JP2017110891A - Heat radiation module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin and light-weight heat radiation module excellent in heat radiation performance.SOLUTION: Provided is a heat radiation module that includes a heat pipe including: a metal plate having a first surface, a second surface on an opposite side to the first surface and an open hole penetrating from the first surface to the second surface; a hollow container; and a wick stored in the container. The container is engaged to the open hole so as to prevent falling-out from the metal plate, and the container is exposed from the second surface of the metal plate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat dissipation module.

In a portable electronic device represented by a smartphone, a large number of electronic components are accommodated in a limited space. In order for each electronic component to operate normally, it is necessary to dissipate the heat generated by each electronic component in the device.
FIG. 7 is a cross-sectional view schematically showing an example of the structure of the portable electronic device 100. In a space between the U-shaped casing 11 and the display device 12 fixed to the casing 11, a printed circuit board (PCB), a heating element 14 such as a CPU mounted on the printed circuit board, a battery 15, Is housed.
The heating element 14 is a heating element such as a CPU integrated with high density. In the portable electronic device 100 of FIG. 7, the space around the heating element 14 that is a heating element is limited. In particular, the distance h1 between the upper surface 14t of the heating element 14 and the back surface 12b of the display device 12 and the distance h2 between the upper surface 15t of the battery 15 and the upper surface 14t of the heating element 14 are very limited.

  In order to dissipate heat generated by a heating element such as a CPU in such a limited space, a heat dissipation module in which a metal plate and a graphite sheet are combined is often used. In addition, an extremely thin heat pipe may be used.

  Patent Document 1 discloses a heat transfer means including only a heat pipe that is in direct contact with an upper surface of a heating element such as a CPU, a heat pipe that is arranged apart from the heating element, the heat pipe, and the heating element. There is disclosed a heat transfer means comprising a heat receiving plate that is in close contact with the upper surface.

JP 2014-165596 A

A heat dissipation module combining a metal plate and a graphite sheet is thin and lightweight and can be arranged from the heating element to the upper surface of the battery, but sufficient heat dissipation performance may not be obtained.
A heat dissipation module using an ultra-thin heat pipe can be placed from the heating element to the top surface of the battery, and is cheaper than a component using a graphite sheet, but because of its thickness (capacity) In some cases, sufficient heat dissipation performance cannot be obtained. If the width is the same, the heat dissipation performance of the heat pipe decreases as the thickness decreases.

The heat transfer means consisting only of the heat pipe that is in direct contact with the upper surface of the heating element can be arranged from the heating element to the upper surface of the battery, and is less expensive than a component using a graphite sheet. Since there is no heat receiving body through which the heat received is diffused, sufficient heat dissipation performance may not be obtained.
Heat transfer means consisting of a heat pipe arranged apart from the side of the heating element and a heat receiving plate in close contact with the heat pipe and the upper surface of the heating element is less expensive than a component using a graphite sheet. Since the heat pipe cannot be disposed so as to be in direct thermal contact with the upper surface of the heating element, sufficient heat dissipation performance may not be obtained. Moreover, it cannot be applied to an electronic device having no space for arranging a heat pipe on the side of the heating element.

  In particular, in portable electronic devices where electronic components are being mounted at higher density, such as smartphones, there is a demand for heat dissipation modules that are thin and have excellent heat dissipation performance.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide a heat dissipation module that is thin and has excellent heat dissipation performance.

  (1) A heat dissipation module according to an aspect of the present invention includes a first surface, a second surface opposite to the first surface, and a through hole penetrating from the first surface to the second surface. A heat pipe including a metal plate, a hollow container, and a wick accommodated in the container, and the container is engaged with the through hole so as not to fall off the metal plate. The container is exposed from the second surface of the metal plate.

