CN1670950A - Integrated heat-pipe radiator with outside diversion - Google Patents
Integrated heat-pipe radiator with outside diversion Download PDFInfo
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- CN1670950A CN1670950A CN 200410008659 CN200410008659A CN1670950A CN 1670950 A CN1670950 A CN 1670950A CN 200410008659 CN200410008659 CN 200410008659 CN 200410008659 A CN200410008659 A CN 200410008659A CN 1670950 A CN1670950 A CN 1670950A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract
An outer diversion integrated heat pipe radiator, which contains closed vacuum box for absorbing heat, a vacuum radiation board perforated with vacuum box, the narrow gap between vacuum board forming cooling fluid pass way, radiation fins welded on vacuum radiation board, liquid work medium filled in vacuum box, liquid absorption core set on the inner surface of vacuum box and inner wall of vacuum radiation board, flow-stopping board covered on cooling fluid pass way where the fins are set. Said invention changes the traditional radiation mode and raises heat conductive efficiency.
Description
Technical field
The present invention relates to a kind of heat-pipe radiator, especially a kind of based on heat pipe, radiating fin is assisted and strengthened means, by the outside water conservancy diversion integrated heat pipe radiator of the three-dimensional condensation heat radiation of the having of making of the flow direction of guiding cooling fluid network.
Background technology
Along with the fast development of electronics, power technology, particularly the integrated level along with integrated circuit increases substantially, and the heat dissipation problem of electronic devices and components has become one of the speed of service of restriction electronic equipment and major issue of power output.
With the computer CPU chip is example, and its integrated level has improved nearly 20,000 times in 30 years, and the heat flow of its generation has reached 100W/cm
2Degree.
As everyone knows, the reliability of computer operation and life-span and its working temperature have confidential relation, and the integrated level of chip is high more, the heat of its generation is just high more, if can not in time these heats be left, the reliability of computer operation will reduce significantly, even occurs and can't normally move.For computer development research institution,, just can't develop the data processing equipment that speed is faster, power is higher, volume is littler if can not effectively solve the heat that chip and other electronic devices and components produce at work.
At present, the radiating mode of computer and electronic component normally is installed in the pectination heating panel of aluminum alloy materials manufacturing on the body of chip or other electron component, makes a bigger area of dissipation, simultaneously, be equipped with fan heat is scattered, thereby reduce temperature.Though this mode is simple in structure, with low cost, can only be applicable to that arithmetic speed is not high, the components and parts heat radiation in the little electronic equipment of power.
1998, the state-run laboratory of U.S. Sang Diya utilized hot pipe technique to carry out the heat radiation of computer chip, has obtained effect preferably.
Figure 1 shows that a kind of heat abstractor that adopts heat pipe of present use, it comprises a framework 1.Closely be equipped with on the base plate of framework 1 and a plurality ofly make with foil, and the radiating fin 2 of dense distribution.Crouch on framework 1 inner bottom plating and be provided with heat pipe 3 (quantity of heat pipe can be two or three).Heat pipe 3 passes the bottom of radiating fin 2, protrudes upward the top that curved turnback penetrates radiating fin 2.All radiating fins 2 all closely are sticked with heat pipe 3 and are connected.In heat pipe 3, be placed with and meet heat vaporization, the liquid working substance that precooling is condensed.When framework 1 is installed on the chip, the heat that chip produces is vaporized the heat pipe 3 interior liquid working substances that are located on framework 1 inner bottom plating that crouch, heat is along with the liquid working substance of vaporization enters the heat pipe 3 that is arranged in radiating fin 2 tops, and meet the condensation knot, heat then sheds to the external world by radiating fin 2.After air blast cooling fan 4 was installed at radiating fin 2 tops again, heat is easier to shed.
Because heat pipe has high heat transfer efficiency, so the heat that chip produces can be passed on the radiating fin at a distance faster, reaches the heat radiation purpose.This mode has higher radiating efficiency compared with pectination heating panel mode in the past.Because the temperature position far away apart from chip often of fin on the pectination heating panel, temperature is lower, and it is higher near the bottom position temperature of chip, this temperature gradient phenomenon has been wasted a large amount of area of dissipations, therefore, can not have higher radiating efficiency, utilize heat pipe then can overcome the bad shortcoming of the existing radiating effect of pectination heating panel.
