed is not high, the components and parts heat radiation in the little electronic equipment of power.
1998, the state-run laboratory of U.S. Sang Diya utilized hot pipe technique to carry out the heat radiation of computer chip, has obtained effect preferably.
Figure 1 shows that a kind of heat abstractor that adopts heat pipe of present use, it comprises a framework 1.Closely be equipped with on the base plate of framework 1 and a plurality ofly make with foil, and the radiating fin 2 of dense distribution.Crouch on framework 1 inner bottom plating and be provided with heat pipe 3 (quantity of heat pipe can be two or three).Heat pipe 3 passes the bottom of radiating fin 2, protrudes upward the top that curved turnback penetrates radiating fin 2.All radiating fins 2 all closely are sticked with heat pipe 3 and are connected.In heat pipe 3, be placed with and meet heat vaporization, the liquid working substance that precooling is condensed.When framework 1 is installed on the chip, the heat that chip produces is vaporized the heat pipe 3 interior liquid working substances that are located on framework 1 inner bottom plating that crouch, heat is along with the liquid working substance of vaporization enters the heat pipe 3 that is arranged in radiating fin 2 tops, and meet the condensation knot, heat then sheds to the external world by radiating fin 2.After air blast cooling fan 4 was installed at radiating fin 2 tops again, heat is easier to shed.
Because heat pipe has high heat transfer efficiency, so the heat that chip produces can be passed on the radiating fin at a distance faster, reaches the heat radiation purpose.This mode has higher radiating efficiency compared with pectination heating panel mode in the past.Because the temperature position far away apart from chip often of fin on the pectination heating panel, temperature is lower, and it is higher near the bottom position temperature of chip, this temperature gradient phenomenon has been wasted a large amount of area of dissipations, therefore, can not have higher radiating efficiency, utilize heat pipe then can overcome the bad shortcoming of the existing radiating effect of pectination heating panel.
Though heat-pipe radiating apparatus shown in Figure 1 has better radiating effect, but, owing to himself be based on the entity radiator in structure, heat pipe only is used for the fin efficiency of strong radiator radiating fin, can not give full play to the heat pipe compactness, light, the advantage of efficient heat transfer, the deficiency of its existence mainly shows as: between thermal source and the base plate, between heat pipe and the base plate, all there is higher thermal resistance between heat pipe and the fin, simultaneously, consider the problem of radiator intensity, can not do fin very thinly, and thicker fin waste material not only, occupy the confined space, and can not obtain more area of dissipation, so this mode still can not satisfy the super large integrated circuit, high-power electronic device and high-speed chip make its application be subjected to certain restriction to heat radiation institute requirement.
In sum, provide that to have more the heat abstractor of high cooling efficiency be to make high-power, the high-velocity electrons equipment and the powerful guarantee of large scale integrated chip more, also one of insider's problem demanding prompt solution at present just.
The utility model content
Technical problem to be solved in the utility model is at present electronics, electric power manufacturing technology field is high efficiency heat radiation device and can't further improve electronic component for want of, the speed of service of circuit chip and power output and the integrated heat pipe radiator of the auxiliary flow-guiding radiation in a kind of outside is provided, this radiator is according to the adopting heat pipes for heat transfer principle, by to heat absorbing end, the cooling channels in the release end of heat outside is optimized the layout setting, realization is based on heat pipe, with radiating fin is the integrated heat pipe electronic radiation device of heat conduction reinforced means, compare with the conventional heat pipe heat abstractor of other same sizes, have bigger radiating efficiency.
Technical problem to be solved in the utility model is achieved through the following technical solutions:
The integrated heat pipe radiator of the auxiliary flow-guiding radiation in a kind of outside, it comprises that one is airtight, inside is filled with the vacuum box body of liquid working substance, and the upper surface of vacuum box body is erect side by side and is installed with the vacuum heating panel that connects by bottom and described vacuum box intracoelomic cavity more than.Crack between the vacuum heating panel constitutes outside cooling channels, and the flow direction along cooling fluid in this crack is provided with radiating fin.Be laid with on the inwall of the inner surface of vacuum box body and described vacuum heating panel can adsorptive liquid wick.
Be respectively arranged with the bent plate of " L " type in the vacuum heating panel on the outer surface of two vacuum heating panels in the outside, the longitudinal component of this bent plate and vacuum heating panel are set up in parallel, the end edge of its lateral part is welded on the bottom of outer surface of two vacuum heating panels in the described outside, makes and forms the auxiliary cooling channels in the outside between described bent plate and the vacuum heating panel; Flow direction welding along cooling fluid in the auxiliary cooling channels in this outside is provided with the auxiliary heat dissipation fin.
