CN205619792U - Heat pipe formula heat radiation structure and corresponding radiator thereof - Google Patents
Heat pipe formula heat radiation structure and corresponding radiator thereof Download PDFInfo
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- CN205619792U CN205619792U CN201620354662.3U CN201620354662U CN205619792U CN 205619792 U CN205619792 U CN 205619792U CN 201620354662 U CN201620354662 U CN 201620354662U CN 205619792 U CN205619792 U CN 205619792U
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- heat pipe
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- type radiator
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Abstract
The utility model relates to a heat pipe formula heat radiation structure and corresponding radiator thereof belongs to heat dissipation technical field. It includes by integrated into one piece's evaporation zone and condensation segment, the condensation segment is the spatial grid structure of space three -dimensional order, and spatial grid structure comprises hollow heat pipe, constitutes one kind or several kinds combination among tetrahedron unit topological structure, hexahedron unit topological structure, dodecahedron unit topological structure, tetrakaidecahedron unit topological structure, the icosahedron unit topological structure. The heat radiation structure inner wall circulates for porous structure adopts the capillary principle to retrieve condensed fluid. The utility model discloses an adopt three -dimensional order spatial grid structure to replace conventional heat pipe and cooling fin structure among the prior art, the heat conductivility and the heat dispersion that utilize three -dimensional interconnection constitutional features and high specific surface area characteristic to improve the heat pipe realize dispelling the heat fast. Be fit for high -power high thermal current density electron device light efficient heat dissipation demand, have wide application prospect.
Description
Technical field
This utility model belongs to cooling technical field, particularly relates to a kind of efficient radiator heat
Tubular construction and corresponding heat-pipe radiator thereof.
Background technology
Along with developing rapidly of modern power electronics technology, the power density of high performance components is the most more come
The biggest, for the normal work of guaranteed output device, it is necessary to dispel the heat timely and effectively；Meanwhile,
The integrated level of high performance components is more and more higher, it is desirable to radiator is sent out to miniaturization, lightweight direction
Exhibition.Conventional heat pipe radiator is that one or more heat pipe is embedded the end contacted with power device at present
On portion's heat sink, heat is delivered to, by heat pipe, the colling end that fin covers, will by fin
Heat sheds, but due to heat pipe independently of one another and need extra heat dissipation sheet to cause radiating efficiency limited and
Volume is relatively large, is further improved.
Utility model content
For the problems referred to above, the purpose of this utility model is to provide the heat pipe-type of a kind of efficient and light weight
Radiator structure and corresponding radiator thereof.The orderly grid structure of space three-dimensional ensure that heat pipe is mutually
Connection intercommunication, it is achieved uniform high-efficiency dispels the heat；The high-specific surface area of three-dimensional order grid structure heat pipe ensures
Bigger condensation area and area of dissipation is obtained during flow of vapor, good heat-transfer, simultaneously
Eliminate extra radiating fin, optimize heat spreader structures.
The purpose of this utility model is achieved through the following technical solutions: a kind of heat pipe-type heat radiation knot
Structure, including integrated evaporator section and condensation segment, described condensation segment is the net that space three-dimensional is orderly
Shelf structure, described grid structure is made up of hollow heat pipe.
Further, described grid structure includes that tetrahedron element topological structure, hexahedral element are opened up
Flutter structure, dodecahedron unit topological structure, tetrakaidecahedron unit topological structure, icosahedron list
The combination of one or more in unit's topological structure.
Further, described hollow inside heat pipe has hollow channel, described hollow channel transversal
Face is generally circular in shape, oval, square, rectangle, triangle or trapezoidal.
Further, the inwall of described hollow heat pipe is loose structure, and its pore diameter range is
100nm～100um.
Further, described evaporator section connects in inside with condensation segment.
Further, described evaporator section is a hollow slab structure, and the inwall of described flat board has many
Pore structure.
This utility model also provides for a kind of radiator, including above-mentioned radiator structure.Described radiator
In fill pure water, alcohol-water solution, ammonia spirit or from wetting liquid working medium.
