JP7082308B1 - Information processing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an information processing apparatus capable of ensuring sufficient heat dissipation while reducing the size and thickness.
An information processing apparatus includes a first surface that comes into contact with a heating element arranged inside a housing, a second surface on the opposite side thereof, and a third surface that straddles the first surface and the second surface. A plate-shaped base plate having thermal conductivity, a vapor chamber having a thermal conductive contact surface covering the second surface of the base plate, a first connection portion connected to the third surface of the base plate, and a thermal contact surface of the vapor chamber. It is provided with a second connecting portion connected to the heating element, and a heat pipe having a heat pipe on one end side and extending to a position where the other end side is separated from the heating element.
[Selection diagram] Fig. 2

Description

Embodiments of the present invention relate to an information processing apparatus.

Conventionally, in information processing devices such as tablet terminals, notebook personal computers, and smartphones, it has been possible to efficiently dissipate heat from heat-generating components mounted inside the housing, such as a CPU (Central Processing Unit). It is important in terms of maintaining performance, improving quality, and suppressing deterioration. Therefore, an information processing device having a heat dissipation structure using an electric fan or the like inside the housing has been proposed.

Japanese Patent No. 6370223

In recent years, information processing devices have been actively miniaturized and thinned, and various components have been miniaturized. At the same time, the electric fan for heat dissipation, which can be one of the causes of the increase in size, has been omitted and fanless. Proposals have been made to reduce the thickness of the structure. However, in the case of a fanless structure, it is difficult to secure a heat dissipation path and select a heat dissipation position, and further improvement is required to secure sufficient heat dissipation while reducing the size and thickness of the information processing device. is the current situation.

Therefore, one example of the problem to be solved by the present invention is to provide an information processing apparatus capable of ensuring sufficient heat dissipation while reducing the size and thickness.

The information processing apparatus according to the first aspect of the present invention straddles the first surface, the second surface on the opposite side, the first surface, and the second surface in contact with the heating element arranged inside the housing. A plate-shaped base plate having a heat conductive surface having a third surface, a vapor chamber having a heat conductive contact surface covering the second surface of the base plate, and a first connection connected to the third surface of the base plate. A heat pipe having a portion, a second connecting portion connected to the heat conductive contact surface of the vapor chamber on one end side, and the other end side extending to a position separated from the heating element. , The heat pipe is provided at least two, and the first connection portion of the heat pipe is connected to each of the different third surfaces formed on the base plate .

Further, for example, a heat radiating sheet that diffuses heat at a heat radiating position may be connected to the other end side of the heat pipe of the information processing apparatus.

Further, the heat dissipation sheet of the information processing apparatus may be arranged so as to be in surface contact with the surface of the battery arranged in the housing, for example.

Further, the heat dissipation sheet of the information processing apparatus may include, for example, a heat conductive metal plate that comes into surface contact with the surface of the battery.

According to the above aspect of the present invention, since the heat pipe is connected to the third surface, that is, the side surface of the base plate, the presence of the heat pipe in the heat dissipation structure including the vapor chamber and the heat pipe is in the thickness direction of the heating element. It is possible to suppress the influence on the increase in the thickness of the pipe. As a result, it is possible to suppress an increase in the thickness of the information processing apparatus and contribute to the overall thinning. Further, since heat can be transported to a position separated from the heating element by the vapor chamber and the heat pipe, efficient heat dissipation can be realized even in the case of a fanless structure.

FIG. 1 is an exemplary and schematic plan view showing the appearance of a tablet terminal device as an example of the information processing device according to the embodiment. FIG. 2 is an exemplary and schematic plan view showing a state in which the display device of the tablet terminal device of FIG. 1 is removed and the internal structure including the heat dissipation structure is exposed. FIG. 3 is an exemplary and schematic perspective view showing a heat dissipation structure of the information processing apparatus according to the embodiment. FIG. 4 is an exemplary and schematic perspective view showing a state in which the heat dissipation structure shown in FIG. 3 is viewed from the back side. FIG. 5 is a cross-sectional view taken along the line AA of FIG. 4, which is an exemplary and schematic cross-sectional view illustrating an arrangement state and a heat conduction state of the constituent members of the heat dissipation structure of the information processing apparatus according to the embodiment.

