CN207706623U - A kind of electronic equipment radiator - Google Patents
A kind of electronic equipment radiator Download PDFInfo
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- CN207706623U CN207706623U CN201820099251.3U CN201820099251U CN207706623U CN 207706623 U CN207706623 U CN 207706623U CN 201820099251 U CN201820099251 U CN 201820099251U CN 207706623 U CN207706623 U CN 207706623U
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- tube body
- mesh grid
- electronic equipment
- heat
- copper powder
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Abstract
The utility model discloses a kind of electronic equipment radiators of electronic equipment dissipating heat technical field.The radiator includes shell, slim flat-shaped heat pipe is equipped in shell, heat pipe includes the internal tube body vacuumized, the liquid-sucking core and working fluid of setting capillary structure in tube body, liquid-sucking core includes copper powder layer and mesh grid, copper powder layer is discontinuously sintered in inboard wall of tube body, setting is attached to the mesh grid of inboard wall of tube body between adjacent two sections of copper powder layers, steam channel is constituted in tube body, mesh grid is rolled into multilayer along inboard wall of tube body, mesh grid innermost layer constitutes steam channel, and passage gaps are formed between mesh grid adjacent two layers；One end of tube body is evaporation ends, and the other end is condensation end, and evaporation ends are cemented in by heat conductive silica gel on master chip, and condensation end is equipped with graphite film, and graphite film is mounted on inner walls.The utility model improves adopting heat pipes for heat transfer speed by increasing capillary force, and the heat that master chip is implemented in combination with graphite film is spread by diffusion transformation for face, good heat dissipation effect.
Description
Technical field
The utility model is related to the technical field of heat dissipation of electronic equipment, more particularly to a kind of electronic equipment radiator.
Background technology
Current light and thin type electric consumers, using tablet and smart mobile phone as mainstream.Its radiating mode is mainly with quilt
Based on dynamic heat dissipation, heat sink material is mainly upper based on homogeneous material thermal diffusion film, at present and with synthetic graphite in thermal diffusion film
Can be best, horizontal thermal conductivity K=1500W/mK can be reached, but as Intelligent flat and mobile phone are to meet the consumer group increasingly
The requirement of raising, master chip power consumption can be continuously increased, and the performance of graphite material gradually can not meet electronics industry at present
Growth requirement, though because the area of graphite material is big, its radiating mode in heat source part is still traditional point thermal diffusion
Pattern, therefore the heat Relatively centralized of heat source part, are unable to reach preferable heat dissipation effect, and heat cannot shed in time, for a long time
Service failure master chip influences the normal operation of electronic equipment.
Utility model content
The purpose of this utility model is to provide a kind of electronic equipment radiator of good heat dissipation effect.
In order to realize above-mentioned purpose of utility model, the following technical side that the utility model radiating device for electronic equipment uses
Case：
A kind of electronic equipment radiator, including shell, the shell is interior to be equipped with slim flat-shaped heat pipe, the heat pipe packet
The internal tube body vacuumized is included, the liquid-sucking core and working fluid of capillary structure are set in tube body, and the liquid-sucking core includes copper powder layer
And mesh grid, copper powder layer are discontinuously sintered in inboard wall of tube body, and the volume for being attached to inboard wall of tube body is arranged between adjacent two sections of copper powder layers
Knitmesh, tube body is interior to constitute steam channel, and the mesh grid is rolled into multilayer along inboard wall of tube body, and it is logical that mesh grid innermost layer constitutes steam
Road forms passage gaps between mesh grid adjacent two layers；One end of the tube body is evaporation ends, and the other end of tube body is condensation
End, the evaporation ends are cemented in by heat conductive silica gel on master chip, and the condensation end is equipped with graphite film, and the graphite film is mounted on
Inner walls.The utility model accelerates heat transfer rate by the capillary structure of increase heat pipe wicks, improves the heat dissipation effect of heat pipe
Fruit, wherein liquid-sucking core includes interruption sintering in the copper powder layer of inboard wall of tube body and the braiding being arranged between adjacent two sections of copper powder layers
Net, mesh grid plasticity is strong, is suitble to thin type heat pipe, but capillary force is inadequate, by the way that mesh grid is rolled into multilayer in inboard wall of tube body, and
It is combined with the stronger copper powder layer of capillary force, effectively improves the capillary force of liquid-sucking core so that steam is quickly taken out after condensation end condensation
Evaporation ends are returned, the heat transfer rate of heat pipe is accelerated so that heat quickly passes to graphite film, realizes that master chip heat is turned by a diffusion
Become face diffusion, heat is quickly shed, improves the heat dissipation effect to master chip, also, be arranged between mesh grid adjacent two layers
Passage gaps facilitate some vapor to be flowed from passage gaps, increase the capillary force of mesh grid while will not block heat pipe.
Preferably, reticular structure made of the mesh grid is cross-woven by lateral braid over braid and vertical braid over braid.Braiding
Reticular structure made of net is cross-woven by lateral braid over braid and vertical braid over braid, improves the capillary force of mesh grid.