(2) In the heat dissipation module according to (1), the container may protrude from a second surface of the metal plate.
(3) In the heat dissipation module according to (1) or (2), the through hole has a width smaller than a width of the first hole and the first hole, and the first hole A second hole communicating with the hole, wherein the metal plate has an intermediate surface formed between the first hole and the second hole, and the container is formed of the metal plate. The container may have a lip portion that contacts the intermediate surface, and at least a part of the container may be accommodated in the first hole and the second hole.
(4) In the heat dissipation module according to (1) or (2), the through hole includes a third hole whose width gradually decreases from the first surface toward the second surface, At least a part of the container may be fitted in the third hole.

  According to the aspect of the present invention, it is possible to provide a heat dissipation module that is thin and has excellent heat dissipation performance.

It is sectional drawing which shows typically the cross section of the electronic device to which the thermal radiation module which concerns on one Embodiment is applied. It is a top view which shows the positional relationship of the thermal radiation module which concerns on one Embodiment, a heat generating body, and a battery. It is sectional drawing which shows typically the contact with the thermal radiation module and heating element which concern on one Embodiment distribute | arranged in the electronic device. It is sectional drawing which shows typically the cross section of the metal plate of the thermal radiation module which concerns on one Embodiment. It is sectional drawing which shows typically the cross section of the heat pipe of the thermal radiation module which concerns on one Embodiment. It is sectional drawing which shows typically the contact with the thermal radiation module and heat generating body which concern on the other example distribute | arranged in the electronic device. It is sectional drawing which shows an example of the structure of an electronic device typically.

  Hereinafter, a heat dissipation module according to an embodiment of the present invention will be described with reference to the drawings. In the drawings, for convenience of explanation, some parts are enlarged or omitted, but the dimensional ratios of the components shown in the drawings are not necessarily the same as the actual ones.

  FIG. 1 is a cross-sectional view showing an example of the structure of an electronic device and an example in which the heat dissipation module according to the present embodiment is applied to an electronic device 10 having this structure.

The electronic device 10 includes a U-shaped housing 11 having an opening, a display device 12 fixed to the housing 11 so as to close the opening of the housing 11, and a space between the housing 11 and the display device 12. It contains a printed circuit board (PCB) 13, a heating element 14 mounted on the printed circuit board 13, and a battery 15.
The display device 12 is, for example, a liquid crystal panel module or an organic EL panel module. The heating element 14 is, for example, a CPU (Central Processing Unit).

In the space between the upper surface 14t of the heating element 14 and the back surface 12b of the display device 12, and the space between the upper surface 15t of the battery 15 and the back surface 12b of the display device 12, the heat dissipation module 1 according to this embodiment is arranged. Has been. As an example, the distance between the upper surface 14t of the heating element 14 and the rear surface 12b of the display device 12 is 0.40 mm.
Note that the heat dissipation module 1 is not limited to the electronic device 10 illustrated in FIG. 1, and can be applied to any electronic device having a similar spatial restriction.

The heat dissipation module 1 includes a metal plate 2 having a first surface 2a and a second surface 2b opposite to the first surface 2a, and a heat pipe 3 engaged with the metal plate 2. In the example of FIG. 1, the first surface 2 a is in contact with the back surface 12 b of the display device 12, and the second surface 2 b is opposed to the heating element 14 and the battery 15. The heat pipe 3 is in direct thermal contact with the heating element 14. “Directly in thermal contact” means that they are in thermal contact without interposing another element such as a metal plate that is substantially responsible for heat dissipation.
In order to ensure the contact between the heat pipe 3 and the heating element 14, grease, an adhesive, or the like is arranged between the heat pipe 3 and the heating element 14 so as not to substantially impede the thermal contact. Also good. It should be noted that interposing an auxiliary material for such contact does not mean a departure from “direct thermal contact”.

  As illustrated in FIG. 4, the metal plate 2 has a through hole 2 c that penetrates from the first surface 2 a to the second surface 2 b. Examples of the material of the metal plate 2 include, but are not limited to, copper, aluminum, stainless steel, magnesium, and the like. An appropriate metal plate can be used according to the rigidity, thermal conductivity, workability, etc. required for the metal plate 2. An example is a copper plate having a thickness of 0.20 mm. Or you may use the board which combined the stainless steel plate and the graphite sheet (graphene) as the metal plate 2 from a rigid, lightweight, and heat conductive viewpoint.