Fixedly be coated with flow-stopping plate on two side end faces of the auxiliary cooling channels in the outside cooling channels and the outside, the width of this flow-stopping plate is less than the width of described side end face.Form going out/entering the mouth of cooling fluid between flow-stopping plate and the vacuum box body.
During use, heat-generating electronic elements closely is attached at vacuum box body below, and at the top of vacuum heating panel the cooling fan to canyon is installed.The heat that heat-generating electronic elements work produces imports in the vacuum box body.Liquid working substance is met the heat vaporization, heat is transmitted to the vacuum heating panel, and outwards transmit by the radiating fin of welding, and simultaneously, cooling fan blow cool air enters cooling channels downwards.Under the stopping of flow-stopping plate, cold airflow can only be discharged from the outlet near the vacuum box body.
The surface of vacuum box body is the higher relatively position of temperature, and the outlet of cooling fluid is arranged on this, can more effectively improve radiating efficiency, and radiating fin is complied with the flow direction setting of cooling fluid, makes cold airflow can discharge and take away the heat on radiating fin surface smoothly in cooling channels.
According to above-mentioned heat dissipation technology principle, the utility model also provides the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the another kind of outside, the difference of it and technique scheme is: cancelled described flow-stopping plate, and fixedly be coated with top board on the top end face of the auxiliary cooling channels of the described outside cooling channels and the outside.It in use, basic identical with technique scheme, just cooling fluid is to assist an end face of cooling channels to flow to another end face by the outside cooling channels and the outside, and radiating fin, auxiliary heat dissipation fin then shed the heat that heat-generating electronic elements produced by the cooling fluid that passes cooling channels.
Even for the heat radiation that keeps the vacuum heating panel, one or one or more can also be set at vacuum heating panel top make the communicating pipe that is interconnected between the vacuum heating panel.
In first kind of technical scheme, flow out and be convenient to production and processing smoothly, all radiating fins all can be set to the structure of forming by vertical fin and horizontal fin for ease of cold airflow.Vertical fin is provided with at interval in vertical mode, and its length presents shortening mode gradually by the middle part to the both sides end face and arranges; Laterally fin is divided into two parts, and takes the horizontal interval to be provided with respectively below flow-stopping plate, and its length presents shortening mode gradually from bottom to top arranges, and can make vertical fin non-intersect with horizontal fin.After cold airflow enters cooling channels by inlet, under the guide functions of vertical fin, vertically blow to the vacuum box surface, and under the guide functions of horizontal fin, the cold airflow vertical duction is discharged by outlet.In this course, cold airflow can shed heat with the degree of maximum.
In above-mentioned second kind of technical scheme, because top board is covered on the top end face of cooling channels, be on the top end face of vacuum heating panel, make the outlet or the inlet of two end faces formation cooling fluids of the auxiliary cooling channels in the outside cooling channels and the outside.Can satisfy the needs that cooling fan is arranged on side direction like this, make cold airflow enter this passage, and discharge from the other end by an end face of cooling channels.In this scheme, all radiating fins all are welded on the surface of vacuum box body by the flow direction of its side along cooling fluid, be arranged in parallel with the vacuum heating panel, also can be welded on the inner surface of bent plate of vacuum heating panel and described " L " type, be arranged in parallel with the surface of vacuum box body.
Employed wick can be made up of multi-layer fiber mesh grid or folded the establishing of multiple layer metal silk screen in the utility model, also can be to adopt the powder sintered plate body made from micropore.Can also be to bend continuously or crooked made shoestring by reciprocal by metal or organic material thin slice, and by welding or bonding being sticked on the inwall of described housing.
Aborning, when the vacuum box body adopts Shooting Technique, for the surface of minimizing heat-generating electronic elements and the thermal resistance between the vacuum box bottom, improve heat conduction efficiency, can set firmly the heat-conducting plate that can fit tightly at the vacuum box bottom with the radiating surface of outside heat-generating electronic elements.The mode of setting firmly of heat-conducting plate can adopt the mode that embeds the vacuum box bottom, also can offer a special use depression that is used to embed the heat-generating electronic elements radiating surface at the vacuum box bottom, with the bottom surface of heat-conducting plate as this special use depression.