Hereinafter, exemplary embodiments of the present invention will be disclosed. The configurations of the embodiments shown below, as well as the actions, results, and effects produced by such configurations, are examples. The present invention can be realized by a configuration other than the configurations disclosed in the following embodiments, and at least one of various effects based on the basic configuration and derivative effects can be obtained. ..

FIG. 1 is an exemplary and schematic plan view showing the appearance of the tablet terminal device 10 as an example of the information processing device according to the embodiment.

The tablet terminal device 10 includes, for example, a display device 12 such as an LCD (Liquid Crystal Display) or an OLED (Organic Light Emitting Diode). The display device 12 includes, for example, a display surface 12a on almost the entire surface of the thin rectangular housing 10a on one surface side. On the side surface of the housing 10a and the like, a power switch (not shown), switches that realize various functions such as volume adjustment, a speaker that outputs audio data, and the like are arranged. Further, a lens portion (not shown) of the imaging unit is arranged on a part of the display surface 12a side of the housing 10a, a part of the back surface side of the display surface 12a (the back surface side of the housing 10a), and the like. The image pickup unit is, for example, a digital camera having a built-in image pickup element such as a CCD (Charge Coupled Device) or a CIS (CMOS image sensor).

Further, the display surface 12a of the display device 12 is covered with, for example, a capacitive touch panel 14 as a transparent input device. Therefore, the user of the tablet terminal device 10 can visually recognize various images (for example, icons, texts, video contents, etc.) displayed on the tablet terminal device 10 (display surface 12a) through the touch panel 14. Further, since the touch panel 14 is of a capacitance type, the user can touch the position of the surface 14a (operation surface) of the touch panel 14 corresponding to the image displayed on the display surface 12a with a finger or a dedicated pen 16. By operating the surface 14a by moving a finger or a pen 16, an image displayed on the display surface 12a can be selected, and characters, figures, and the like can be drawn on the display surface 12a. In the case of the example of FIG. 1, the pen 16 is detachably held on the side surface of the housing 10a of the tablet terminal device 10. The pen 16 can be held, for example, by using a magnet or by using a folder or the like.

FIG. 2 is an exemplary and schematic flat surface in a state where the display device 12 (touch panel 14) of the tablet terminal device 10 of FIG. 1 is removed, and heat is dissipated to dissipate heat generated inside the housing 10a. A state in which the internal structure including the structure 18 is exposed is shown. In this specification, the X direction, the Y direction, and the Z direction are defined for convenience. The X direction, the Y direction, and the Z direction are orthogonal to each other. The X direction is defined in the −X direction and the + X direction along the long side of the tablet terminal device 10 (housing 10a). The Y direction is defined in the −Y direction and the + Y direction along the short side of the tablet terminal device 10 (housing 10a). The Z direction is defined as a −Z direction toward the back side and a + Z direction toward the front side along the thickness of the tablet terminal device 10 (housing 10a).

In FIG. 2, in the left side region inside the tablet terminal device 10, for example, which is biased in the −X direction, as components for driving the tablet terminal device 10, the CPU 20 and the ROM (Read Only Memory), RAM ( Random Access Memory), SSD (Solid State Drive), storage units such as flash memory, communication interfaces, etc. are arranged in a state of being mounted on a board. Further, in the right side region inside the tablet terminal device 10, for example, which is biased in the X direction, the battery 22 is arranged by utilizing most of the right side region. Since the battery 22 is arranged on the lower surface side of the heat dissipation structure 18, it is shown in FIG. 2 in a state where only a part thereof can be seen. The battery 22 is, for example, a substantially rectangular component having a long side in the X direction and a short side in the Y direction. In the case of FIG. 2, two short sides are arranged side by side along the Y direction. There is. The arrangement of each component is an example and can be changed as appropriate. By collecting small parts such as board-mounted parts in the area on one side and arranging large parts such as batteries on the other side in the housing 10a, it becomes easy to effectively utilize the internal space of the housing 10a. ..

