JP6557112B2 - Heat dissipation device for portable information equipment - Google Patents

Description

  The present invention relates to a heat dissipation device for a portable information device such as a smartphone or a tablet information terminal.

  Electronic components such as arithmetic elements (CPU) and storage elements (RAM, ROM) used for information processing have recently been increased in speed or capacity, and it is required to suppress the temperature rise due to heat generation associated therewith. It has been. Patent Document 1 describes a portable information terminal configured to carry the heat of a CPU to a low temperature part by a heat pipe and diffuse the heat of the CPU. According to the description in Patent Document 1, the low temperature portion is the inside of the housing and the portion between the outer peripheral portion of the housing and the battery. In addition, the heat pipe described in Patent Document 1 is a flat portion that is partly processed to have a flat cross section, and for this reason, the housing can be thinned or downsized.

JP 2014-165596 A

  However, in the configuration described in Patent Document 1, even if heat from the CPU or the like can be transported between the outer peripheral portion of the housing and the battery by a heat pipe, heat dissipation from the housing to the outside is promoted. Not configured. Therefore, in the configuration described in the cited document 1, there is a limit to lowering the heat spot of electronic components such as CPUs and casings that are increasing in speed or capacity, and more efficient in heat dissipation or cooling. In fact, there is a demand for the development of excellent devices.

  The present invention has been made paying attention to the above technical problem, and provides a heat dissipating device for a portable information device that can positively generate heat dissipating from the housing to the outside to suppress the temperature rise of the electronic component. It is intended to provide.

  In order to achieve the above object, the present invention provides a heat dissipation device for a portable information device in which a heating element is provided inside a casing constituted by an outer frame portion, a front surface member, and a back surface member. A heat pipe in which a working fluid that changes phase is enclosed has an evaporating part for evaporating the working fluid and a condensing part for condensing the working fluid, and the evaporating part is capable of transferring heat to the heating element. In addition to being connected, the condensing part is arranged so as to be capable of transferring heat to the outer frame part and along the inner surface of the outer frame part.

  In the present invention, the heat pipe further includes a cylindrical intermediate portion that is a portion between the evaporation portion and the condensation portion, and the evaporation portion has a flat shape along the surface of the heating element. The condensing part may be formed in a flat shape along the inner surface of the outer frame part.

  In the present invention, the evaporation unit has an upper surface and a lower surface that face each other in the thickness direction of the evaporation unit, and the condensation unit has a direction intersecting the upper surface and the lower surface of the evaporation unit. It may have a flat surface that faces.

  Furthermore, in this invention, it further has the attachment contacted so that heat transfer is possible for the inner surface of the said outer frame part, and a part of inner surface of the said surface member or the said back surface member, and the said condensation part is attached to the said attachment. It may be contacted so that heat can be transferred.

  In the present invention, the inner surface of the outer frame portion is a heat diffusion wall, the attachment has a shelf plate portion protruding from the heat diffusion wall toward the inside of the housing, It may be fixed in a state of being in close contact with the shelf board.

  In this invention, the said attachment may be provided with the shelf part which carries out surface contact with the inner surface of the said back surface member, and transfers heat to the said back surface member.

  In the present invention, the attachment may include a heat transfer plate that is in surface contact with the inner surface of the surface member and transfers heat to the surface member.

  In the present invention, the casing of the portable information device has an outer frame portion, and the heat pipe condensing portion that transports the heat of the heating element runs along the outer frame portion and transfers heat to the outer frame portion. Are arranged to be. The heat of the heating element is transmitted to the outer frame portion and diffused to the outer frame portion, and is dissipated from the outer frame portion to the outside. The outer frame portion is a portion that maintains the strength of the casing, and has a large heat capacity, such as being thick, and is easily exposed to the outside to dissipate heat. It can be received at the frame and diffused to the outside. Therefore, the temperature rise of the heating element is suppressed, and the temperature of the heating element can be maintained at a temperature that does not hinder the operation or function. In addition, the outer frame has a large heat capacity, so that the temperature is not easily raised, and there are few places where the user of the portable information device touches, so it is possible to avoid a situation such as an uncomfortable feeling on the user's hand. it can.