In addition, for further improving radiating efficiency, technique scheme can also be in conjunction with the manufacturing of heat-generating electronic elements, at the vacuum box bottom perforate can also be set, size and perforate are complementary, the device substrate that the surface is provided with integrated electronic circuit or electronic component inner core embeds in this perforate, makes integrated electronic circuit or electronic component inner core be positioned at the vacuum box body.The periphery of device substrate and the tight sealing-in of vacuum box body.The lead-foot-line of the inner core of integrated electronic circuit or electronic component is arranged on the surface that device substrate is positioned at the external side of vacuum box.
In this scheme, wick is on the inner core of electric insulation and be laid in integrated electronic circuit or electronic component.Liquid working substance is an electrical insulating material, and compatible with the inner core material chemistry of described integrated electronic circuit or electronic component, electric compatible.
By heat-generating electronic elements and vacuum box sports association are closed manufacturing, overcome the heat conduction resistance, the heat that heat-generating electronic elements is produced at work directly sends out by the vaporization of liquid working substance, reaches best radiating effect.
By above technical scheme as can be known: the utility model is by a plurality of vacuum heating panels, the bent plate of " L " type and the setting of flow-stopping plate or top board, be filled with the auxiliary cooling channels in the formation outside and the outside on the vacuum box body of liquid working substance, this cooling channels may command cooling fluid directed flow, changed the distributed set-up mode of traditional single heat pipe, improved radiating efficiency greatly to heat-generating electronic elements, be the future more manufacturing and the high-speed electronic device of large scale integrated chip, great-power electronic, the exploitation of power equipment, manufacturing is laid a good foundation, and has great practical value.
Description of drawings
Fig. 1 is the structural representation of the present heat-pipe radiator of using always;
Fig. 2 is the perspective view of first embodiment provided by the utility model;
Fig. 3 is a side sectional view embodiment illustrated in fig. 2;
Fig. 4 is a front section view embodiment illustrated in fig. 2;
Fig. 5 is the middle structural representation that strengthens fin embodiment illustrated in fig. 2;
Fig. 6 is the structural representation of middle stiffener embodiment illustrated in fig. 2;
Fig. 7 is a middle user mode schematic diagram embodiment illustrated in fig. 2;
Fig. 8 is the perspective view of second embodiment provided by the utility model
Fig. 9 is a structural representation of the related wick of the utility model;
Figure 10 is another structural representation of the related wick of the utility model;
" U " shape liquid sucting core structure schematic diagram that Figure 11 bends for the related thin slice of the utility model;
" V " shape liquid sucting core structure schematic diagram that Figure 12 bends for the related thin slice of the utility model;
" Ω " shape liquid sucting core structure schematic diagram that Figure 13 bends for the related thin slice of the utility model;
Figure 14 is a structural representation of setting up communicating pipe among first or second embodiment;
Figure 15 is the sectional structure chart of the 3rd embodiment provided by the utility model;
Figure 16 is the sectional structure chart of the 4th embodiment provided by the utility model.
Embodiment
Below, also in conjunction with the accompanying drawings the utility model is described in further detail by specific embodiment.
Embodiment one
Figure 2 shows that the external structure schematic diagram of a preferred embodiment provided by the utility model.It comprises an enclosed vacuum box body 10 that is used to absorb heat, and is filled with in the vacuum box body 10 to meet the heat vaporization, meets the liquid working substance (not shown) of condensation knot.On the surface of vacuum box body 10, erect and be installed with two vacuum heating panels 11 that be arranged in parallel.The bottom of vacuum heating panel 11 and vacuum box body 10 inner chambers connect.Crack between the vacuum heating panel 11 constitutes outside cooling channels.Flow direction along cooling fluid in this crack is provided with radiating fin 20.Radiating fin 20 adopts the multi-disc close interval to arrange and is provided with.
On the inwall of the inner surface of described vacuum box body 10 and vacuum heating panel 11, be laid with can adsorptive liquid the wick (not shown).
On the outer surface of two vacuum heating panels 11, be respectively arranged with the bent plate 12 of " L " type, the longitudinal component 121 and the vacuum heating panel 11 of this bent plate 12 are set up in parallel, the bottom of the outer surface of two vacuum heating panels 11 outside the end edge of its lateral part 122 is welded on makes and forms the auxiliary cooling channels in the outside between bent plate 12 and the vacuum heating panel 11.Flow direction welding along cooling fluid in the auxiliary cooling channels in this outside is provided with auxiliary heat dissipation fin 21.
Fixedly be coated with flow-stopping plate 30 on two side end faces of the auxiliary cooling channels in the outside cooling channels and the outside, the width of this flow-stopping plate 30 forms the outlet of cooling fluid less than the height of side end face between this flow-stopping plate 30 and the vacuum box body 10.The top end face of the auxiliary cooling channels in the outside and the outside is the inlet of cooling fluid.
The internal structure of present embodiment as shown in Figure 3.The inner surface of vacuum box body 10 be laid with can adsorptive liquid working medium 13 wick 40.Wick 40 can adopt welding or bonding mode to lay, and extends on the inwall of the vacuum heating panel 11 that is laid in.The system of laying of wick 40 can see in Fig. 4 that as shown in Figure 3, Figure 4 wick 40 extends to the inwall of both sides vacuum heating panel 11 from vacuum box body 10 inside bottom.
In use, liquid working substance 13 is met the heat vaporization, and heat is sent in the vacuum heating panel 11, meet cold after, emit heat and be converted into liquid state and pass back in the vacuum box body 10.When the electronic equipment that present embodiment is installed is in to tilt or during inversion state, wick 40 can adsorptive liquid working medium 13, and it is delivered to heat absorbing end in the vacuum box body 10, thereby can not influence the operate as normal of present embodiment.
Referring to Fig. 3, radiating fin 20 is made up of vertical fin 201 and horizontal fin 202.Vertical fin 201 is provided with at interval perpendicular to the inlet of cooling fluid, and its length presents shortening mode gradually by the middle part to the both sides end face and arranges; Laterally fin 202 is divided into two parts, and the horizontal interval is provided with perpendicular to the outlet of cooling fluid below flow-stopping plate 30 respectively, and its length presents shortening mode gradually from bottom to top and arranges.Vertical fin 201 forms the right angle with laterally fin 202 is non-intersect.
Referring to Fig. 4, the set-up mode of auxiliary heat dissipation fin 21 is identical with radiating fin 20, and its vertical fin 211 also forms the right angle with laterally fin 212 is non-intersect.
For increasing area of dissipation and intensity, enhancing fin 22 can be set between the every fin.The set-up mode of enhancing fin 22 as shown in Figure 5.Strengthen the bending of fin 22 usefulness scale coppers and make, and be welded between radiating fin or the auxiliary heat dissipation fin.
All radiating fins can be made waveform, thereby increase area of dissipation, can also offer many group through holes and a plurality of upright thorn in the radiating fin surface distributed.When cold wind flows through, cause turbulent flow, make radiating effect better.Radiating fin among Fig. 3 is a waveform, and the surface is provided with a plurality of upright thorns 23.Being provided with of upright thorn 23 can be adopted and be offered the mode that through hole combines, and promptly when through hole is offered in punching press, the sheet metal that sweeps away dug and constitutes upright thorn.
Have additional between the radiating fin among Fig. 4 and strengthen fin 22 (see the heatsink transverse fin, the auxiliary fin on the vertical fin is not shown).
For improving radiating efficiency, reduce thermal resistance, in the mill, that usually the wall of vacuum heating panel and vacuum box body is made is thinner relatively.For gaining in strength, stiffener can be set up, as shown in Figure 6 in the utility model.In the present embodiment, the outline of stiffener 14 is identical with the interior cross sectional shape of vacuum box body 10 and vacuum heating panel 11, its circumferential perimeter is separately fixed on the inwall of vacuum box body 10 and vacuum heating panel 11, and one or more holes can be offered in its middle part, to guarantee flowing of liquid working substance.As required, can also set up multilayer stiffener 14.
Figure 7 shows that the user mode schematic diagram of present embodiment.In use, present embodiment is installed on the surface of integrated chip (as CPU), cooling fan 4 is installed at the top of vacuum heating panel.Cold wind direction of arrow in the figure enters the auxiliary cooling channels in the outside and the outside from top to bottom, and under the stopping of flow-stopping plate 30, cold wind is through turnover, and the two routes outside and the outside assist two outlets of cooling channels to discharge about being divided into.
Embodiment two
Figure 8 shows that the structural representation of another embodiment provided by the utility model.The difference of it and the foregoing description one is:
First: cancelled flow-stopping plate, and on the top end face of the auxiliary cooling channels of the outside cooling channels and the outside, fixed covering one top board 50, made two cooling channels be straight-through shape.
Second: radiating fin 20 and auxiliary heat dissipation fin 21 all adopt the lateral separation mode to be provided with, and all are provided with the enhancing fin between all radiating fins.
Present embodiment can also carry out the vertical parallel setting with radiating fin 20 or auxiliary heat dissipation fin 21, and a side of fin is welded on the surface of vacuum box body 10, and opposite side is welded on the inboard of top board 50.
In the present embodiment, in the inboard cooling channels a plurality of thin-walled heat pipes of being made by metal material can also be set, this thin-walled heat pipe pass outside fin and with its welding, and the end of thin-walled heat pipe is fixed on the surface of vacuum heating panel, this thin-walled heat pipe and vacuum heating panel internal run-through.
Present embodiment can satisfy the requirement of horizontal installation cooling fan, also can be applicable to concentrate in the electronic equipment of ventilation and heat, is the heat-generating electronic elements heat radiation.
Employed wick among above-mentioned two embodiment can be made in many ways.
Figure 9 shows that and adopt the folded wick of establishing composition of multiple layer metal silk screen 41 welding.Between the multiple layer metal silk screen 41 and itself have abundant space, can produce liquid adsorption effect preferably.
Shown in Figure 10 is the partial schematic diagram that adopts the porous wick of powder sintering process manufacturing, and this wick relies on its inner and surperficial micropore 42 to produce capillary forces, and liquid is adsorbed.
Shown in Figure 11 is to adopt the sheet metal with good heat conductive performance according to the shoestring wick of " U " font by back and forth being bent into continuously.Make and formed a plurality of " U " shape groove in this shoestring wick.Offer porose 43 in the foil surfaces of this shoestring wick.Hole 43 can be slotted hole or circular hole or the slit aperture that is convexly equipped with or is arranged with.This shoestring wick can be welded on the inwall of vacuum box body and vacuum heating panel.Compare with above-mentioned other wick, it not only has good capillary absorption affinity, simultaneously, owing to himself be exactly the good conductor of heat, therefore, in use, it can participate in heat conduction directly, and can be fast with heat to liquid working substance transmission at a distance, and carry out larger area vaporization heat radiation by its surperficial hole 43, therefore, it has better radiating effect than the porous wick of above-mentioned multiple layer metal silk screen wick, powder sintering process manufacturing.
Wick also can be made structure as shown in figure 12.Sheet metal is made by back and forth bending continuously according to " V " font; Also can make structure as shown in figure 13.Sheet metal is made by back and forth bending continuously according to " Ω " shape.In Figure 12, Figure 13, it is porose 43 that the surface of wick is all offered, and is used for liquid working substance by its surface vaporization.
By among hole 43 and Figure 11, Figure 12, Figure 13 respectively a plurality of " U " shape groove, a plurality of " V " shape groove and a plurality of " Ω " shape groove that form of nature can make easily liquid working substance within it portion extend.
For ease of vaporization, the extension of liquid working substance, can also be with the port closed of " U " shape groove, " V " shape groove and " Ω " shape groove.
The wick that adopts sheet metal to bend can be delivered to far-end rapidly with heat by himself good thermal conductivity, and its surperficial tapping also has the effect of strengthening boiling, the evaporating capacity of liquid working substance is improved, and then has accelerated radiating rate.Moreover, this wick self has higher intensity, when it is welded on vacuum box body and vacuum heating panel inwall, can play good booster action, thereby can adopt thin made vacuum box body and vacuum heating panel, so just can when reducing manufacturing cost greatly, further improve radiating efficiency.
Above-mentioned two embodiment can also do further improvement, as shown in figure 14.Among the figure, be provided with two communicating pipe 15 at vacuum heating panel 11 tops, this communicating pipe 15 makes between the vacuum heating panel 11 and is interconnected, and when heat radiation work, can make the isostasy of the gasifying liquid working medium in the vacuum heating panel top, thereby guarantee uniformly transfer heat.
According to structure and the radiating principle of above-mentioned two embodiment,, can also on the basis of the foregoing description, do further improvement, and obtain following two embodiment for improving the radiating efficiency of heat-generating electronic elements.
Embodiment three
As shown in figure 15, this embodiment is identical with the general structure of the foregoing description one, its difference is: the lower surface of vacuum box body 10 offers a special use depression 101 that outside heat-generating electronic elements can be embedded, and the bottom surface of this special use depression 101 is the lower heat-conducting plate of thermal resistance 102.In use, the radiating surface of heat-generating electronic elements fits tightly the surface at heat-conducting plate 102.When vacuum box body 10 adopted plastic material to make, this mode can not reduce the heat conduction efficiency between heat-generating electronic elements and the vacuum box body 10, and helps large-scale mass production.
Embodiment four
Figure 16 shows that a preferred embodiment structural representation that combines with large scale integrated chip provided by the utility model.
Present embodiment is provided with a perforate in the bottom of vacuum box body 10 on the basis of using for reference embodiment three, embed the device substrate 103 that is complementary with its size, the tight sealing-in in bottom surface of the periphery of this device substrate 103 and vacuum box body 10 in this perforate.
Present embodiment directly is produced on integrated electronic circuit chip in the vacuum box body, thoroughly eliminated the influence of thermal resistance to heat radiation, thereby improved radiating efficiency to greatest extent, it will become following more extensive, the higher speed of service and reach one of direction of more high power integrated ciruit chip development, development.Moreover, present embodiment can also be used to make high power transistor, only needs the inner core of high power transistor directly is produced in the vacuum box body, just can efficiently distribute the heat that high power transistor produces when work.
It should be noted last that: above embodiment is the unrestricted the technical solution of the utility model in order to explanation only, although the utility model is had been described in detail with reference to the foregoing description, those of ordinary skill in the art is to be understood that: still can make amendment or be equal to replacement the utility model, and not breaking away from any modification or partial replacement of spirit and scope of the present utility model, it all should be encompassed in the middle of the claim scope of the present utility model.
Claims (29)
1, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in a kind of outside, it comprises that one is airtight, inside is filled with the vacuum box body of liquid working substance, and the upper surface of vacuum box body is erect side by side and is installed with the vacuum heating panel that connects by bottom and described vacuum box intracoelomic cavity more than; Crack between the vacuum heating panel constitutes outside cooling channels, in this crack, be provided with radiating fin, it is characterized in that along the flow direction of cooling fluid: be laid with on the inwall of the inner surface of described vacuum box body and described vacuum heating panel can adsorptive liquid wick;
Be respectively arranged with the bent plate of " L " type in the described vacuum heating panel on the outer surface of two vacuum heating panels in the outside, the longitudinal component of this bent plate and vacuum heating panel are set up in parallel, the end edge of its lateral part is welded on the bottom of outer surface of two vacuum heating panels in the described outside, makes and forms the auxiliary cooling channels in the outside between described bent plate and the vacuum heating panel; Flow direction welding along cooling fluid in the auxiliary cooling channels in this outside is provided with the auxiliary heat dissipation fin;
Fixedly be coated with flow-stopping plate on two side end faces of the auxiliary cooling channels in the described outside cooling channels and the outside, the width of this flow-stopping plate is less than the height of described side end face.
2, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 is characterized in that: described radiating fin and auxiliary heat dissipation fin are formed by vertical fin and horizontal fin; Described vertical fin perpendicular separation is provided with, and its length presents shortening mode gradually by the middle part to the both sides end face and arranges; Described horizontal fin is divided into two parts, and is provided with at interval in the flow-stopping plate lower horizontal respectively, and its length presents shortening mode gradually from bottom to top and arranges.
3, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in a kind of outside, it comprises that one is airtight, inside is filled with the vacuum box body of liquid working substance, and the upper surface of vacuum box body is erect side by side and is installed with the vacuum heating panel that connects by bottom and described vacuum box intracoelomic cavity more than; Crack between the vacuum heating panel constitutes outside cooling channels, in this crack, be provided with radiating fin, it is characterized in that along the flow direction of cooling fluid: be laid with on the inwall of the inner surface of described vacuum box body and described vacuum heating panel can adsorptive liquid wick;
Be respectively arranged with the bent plate of " L " type in the described vacuum heating panel on the outer surface of two vacuum heating panels in the outside, the longitudinal component of this bent plate and vacuum heating panel are set up in parallel, the end edge of its lateral part is welded on the bottom of outer surface of two vacuum heating panels in the described outside, makes and forms the auxiliary cooling channels in the outside between described bent plate and the vacuum heating panel; Flow direction welding along cooling fluid in the auxiliary cooling channels in this outside is provided with the auxiliary heat dissipation fin;
Fixedly be coated with top board on the top end face of the auxiliary cooling channels in the described outside cooling channels and the outside.
4, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 and 2 is characterized in that: described vacuum box body is rectangle or circle or the hexagonal body that adopts the good made of heat conductivility.
5, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 and 2 is characterized in that: described vacuum heating panel top also is provided with and makes the communicating pipe that is interconnected between the vacuum heating panel, this communicating pipe is one or one or more.
6, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 and 2, it is characterized in that: described wick is made up of multi-layer fiber mesh grid or folded the establishing of multiple layer metal silk screen, or adopts the powder sintered plate body made from micropore.
7, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 and 2 is characterized in that: described wick is to be bent continuously or crooked made shoestring by reciprocal by metal or organic material thin slice; Described sheet surface is offered porose, and by welding or bonding being sticked on the inwall of described housing.
8, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 7, it is characterized in that: described shoestring, is made and forms a plurality of " U " shape groove or " V " shape groove or " Ω " shape groove in this shoestring according to " U " font or " V " font or " Ω " shape back and forth bends or bending is made by described thin slice.
9, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 and 2, it is characterized in that: also be installed with one or more layers stiffener in the described vacuum box body, this stiffener stretches in the described vacuum heating panel, and its end face is fixedlyed connected with the inwall of vacuum box body and the inwall of vacuum heating panel.
10, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 and 2, it is characterized in that: also be provided with the thin-walled heat pipe that one or more are made by metal material in the described inboard cooling channels, this thin-walled heat pipe passes described outside fin, and weld with described outside fin, its end is fixed on the surface of vacuum heating panel or vacuum box body, and with described vacuum heating panel and vacuum box body internal run-through.
11, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 and 2, it is characterized in that: described fin is the waveform that sheet metal is made.
12, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 and 2, it is characterized in that: described fin surface offers the via hole that the described cooling fluid of more than one confession passes, perhaps the perpendicular upright thorn that can cause described cooling fluid turbulent flow that is provided with on its surface.
13, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 and 2 is characterized in that: also be welded with the enhancing fin between the described radiating fin, this strengthens the flow direction setting of fin along cooling fluid.
14, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 and 2, it is characterized in that: described vacuum box bottom is installed with one or more heat-conducting plates that can fit tightly with the radiating surface of outside heat-generating electronic elements, this heat-conducting plate embeds described vacuum box bottom, or is opened in the bottom surface that described vacuum box bottom is used to embed the special use depression of heat-generating electronic elements radiating surface.
15, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 14, it is characterized in that: described heat-conducting plate is rectangle or the circle of being made by the metallic plate with good heat conductive performance or organic soft board.
16, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 1 and 2, it is characterized in that: described vacuum box bottom also offers one or more perforate, embed the device substrate that is complementary with its size, the periphery of this device substrate and the tight sealing-in of vacuum box bottom in this perforate; The surface that described device substrate is positioned at described vacuum box body is provided with the inner core of integrated electronic circuit or electronic component; The lead-foot-line of the inner core of described integrated electronic circuit or electronic component is arranged on the surface that described device substrate is positioned at the external side of vacuum box; Described wick is laid on the inner core of described integrated electronic circuit or electronic component.
17, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 3 is characterized in that: described vacuum box body is rectangle or circle or the hexagonal body that adopts the good made of heat conductivility.
18, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 3 is characterized in that: described vacuum heating panel top also is provided with and makes the communicating pipe that is interconnected between the vacuum heating panel, this communicating pipe is one or one or more.
19, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 3, it is characterized in that: described wick is made up of multi-layer fiber mesh grid or folded the establishing of multiple layer metal silk screen, or adopts the powder sintered plate body made from micropore.
20, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 3 is characterized in that: described wick is to be bent continuously or crooked made shoestring by reciprocal by metal or organic material thin slice; Described sheet surface is offered porose, and by welding or bonding being sticked on the inwall of described housing.
21, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 20, it is characterized in that: described shoestring, is made and forms a plurality of " U " shape groove or " V " shape groove or " Ω " shape groove in this shoestring according to " U " font or " V " font or " Ω " shape back and forth bends or bending is made by described thin slice.
22, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 3, it is characterized in that: also be installed with one or more layers stiffener in the described vacuum box body, this stiffener stretches in the described vacuum heating panel, and its end face is fixedlyed connected with the inwall of vacuum box body and the inwall of vacuum heating panel.
23, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 3, it is characterized in that: also be provided with the thin-walled heat pipe that one or more are made by metal material in the described inboard cooling channels, this thin-walled heat pipe passes described outside fin, and weld with described outside fin, its end is fixed on the surface of vacuum heating panel or vacuum box body, and with described vacuum heating panel and vacuum box body internal run-through.
24, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 3, it is characterized in that: described fin is the waveform that sheet metal is made.
25, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 3, it is characterized in that: described fin surface offers the via hole that the described cooling fluid of more than one confession passes, perhaps the perpendicular upright thorn that can cause described cooling fluid turbulent flow that is provided with on its surface.
26, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 3 is characterized in that: also be welded with the enhancing fin between the described radiating fin, this strengthens the flow direction setting of fin along cooling fluid.
27, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 3, it is characterized in that: described vacuum box bottom is installed with one or more heat-conducting plates that can fit tightly with the radiating surface of outside heat-generating electronic elements, this heat-conducting plate embeds described vacuum box bottom, or is opened in the bottom surface that described vacuum box bottom is used to embed the special use depression of heat-generating electronic elements radiating surface.
28, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 27, it is characterized in that: described heat-conducting plate is rectangle or the circle of being made by the metallic plate with good heat conductive performance or organic soft board.
29, the integrated heat pipe radiator of the auxiliary flow-guiding radiation in the outside according to claim 3, it is characterized in that: described vacuum box bottom also offers one or more perforate, embed the device substrate that is complementary with its size, the periphery of this device substrate and the tight sealing-in of vacuum box bottom in this perforate; The surface that described device substrate is positioned at described vacuum box body is provided with the inner core of integrated electronic circuit or electronic component; The lead-foot-line of the inner core of described integrated electronic circuit or electronic component is arranged on the surface that described device substrate is positioned at the external side of vacuum box; Described wick is laid on the inner core of described integrated electronic circuit or electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420048972 CN2710162Y (en) | 2004-05-27 | 2004-05-27 | Integrated heat tube radiator with outside auxiliary guide radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420048972 CN2710162Y (en) | 2004-05-27 | 2004-05-27 | Integrated heat tube radiator with outside auxiliary guide radiation |
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| Publication Number | Publication Date |
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| CN2710162Y true CN2710162Y (en) | 2005-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420048972 Expired - Lifetime CN2710162Y (en) | 2004-05-27 | 2004-05-27 | Integrated heat tube radiator with outside auxiliary guide radiation |
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| Country | Link |
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| CN (1) | CN2710162Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100342529C (en) * | 2005-11-10 | 2007-10-10 | 上海交通大学 | Micropassage type radiator based on diamond film |
| CN104582435A (en) * | 2014-12-23 | 2015-04-29 | 西安电子工程研究所 | Intensive structure for heat transmission of heat flow in remote space |
| CN107910306A (en) * | 2017-12-15 | 2018-04-13 | 中国振华集团云科电子有限公司 | A kind of water-cooling type radiator and cooling system |
| CN108818143A (en) * | 2018-05-04 | 2018-11-16 | 芜湖良匠机械制造有限公司 | A kind of heat exchanger for glass substrate rack lathe process |
-
2004
- 2004-05-27 CN CN 200420048972 patent/CN2710162Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100342529C (en) * | 2005-11-10 | 2007-10-10 | 上海交通大学 | Micropassage type radiator based on diamond film |
| CN104582435A (en) * | 2014-12-23 | 2015-04-29 | 西安电子工程研究所 | Intensive structure for heat transmission of heat flow in remote space |
| CN107910306A (en) * | 2017-12-15 | 2018-04-13 | 中国振华集团云科电子有限公司 | A kind of water-cooling type radiator and cooling system |
| CN108818143A (en) * | 2018-05-04 | 2018-11-16 | 芜湖良匠机械制造有限公司 | A kind of heat exchanger for glass substrate rack lathe process |
| CN108818143B (en) * | 2018-05-04 | 2019-07-30 | 芜湖良匠机械制造有限公司 | A kind of heat exchanger for glass substrate rack lathe process |
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Effective date of registration: 20100629 Address after: 2 2 storey East, building 11, 116600 Optics Valley Road, Dalian Development Zone, Liaoning, China Patentee after: Dalian Termalway Technology Co., Ltd. Address before: Shahekou District of Dalian City, Liaoning Province, 116023 Lane 25, Jing bin Heishijiao No. 1-203 Patentee before: Yang Hongwu |
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