By the way, in the board mounting component, the CPU 20 can be said to be one of the heat generating bodies that generate the most heat when the tablet terminal device 10 is driven. Then, in order to drive the tablet terminal device 10 satisfactorily and to make it difficult for the user to feel a sense of discomfort due to excessive heat generation, it is possible to efficiently and quickly dissipate the heat generated in the heating element such as the CPU 20. desirable. Therefore, when the tablet terminal device 10 is driven in a high load state, rapid heat dissipation is particularly important. Further, it is desirable that the tablet terminal device 10 continuously and smoothly dissipates heat even when it is driven under a normal load state.

Therefore, in the case of the tablet terminal device 10 of the present embodiment, a heat radiating structure 18 for quickly and continuously heat-transporting the heat generated by the heating element to a position separated from the heating element is provided. As an example, the heat radiating structure 18 shown in FIG. 2 receives heat generated by the CPU 20 having a large amount of heat generation among the components mounted on the substrate arranged in the left side region biased in the −X direction inside the housing 10a. Heat is transported to the battery 22 arranged in the right side region of the housing 10a that is biased in the X direction. Then, the transported heat is diffused to the surface of the battery 22 and radiated to the display device 12 side mounted in the + Z direction and the back cover (the back surface side of the housing 10a) existing in the −Z direction. ing.

FIG. 3 is an exemplary and schematic perspective view showing only the heat dissipation structure 18 shown in FIG. Further, FIG. 4 is an exemplary and schematic perspective view showing a state in which the heat dissipation structure 18 shown in FIG. 3 is viewed from the back side. Further, FIG. 5 is a cross-sectional view taken along the line AA of FIG. 4, which is an exemplary and schematic cross-sectional view illustrating an arrangement state and a heat conduction state of each component constituting the heat dissipation structure 18.

As shown in FIGS. 3 and 4, the heat radiating structure 18 of the present embodiment is mainly composed of a base plate 24, a vapor chamber 26, and a heat pipe 28.

The base plate 24 has a first surface 24a (see FIG. 4) in contact with the CPU 20, which is one of the heating elements arranged inside the housing 10a, and a second surface 24b (see FIG. 3) on the opposite side thereof. It is a plate-shaped member having thermal conductivity having a third surface 24c (see FIGS. 3 and 4) straddling the first surface 24a and the second surface 24b. The base plate 24 can be made of, for example, a resin material (for example, a graphite sheet or the like) containing a metal having high thermal conductivity such as copper or aluminum and a heat conductive substance such as graphite. The base plate 24 is sandwiched between the CPU 20 and the vapor chamber 26, and has a function of filling a gap between the CPU 20 and the vapor chamber 26 to improve thermal conductivity.

In the case of the present embodiment, the base plate 24 includes a leaf spring S that presses the first surface 24a of the base plate 24 against the contact surface (for example, the upper surface at the time of mounting the substrate) of the CPU 20. As shown in FIG. 4 and the like, in the case of the present embodiment, the leaf springs S are provided at four locations. A fixing hole Sa is formed on one end side of each leaf spring S. Then, it is fixed to the substrate or the like by a fastening member Sb (see FIG. 2) such as a screw inserted into the fixing hole Sa. Further, the other end side of the leaf spring S abuts on the second surface 24b of the base plate 24, presses the base plate 24 against the CPU 20 by utilizing the spring property of the leaf spring S, and the adhesion and heat between the base plate 24 and the CPU 20 are obtained. It improves the conductivity.