Though heat-pipe radiating apparatus shown in Figure 1 has better radiating effect, but, owing to himself be based on the entity radiator in structure, heat pipe only is used for the fin efficiency of strong radiator radiating fin, can not give full play to the heat pipe compactness, light, the advantage of efficient heat transfer, the deficiency of its existence mainly shows as: between thermal source and the base plate, between heat pipe and the base plate, all there is higher thermal resistance between heat pipe and the fin, simultaneously, consider the problem of radiator intensity, can not do fin very thinly, and thicker fin waste material not only, occupy the confined space, and can not obtain more area of dissipation, so this mode still can not satisfy the super large integrated circuit, high-power electronic device and high-speed chip make its application be subjected to certain restriction to heat radiation institute requirement.
In sum, provide that to have more the heat abstractor of high cooling efficiency be to make high-power, the high-velocity electrons equipment and the powerful guarantee of large scale integrated chip more, also one of insider's problem demanding prompt solution at present just.
Summary of the invention
The objective of the invention is at present electronics, electric power manufacturing technology field is high efficiency heat radiation device and can't further improve electronic component for want of, the speed of service of circuit chip and power output and a kind of outside water conservancy diversion integrated heat pipe radiator is provided, this radiator is according to the adopting heat pipes for heat transfer principle, by to heat absorbing end, the cooling channels in the release end of heat outside is optimized the layout setting, realization is based on heat pipe, with radiating fin is the integrated heat pipe electronic radiation device of heat conduction reinforced means, compare with the conventional heat pipe heat abstractor of other same sizes, have bigger radiating efficiency.
The objective of the invention is to be achieved through the following technical solutions:
A kind of outside water conservancy diversion integrated heat pipe radiator, it comprises an enclosed vacuum box body that is used to absorb heat, and erects on the surface of vacuum box body to be installed with the vacuum heating panel that connects by bottom and described vacuum box intracoelomic cavity more than.Crack between the vacuum heating panel constitutes cooling channels.Also welding is provided with the fin that is used to enlarge area of dissipation between the vacuum heating panel.
Be filled with in the vacuum box body and meet the heat vaporization, meet the liquid working substance of condensation knot.Be laid with on the inwall of the inner surface of vacuum box body and vacuum heating panel can adsorptive liquid wick.Fixedly be coated with flow-stopping plate on the end face of cooling channels, the width of this flow-stopping plate is less than the width of described end face, makes the outlet that forms cooling fluid between flow-stopping plate and the vacuum box body, and makes the top end face of cooling channels become the inlet of cooling fluid; Described fin is arranged in the cooling channels along the flow direction of cooling fluid.
During use, heat-generating electronic elements closely is attached at vacuum box body below, and at the top of vacuum heating panel the cooling fan to canyon is installed.The heat that heat-generating electronic elements work produces imports in the vacuum box body.Liquid working substance is met the heat vaporization, heat is transmitted to the vacuum heating panel, and outwards transmit by the fin of welding, and simultaneously, cooling fan blow cool air enters cooling channels downwards.Under the stopping of flow-stopping plate, cold airflow can only be discharged from the outlet near the vacuum box body.
The surface of vacuum box body is the higher relatively position of temperature, and the outlet of cooling fluid is arranged on this, can more effectively improve radiating efficiency, and fin is complied with the flow direction setting of cooling fluid, makes cold airflow can discharge and take away the heat on fin surface smoothly in cooling channels.
The vacuum box body can adopt the good made of heat conductivility, and its shape can be a rectangle, also can be circular or other arbitrary shape.
In above-mentioned the setting, the vacuum heating panel can be arranged in parallel in the vacuum box surface, can center, vacuum box surface be that setting is outwards radiated in the center of circle also.
Even for the heat radiation that keeps the vacuum heating panel, one or one or more can also be set at vacuum heating panel top make the communicating pipe that is interconnected between the vacuum heating panel.
Flow out and be convenient to production and processing smoothly for ease of cold airflow, fin can be divided into upper and lower two sections settings.Epimere is perpendicular to the entrance face of described cooling fluid; The lower end is perpendicular to the exit end face of described cooling fluid, and upper and lower two sections fins are non-intersect.After cold airflow enters cooling channels by inlet, under the guide functions of epimere fin, vertically blow to the vacuum box surface, and under the guide functions of hypomere fin, the cold airflow vertical duction is discharged by outlet.In this course, cold airflow can shed heat with the degree of maximum.
In technique scheme, flow-stopping plate fixedly can also be covered on the top end face of cooling channels, promptly on the top end face of vacuum heating panel, make the outlet or the inlet of two end faces formation cooling fluids of cooling channels.Be provided with like this and can satisfy the needs that cooling fan is arranged on side direction, make cold airflow enter this passage, and discharge from the other end by an end face of cooling channels.In this scheme, the side of fin can be welded on the surface of vacuum box body, be arranged in parallel with the vacuum heating panel, also can be welded on the surface of vacuum heating panel, be arranged in parallel with the surface of vacuum box body.
Employed wick can be made up of multi-layer fiber mesh grid or folded the establishing of multiple layer metal silk screen in the technique scheme, also can be to adopt the powder sintered plate body made from micropore.Can also be to bend continuously or crooked made shoestring by reciprocal by metal or organic material thin slice, and by welding or bonding being sticked on the inwall of described housing.
Aborning, when the vacuum box body adopts Shooting Technique, for the surface of minimizing heat-generating electronic elements and the thermal resistance between the vacuum box bottom, improve heat conduction efficiency, can set firmly the heat-conducting plate that can fit tightly at the vacuum box bottom with the radiating surface of outside heat-generating electronic elements.The mode of setting firmly of heat-conducting plate can adopt the mode that embeds the vacuum box bottom, also can offer a special use depression that is used to embed the heat-generating electronic elements radiating surface at the vacuum box bottom, with the bottom surface of heat-conducting plate as this special use depression.
In addition, for further improving radiating efficiency, technique scheme can also be in conjunction with the manufacturing of heat-generating electronic elements, at the vacuum box bottom perforate can also be set, size and perforate are complementary, the device substrate that the surface is provided with integrated electronic circuit or electronic component inner core embeds in this perforate, makes integrated electronic circuit or electronic component inner core be positioned at the vacuum box body.The periphery of device substrate and the tight sealing-in of vacuum box body.The lead-foot-line of the inner core of integrated electronic circuit or electronic component is arranged on the surface that device substrate is positioned at the external side of vacuum box.
In this scheme, wick is on the inner core of electric insulation and be laid in integrated electronic circuit or electronic component.Liquid working substance is an electrical insulating material, and compatible with the inner core material chemistry of described integrated electronic circuit or electronic component, electric compatible.
By heat-generating electronic elements and vacuum box sports association are closed manufacturing, overcome the heat conduction resistance, the heat that heat-generating electronic elements is produced at work directly sends out by the vaporization of liquid working substance, reaches best radiating effect.
By above technical scheme as can be known: the present invention constitutes the passage of may command cooling fluid directed flow in the outside of the vacuum box body that is filled with liquid working substance by a plurality of vacuum heating panels and flow-stopping plate, changed the distributed set-up mode of traditional single heat pipe, improved radiating efficiency greatly to heat-generating electronic elements, for future more the manufacturing of large scale integrated chip and high-speed electronic device, great-power electronic, power equipment exploitation, make and lay a good foundation, have great practical value.
Description of drawings
Fig. 1 is the structural representation of the present heat-pipe radiator of using always;
Fig. 2 is the perspective view of first embodiment provided by the present invention;
Fig. 3 is a side sectional view embodiment illustrated in fig. 2;
Fig. 4 is the location drawing that is provided with of wick in embodiment illustrated in fig. 2;
Fig. 5 is embodiment illustrated in fig. 2 at the user mode schematic diagram;
Fig. 6 is the structural representation of middle fin embodiment illustrated in fig. 2;
Fig. 7 is the structural representation of middle stiffener embodiment illustrated in fig. 2;
Fig. 8 is a structural representation of wick involved in the present invention;
Fig. 9 is another structural representation of wick involved in the present invention;
" U " shape liquid sucting core structure schematic diagram that Figure 10 bends for thin slice involved in the present invention;
" V " shape liquid sucting core structure schematic diagram that Figure 11 bends for thin slice involved in the present invention;
" Ω " shape liquid sucting core structure schematic diagram that Figure 12 bends for thin slice involved in the present invention;
Figure 13 is the structural representation that has additional communicating pipe embodiment illustrated in fig. 2;
Figure 14 is the perspective view of second embodiment provided by the present invention;
Figure 15 is a mounting means schematic diagram of fin among second embodiment shown in Figure 14;
Figure 16 is another mounting means schematic diagram of fin among second embodiment shown in Figure 14;
Figure 17 is the front view of second embodiment shown in Figure 14;
Figure 18 is for setting up the structural representation of communicating pipe among second embodiment shown in Figure 14;
Figure 19 is the perspective view of the 3rd embodiment provided by the present invention;
Figure 20 is the sectional structure chart of the 4th embodiment provided by the present invention;
Figure 21 is the sectional structure chart of the 5th embodiment provided by the present invention.
Embodiment
Below, also the present invention is described in further detail in conjunction with the accompanying drawings by specific embodiment.
Embodiment one
Figure 2 shows that the external structure schematic diagram of a preferred embodiment provided by the present invention.It comprises an enclosed vacuum box body 10 that is used to absorb heat, and is filled with in the vacuum box body 10 to meet the heat vaporization, meets the liquid working substance (not shown) of condensation knot.On the surface of vacuum box body 10, erect and be installed with three vacuum heating panels 11 that be arranged in parallel.The bottom of vacuum heating panel 11 and vacuum box body 10 inner chambers connect.Crack between the vacuum heating panel 11 constitutes cooling channels.Also welding is provided with the fin 20 that is used to enlarge area of dissipation between vacuum heating panel 11.Fin 20 adopts the multi-disc dense arrangement to be arranged in the cooling channels.
Fixedly be coated with flow-stopping plate 30 respectively on two end faces of cooling channels, the width of this flow-stopping plate 30 is less than the width of end face, make between flow-stopping plate 30 and the vacuum box body 10 outlet 22 that forms cooling fluid, and make the top end face of cooling channels become the inlet 21 of cooling fluid.
The internal structure of present embodiment as shown in Figure 3.The inner surface of vacuum box body 10 be laid with can adsorptive liquid working medium 13 wick 40.Wick 40 can adopt welding or bonding mode to lay, and extend on the inwall of the vacuum heating panel 11 that is laid in, as shown in Figure 4, in the present embodiment, wick 40 extends to the inwall of both sides vacuum heating panel 11 from vacuum box body 10 inside bottom, and middle vacuum heating panel 11 inwalls do not lay.
Meeting when hot, liquid working substance 13 vaporizations are sent into heat in the vacuum heating panel 11, meet cold after, emit heat and be converted into liquid state and pass back in the vacuum box body 10.When the electronic equipment that present embodiment is installed is in to tilt or during inversion state, wick 40 can adsorptive liquid working medium 13, and it is delivered to heat absorbing end in the vacuum box body 10, thereby can not influence the operate as normal of present embodiment.
As Fig. 3, Fig. 4, the set-up mode of fin 20 is a flow direction of complying with cooling fluid.In being provided with, fin 20 is divided into upper and lower two sections settings, wherein, epimere vertically is provided with perpendicular to the inlet 21 of cooling fluid; Hypomere is perpendicular to outlet 22 horizontally sets of cooling fluid, and upper and lower two sections fins are non-intersect, forms the right angle.
Figure 5 shows that the user mode schematic diagram of present embodiment.In use, present embodiment is installed on the surface of integrated chip (as CPU), cooling fan 4 is installed at the top of vacuum heating panel.Cold wind direction of arrow in the figure enters cooling channels from top to bottom, and under the stopping of flow-stopping plate 30, cold wind is through turnover, and two outlets 22 of two routes discharge about being divided into.
In the present embodiment,, can increase auxiliary fin 201 between the every fin 20, fin partial structurtes signal as shown in Figure 6 for increasing area of dissipation and intensity.Auxiliary fin 201 usefulness scale coppers bending is made, and is welded between the fin 20.
Fin can also be made waveform, thereby increases area of dissipation, can also offer many group through holes and a plurality of upright thorn in the fin surface distributed.Causing turbulent flow when cold wind flows through, is that radiating effect is better.Do not set up auxiliary fin between the fin 20 among Fig. 3, but fin 20 is a waveform, and the surface is provided with a plurality of upright thorns 202.Being provided with of upright thorn 202 can be adopted and be offered the mode that through hole combines, and promptly when through hole is offered in punching press, the sheet metal that sweeps away dug and constitutes upright thorn.
Have additional auxiliary fin 201 (section fin, the auxiliary fin on the epimere fin is not shown) as follows between the fin 20 among Fig. 4.
For improving radiating efficiency, reduce thermal resistance, in the mill, that usually the wall of vacuum heating panel and vacuum box body is made is thinner relatively.For gaining in strength, stiffener can be set up in the present invention, as shown in Figure 7.In the present embodiment, the outline of stiffener 14 is identical with the interior cross sectional shape of vacuum box body 10 and vacuum heating panel 11, its circumferential perimeter is separately fixed on the inwall of vacuum box body 10 and vacuum heating panel 11, and one or more holes can be offered in its middle part, to guarantee flowing of liquid working substance.As required, can also set up multilayer stiffener 14.
Wick 40 of the present invention can be made various ways.Shown in Figure 8 is to adopt the folded composition of establishing of multiple layer metal silk screen 41 welding.Between the multiple layer metal silk screen 41 and itself have abundant space, can produce liquid adsorption effect preferably.
Shown in Figure 9 is the partial schematic diagram that adopts the porous wick of powder sintering process manufacturing, and this wick relies on its inner and surperficial micropore 42 to produce capillary forces, and liquid is adsorbed.
Shown in Figure 10 is that a kind of employing has the sheet metal of good heat conductive performance according to the shoestring wick of " U " font by back and forth being bent into continuously.Make and formed a plurality of " U " shape groove in this shoestring wick.Offer porose 43 in the foil surfaces of this shoestring wick.Hole 83 can be slotted hole or circular hole or the slit aperture that is convexly equipped with or is arranged with.This shoestring wick can be welded on the inwall of vacuum box body and vacuum heating panel.Compare with above-mentioned other wick, it not only has good capillary absorption affinity, simultaneously, owing to himself be exactly the good conductor of heat, therefore, in use, it can participate in heat conduction directly, and can be fast with heat to liquid working substance transmission at a distance, and carry out larger area vaporization heat radiation by its surperficial hole 43, therefore, it has better radiating effect than the porous wick of above-mentioned multiple layer metal silk screen wick, powder sintering process manufacturing.
Wick also can be made as shown in figure 11.Sheet metal is made by back and forth bending continuously according to " V " font; Also can make as shown in figure 12.Sheet metal is made by back and forth bending continuously according to " Ω " shape.In Figure 11, Figure 12, it is porose 43 that the surface of wick is all offered, and is used for liquid working substance by its surface vaporization.
By among hole 43 and Figure 10, Figure 11, Figure 12 respectively a plurality of " U " shape groove, a plurality of " V " shape groove and a plurality of " Ω " shape groove that form of nature can make easily liquid working substance within it portion extend.
For ease of vaporization, the extension of liquid working substance, can also be with the port closed of " U " shape groove, " V " shape groove and " Ω " shape groove.
The foregoing description can also be done further improvement, as shown in figure 13.Among the figure, be provided with two communicating pipe 15 at vacuum heating panel top, this communicating pipe 15 makes between the vacuum heating panel and is interconnected, and when heat radiation work, can make the isostasy of the gasifying liquid working medium in the vacuum heating panel top, thereby guarantee uniformly transfer heat.
Vacuum box body involved in the present invention can adopt the good made of heat conductivility, and its shape can be rectangle, also can see embodiment two for circular or other shapes.
Embodiment two
The structure of circular vacuum box body embodiment as shown in figure 14.Among the figure, vacuum box body 10 is circular, and vacuum heating panel 11 is that the center of circle is outwards with the setting of radiation form with vacuum box body 10 centre of surfaces.In the present embodiment, vacuum heating panel 11 is made into long and short two kinds of forms.Wherein, short vacuum heating panel 11 is arranged on the periphery near vacuum box body 10 circumference, makes the liquid working substance of the vaporization that enters vacuum heating panel 11 comparatively even.Flow-stopping plate 30 ring is arranged on vacuum heating panel 11 outer upper week, and the width of this flow-stopping plate 30 is less than the height of vacuum heating panel 11, make its with vacuum box body 10 between the outlet 22 of formation cooling fluid, and the top of vacuum heating panel 11 is the inlet 21 of cooling fluid.When installed at the top of vacuum heating panel 11 and start cooling fan to canyon, cold wind was discharged by outlet 22 after can blowing to vacuum box body 10 surfaces again.
In the present embodiment, being provided with of fin can be taked various ways, as Figure 15, shown in Figure 16.Fin 20 among Figure 15 adopts sheet metal to make, and is arranged between the vacuum heating panel 11 with concentrically ringed distribution mode.Fin 20 among Figure 16 is similar to vacuum heating panel 11, is arranged between short the vacuum heating panel 11 and center with the radiation form, then is welded with auxiliary fin 201 with the scale copper bending between the vacuum heating panel 11 and between vacuum heating panel 11 and the fin 20.
The fin of present embodiment also adopts the upper and lower segmentation set-up mode in the foregoing description, as shown in figure 17.The epimere (not shown) vertically is provided with perpendicular to the inlet 21 of cooling fluid; Hypomere is perpendicular to outlet 22 horizontally sets of cooling fluid, and upper and lower two sections fins are non-intersect in inside, forms the right angle.
Same as the previously described embodiments, for making the isostasy of the gasifying liquid working medium in the vacuum heating panel top, guarantee uniformly transfer heat, present embodiment also can be set up a connecting pipe, and its structure is as shown in figure 18.Communicating pipe 15 is circular, is connected across between the vacuum heating panel 11, makes each vacuum heating panel 11 internal pressure equilibrium.
The present invention can also make another kind of form, sees embodiment three.
Embodiment three
As shown in figure 19.The difference of present embodiment and embodiment one is: a shelves stream plate 30 fixedly covers on the top end face of cooling channels, i.e. the top of vacuum heating panel 11, make the end face of cooling channels form cooling fluid outlet 22, enter the mouth 21.Another difference is the horizontal one-part form setting of fin 20 whole employings, is arranged on the surface of vacuum heating panel 11 by its side welding.Arbitrary end in the end face of cooling channels can be installed cooling fan, and regardless of the blowing direction of cooling fan, being provided with all and the wind direction following current of fin 20.
Present embodiment can also be provided with the fin vertical parallel, the one side is welded on the surface of vacuum box body, opposite side is fixing by communicating pipe 15, and a plurality of thin-walled heat pipes of being made by metal material can also be set in the cooling channels of its formation, this thin-walled heat pipe passes fin and welds with fin, and its end is fixed on the surface of vacuum heating panel, this thin-walled heat pipe and vacuum heating panel internal run-through.
Embodiment four
Figure 20 is the structural representation of another embodiment provided by the present invention, this embodiment is identical with the general structure of the foregoing description one, its difference is: the lower surface of vacuum box body 10 offers a special use depression 101 that outside heat-generating electronic elements can be embedded, and the bottom surface of this special use depression 101 is the lower heat-conducting plate of thermal resistance 102.In use, the radiating surface of heat-generating electronic elements fits tightly the surface at heat-conducting plate 102.When vacuum box body 10 adopted plastic material to make, this mode can not reduce the heat conduction efficiency between heat-generating electronic elements and the vacuum box body 10, and helps large-scale mass production.
Embodiment five
Shown in Figure 21 is combine with large scale integrated chip preferable provided by the present invention
The example structure schematic diagram.
Present embodiment is provided with a perforate in the bottom of vacuum box body 10 on the basis of using for reference embodiment four, embed the device substrate 103 that is complementary with its size, the tight sealing-in in bottom surface of the periphery of this device substrate 103 and vacuum box body 10 in this perforate.
Device substrate 103 is positioned on the surface of vacuum box body 10 and is provided with integrated electronic circuit 104 in advance, and the lead-foot-line 105 of integrated electronic circuit 104 is arranged on the surface that device substrate 103 is positioned at vacuum box body 10 outsides.Liquid working substance in the vacuum box body 10 is an electrical insulating material, and compatible, electric compatible with integrated electronic circuit 104 chemistry.
Present embodiment directly is produced on integrated electronic circuit chip in the vacuum box body, thoroughly eliminated the influence of thermal resistance to heat radiation, thereby improved radiating efficiency to greatest extent, it will become following more extensive, the higher speed of service and reach one of direction of more high power integrated ciruit chip development, development.Moreover, present embodiment can also be used to make high power transistor, only needs the inner core of high power transistor directly is produced in the vacuum box body, just can efficiently distribute the heat that high power transistor produces when work.
It should be noted last that: above embodiment is the unrestricted technical scheme of the present invention in order to explanation only, although the present invention is had been described in detail with reference to the foregoing description, those of ordinary skill in the art is to be understood that: still can make amendment or be equal to replacement the present invention, and not breaking away from any modification or partial replacement of the spirit and scope of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (18)
1, a kind of outside water conservancy diversion integrated heat pipe radiator, it comprises an enclosed vacuum box body that is used to absorb heat, and erects on the surface of vacuum box body to be installed with more than one by the vacuum heating panel of bottom with the perforation of described vacuum box intracoelomic cavity; Crack between the vacuum heating panel constitutes cooling channels; Also welding is provided with the fin that is used to enlarge area of dissipation between the vacuum heating panel; Be filled with in the vacuum box body and meet the heat vaporization, meet the liquid working substance of condensation knot, it is characterized in that: be laid with on the inwall of the inner surface of described vacuum box body and described vacuum heating panel can adsorptive liquid wick; Fixedly be coated with flow-stopping plate on the end face of described cooling channels, the width of this flow-stopping plate makes the outlet that forms cooling fluid between flow-stopping plate and the vacuum box body less than the width of described end face; The top end face of described cooling channels is the inlet of cooling fluid; Described fin is arranged in the cooling channels along the flow direction of cooling fluid.
2, the outside according to claim 1 water conservancy diversion integrated heat pipe radiator is characterized in that: described vacuum box body is rectangle or circle or the hexagonal body that adopts the good made of heat conductivility.
3, the outside according to claim 1 and 2 water conservancy diversion integrated heat pipe radiator is characterized in that: described vacuum heating panel be arranged in parallel in described vacuum box surface or is that the center of circle is outwards with the setting of radiation form with center, described vacuum box surface.
4, the outside according to claim 1 water conservancy diversion integrated heat pipe radiator is characterized in that: described vacuum heating panel top also is provided with and makes the communicating pipe that is interconnected between the vacuum heating panel, this communicating pipe is one or one or more.
5, according to claim 1 or 2 or 4 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described fin is divided into upper and lower two sections settings, and wherein, epimere is perpendicular to the entrance face of described cooling fluid; The lower end is perpendicular to the exit end face of described cooling fluid, and upper and lower two sections fins are non-intersect.
6, the outside according to claim 1 water conservancy diversion integrated heat pipe radiator, it is characterized in that: described flow-stopping plate can also fixedly cover on the top end face of described cooling channels, makes the outlet or the inlet of the end face formation cooling fluid of described cooling channels; Described fin is arranged on the surface of described vacuum heating panel or vacuum box body by its side welding.
7, according to claim 1 or 2 or 4 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described wick is made up of multi-layer fiber mesh grid or folded the establishing of multiple layer metal silk screen, or adopts the powder sintered plate body made from micropore.
8, according to claim 1 or 2 or 4 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described wick is to be bent continuously or crooked made shoestring by reciprocal by metal or organic material thin slice; Described sheet surface is offered porose, and by welding or bonding being sticked on the inwall of described housing.
9, the outside according to claim 7 water conservancy diversion integrated heat pipe radiator, it is characterized in that: described shoestring, is made and forms a plurality of " U " shape groove or " V " shape groove or " Ω " shape groove in this shoestring according to " U " font or " V " font or " Ω " shape back and forth bends or bending is made by described thin slice.
10, according to claim 1 or 2 or 4 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: also be installed with one or more layers stiffener in the described vacuum box body, this stiffener stretches in the described vacuum heating panel, and its end face is fixedlyed connected with the inwall of vacuum box body and the inwall of vacuum heating panel.
11, according to claim 1 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: also be provided with the thin-walled heat pipe that one or more are made by metal material in the described cooling channels, this thin-walled heat pipe passes described fin, and with the welding of described fin, its end is fixed on the surface of vacuum heating panel or vacuum box body, and with described vacuum heating panel and vacuum box body internal run-through.
12, according to claim 1 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described fin is the waveform that sheet metal is made.
13, according to claim 1 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described fin is that sheet metal bends the radiating fin group that is constituted continuously according to " Z " font.
14, according to claim 1 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described fin surface offers the via hole that the described cooling fluid of more than one confession passes, perhaps the perpendicular upright thorn that can cause described cooling fluid turbulent flow that is provided with on its surface.
15, according to claim 1 or 6 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: also be welded with the auxiliary heat dissipation sheet that improves radiating efficiency between the described fin, this auxiliary heat dissipation sheet is along the flow direction setting of cooling fluid.
16, according to claim 1 or 2 or 4 or 6 or 8 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described vacuum box bottom is installed with one or more heat-conducting plates that can fit tightly with the radiating surface of outside heat-generating electronic elements, this heat-conducting plate embeds described vacuum box bottom, or is opened in the bottom surface that described vacuum box bottom is used to embed the special use depression of heat-generating electronic elements radiating surface.
17, the outside according to claim 15 water conservancy diversion integrated heat pipe radiator, it is characterized in that: described heat-conducting plate is rectangle or the circle of being made by the metallic plate with good heat conductive performance or organic soft board.
18, according to claim 1 or 2 or 4 or 6 or 8 described outside water conservancy diversion integrated heat pipe radiators, it is characterized in that: described vacuum box bottom also offers one or more perforate, embed the device substrate that is complementary with its size, the periphery of this device substrate and the tight sealing-in of vacuum box bottom in this perforate; The surface that described device substrate is positioned at described vacuum box body is provided with the inner core of integrated electronic circuit or electronic component; The lead-foot-line of the inner core of described integrated electronic circuit or electronic component is arranged on the surface that described device substrate is positioned at the external side of vacuum box; Described wick is on the inner core of electric insulation and be laid in described integrated electronic circuit or electronic component; Described liquid working substance is an electrical insulating material, and compatible with the inner core material chemistry of described integrated electronic circuit or electronic component, electric compatible.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100086598A CN100405588C (en) | 2004-03-16 | 2004-03-16 | Integrated heat-pipe radiator with outside diversion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100086598A CN100405588C (en) | 2004-03-16 | 2004-03-16 | Integrated heat-pipe radiator with outside diversion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1670950A true CN1670950A (en) | 2005-09-21 |
| CN100405588C CN100405588C (en) | 2008-07-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100086598A Expired - Fee Related CN100405588C (en) | 2004-03-16 | 2004-03-16 | Integrated heat-pipe radiator with outside diversion |
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| Country | Link |
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| CN (1) | CN100405588C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7699094B2 (en) | 2006-04-28 | 2010-04-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber heat sink |
| CN101065001B (en) * | 2006-04-28 | 2010-12-22 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN101288355B (en) * | 2005-10-13 | 2012-08-22 | 国际商业机器公司 | Rotatable liquid reservoir for computer cooling |
| CN108695578A (en) * | 2017-03-30 | 2018-10-23 | 罗伯特·博世有限公司 | Battery system |
| CN112710180A (en) * | 2019-10-25 | 2021-04-27 | Abb瑞士股份有限公司 | Steam chamber |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11289039A (en) * | 1998-04-02 | 1999-10-19 | Furukawa Electric Co Ltd:The | Heat pipe type cooler |
| CN2500070Y (en) * | 2001-08-03 | 2002-07-10 | 富准精密工业(深圳)有限公司 | Radiator device |
| US6588498B1 (en) * | 2002-07-18 | 2003-07-08 | Delphi Technologies, Inc. | Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
| CN2727966Y (en) * | 2004-03-17 | 2005-09-21 | 杨洪武 | Outboard diversion integrated heat pipe radiator |
-
2004
- 2004-03-16 CN CNB2004100086598A patent/CN100405588C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101288355B (en) * | 2005-10-13 | 2012-08-22 | 国际商业机器公司 | Rotatable liquid reservoir for computer cooling |
| US7699094B2 (en) | 2006-04-28 | 2010-04-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber heat sink |
| CN101065001B (en) * | 2006-04-28 | 2010-12-22 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN108695578A (en) * | 2017-03-30 | 2018-10-23 | 罗伯特·博世有限公司 | Battery system |
| CN112710180A (en) * | 2019-10-25 | 2021-04-27 | Abb瑞士股份有限公司 | Steam chamber |
| EP3813098A1 (en) * | 2019-10-25 | 2021-04-28 | ABB Schweiz AG | Vapor chamber |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100405588C (en) | 2008-07-23 |
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