Preferably, the mesh grid is metal net.Mesh grid is metal net, and not only plasticity is strong, and more
Good is attached at inboard wall of tube body.
Preferably, the thickness of the heat pipe is 0.3~0.4 millimeter.The thickness of heat pipe is 0.3~0.4 millimeter, and heat pipe is super
Thin heat pipe, it is small, it is light-weight, it is suitble to use in electronic equipment, use space is greatly saved.
Preferably, the evaporation ends setting is tapered.Evaporation ends setting is tapered so that working fluid heated fast evaporates
Form steam.
Preferably, heat emission hole is arranged close to the position of graphite film in the handset shell.By the way that heat emission hole is arranged on shell
Auxiliary heat dissipation.
Preferably, the working fluid is pure water, acetone, methanol or ammonium hydroxide.It is fast convenient for working fluid after evaporation ends are heated
Speed evaporation forms steam flow condensation end.
Compared with prior art, the beneficial effects of the utility model are：
1, heat pipe is connected by heat conductive silica gel with master chip by the utility model, and master chip heat can be uniformly distributed in rapidly
Tube surface then transfers heat to graphite film by heat pipe, realizes that heat from heat source is spread by diffusion transformation for face, greatly
Electronic equipment heat conduction efficiency is improved, after heat pipe, heat source temperature is dragged down rapidly, ensures electronic equipment effective utilization；
2, the utility model increases the capillary force of liquid-sucking core to improve the heat dissipation effect of heat pipe, imbibition by improving heat pipe
Core includes copper powder layer and mesh grid, and mesh grid plasticity is strong, is suitble to thin type heat pipe, but capillary force is inadequate, passes through mesh grid and copper
The combination of bisque improves capillary force, meanwhile, mesh grid is rolled into multilayer along heat pipe inner wall, by the mesh grid of multilayered structure, is carried
High capillary force, and passage gaps are formed between mesh grid adjacent two layers, it circulates convenient for steam, heat pipe will not be blocked, heat pipe dissipates
Thermal effect is good；
3, heat pipe is arranged to slim flat-shaped by the utility model, small, light-weight, and having saved makes in electronic equipment
With area, it is easily installed.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is A-A sectional views in Fig. 1；
Fig. 3 is B-B sectional views in Fig. 1；
Fig. 4 is woven mesh structure figure；
Fig. 5 is the portions C enlarged drawing in Fig. 1.
Wherein, 1 shell, 2 condensation ends, 3 graphite films, 4 copper powder layers, 5 mesh grids, 6 heat conductive silica gels, 7 evaporation ends, 8 master chips,
9 steam channels, 10 tube bodies, 11 heat emission holes, 12 passage gaps, 13 lateral braid over braids, 14 vertical braid over braids.
Specific implementation mode
With reference to the accompanying drawings and detailed description, the utility model is furtherd elucidate, it should be understood that these embodiments are only
For illustrating the utility model rather than limitation the scope of the utility model, after having read the utility model, this field
Technical staff falls within the application range as defined in the appended claims to the modification of the various equivalent forms of the utility model.
As shown in Figs. 1-5, a kind of electronic equipment radiator, including shell 1, shell 1 is interior to be equipped with slim flat-shaped heat pipe,
The thickness of heat pipe is 0.3~0.4 millimeter, small, light-weight, is suitble to use in electronic equipment, use space is greatly saved,
Heat pipe includes the internal tube body 10 vacuumized, and the liquid-sucking core and working fluid of capillary structure are arranged in tube body 10, and working fluid is
Pure water, acetone, methanol or ammonium hydroxide, liquid-sucking core include copper powder layer 4 and mesh grid 5, and 5 plasticity of mesh grid is strong, are suitble to thin type heat pipe,
But capillary force is inadequate, and capillary force is improved by mesh grid 5 and the combination of copper powder layer 4, wherein mesh grid 5 is metal net, is compiled
Reticular structure made of knitmesh 5 is cross-woven by lateral braid over braid 13 and vertical braid over braid 14, copper powder layer 4 are discontinuously sintered in pipe
10 inner wall of body, between adjacent two sections of copper powder layers 4 setting be attached to the mesh grid 5 of 10 inner wall of tube body, it is logical to constitute steam in tube body 10
Road 9, mesh grid 5 are rolled into multilayer along 10 inner wall of tube body, and 5 innermost layer of mesh grid constitutes steam channel 9,5 adjacent two layers of mesh grid it
Between form passage gaps 12, the settings of the passage gaps 12 will not block heat pipe, heat pipe heat radiation effect is good convenient for steam circulation；
One end of tube body 10 is evaporation ends 7, and the other end of tube body 10 is condensation end 2, and evaporation ends 7 are arranged tapered, and evaporation ends 7 are by leading
Hot silica gel 6 cements on master chip 8, and condensation end 2 is equipped with graphite film 3, and graphite film 3 is mounted on 1 inner wall of shell, realizes master chip 8
Heat by diffusion transformation be that face is spread, heat emission hole 11, auxiliary heat dissipation is arranged close to the position of graphite film 3 in shell 1 so that main
The heat of chip 8 quickly sheds, good heat dissipation effect.