The vapor chamber 26 includes a heat conductive contact surface 26a that covers the second surface 24b of the base plate 24, as shown in FIGS. 4 and 5. As shown in FIG. 5, the vapor chamber 26 is a hollow structure in which an outer wall portion 26b is formed of a thin metal foil such as copper or aluminum, and a cooling hydraulic fluid (for example, pure water as a refrigerant) is formed in the internal space thereof. Etc.) are enclosed. By bringing the heat conductive contact surface 26a of the vapor chamber 26 into contact with the surface of the heat source (in this case, the second surface 24b of the base plate 24 to which heat has been transferred from the CPU 20), the internal hydraulic fluid becomes vaporized steam and creates an internal space. Move at high speed toward the low temperature part. Then, the vaporized operating liquid touches the outer wall portion 26b of the low temperature portion, is cooled, and is liquefied. The liquefied operating liquid returns to the high temperature part due to the capillary phenomenon. By repeating this process, the vapor chamber 26 transfers heat from the high temperature portion to the low temperature portion.

As shown in FIGS. 4 and 5, the heat pipe 28 has a first connection portion 28a connected to the third surface 24c of the base plate 24 and a second connection connected to the heat conductive contact surface 26a of the vapor chamber 26. A portion 28b and a portion 28b are provided in the first end portion region portion 28c on the one end side. Further, on the other end side of the heat pipe 28 opposite to the first end region 28c, a second end region 28d extending to a position separated from the heating element (CPU 20) is provided. That is, the heat pipe 28 is an elongated tubular member having a first end region portion 28c in a high temperature portion where a heating element is present and a second end region region 28d in a low temperature portion separated from the heating element. ..

The structure of the heat pipe 28 and the principle of heat transfer are the same as those of the vapor chamber 26. The heat pipe 28 is a tubular member made of a metal having high thermal conductivity such as copper or aluminum. The inner wall of the heat pipe 28 has a capillary structure. A small amount of hydraulic fluid (for example, pure water) is sealed inside the heat pipe 28 under reduced pressure. When one end of the heat pipe 28 is heated, the hydraulic fluid immediately evaporates inside the reduced pressure state, and heat is absorbed by the transfer of latent heat. The evaporated hydraulic fluid becomes a vapor flow and moves to the low temperature side at high speed. The transferred steam touches the inner wall on the low temperature side and returns to the liquid while passing heat (heat release by latent heat of condensation). The hydraulic fluid that has returned to the liquid returns to the high temperature side (original position) through the capillary structure. The heat pipe 28 can repeat the above-mentioned operation to transfer heat from the high temperature portion to the low temperature portion.

As shown in FIGS. 4 and 5, the heat pipe 28 is thermally connected to the third surface 24c of the base plate 24. That is, the heat pipe 28 is connected to the side surface of the base plate 24. As a result, when the heat dissipation structure 18 composed of the base plate 24, the vapor chamber 26, and the heat pipe 28 is attached to the CPU 20 which is a heating element, the thickness of the heat pipe 28 is added to the laminated thickness in the Z direction. Can be avoided. That is, the heat dissipation structure 18 is thinned by suppressing an increase in thickness in the Z direction with respect to the CPU 20 while ensuring heat dissipation performance for rapid heat transport. As a result, it is possible to contribute to the thinning of the tablet terminal device 10 while ensuring and improving the heat dissipation characteristics of the tablet terminal device 10. In FIG. 5, the thickness of the base plate 24 in the Z direction and the thickness of the heat pipe 28 in the Z direction are substantially the same, but the thickness of the heat pipe 28 in the Z direction is the thickness of the base plate 24 in the Z direction. It may be equal to or less than the thickness of. Further, the width of the heat pipe 28 in the Y direction can be appropriately set according to the required heat transport capacity (heat absorption capacity).

Further, since the vapor chamber 26 covers the entire base plate 24 (CPU 20), the heat generated by the CPU 20 can be smoothly transported (diffused) widely over the entire vapor chamber 26. As a result, it is possible to suppress the formation of hot spots due to the heat generated by the CPU 20. Further, in the heat pipe 28, the first connection portion 28a is thermally connected to the third surface 24c (side surface) of the base plate 24, and the second connection portion 28b is thermally connected to the heat conduction contact surface 26a of the vapor chamber 26. Has been done. Therefore, the heat pipe 28 absorbs the heat generated by the CPU 20 via the base plate 24 and efficiently heats the heat from the first end region portion 28c on one side to the second end region portion 28d on the other side. Can be transported. Further, the heat pipe 28 can generate heat generated by the CPU 20 diffused in the vapor chamber 26, absorb heat, and efficiently transfer heat from the first end region portion 28c to the second end region portion 28d. ..

Further, as shown in FIG. 5, since the heat pipe 28 is arranged so as to be in contact with the base plate 24 and to be wrapped in the vapor chamber 26, the heat generated by the CPU 20 is effectively absorbed by the heat pipe 28. The heat transport capacity can be effectively used. Therefore, the formation of hot spots around the CPU 20 can be more effectively suppressed. That is, in the heat radiating structure 18, the heat pipe 28 is arranged so as to sufficiently exert the heat transport capacity of the heat pipe 28. In this way, heat can be efficiently transferred by the vapor chamber 26 and the heat pipe 28 that come into contact with the base plate 24, so that heat dissipation is effective even when the tablet terminal device 10 (CPU 20) having a fanless structure is driven in an overloaded state. It can be done quickly and targetedly. In other words, the tablet terminal device 10 (CPU 20) having a fanless structure can be used for a long time in an overloaded state. Further, even when the tablet terminal device 10 (CPU 20) having a fanless structure is driven under a normal load state, good heat dissipation can be smoothly performed.

In the case of this embodiment, an example in which two heat pipes 28 are provided is shown. In each of the two heat pipes 28, the first connecting portion 28a is connected to a different third surface 24c of the base plate 24. As shown in FIG. 4, a first connecting portion 28a of one heat pipe 28A is connected to one side portion 24c1 of the substantially rectangular base plate 24. Further, the first connecting portion 28a of the other heat pipe 28B is connected to the side portion 24c2 facing the side portion 24c1 of the base plate 24. By connecting the two heat pipes 28A and 28B to the opposite positions of the base plate 24 in this way, the base plate is compared with the case where the two heat pipes 28A and the heat pipes 28B are connected to the close positions of the base plate 24 (for example, the adjacent third surface 24c). It is possible to efficiently absorb heat from 24 and realize quick and smooth heat transfer. Further, as shown in FIGS. 2, 4 and the like, the second end region portion 28d of the heat pipe 28A and the second end region portion 28d of the heat pipe 28B are arranged at positions separated in the Y direction. There is. As a result, the transported heat can be dissipated from positions separated from each other, and it is easy to avoid concentration of heat distribution due to heat dissipation.

The number of heat pipes 28 arranged can be changed as appropriate, and may be one or three or more. Further, when the first connection portion 28a of the heat pipe 28 is connected to the base plate 24 on the third surface 24c, the position is not limited to the position shown in FIG. 4, and can be appropriately changed according to the layout of each component and the like. It may be connected to the third surface 24c at another position, and the same effect can be obtained.

Further, in the case of the heat dissipation structure 18 of the present embodiment, as a heat dissipation sheet that more efficiently diffuses heat at the heat dissipation position (heat transport destination) on the other end side (second end region portion 28d) of the heat pipe 28. For example, the graphite sheet 30 is connected. The graphite sheet 30 is made of graphite (stone ink), which is an allotrope of carbon, in the form of a thin sheet, and has a characteristic of high thermal conductivity in the plane direction.

The heat transported by the heat pipe 28 is transferred to the graphite sheet 30 and diffused, and is dissipated to the back cover side of the housing 10a via the surface of the battery 22. Similarly, the heat transferred to the graphite sheet 30 is transferred to the display device 12 mounted on the housing 10a and dissipated. As described above, the battery 22 is a large component in the housing 10a, has a large surface area, and generates a small amount of heat during driving as compared with the CPU 20 and the like, so that a low temperature portion is formed inside the housing 10a. be able to. Therefore, the heat transported from the high temperature portion of the CPU 20 or the like is easily absorbed, and can be smoothly diffused and dissipated.

As shown in FIGS. 2 and 4, a graphite sheet 30A is connected to the second end region portion 28d of the heat pipe 28A. Further, a graphite sheet 30B is connected to the second end region portion 28d of the heat pipe 28B. As a result, the heat transported through the heat pipe 28A diffuses from the + Y direction side toward the surface direction of the graphite sheet 30A via the graphite sheet 30A, and the heat transported via the heat pipe 28B is the graphite sheet. It diffuses from the −Y direction side toward the surface of the graphite sheet 30B via 30B. As a result, it is easy to perform rapid heat diffusion over a wide range, and it is possible to suppress the formation of high temperature portions such as hot spots at the heat transport destination. Further, since heat diffusion can be performed substantially evenly and over a wide range with respect to the battery 22 with which the graphite sheet 30A is in contact and the battery 22 with which the graphite sheet 30B is in contact, a difference in heat load between the plurality of batteries 22 occurs. It becomes difficult to do. As a result, it is easy to suppress the bias of deterioration of the battery 22, and it is possible to contribute to suppressing the deterioration of the battery 22 as a whole mounted on the tablet terminal device 10.

In the case of the heat dissipation structure 18 of the present embodiment, the graphite sheet 30 (heat dissipation sheet) may be provided with a metal plate in order to further improve the heat dissipation efficiency. As shown in FIG. 4, as an example, a graphite sheet 30C is provided in a state of being connected to the graphite sheet 30A, and a metal plate 32 having a high thermal conductivity such as copper or aluminum is connected to the graphite sheet 30C. Has been done. That is, the graphite sheet 30C includes a metal plate 32 that comes into surface contact with the surface of the battery 22. The metal plate 32 can absorb the heat transferred to the graphite sheet 30C and promote the diffusion and heat dissipation of the heat to the battery 22. In the case of FIG. 4, the metal plate 32 is arranged on a part of the graphite sheet 30C, but may be arranged on the entire surface of the graphite sheet 30C. Further, in the case of FIG. 4, a part of the metal plate 32 protrudes from the graphite sheet 30C and is formed so as to be connectable to a part other than the battery 22. As a result, the metal plate 32 can transport the heat transported by the heat pipe 28A not only to the battery 22 but also to the members around the battery 22 and the wall surface of the housing 10a, further improving the high thermal efficiency. be able to. In the case of the present embodiment, an example in which the graphite sheet 30C provided with the metal plate 32 is connected only to the graphite sheet 30A side is shown, but the connection of the graphite sheet 30C provided with the metal plate 32 is the heat dissipation state in the housing 10a. It can be appropriately selected depending on (heat distribution, etc.). For example, the metal plate 32 may be connected to the graphite sheet 30B side or both may be connected, and the same effect can be obtained. Further, the metal plate 32 may be attached to the graphite sheet 30A or the graphite sheet 30B, and the same effect can be obtained.

As described above, the tablet terminal device 10 of the present embodiment includes a base plate 24, a vapor chamber 26, and a heat pipe 28. The base plate 24 is a third surface that straddles a first surface 24a as a heating element arranged inside the housing 10a, for example, a first surface 24a that contacts the CPU 20, a second surface 24b on the opposite side thereof, a first surface 24a, and a second surface 24b. It is a plate-shaped member having a surface 24c and having thermal conductivity. The vapor chamber 26 is a member provided with a heat conductive contact surface that covers the second surface 24b of the base plate 24. The heat pipe 28 has a first connecting portion 28a connected to the third surface 24c of the base plate 24 and a second connecting portion 28b connected to the heat conductive contact surface 26a of the vapor chamber 26 on one end side. The other end side extends to a position away from the heating element (for example, CPU 20). According to this configuration, when the heat dissipation structure 18 composed of the base plate 24, the vapor chamber 26, and the heat pipe 28 is attached to the CPU 20 which is a heating element, the thickness of the heat pipe 28 is added to the thickness in the stacking direction. Can be avoided. As a result, it is possible to suppress an increase in the thickness of the heat radiating structure 18 with respect to the heating element, thereby contributing to the thinning of the heat radiating structure 18 and the thinning of the tablet terminal device 10. Further, since the vapor chamber 26 and the heat pipe 28 enable heat transfer to a position separated from the heating element (CPU 20), efficient heat dissipation can be realized even in the case of a fanless structure.