The beneficial effects of the utility model are: (1) this utility model is by one or more traditional warm
The plane combination of pipe changes over the grid structure of three-dimensional order, and heat-transfer effect is by change of conducting heat independently of one another
Become heat transfer in parallel, improve the uniformity of heat radiation；(2) eliminate independent fin or fin dissipates
Hot part, changes and is relied on the high-specific surface area of self directly to dispel the heat by heat pipe, improves heat radiation effect
Achieve overall structure while rate to simplify and the target of loss of weight；(3) by the capillary of inside heat pipe
Condensed fluid resorption is recycled by syphon structure, saves structure space, it is not necessary to applied cyclic device；
(4) achieved the requirement of efficient and light weight by the change of heat pipe structure, can be widely applied to energy and turn
Change, thermal switch, thermal diode, temperature control and the field such as heat transfer.Alternative conventional heat pipe dissipates
Hot device and part water-filled radiator, be especially suitable for high-power high heat flux electronic device efficient and light weight
Radiating requirements.
Other advantages of the present utility model can by the description write, claims and
Accompanying drawing becomes apparent, or understands by implementing this utility model.
Accompanying drawing explanation
Accompanying drawing is only used for illustrating the purpose of specific embodiment, and is not considered as of the present utility model
Limiting, in whole accompanying drawing, identical reference marks represents identical parts.
Fig. 1 is structural representation of the present utility model；
Fig. 2 is unit truss structural representation.
Detailed description of the invention
Specifically describe preferred embodiment of the present utility model, wherein, accompanying drawing structure below in conjunction with the accompanying drawings
Become the application part, and be used for explaining of the present utility model together with embodiment of the present utility model
Principle.
As it is shown in figure 1, this utility model provides a kind of efficient hot pipe cooling structure, it includes
Integrated evaporator section 1 and condensation segment 2, described evaporator section is hollow slab structure, described condensation
Section is the grid structure that space three-dimensional is orderly, and described rack is made up of hollow heat pipe.The list of rack
Meta structure be tetrahedral unit framework, hexahedral element structure, dodecahedron cellular construction, 14
The combination of one or more in face body unit structure, icosahedral unit structure, is consequently formed
Space grid structure is that tetrahedron element hollow heat pipe topological structure, the hollow heat pipe of hexahedral element are opened up
Flutter structure, dodecahedron unit air heat in the heart pipe topological structure, tetrakaidecahedron unit air heat in the heart pipe topology
The combination of one or more in structure, icosahedral unit hollow heat pipe topological structure.
The lower section of evaporator section 1 directly contacts with thermal source, and top directly contacts with condensation segment 2, as
The position that the flat board of evaporator section 1 contacts with the rack as condensation segment 2 is connected for both are internal
Position.The flat board inwall of evaporator section 1 is fibre structure or porous wick structure structure.
The hollow inside heat pipe constituting condensation segment 2 has hollow channel, the cross section shape of hollow channel
Shape be circular, oval, square, rectangle, triangle or trapezoidal can.Hollow heat pipe interior
Wall is fibre structure or porous wick structure structure, and its pore diameter range is 100nm～100um.Hollow is led to
Road provides the passage of gas, and capillary wick structure provides the capillary force of working medium backflow.
Evaporator section 1 flat board inwall and the fiber of the hollow heat pipe inner wall of condensation segment 2 or porous wick structure are tied
Structure, all through hanging sintering or diffusion-sintering or can be increased the method shape that material manufactures by making material itself
Become.
Above-mentioned evaporator section 1 and the integrative-structure of condensation segment 2 can use increasing material to manufacture one chemical conversion
Type, or use mould machine-shaping.
General in radiator structure fill pure water, alcohol-water solution, ammonia spirit or from wetting liquid working medium,
It is the liquid working substance stage by thermal evaporation at evaporator section 1, is that gas working medium condensation dissipates at condensation segment 2
The stage of heat.When thermal source heats at evaporator section 1, in flat board evaporation section 1, it is in high vacuum state
Working medium be heated and be evaporated to rapidly isothermal saturated vapor, steam enters condensation segment 2, under small pressure reduction
Hollow channel along condensation segment 2 flows to all directions；In condensation segment, gas releasing heat coagulates
Forming liquid, heat tradition is arrived by the release heat of transformation the high-specific surface area by hollow heat pipe self
In environment around, the liquid of condensation is back to evaporator section 1 by capillary wick structure, repeats to follow
Ring.