The specific work process and principle of the utility model：The heat that the master chip 8 of electronic equipment generates passes through thermal conductive silicon
6 Quick uniform of glue is distributed in tube surface, and heat pipe releases the latent heat of vaporization and transfers heat to graphite film 3, realizes the heat of master chip 8
Amount is spread by diffusion transformation for face, meanwhile, 11 auxiliary heat dissipation of heat emission hole is set on the shell 1 of electronic equipment；Specifically, main
For the heat transfer that chip 8 generates to heat pipe evaporation ends 7, it is latent that the working fluid in tube body 10 absorbs vaporization after evaporation ends 7 are heated
At steam, the steam pressures of evaporation ends 7 is higher than condensation end 2 for thermal change, and both ends form pressure difference, and driving steam is from evaporation ends 7 toward cold
2 flowing of solidifying end, steam condenses the releasing latent heat of vaporization in condensation end 2 and transfers heat to graphite film 3, while steam is in condensation end
2 condensations form working fluid, and working fluid forms different radius of curvature in capillary structure, and the capillary force of generation is by workflow
Body draws back evaporation ends 7, forms cycle；Wherein, heat pipe is arranged to slim flat-shaped, and the mesh grid of capillary structure is arranged in 10 inner wall of tube body
5 and copper powder layer 4,5 plasticity of mesh grid is strong, is suitble to thin type heat pipe, but capillary force is inadequate, passes through the knot of mesh grid 5 and copper powder layer 4
It closes and improves capillary force, meanwhile, mesh grid 5 is rolled into multilayer along 10 inner wall of tube body, by the mesh grid 5 of multilayered structure, improves hair
Thin power, and passage gaps 12 are formed between 5 adjacent two layers of mesh grid, increase the circulation area of steam, steam will not when circulating
It results in blockage.
Claims (7)
1. a kind of electronic equipment radiator, it is characterised in that：Including shell, slim flat-shaped heat pipe is equipped in the shell,
The heat pipe includes the internal tube body vacuumized, and the liquid-sucking core and working fluid of capillary structure, the liquid-sucking core are arranged in tube body
Including copper powder layer and mesh grid, copper powder layer is discontinuously sintered in inboard wall of tube body, is arranged between adjacent two sections of copper powder layers and is attached to pipe
The mesh grid of internal wall, tube body is interior to constitute steam channel, and the mesh grid is rolled into multilayer, mesh grid innermost layer structure along inboard wall of tube body
At steam channel, passage gaps are formed between mesh grid adjacent two layers；One end of the tube body is evaporation ends, the other end of tube body
For condensation end, the evaporation ends are cemented in by heat conductive silica gel on master chip, and the condensation end is equipped with graphite film, the graphite film
It is mounted on inner walls.
2. radiating device for electronic equipment according to claim 1, it is characterised in that：The mesh grid by lateral braid over braid and
Reticular structure made of vertical braid over braid is cross-woven.
3. radiating device for electronic equipment according to claim 1, it is characterised in that：The mesh grid is metal net.
4. radiating device for electronic equipment according to claim 1, it is characterised in that：The thickness of the heat pipe is 0.3~0.4
Millimeter.
5. radiating device for electronic equipment according to claim 1, it is characterised in that：The evaporation ends setting is tapered.
6. radiating device for electronic equipment according to claim 1, it is characterised in that：The shell is close to the position of graphite film
Heat emission hole is set.
7. radiating device for electronic equipment according to claim 1, it is characterised in that：The working fluid be pure water, acetone,
Methanol or ammonium hydroxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820099251.3U CN207706623U (en) | 2018-01-22 | 2018-01-22 | A kind of electronic equipment radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820099251.3U CN207706623U (en) | 2018-01-22 | 2018-01-22 | A kind of electronic equipment radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207706623U true CN207706623U (en) | 2018-08-07 |
Family
ID=63035569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820099251.3U Active CN207706623U (en) | 2018-01-22 | 2018-01-22 | A kind of electronic equipment radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207706623U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110044193A (en) * | 2019-04-29 | 2019-07-23 | 深圳市尚翼实业有限公司 | A kind of heat pipe |
| CN112902490A (en) * | 2021-02-04 | 2021-06-04 | 中国科学院理化技术研究所 | Adsorption refrigerator |
| CN113782506A (en) * | 2021-09-27 | 2021-12-10 | 深圳威铂驰热技术有限公司 | High heat flux density device |
-
2018
- 2018-01-22 CN CN201820099251.3U patent/CN207706623U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110044193A (en) * | 2019-04-29 | 2019-07-23 | 深圳市尚翼实业有限公司 | A kind of heat pipe |
| CN112902490A (en) * | 2021-02-04 | 2021-06-04 | 中国科学院理化技术研究所 | Adsorption refrigerator |
| CN113782506A (en) * | 2021-09-27 | 2021-12-10 | 深圳威铂驰热技术有限公司 | High heat flux density device |
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