It is a typical top view showing an example of the present invention, and is a top view in the state where a monitor part was removed. It is an arrow line view which follows the II-II line | wire of FIG. It is an arrangement drawing which shows the state where the condensation part is put on the shelf board part of an attachment. It is sectional drawing which shows the other example of an attachment. It is sectional drawing which shows the further another example of an attachment. It is a side view of the heat pipe which shows the example of the heat pipe bent so that an evaporation part and a condensation part may exist in a different height position. It is a figure which shows the example of the heat pipe which formed the evaporation part and the condensation part in the flat shape, and made the intermediate part the cross-sectional shape with a round pipe, (A) is a top view, (B) also describes cross-sectional shape FIG. It is an arrangement | positioning figure which shows the example which made the condensation part contact | adhere directly to the thermal diffusion wall.

  Hereinafter, an example in which the heat dissipation device of the present invention is applied to a smartphone will be described as an embodiment of the present invention. FIG. 1 is a schematic plan view of the smartphone 1, showing a state in which the monitor unit 3 as a surface member is removed from the housing 2, and FIG. 2 is an arrow along the line II-II in FIG. 1. FIG. The housing 2 is formed as a substantially rectangular hollow body by a substantially rectangular outer frame portion 4, a monitor portion 3 corresponding to the front surface member of the present invention, and a back plate 5 corresponding to the back surface member of the present invention. . The outer frame portion 4 is a portion that forms a so-called framework of the housing 2 and is preferably formed thick with a light alloy material so that the smartphone 1 is lightweight and not distorted. A heat diffusion wall 6 is provided along the inner surface of the outer frame portion 4. The heat diffusion wall 6 is a rectangular frame-shaped body formed of a metal thin plate or sheet material, and is in close contact with the inner surface of the outer frame portion 4. The monitor unit 3 is a part for displaying information and is formed of a liquid crystal panel. The back plate 5 is a portion corresponding to a so-called lid of the housing 2 and is preferably formed of a synthetic resin in terms of weight reduction and design.

  A substrate (motherboard) 7 is disposed inside the housing 2 at a position close to one in the longitudinal direction (the left direction in FIGS. 1 and 2), and an arithmetic element (CPU) corresponding to a heating element on the substrate 7. 8 is implemented. The arithmetic element 8 is arranged so as to be positioned on the monitor unit 3 side of the substrate 7. More specifically, the substrate 7 is disposed at a position close to the inner surface of the back plate 5, and the arithmetic element 8 is attached to the surface of the substrate 7 opposite to the surface on the back plate 5 side.

  Inside the housing 2, a battery 9 is arranged at a location near the other in the longitudinal direction (the right direction in FIGS. 1 and 2). The battery 9 has a rectangular plate shape with a width W9 narrower than the width W3 inside the housing 2, and is held away from the back plate 5 by being held by a predetermined holding frame 10 provided inside the housing 2. It may be. Further, a gap C is formed between the battery 9 and the heat diffusion wall 6 disposed on the inner surface side of the outer frame portion 4.

  A pair of heat pipes 11 </ b> A and 11 </ b> B are provided to carry the heat of the arithmetic element 8 to the outer frame portion 4 side and suppress the temperature rise of the arithmetic element 8. The heat pipes 11A and 11B are heat transport elements in which a working fluid that transports heat in the form of latent heat and a wick that generates a capillary force when the liquid-phase working fluid permeates into a sealed container. The principle structure is the same as that of a general heat pipe known in the art. The heat pipes 11A and 11B shown in FIGS. 1 and 2 have a copper pipe as a container, water is sealed as a working fluid that changes in phase therein, and a bundle of thin wires such as copper fiber and carbon fiber is used as a wick. It is a heat pipe enclosed inside, and the container is formed in a flat shape. The flat shape may be formed by crushing a copper round pipe.

  Each of the heat pipes 11A and 11B is bent at two locations, and a portion having a predetermined length on one end side is set as the evaporation portions 12A and 12B, and a predetermined length on the opposite end side. These portions are the condensation portions 13A and 13B. Each of the evaporation units 12A and 12B is disposed on the upper side (the upper side in FIG. 2) of the arithmetic element 8 described above while being close to each other and parallel to each other. A thermal diffusion plate 15 is disposed above the arithmetic element 8 with a thermal conductive material (TIM: Thermal Interface Material) 14 sandwiched between them as shown in an enlarged view in FIG. The heat diffusing plate 15 is a thin plate (or sheet-shaped) member having a high thermal conductivity such as a metal plate such as a copper plate or a carbon graphite sheet. The heat diffusing plate 15 has evaporating portions 12A, 11A of the heat pipes 11A, 11B. 12B is closely attached so that heat can be transferred. Since the heat pipes 11 </ b> A and 11 </ b> B are formed in a flat shape as described above, the lower surfaces of the evaporation units 12 </ b> A and 12 </ b> B are flat surfaces, and the flat surfaces are arranged on the heat diffusion plate 15. The heat diffusion plate 15 is brought into close contact with and joined by means such as brazing or soldering. By adopting such a joint structure, the heat transfer area between the heat pipes 11A and 11B and the heat diffusion plate 15 is increased.

  Each of the heat pipes 11A and 11B is bent at two locations, so that the condensing parts 13A and 13B are arranged at positions along the heat diffusion wall 6 on the inner surface side of the outer frame part 4 constituting the housing 2. ing. In the example shown in FIGS. 1 and 2, each condensing part 13 </ b> A, 13 </ b> B is arranged in the gap C between the battery 9 and the heat diffusion wall 6 so that heat transfer occurs between the heat diffusion wall 6. It is configured. Since the heat pipes 11A and 11B are formed in a flat shape, the condensing portions 13A and 13B are also formed in a flat shape, and are thin in the thickness direction of the housing 2, and the upper and lower surfaces are flat. ing. Therefore, attachments 16A and 16B are provided to widen the heat transfer area between the condensing parts 13A and 13B and the heat diffusion wall 6 (or the outer frame part 4). FIG. 4 shows an example of the attachments 16A and 16B. The example shown here includes shelf plates 17A and 17B extending from the intermediate portion in the height direction of the heat diffusion wall 6 toward the battery 9. Yes. The shelf parts 17A, 17B are configured to be integrated with the heat diffusion wall 6 by a material having high thermal conductivity such as metal or carbon, and the condensing parts 13A, 13B have their flat surfaces formed on the shelf parts 17A, 17B. Adhering to the attachments 16A and 16B. Therefore, the flat surfaces of the condensing parts 13A and 13B become heat transfer surfaces, and the heat transfer area is increased.

  Next, the operation of the heat dissipation device described above will be described. The arithmetic element 8 generates heat by operating, and the heat is transmitted to the evaporation parts 12A and 12B of the heat pipes 11A and 11B via the heat conductive material 14 and the heat diffusion plate 15. Since the heat pipes 11A and 11B are formed in a flat shape as described above, the heat transfer area between the evaporation units 12A and 12B and the heat diffusion plate 15 is wide, and heat transfer to the evaporation units 12A and 12B is performed. It is done efficiently. That is, in the above-described heat radiating device according to the present invention, the thermal resistance between the arithmetic element 8 that is a heating element and the heat pipes 11A and 11B is reduced.

  The working fluid permeates the wicks in the evaporation units 12 </ b> A and 12 </ b> B, and the working fluid is evaporated by the heat transmitted from the arithmetic element 8. Since the condensing parts 13A, 13B of the heat pipes 11A, 11B are arranged so that heat is taken away by the outer frame part 4 through the gap C away from the arithmetic element 8, the temperature and pressure of the condensing parts 13A, 13B are Low. Therefore, the heated and evaporated working fluid flows toward the condensing units 13A and 13B. The heat of the working fluid is transmitted from the attachments 16A and 16B to the heat diffusion wall 6 in the condensing parts 13A and 13B, and further diffused from the outer frame part 4 to the outside. The working fluid radiated by the condensers 13A and 13B is liquefied and penetrates into the wick. On the other hand, the working fluid evaporates in the evaporation units 12A and 12B, the meniscus in the wick is lowered, and capillary force is generated. Therefore, the working fluid that has permeated the wick in the condensing units 13A and 13B is returned to the evaporating units 12A and 12B by capillary force.

  The condensing portions 13A and 13B are formed in a flat shape similar to the evaporation portions 12A and 12B described above, and are formed in a flat shape substantially perpendicular to the heat diffusion wall 6, but the attachments 16A and 16B are condensing portions. 13A and 13B, and shelf parts 17A and 17B which are integrated with the heat diffusion wall 6 are provided, and the condensing parts 13A and 13B are in close contact with the shelf parts 17A and 17B. Therefore, the heat transfer area between the condensing parts 13A and 13B and the attachments 16A and 16B or the heat diffusion wall 6 is widened.

  The outer frame portion 4 is formed thicker than other portions so as to maintain the strength of the housing 2, and its heat capacity is increased. Further, since the outer frame portion 4 is in contact with the outside air, heat is radiated from the outer frame portion 4. For this reason, the temperature of the outer frame portion 4 is unlikely to increase. Further, when the smartphone 1 is held in the hand, the smartphone 1 is placed on the palm, but it is rare that the outer frame portion 4 that is the outer peripheral portion of the smartphone 1 is strongly gripped. Furthermore, even if the outer frame portion 4 is gripped, the outer frame portion 4 is low in height and has a small area in contact with the palm or finger, so that heat is not easily transmitted from the outer frame portion 14 to the hand or finger. Therefore, even if the heat of the arithmetic element 8 is transmitted to the outer frame part 4 via the heat pipes 11A and 11B described above, it becomes difficult to hold the smartphone 1 by hand even if the temperature of the outer frame part 4 rises. , Preventing or suppressing the user from feeling uncomfortable.

  The heat of the arithmetic element 8 is carried to the outer frame part 4 as described above and absorbed by the outer frame part 4 or is dissipated from the outer frame part 4 to the outside. Therefore, the temperature of the arithmetic element 8 is maintained below the temperature at which the operation is compensated (for example, 95 ° C.), and an abnormal function of the arithmetic element 8 and a decrease in the operation speed can be avoided. In addition, the temperature of the outer frame portion 4 and the vicinity thereof or the position where the arithmetic element 8 is arranged and the vicinity thereof in the housing 2 is an allowable temperature when the user holds the smartphone 1 (for example, 55 ° C.). ) It can be suppressed to the following.

  Attachment 16A, 16B mentioned above is comprised so that the transmission of the heat | fever from the condensation parts 13A, 13B to the thermal diffusion wall 6 or the outer frame part 4 may be accelerated | stimulated. In the present invention, the attachment may be configured not only to promote heat transfer to the heat diffusion wall 6 or the outer frame part 4 but also to promote heat transfer to the monitor part 3 and the back plate 5. FIG. 5 is a schematic cross-sectional view showing an example thereof, and the attachments 18A and 18B shown here are examples configured to promote heat transfer to the back plate 5, and the condensers 13A and 13B are in close contact with each other. The shelf parts 19A and 19B to be extended are integrated with the lower end part of the heat diffusion wall 6 so as to extend along the inner surface of the back plate 5. Therefore, the attachments 18A and 18B have an L-shaped cross section. It is configured to make.

  The attachments 20A and 20B shown in FIG. 6 are examples configured to promote heat transfer to the back plate 5 and the monitor unit 3, and the shelf plates 21A and 21B for bringing the condensation units 13A and 13B into close contact with each other are thermally diffused. A heat transfer plate that is integrated with the lower end of the wall 6 so as to extend along the inner surface of the back plate 5 and is parallel to the shelf plates 21A and 21B and extends along the inner surface of the monitor unit 3. 22A and 22B are integrally provided at the upper end of the heat diffusion plate 6. Accordingly, the attachments 20A and 20B shown in FIG. 6 are configured such that the cross-sectional shape is a “U” shape.

  Also in the attachments 18A, 18B, 20A, and 20B shown in FIG. 5 and FIG. 6, the condensing portions 13A and 13B are placed on the shelf portions 19A, 19B, 21A, and 21B, and are fixed with the flat bottom surfaces in close contact with each other. ing. Accordingly, the heat transfer area between the condensing parts 13A and 13B and the shelf parts 19A, 19B, 21A and 21B is enlarged. The heat of the arithmetic element 8 carried by the heat pipes 11A, 11B is transmitted from the condensing parts 13A, 13B to the heat diffusion wall 6 via the attachments 18a, 18B, 20A, 20B and diffused to the outer frame part 4. It is diffused from the outer frame part 4 to the outside. Further, in the example shown in FIG. 5, the shelf plates 19A and 19B of the attachments 18A and 18B come into surface contact with the back plate 5 so that heat transfer occurs between them. 5 is also transmitted and diffused, and diffused from the back plate 5 to the outside. When the attachments 18A and 18B are configured as shown in FIG. 5 in this way, the heat dissipating area is increased because the heat dissipating area for the heat transfer from the condensing parts 13A and 13B and the outside is widened. Alternatively, the cooling performance of the arithmetic element 8 is improved.

  Furthermore, in the example shown in FIG. 6, the attachments 20 </ b> A and 20 </ b> B include heat transfer plates 22 </ b> A and 22 </ b> B that are in close contact with the monitor unit 3 in addition to the shelf plates 21 </ b> A and 21 </ b> B that are in close contact with the back plate 5. Therefore, in addition to the outer frame portion 4 and the back plate 5, heat is transmitted from the condensing unit 13 to the monitor unit 3 to be diffused and dissipated to the outside. When the attachments 20A and 20B are configured as shown in FIG. 6 as described above, the heat dissipating area is further increased because the heat transfer area from the condensing parts 13A and 13B and the heat dissipating area to the outside are further increased. Or the cooling performance of the arithmetic element 8 is further improved.