  As illustrated in FIG. 5, the heat pipe 3 includes a hollow container 4 and a wick 5 accommodated in the container 4. The container 4 is sealed, and a working fluid is placed in the container 4. The material of the container 4 can be appropriately selected from known metal materials depending on conditions such as the type of working fluid and the operating temperature. In particular, when a metal material having high thermal conductivity such as copper or aluminum is used, high heat transportability and high thermal diffusivity can be obtained. As an example, a heat pipe 3 having a thickness of 0.40 mm using a copper container 4 may be mentioned.

  As illustrated in FIG. 5, the wick 5 is disposed on the inner wall surface 4 f of the container 4 along the longitudinal direction of the container 4. As an example of the material of the wick, a metal ultrafine wire fiber, a metal mesh, and a sintered body of metal powder can be given. The gas-phase working fluid can circulate in the space in the container 4 where the wick 5 is not provided. On the other hand, the liquid-phase working fluid can move along the wick 5 by capillary action.

In the example of FIG. 1, one end (evaporating part) of the heat pipe 3 is in direct thermal contact with the metal plate 2 and the heating element 14. The heat generated by the heating element 14 is recovered by evaporating the liquid-phase working fluid and transferring it to a gas-phase working fluid in the evaporation section of the heat pipe 3. The gas phase working fluid flows through the space in the container 4 toward the other end (condensing part) of the heat pipe 3, is condensed, and returns to the liquid phase working fluid. The liquid-phase working fluid travels through the wick 5 by capillary action and moves to the evaporation section.
Thus, the heat pipe 3 can repeatedly transport the heat recovered in the evaporation unit to the condensing unit by repeatedly using the liquid phase / gas phase transition of the working fluid. Moreover, since the heat pipe 3 engages with the metal plate 2 and is in direct thermal contact, the heat recovered by the heat pipe 3 can be dissipated more efficiently.

  FIG. 3 is a cross-sectional view schematically showing contact between the heat dissipating module 1 and the heat generating element 14 disposed in the electronic device 10 including the display device 12 and the heat generating element 14. In the example of this figure, the display device 12 and the heat dissipation module 1 are in direct contact, but the display device 12 and the heat dissipation module 1 may not be in direct contact depending on the design of the electronic device.

As illustrated in FIG. 3, the container 4 is engaged with the through hole 2 c so as not to drop off the metal plate 2. In particular, when the metal plate 2 is arranged so that the second surface 2b is below the first surface 2a in the direction of gravity, the metal plate 2 and the container 4 Are engaged with each other.
Therefore, the movement of the heat pipe 3 relative to the metal plate 2 is restricted. As a result, in the electronic device 10, direct thermal contact between the metal plate 2 and the heat pipe 3 and direct thermal contact between the heat pipe 3 and the heating element 14 can be ensured.

The container 4 has the 1st surface 4a and the 2nd surface 4b on the opposite side to the 1st surface 4a so that it may illustrate in FIG. The first surface 4 a may be flush with the first surface 2 a of the metal plate 2.
In this case, in the electronic device in which the first surface 2a of the metal plate 2 is in contact with the back surface 12b of the display device 12, the thickness is substantially equal to the distance between the back surface 12b of the display device 12 and the upper surface 14t of the heating element 14. The heat pipe 3 which has can be used. That is, the thickness (capacity) of the container 4 (heat pipe 3) can be maximized in the space between the back surface 12b of the display device 12 and the upper surface 14t of the heating element 14 in the electronic device 10.
Even when the back surface 12b of the display device 12 and the first surface 2a of the metal plate 2 are not in direct contact with each other due to the design of the electronic device, the capacity of the heat pipe 3 can be maximized.
If the width is the same, the heat dissipation performance of the heat pipe increases as the thickness increases. Therefore, the heat dissipation module 1 with higher cooling performance can be provided.
Further, since the flatness of the first surface 2a of the metal plate 2 can be ensured, in the electronic device in which the first surface 2a of the metal plate 2 is in contact with the back surface 12b of the display device 12, the smooth operation of the display device 12 functioning as a touch panel is performed. Can be secured.
The first surface 4 a may be in a position recessed from the first surface 2 a of the metal plate 2. Even in this case, direct thermal contact between the metal plate 2 and the heat pipe 3 and direct thermal contact between the heat pipe 3 and the heating element 14 can be ensured. The second surface 4b of the container 4 is arranged at an appropriate position according to the characteristics required for the heat radiation module 1, such as the weight, heat recovery efficiency, in-plane thermal diffusivity, and the shape of the heating element 14. Can do.

  As illustrated in FIG. 3, the container 4 is exposed from the second surface 2 b of the metal plate 2. Therefore, the heat pipe 3 can be directly brought into thermal contact with the heating element 14 and can directly recover the heat generated in the heating element 14. For this reason, the heat generated in the heating element 14 can be efficiently dissipated.

  The container 4 (second surface 4b) may protrude from the second surface 2b of the metal plate 2 as illustrated in FIG. In this case, the thickness of the metal plate 2 can be relatively reduced, and the thickness of the heat pipe 3 can be increased (that is, the capacity of the heat pipe 3 can be increased).

For example, the heat pipe 3 having a thickness substantially equal to the distance between the back surface 12b of the display device 12 and the top surface 14t of the heating element 14, and a strength that can withstand mounting on the electronic device 10 can be secured, and The heat radiation module 1 including the metal plate 2 that is thin enough to ensure the engagement between the metal plate 2 and the heat pipe 3 can be realized.
In this case, the metal plate 2 can be thinned while ensuring direct thermal contact between the heat pipe 3 and the heating element 14. As a result, the heat dissipation module 1 can be reduced in weight, and the heat dissipation module 1 with higher cooling performance can be provided.

Note that the second surface 4 b of the container 4 may be flush with the second surface 2 b of the metal plate 2. When an auxiliary material such as grease is disposed between the second surface 4b and the upper surface 14t of the heating element 14, the second surface 4b is separated from the second surface 2b of the metal plate 2 by the thickness of the auxiliary material. It may be in a recessed position. The second surface 4b of the container 4 is arranged at an appropriate position according to the characteristics required for the heat radiation module 1, such as the weight, heat recovery efficiency, in-plane thermal diffusivity, and the shape of the heating element 14. Can do.
Although the heat dissipation module 1 illustrated in FIG. 3 includes one heat pipe 3, the heat dissipation module 1 may include a plurality of heat pipes 3 depending on the configuration of the electronic device to which the heat dissipation module 1 is applied.

As illustrated in FIG. 5, the wick 5 may be disposed at a position closer to the second surface 4 b in the container 4. Since the wick 5 includes a liquid-phase working fluid, the heating element 14 is formed by evaporation of the working fluid by disposing the wick 5 in the electronic device 10 at a position closer to the second surface 4b in contact with the heating element 14. The heat recovery from can be performed more efficiently.
However, the position of the wick 5 in the container 4 can be appropriately determined according to the electronic device to which the heat dissipation module 1 is applied. For example, the wick 5 may be arranged on the entire inner wall surface of the container 4 in a cross section perpendicular to the longitudinal direction of the container 4.

  In the heat dissipation module in which the heat pipe is embedded in the metal plate so that only the surface facing the heating element is exposed using a metal plate thicker than the heat pipe thickness compared to the heat dissipation module 1 according to the present embodiment. The thickness of the metal plate increases the total weight of the heat dissipation module and increases the occupied space in the electronic device. Furthermore, due to the presence of the metal plate between the heat pipe and the display device 12, the thickness of the heat pipe is limited, and the cooling performance of the heat dissipation module is degraded.

On the other hand, according to the heat dissipation module 1 according to the present embodiment, both surfaces of the heat pipe 3 engaging with the metal plate 2 (that is, the first surface 4a and the second surface 4b) are exposed from the metal plate 2, While securing the heat pipe 3 to the metal plate 2, the maximum thickness of the heat pipe 3 (container 4) in the space between the back surface 12 b of the display device 12 and the upper surface 14 t of the heating element 14 in the electronic device 10. Can be That is, the capacity of the heat pipe 3 can be maximized. Therefore, the heat dissipation module 1 with higher cooling performance can be provided.
Furthermore, since the thickness of the metal plate 2 can be reduced as long as the strength to withstand mounting on the electronic device 10 and the fixing of the metal plate 2 and the heat pipe 3 can be ensured, it is lighter, and The heat dissipation module 1 that occupies less space in the electronic device can be provided.
In particular, the heat dissipation module 1 described above has a significant effect on an electronic device in which the gap in which the heat dissipation module can be disposed (that is, the gap between the main heat generating surface of the heat generating element 14 and the element above it) is sub-millimeters. Play.

  Hereinafter, an example of the structure of the metal plate 2 and the heat pipe 3 that can be engaged with each other will be described in detail with reference to FIGS. 4 and 5. In addition, about the element which has a left-right symmetric structure in a figure, only one of the left-right structure is demonstrated, and description about the other may be abbreviate | omitted. However, as long as the same effect is obtained, these elements do not necessarily have a symmetrical structure.

  The metal plate 2 illustrated in FIG. 4 includes a first surface 2a, a second surface 2b opposite to the first surface 2a, a through hole 2c penetrating from the first surface 2a to the second surface 2b, Have The through hole 2c includes a first hole 2d having a width w1 and a second hole 2e having a width w2 smaller than the width w1 and communicating with the first hole 2d. The through hole 2c illustrated in FIG. 4 has a hat shape in the cross section.

In the example of FIG. 2, the through hole 2 c including the first hole 2 d and the second hole 2 e is provided in a region corresponding to a region where the heat pipe 3 is arranged.
The width w1 and the width w2 may be appropriately determined so that the through hole 2c and the container 4 of the heat pipe 3 are engaged. Since the width w1 and the width w2 are different, a step (intermediate surface 2f) is formed between the first hole 2d and the second hole 2e. That is, the metal plate 2 has an intermediate surface 2f formed between the first hole 2d and the second hole 2e. As an example, the depth of the first hole 2d is 0.15 mm, and the depth of the second hole 2e is 0.05 mm.

The heat pipe 3 having the container 4 having a shape corresponding to the shape of the first hole 2 d and the second hole 2 e can be engaged with the metal plate 2. In particular, when the metal plate 2 is disposed so that the second surface 2b is lower than the first surface 2a in the direction of gravity, an intermediate formed between the first hole 2d and the second hole 2e. Since the container 4 (a lip portion 41 described later) is caught on the surface 2f, the heat pipe 3 can be prevented from falling off the metal plate 2.
The hat-shaped through hole 2c including the first hole 2d and the second hole 2e as described above can be obtained, for example, by performing two-stage cutting on a metal plate.

The heat pipe 3 illustrated in FIG. 5 includes a hollow container 4 and a wick 5 accommodated in the container 4. As illustrated in FIG. 5, the container 4 includes a lip portion 41 configured to be able to contact the intermediate surface 2 f of the metal plate 2. At least a part of the container 4 is configured to be accommodated in the first hole 2d and the second hole 2e.
More specifically, the container 4 includes a first surface 4a having a width w3, a second surface 4b having a width w4 opposite to the first surface 4a and smaller than the width w3, and a first surface 4a. A first side surface 4c extending from the end toward the plane including the second surface 4b, a second side surface 4e extending from the end of the second surface 4b toward the plane including the second surface 4b, the first side surface 4c and the second And an intermediate surface 4d connecting the side surface 4e. The container 4 illustrated in FIG. 5 has a hat shape in the cross section.
As an example, a container in which w3 is 5 mm, the length (one side) of the lip 41 is 0.4 mm, the thickness of the lip 41 is 0.15 mm, and the total thickness is 0.40 mm.

The lip portion 41 is a portion of the container 4 that extends outward from the second side surface 4e, and includes a first side surface 4c and an intermediate surface 4d. When the intermediate surface 4d of the container 4 abuts on the intermediate surface 2f of the metal plate 2, the heat pipe 3 and the metal plate 2 are engaged with each other.
The hat-shaped heat pipe 3 (container 4) as described above is, for example, a female metal for providing a hat shape in a cross section perpendicular to the longitudinal direction of the container by disposing the wick 5 in a substantially cylindrical hollow container. It can be obtained by pressing the container using a mold.

The length of the heat pipe 3 can be appropriately determined according to the heat dissipation performance required for the heat dissipation module 1.
The lip portion 41 may be formed over the entire length in the length direction of the container 4 or may be partially formed. For example, referring to FIG. 1, the lip portion 41 is formed in a portion disposed between the upper surface 14t of the heating element 14 and the back surface 12b of the display device 12, and the lip portion 41 is not formed in other portions. Also good.

  In the metal plate 2 and the heat pipe 3 that are engaged with each other as illustrated in FIGS. 4 and 5, the width w1 of the first hole 2d of the metal plate 2 and the second hole 2e of the metal plate 2 The width w2, the width w3 of the first surface 4a of the container 4, and the width w4 of the second surface 4b of the container 4 satisfy the relationship of w1 ≧ w3, w3> w2, and w2 ≧ w4.

When w1 = w3 and w2 = w4 are satisfied, that is, the side wall of the first hole 2d of the metal plate 2 is in contact with the first side surface 4c of the container 4 and the second hole 2e of the metal plate 2 When the side wall and the second side surface 4e of the container 4 abut, the metal plate 2 and the heat pipe 3 are most stably engaged with each other, and the contact area between the metal plate 2 and the heat pipe 3 is maximized. In this case, it is possible to more reliably prevent the heat pipe 3 from falling off the metal plate 2, and furthermore, the heat recovered by the heat pipe 3 can be more efficiently diffused to the metal plate 2.
The heat dissipation module using the hat-shaped engagement as described above is more advantageous than the later-described modification in terms of the size of the contact area and the fixing property of the heat pipe to the metal plate.

  The metal plate 2 and the heat pipe 3 may be designed so as to satisfy w1> w3 or w2> w4. In this case, the efficiency of the operation | work which engages the metal plate 2 and the heat pipe 3 can be improved. Moreover, even when the processing accuracy of the through hole 2c of the metal plate 2 and the container 4 of the heat pipe 3 is not high, the metal plate 2 and the heat pipe 3 can be more easily engaged.

  It should be noted that solder is not applied to the portion where the heat pipe 3 and the metal plate 2 are in contact (more specifically, the portion where the intermediate surface 2f and the intermediate surface 4d are in contact with each other). Or an adhesive may be provided. In this case, the heat pipe 3 can be fixed to the metal plate 2 more reliably.

<Modification>
A modification of the heat dissipation module including a metal plate and a heat pipe that can be engaged with each other will be described with reference to FIG. Description of elements having the same structure as described above is omitted.
FIG. 6 is a cross-sectional view schematically showing the contact between the heat radiating module 21 and the heat radiating module 21 arranged in the electronic device 10 including the display device 12 and the heat radiating element 14. In the example of this figure, the display device 12 and the heat dissipation module 21 are in direct contact, but the display device 12 and the heat dissipation module 21 may not be in direct contact depending on the design of the electronic device.
The heat dissipation module 21 illustrated in FIG. 6 includes a metal plate 22 and a heat pipe 23. The heat pipe 23 is in direct thermal contact with the heating element 14. Grease and an adhesive may be disposed between the heat pipe 23 and the heating element 14 so as not to substantially hinder these thermal contacts.

The metal plate 22 has the same structure as the metal plate 2 shown in FIG. 4 except for the cross-sectional shape of the through hole. The through hole 22c of the metal plate 22 includes a third hole 22f whose width gradually decreases from the first surface 22a toward the second surface 22b. That is, the inner wall is formed between the first surface 2a and the second surface 2b of the metal plate 22 so that the opening area of the third hole 22f gradually decreases from the first surface 2a to the second surface 2b. Yes. The through hole 22c illustrated in FIG. 6 has a trapezoidal shape in the cross section.
The trapezoidal through hole 22c including the third hole 22f as described above is obtained by, for example, cutting the metal plate so that the opening area gradually decreases in the thickness direction of the metal plate 22. Can be obtained.

The heat pipe 23 has the same structure as the heat pipe 3 shown in FIG. 5 except for the cross-sectional shape of the container. The container 24 of the heat pipe 23 has a first surface 24a, a second surface 24b opposite to the first surface 24a, and a side surface 24g connecting the end of the first surface 24a and the end of the second surface 24b. doing. The width of the first surface 24a is larger than the width of the second surface 24b, and therefore the side surface 24g is inclined with respect to the first surface 24a and the second surface 24b. The container 24 illustrated in FIG. 6 has a trapezoidal shape in the cross section.
The heat pipe 23 is in direct thermal contact with the heating element 14 on the second surface 24b.
The trapezoidal heat pipe 23 (container 24) as described above is, for example, a female metal for providing the trapezoidal shape in a cross section perpendicular to the longitudinal direction of the container by disposing the wick 5 in a substantially cylindrical hollow container. It can be obtained by pressing the container using a mold.
The heat pipe 23 (container 24) having a trapezoidal cross section is more advantageous than the heat pipe 3 having a hat shape in cross section described above in terms of the capacity of the container.

  In the heat dissipation module 21 including the metal plate 22 and the heat pipe 23 as described above, at least a part of the container 24 is fitted in the third hole 22 f of the metal plate 22. Therefore, according to the heat dissipation module 21, it is possible to prevent the heat pipe 23 from falling off the metal plate 22, similarly to the heat dissipation module 1 illustrated in FIG. 3. Further, the structure of the metal plate 22 and the heat pipe 23 of the heat dissipation module 21 is simpler than the structure of the heat pipe 3 having the hat-shaped container 4 and the metal plate 2 having the hat-shaped through-hole described above. The processing process of a board and a heat pipe can be simplified.

As illustrated in FIG. 6, in the heat dissipation module 21, the entire side wall of the third hole 22 f of the metal plate 22 may be in contact with the side surface 24 g of the container 24.
In this case, since the metal plate 22 and the heat pipe 23 are more stably engaged with each other, it is possible to more reliably prevent the heat pipe 23 from falling off the metal plate 22.

In addition, as illustrated in FIG. 6, the first surface 24 a of the container 24 is flush with the first surface 22 a of the metal plate 22, and the through hole 22 c in the first surface 22 a of the metal plate 22. The width and the width of the first surface 24a of the container 24 may be the same.
In this case, in the electronic device in which the first surface 22 a of the metal plate 22 is in contact with the back surface 12 b of the display device 12, the space between the back surface 12 b of the display device 12 in contact with the first surface 22 a of the metal plate 22 and the upper surface 14 t of the heating element 14. It is possible to use a heat pipe 23 having a thickness substantially equal to this distance. That is, the thickness of the heat pipe 23 can be maximized in the space between the back surface 12 b of the display device 12 and the upper surface 14 t of the heating element 14 in the electronic device 10. Even when the back surface 12b of the display device 12 and the first surface 22a of the metal plate 22 are not in direct contact due to the design of the electronic device, the capacity of the heat pipe 23 can be maximized.
Therefore, the heat radiation module 21 with higher cooling performance can be provided.
The first surface 24 a may be in a position recessed from the first surface 22 a of the metal plate 22. Even in this case, direct thermal contact between the metal plate 22 and the heat pipe 23 and direct thermal contact between the heat pipe 23 and the heating element 14 can be ensured. The second surface 24b of the container 24 is arranged at an appropriate position according to characteristics required for the heat radiation module 21, such as weight, heat recovery efficiency, in-plane thermal diffusivity, and the shape of the heating element 14. Can do.

Moreover, since the flatness in the 1st surface 22a of the metal plate 22 is securable, the smooth operativity of the display device 12 which functions as a touch panel is securable.
Furthermore, since the contact area between the metal plate 22 and the heat pipe 23 becomes larger, the heat recovered by the heat pipe 23 can be diffused more efficiently into the metal plate 22. In particular, the above-described heat dissipation module 21 has a significant effect on an electronic device in which the gap in which the heat dissipation module can be disposed (that is, the gap between the main heat generating surface of the heat generating element 14 and the element above it) is sub-millimeters. Play.

The container 24 (second surface 24b) may protrude from the second surface 22b of the metal plate 22, as illustrated in FIG. In this case, the thickness of the metal plate 22 can be relatively reduced, and the thickness of the heat pipe 23 can be increased (that is, the capacity of the heat pipe 23 can be increased).
For this reason, while being able to implement | achieve weight reduction of the thermal radiation module 21, the thermal radiation module 21 with higher cooling performance can be provided.

For example, the heat pipe 23 having a thickness substantially equal to the distance between the back surface 12b of the display device 12 and the upper surface 14t of the heating element 14, and the strength capable of withstanding mounting on the electronic device 10 can be secured, and The heat radiation module 21 including the metal plate 22 that is thin enough to ensure the engagement between the metal plate 22 and the heat pipe 23 can be realized.
In this case, the metal plate 22 can be thinned while ensuring direct thermal contact between the heat pipe 23 and the heating element 14. As a result, the heat dissipation module 21 can be reduced in weight, and the heat dissipation module 21 with higher cooling performance can be provided.

  The second surface 24 b of the container 24 may be flush with the second surface 22 b of the metal plate 22. When an auxiliary material such as grease is disposed between the second surface 24 b and the upper surface 14 t of the heating element 14, the second surface 24 b is separated from the second surface 22 b of the metal plate 22 by the thickness of the auxiliary material. It may be in a recessed position. The second surface 24b of the container 24 is arranged at an appropriate position according to characteristics required for the heat radiation module 21, such as weight, heat recovery efficiency, in-plane thermal diffusivity, and the shape of the heating element 14. Can do.

  It should be noted that a portion where the heat pipe 23 and the metal plate 22 are in contact (more specifically, a portion where the third hole 22f and the side surface 24g are in contact) is not substantially disturbed by these thermal contacts. Solder or adhesive may be provided. In this case, the heat pipe 23 can be more reliably fixed to the metal plate 22.

  Although preferred embodiments of the present invention have been described and described above, it should be understood that these are exemplary of the present invention and should not be considered as limiting. Additions, omissions, substitutions, and other changes can be made without departing from the scope of the invention. Accordingly, the invention is not to be seen as limited by the foregoing description, but is limited by the scope of the claims.

  1, 21 ... Radiation module, 2, 22 ... Metal plate, 2a, 22a ... First surface, 2b, 22b ... Second surface, 2c, 22c ... Through hole, 2d ... First hole, 2e ... Second hole 2f ... intermediate surface 3,23 ... heat pipe 4,24 ... container, 5 ... wick, 22f ... third hole, 41 ... lip portion

Claims (4)

A metal plate having a first surface, a second surface opposite to the first surface, and a through hole penetrating from the first surface to the second surface;
A heat pipe comprising a hollow container, and a wick accommodated in the container;
A heat dissipation module comprising:
The container is engaged with the through hole so as not to fall off the metal plate,
The said container is the thermal radiation module exposed from the 2nd surface of the said metal plate.   The heat dissipation module according to claim 1, wherein the container protrudes from the second surface of the metal plate. The through hole includes a first hole and a second hole having a width smaller than the width of the first hole and communicating with the first hole;
The metal plate has an intermediate surface formed between the first hole and the second hole,
The container has a lip portion that comes into contact with an intermediate surface of the metal plate,
The heat dissipation module according to claim 1 or 2, wherein at least a part of the container is accommodated in the first hole and the second hole. The through hole includes a third hole whose width gradually decreases from the first surface toward the second surface;
The heat dissipation module according to claim 1 or 2, wherein at least a part of the container is fitted in the third hole.

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