Further, a graphite sheet 30 (heat dissipation sheet) that diffuses heat at the heat dissipation position is connected to the other end side (second end region portion 28d) of the heat pipe 28. According to this configuration, for example, the heat transferred through the heat pipe 28 is diffused in the plane direction of the graphite sheet 30. As a result, rapid heat diffusion can be easily performed over a wide range, and the formation of high temperature portions such as hot spots at the heat transport destination can be suppressed.

Further, the graphite sheet 30 (heat dissipation sheet) is arranged so as to be in surface contact with the surface of the battery 22 arranged in the housing 10a. According to this configuration, for example, in the housing 10a, the battery 22, which is a component having a smaller heat generation amount and a relatively large surface area than the high temperature portion of the CPU 20 or the like, absorbs heat transferred from the high temperature portion of the CPU 20 or the like. It can be diffused smoothly to dissipate heat.

Further, the graphite sheet 30C (heat dissipation sheet) includes a heat conductive metal plate 32 that comes into surface contact with the surface of the battery 22. According to this configuration, for example, the metal plate 32 can absorb the heat transferred to the graphite sheet 30C and promote the diffusion and heat dissipation of the heat to the battery 22.

Further, at least two heat pipes 28 are provided, and the first connection portion 28a of the heat pipe 28 is connected to different third surfaces 24c formed on the base plate 24, respectively. According to this configuration, for example, by connecting a plurality of heat pipes 28 to different third surfaces 24c of the base plate 24, heat can be efficiently absorbed from the base plate 24, and quick and smooth heat transfer can be realized.

In the above-described embodiment, the tablet terminal device 10 is shown as an example of the information processing device. In another example, as the information processing device, for example, an information processing device such as a notebook computer, a smartphone, a mobile phone, etc., which is required to be thin, the configuration of the present embodiment can be applied and the same effect can be obtained. be able to.

Although embodiments and modifications of the present invention have been described, these embodiments and modifications are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

10 ... Tablet terminal device, 10a ... Housing, 12 ... Display device, 18 ... Heat dissipation structure, 20 ... CPU (heating element), 22 ... Battery, 24 ... Base plate, 24a ... First surface, 24b ... Second surface, 24c ... 3rd surface, 26 ... Vapor chamber, 26a ... Heat conduction contact surface, 26b ... Outer wall part, 28, 28A, 28B ... Heat pipe, 28a ... 1st connection part, 28b ... 2nd connection part, 28c ... 1st End region, 28d ... Second end region, 30, 30A, 30B, 30C ... Graphite sheet (diffusion sheet), 32 ... Metal plate.

Claims (4)

A plate having thermal conductivity having a first surface in contact with a heating element arranged inside the housing, a second surface on the opposite side thereof, and a third surface straddling the first surface and the second surface. Base plate and
A vapor chamber having a heat conductive contact surface covering the second surface of the base plate,
A first connection portion connected to the third surface of the base plate and a second connection portion connected to the heat conduction contact surface of the vapor chamber are provided on one end side, and the other end side is from the heating element. A heat pipe that extends to a distant position,
Equipped with
An information processing apparatus in which at least two heat pipes are provided, and the first connection portion of the heat pipe is connected to different third surfaces formed on the base plate . The information processing apparatus according to claim 1, wherein a heat radiating sheet that diffuses heat at a heat radiating position is connected to the other end side of the heat pipe. The information processing apparatus according to claim 2, wherein the heat radiating sheet is arranged so as to be in surface contact with the surface of the battery arranged in the housing. The information processing apparatus according to claim 3, wherein the heat radiating sheet includes a thermally conductive metal plate that comes into surface contact with the surface of the battery.

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