This space three-dimensional heat pipe-type radiator structure that this utility model provides, dissipates traditional plane
Heat structure changes stereochemical structure into, take up room little in the case of increase area of dissipation, same to intermittent fever
Communicating with each other between pipe, improve the uniformity of heat transfer, radiator structure is internal uses capillary siphon former
The liquid of condensation is drawn back into thermal evaporation section and can be recycled by reason, is integrally improved radiating efficiency real again
Show overall structure to simplify and the purpose of loss of weight.
This structure of the present utility model can be applicable in radiator, with the radiator of this structure
Alternative conventional heat pipe radiator and part water-filled radiator, be especially suitable for high-power high heat flux
The radiating requirements of electronic device efficient and light weight.This utility model protects the heat radiation of this structure too
Device.
Above-described embodiment is only preferred embodiment of the present utility model, it is impossible to be considered for limiting this
The practical range of utility model.All equalizations made according to this utility model application range change and change
Enter, within all should still belonging to patent covering scope of the present utility model.
Claims (10)
1. a heat pipe-type radiator structure, it is characterised in that it include integrated evaporator section and
Condensation segment, described condensation segment is the grid structure that space three-dimensional is orderly, and described grid structure is by hollow
Heat pipe forms.
Heat pipe-type radiator structure the most according to claim 1, it is characterised in that described rack
Structure includes that tetrahedron element topological structure, hexahedral element topological structure, dodecahedron unit are opened up
Flutter the one or several in structure, tetrakaidecahedron unit topological structure, icosahedral unit topological structure
The combination planted.
Heat pipe-type radiator structure the most according to claim 1 and 2, it is characterised in that described
Hollow inside heat pipe has hollow channel, and the shape of cross section of described hollow channel is circular, oval
Shape, square, rectangle, triangle or trapezoidal.
Heat pipe-type radiator structure the most according to claim 1 and 2, it is characterised in that described
The inwall of hollow heat pipe is fiber or porous wick structure structure, and its pore diameter range is 100nm～100um.
Heat pipe-type radiator structure the most according to claim 3, it is characterised in that described hollow
The inwall of heat pipe is fiber or porous wick structure architecture, and its pore diameter range is 100nm～100um.
Heat pipe-type radiator structure the most according to claim 1, it is characterised in that described evaporation
Section connects in inside with condensation segment.
7. according to the heat pipe-type radiator structure described in claim 1 or 6, it is characterised in that described
Evaporator section is a hollow slab structure, and the inwall of described flat board is fiber or porous wick structure structure.
Heat pipe-type radiator structure the most according to claim 4, it is characterised in that described evaporation
Duan Weiyi hollow slab structure, the inwall of described flat board is fiber or porous wick structure structure.
9. a radiator, it is characterised in that include the heat radiation as described in one of claim 1-8
Structure.
Radiator the most according to claim 9, it is characterised in that fill in described radiator
Note pure water, alcohol-water solution, ammonia spirit or from wetting liquid working medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620354662.3U CN205619792U (en) | 2016-04-25 | 2016-04-25 | Heat pipe formula heat radiation structure and corresponding radiator thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620354662.3U CN205619792U (en) | 2016-04-25 | 2016-04-25 | Heat pipe formula heat radiation structure and corresponding radiator thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205619792U true CN205619792U (en) | 2016-10-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620354662.3U Active CN205619792U (en) | 2016-04-25 | 2016-04-25 | Heat pipe formula heat radiation structure and corresponding radiator thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205619792U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901174A (en) * | 2018-05-31 | 2018-11-27 | 孙莅宁 | The radiator of three-dimensional grid structure form for electronic equipment |
| CN112229253A (en) * | 2020-10-30 | 2021-01-15 | 上海卫星装备研究所 | Heat pipe branch connecting device and heat pipe system |
-
2016
- 2016-04-25 CN CN201620354662.3U patent/CN205619792U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901174A (en) * | 2018-05-31 | 2018-11-27 | 孙莅宁 | The radiator of three-dimensional grid structure form for electronic equipment |
| CN112229253A (en) * | 2020-10-30 | 2021-01-15 | 上海卫星装备研究所 | Heat pipe branch connecting device and heat pipe system |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |