KR200263467Y1 - Device for heat dissipation using thermal base in communication equipment - Google Patents

Abstract

The present invention relates to a heat dissipation device for communication equipment having a thermal base that is installed to heat the high temperature heat generated from a printed circuit board or amplifier for communication equipment to the outside, the thermal base is a vacuum inside the body And a predetermined refrigerant inside the body, and a wick which is the refrigerant circulation passage on one surface of the inside, and a temperature difference between a portion (evaporation portion) receiving heat of the wick and a portion (condensation portion) not receiving the wick. Induce cooling to cause phase change.

Description

Heat-dissipating device for communication equipment using thermal base {DEVICE FOR HEAT DISSIPATION USING THERMAL BASE IN COMMUNICATION EQUIPMENT}

The present invention is used for various communication equipments such as mobile communication base stations and repeaters (for example, HPA, LPA, etc.) in which various printed circuit boards and amplifiers are mounted in self-contained or outdoor enclosures. The present invention relates to a heat dissipation device, and more particularly, to a heat dissipation device for communication equipment using a thermal base for efficiently dissipating heat generated from a high heat generating element or an amplifier mounted on the printed circuit board.

In recent years, due to the development of the electronics industry, due to the high integration of circuits and the miniaturization of equipment, electronic function groups are more closely installed on printed board assemblies (PBAs), and more functions are provided. As a result, the power consumption is increased. This means that the electronic components installed on the printed circuit board generate high temperature heat, and have a significant influence on the reliability of the device.

Therefore, a device for dispersing and dissipating heat generated inside the device is inevitably required in order to maintain an environment suitable for use characteristics of each electronic component used in the device. Some thermostats, such as fans, allow natural air circulation. This is because the pre-installed heat dissipation device is unable to fulfill the control room, and according to the high heat generation and miniaturization trend of the system, a larger and expensive air temperature control device is required.

The heat dissipation technology applied in the conventional HPA, LPA, optical repeater, etc., insulates the heat sink itself or a heat pipe into the heat sink to contact the outside air to dissipate heat generated from the high heat generating parts. Most of the heat dissipation was generated inside the equipment to the outside.

However, the structure as described above has a problem that affects the peripheral parts according to the conduction of heat, and in most cases, the problem of not being effective heat dissipation due to the resistance of the heat transfer process, the restriction of the direction of heat dissipation.

In order to solve the above problems, an object of the present invention is to provide a heat dissipation device for communication equipment using a thermal base configured to efficiently dissipate and dissipate heat emitted from a high heat generating element without limitation of position and direction. It is.

Another object of the present invention is to provide a heat dissipation device for communication equipment using a thermal base configured to perform efficient heat dissipation by improving the structure of the cooling fins.

In accordance with the above object, the present invention is a heat dissipation device for communication equipment having a thermal base which is installed to dissipate high temperature heat generated from a printed circuit board or amplifier for communication equipment to the outside, the thermal base is inside the body Is maintained in a vacuum, and a predetermined coolant is attached to the inside of the body and a wick which is the refrigerant circulation passage on one surface of the inside, so that the heat (evaporation part) and the non-condensing part (heat) of the wick are received. It is characterized by inducing a cooling action by causing a phase change due to the temperature difference.

1 is an exploded perspective view of a heat dissipation device consisting of a thermal base and a cooling fin according to an embodiment of the present invention.

Figure 2 is an exploded perspective view showing a coupling structure between the heat sink and the body according to an embodiment of the present invention.

3 is a cross-sectional view showing the configuration of a heat radiation device according to an embodiment of the present invention.

<Description of Major Symbols in Drawing>

10: heat sink 11: thermal base

12: wick 13: refrigerant

30: cooling fin

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. And, if it is determined that the subject matter of the present invention may be unnecessarily obscured, detailed description thereof will be omitted.

According to the present invention, the inside of the thermal base is formed in a vacuum, and a wick including a predetermined refrigerant is formed so that the surface where the high temperature element is in contact causes vaporization to occur inside the other portion. By repeatedly performing the phenomenon that the gas formed by the tile phenomenon is condensed by the low temperature again, it was to perform a heat radiation action.

In addition, a predetermined plate is formed between the thermal base and a printed circuit board or an amplifier in order to protrude a portion of the thermal base that is in contact with the high temperature element and to form a surface with the protruding portion. A mold metallic body is provided. At this time, the body is formed with a predetermined hole into which the protruding portion can be inserted, so that the protruding portion of the thermal base is inserted smoothly. Therefore, the high temperature heat is transmitted only to the protruding portion, and the other portions are not conductive so that the heat is not conducted to the surrounding elements.

In addition, since the cooling fin has a maximum adhesive surface area with the thermal base, efficient heat dissipation to the outside can be performed.

1 is an exploded perspective view of a heat dissipation device composed of a thermal base and a cooling fin according to an embodiment of the present invention, Figure 2 is an exploded perspective view showing a coupling structure between the heat dissipation device and the body according to an embodiment of the present invention As a result, the thermal base 11 according to the present invention has a plurality of protruding portions 14 formed on a surface in contact with the printed circuit board 20 of FIG. 3. The protruding portion 14 corresponds to a portion of a high temperature heating element (21 in FIG. 3) on a printed circuit board or a portion in which an amplifier is located.

As shown in FIG. 2, a predetermined plate-shaped metallic body 15 is installed on the thermal base 11 before the printed circuit board is installed. The metallic body 15 has a hole 16 formed at a position corresponding to the protruding portion of the thermal base 11, so that the protruding portion 14 is inserted so that the printed circuit board is formed of the metallic body 15. Make sure it is a flat surface to be mounted on.

In addition, a cooling fin 30 of at least the same size as that of the surface of the thermal base 11 is attached to the rear surface of the thermal base 11. The cooling fin 30 is bent in a predetermined plate-like plate in a continuous "L" shape or a variety of forms attached to the surface of the thermal base (11). In this case, the cooling fins 30 may be fusion-bonded by a brazing method or solder cream.

3 is a cross-sectional view showing the configuration of the heat dissipation device 10 according to an embodiment of the present invention, the thermal base 11 according to the present invention is made of a predetermined metallic material, the interior of the predetermined space It is formed to have. In this case, the thermal base 11 may be formed of aluminum, copper, or the like having good thermal conductivity.

A wick 12 is attached to a surface of the thermal base 11 in contact with the printed circuit board 20, and a predetermined refrigerant 13 is included in the wick 12. For example, distilled water may be used as the refrigerant 13, and the distilled water may include an amount that can be absorbed by the wick 12. At this time, the inside of the thermal base 11 is to maintain a vacuum state.

On the surface in contact with the printed circuit board 20 of the thermal base 11, the plate-shaped body 15 is installed to coincide with the protruding portion 14 of the thermal base 11, the high temperature element ( A printed circuit board 20 having 21 is provided. (At this time, a portion of the thermal base coinciding with the high temperature element protrudes.)

The arrow shown in FIG. 3 shows the conduction direction of heat moving from the high temperature heating element to the thermal base and finally moving to the cooling fins. The high temperature heat released from the element 21 is transferred to the thermal base 11. At this time, in the part (evaporation part) of ① of the thermal base 11, vaporization phenomenon due to the high temperature heat is generated. The vaporized vapor is moved to the part (condensation part) of the periphery ②, where the condensation phenomenon is changed to liquid. The refrigerant 13, which caused the phase change to liquid in the ② part, is absorbed by the wick 12 again and moves to the ① part. At this time, the cooling fin 30 serves to cool and condense vaporized vapor by vaporization in the thermal base 11, and at the same time emits heat of high temperature applied to the thermal base 11 to the outside. Let's go. Thus, as described above, the evaporation to condensation, and the evaporation is repeated while releasing the conducted heat to the cooling fins 30.

On the other hand, it is obvious to those skilled in the art that the heat dissipation device according to the present invention can be applied to various electronic products as well as general communication devices.

The heat dissipation device according to the present invention has an effect of efficiently dissipating high-temperature heat generated from a printed circuit board or amplifier of a communication equipment to the outside by using a phase change due to a temperature difference of a refrigerant included in a thermal base. have.

Claims (4)

In the heat dissipation device for communication equipment having a thermal base which is installed to dissipate high temperature heat generated from a printed circuit board or amplifier for communication equipment to the outside, The thermal base is, The inside of the body is maintained in a vacuum, and a predetermined coolant is attached to the inside of the body and a wick, which is the refrigerant circulation passage, is attached on one surface of the inside, and the phase change due to the temperature difference between the heat receiving portion and the non-heating portion of the wick. Radiating device for communication equipment using a thermal base, characterized in that to induce a cooling action. The method of claim 1, Phase change of the wick is a heat generating device for communication equipment using a thermal base, characterized in that the vaporization action occurs in the high heat generating element portion, condensation action occurs in other portions. The method of claim 1, Radiating device for a communication equipment using a thermal base on the back of the thermal base is characterized in that the cooling fins are bent in a continuous "d" shape of a predetermined metal plate is attached. The method of claim 3, wherein The cooling fin is a heat dissipation device for communication equipment using a thermal base, characterized in that the fusion bonding by brazing (brazing) method or solder cream (solder cream).