  In addition, when using attachment 18A, 18B, 20A, 20B shown in FIG.5 and FIG.6, in the thickness direction in the housing | casing 2 of the evaporation parts 12A and 12B of the heat pipes 11A and 11B and the condensation parts 13A and 13B The height will be different. Therefore, the heat pipes 11A and 11B are bent not only in the width direction of the housing 2 as shown in FIG. 1 but also in two places in the thickness direction of the housing 2 as shown in FIG. In this way, the evaporation units 12A and 12B are brought into close contact with the heat diffusion plate 15, and the condensing units 13A and 13B are more securely attached to the shelf plates 19A, 19B, 21A and 21B of the attachments 18A, 18B, 20A and 20B. It can be adhered.

  The heat pipes 11A and 11B in the embodiment of the present invention are formed in a flat shape in order to avoid an increase in the thickness of the housing 2 as much as possible. In particular, the places where heat transfer occurs between the members constituting the smartphone 1 such as the evaporation sections 12A and 12B and the condensation sections 13A and 13B are formed in a flat shape in order to secure a wide heat transfer area. Yes. However, there are cases where the gap C is very narrow and the condensing portions 13A and 13B cannot be formed in a flat shape in which the casing 2 is thin in the thickness direction and the upper and lower surfaces are flat. In such a case, as shown in FIG. 8, the intermediate portions 23A and 23B are formed in a cylindrical shape without crushing the copper pipe constituting the container, and the evaporators 12A and 12B and the condensers 13A and 13B are connected. You may form in a flat shape. 8A shows a plan view of the heat pipes 11A and 11B in which the intermediate portions 23A and 23B have a cross-sectional shape as a round pipe, and FIG. 8B shows the heat pipes 11A and 11B. FIG. 8B also shows the cross-sectional shapes of the evaporation units 12A and 12B, the condensation units 13A and 13B, and the intermediate portions 23A and 23B.

  The heat pipes 11A and 11B shown in FIG. 8 are different in the crushing direction by 90 degrees when the evaporation parts 12A and 12B and the condensation parts 13A and 13B are formed in a flat shape. That is, the evaporation units 12A and 12B have an upper surface and a lower surface that face each other in the thickness direction, whereas the condensation units 13A and 13B are along a plane perpendicular to the upper and lower surfaces of the evaporation units 12A and 12B. It has flat surfaces that face each other in the direction. Therefore, when the evaporation units 12A and 12B are placed so that the upper and lower flat surfaces thereof are horizontal, the condensing units 13A and 13B are configured so that the flat surfaces are vertical. Therefore, in a state where the evaporation parts 12A and 12B are installed so that the flat lower surface thereof is in close contact with the upper surface of the heat diffusion plate 15, the condensing parts 13A and 13B are oriented vertically and the flat surface is the outer frame part. 4 is parallel to the inner surface of 4 or the heat diffusion wall 6 described above. Therefore, as schematically shown in FIG. 9, the flat surfaces of the condensing portions 13A and 13B can be brought into close contact with the heat diffusion wall 6 by direct surface contact, and in that case, the attachments 16A, 16B, 18A, 18B, 20A, and 20B can be omitted. Further, in the heat pipes 11A and 11B in which the intermediate portions 23A and 23B are cylindrical, a sufficient flow path of the working fluid vapor is secured in the intermediate portions 23A and 23B so that the working fluid vapor flows smoothly. It becomes. Therefore, the heat transport characteristics of the heat pipes 11A and 11B are improved, and in this respect as well, the heat dissipation characteristics from the arithmetic element 8 or the cooling characteristics of the arithmetic element 8 can be improved.

  Although not described in each of the above-described embodiments, it is between the condensers 13A, 13B and the attachments 16A, 16B, 18A, 18B, 20A, 20B, or between the condensers 13A, 13B and the heat diffusion wall 6. A heat conductive material (TIM) may be interposed between the two. Moreover, when using the attachment provided with heat-transfer board 22A, 22B in addition to shelf part 21A, 21B like attachment 20A, 20B shown in FIG. 6, the condensation part 13A of heat pipe 11A, 11B , 13B may be in close contact with the heat transfer plates 22A, 22B instead of the shelf plates 21A, 21B. Further, the attachment according to the present invention includes the shelf portions 21A and 21B and the heat transfer plates in addition to the shelf portions 21A and 21B that are in surface contact with the back plate 5 and the heat transfer plates 22A and 22B that are in surface contact with the monitor portion 3. The structure which has any one or two of the other shelf parts located between 22A and 22B may be sufficient. In the present invention, one heat pipe may be used, or three or more heat pipes may be used.

  In the present invention, the outer frame portion 4 and the heat diffusion wall 6 in which the condensing portions 13A and 13B of the heat pipes 11A and 11B are arranged are not necessarily vertical side walls but may be inclined side walls. . In the present invention, the outer frame portion 4 and the heat diffusion wall 6 are not limited to flat side walls, and may be curved side walls. Furthermore, in the present invention, the outer frame portion 4 may be formed integrally with the back plate 5. In the present invention, the condensing parts 13A and 13B of the heat pipes 11A and 11B may be formed in a flat shape parallel to the heat diffusion wall 6, and in this case, the condensing parts 13A and 13B are directly connected to the heat diffusion wall 6. The heat diffusion wall 6 may be disposed so as to be capable of transferring heat through an appropriate attachment.

  DESCRIPTION OF SYMBOLS 1 ... Smartphone, 2 ... Housing | casing, 3 ... Monitor part, 4 ... Outer frame part, 5 ... Back plate, 6 ... Heat diffusion wall, 8 ... Arithmetic element (CPU), 9 ... Battery, C ... Gap, 11A, 11B ... Heat pipe, 12A, 12B ... Evaporating part, 13A, 13B ... Condensing part, 15 ... Thermal diffusion plate, 16A, 16B, 20A, 20B ... Attachment, 17A, 17B, 18A, 18B, 19A, 19B, 21A, 21B ... Shelf plate part, 22A, 22B ... heat transfer plate, 23A, 23B ... intermediate part.

Claims (6)

In a heat dissipating device for a portable information device in which a heating element is provided inside a housing constituted by an outer frame portion, a front surface member, and a back surface member,
A heat pipe in which a working fluid that changes phase is enclosed in an airtight container has an evaporating part for evaporating the working fluid, and a condensing part for condensing the working fluid,
The evaporation unit is connected to the heating element so as to be able to transfer heat, and the condensation unit is arranged so as to be able to transfer heat to the outer frame and along the inner surface of the outer frame ,
The heat pipe further includes a cylindrical intermediate portion that is a portion between the evaporation portion and the condensation portion,
The evaporation part is formed in a flat shape along the surface of the heating element, and the condensing part is formed in a flat shape along the inner surface of the outer frame part.
A heat dissipating device for portable information equipment. In a heat dissipating device for a portable information device in which a heating element is provided inside a housing constituted by an outer frame portion, a front surface member, and a back surface member,
A heat pipe in which a working fluid that changes phase is enclosed in an airtight container has an evaporating part for evaporating the working fluid, and a condensing part for condensing the working fluid,
The evaporation unit is connected to the heating element so as to be able to transfer heat, and the condensation unit is arranged so as to be able to transfer heat to the outer frame and along the inner surface of the outer frame ,
An attachment that is in contact with the inner surface of the outer frame portion and a part of the inner surface of the front surface member or the back surface member so as to allow heat transfer;
The condensing part is brought into contact with the attachment so as to transfer heat.
A heat dissipating device for portable information equipment. The heat pipe further includes a cylindrical intermediate portion that is a portion between the evaporation portion and the condensation portion,
The said evaporation part is formed in the flat shape along the surface of the said heat generating body, The said condensation part is formed in the flat shape along the said inner surface of the said outer frame part, The Claim 2 characterized by the above-mentioned. The heat radiating device of the portable information device described. The evaporation part has an upper surface and a lower surface that face each other in the thickness direction of the evaporation part,
The condensing unit, the portable information dissipating device apparatus according to claim 1 or 3, characterized in that it has a flat surface facing a direction crossing the upper and lower surfaces of the evaporation section. The inner surface of the outer frame portion is a heat diffusion wall,
The attachment has a shelf portion protruding from the heat diffusion wall toward the inside of the housing,
The heat dissipation device for a portable information device according to claim 2 or 3 , wherein the condensing part is fixed in a state of being in close contact with the shelf board part. The said attachment is provided with the shelf part which carries out surface contact with the inner surface of at least one of the said surface member or the said back surface member, and transfers heat to the said back surface member, The Claim 2, 3 or 5 characterized by the above-mentioned. Heat dissipation structure for portable information equipment.

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