JP2023081090A - Information processing device - Google Patents

Abstract

To provide an information processing device capable of securing sufficient heat radiation while reducing size and thickness.SOLUTION: An information processing device includes: a plate-like base plate including a first surface brought into contact with a heating element arranged inside a housing, a second surface on an opposite side from the first surface and a third surface straddling the first surface and the second surface to have thermal conductivity; a vapor chamber including a thermal conductive contact surface covering the second surface of the base plate; and a heat pipe having a first connection part connected to the third surface of the base plate and a second connection part connected to the thermal conductive contact surface of the vapor chamber on one end side, and having the other end side extending to a position separated from the heating element.SELECTED DRAWING: Figure 2

Description

An embodiment of the present invention relates to an information processing apparatus.

Conventionally, in information processing devices such as tablet terminals, notebook personal computers, and smartphones, efficient heat dissipation from heat-generating components mounted inside the housing, such as a CPU (Central Processing Unit), etc. It is important in terms of maintaining performance, improving quality, and suppressing deterioration. For this reason, an information processing apparatus has been proposed in which a heat dissipation structure using an electric fan or the like is provided inside the housing.

Japanese Patent No. 6370223

In recent years, the miniaturization and thinning of information processing equipment has been actively promoted, and along with the miniaturization of various component parts, the electric fan for heat dissipation, which is one of the causes of the increase in size, has been omitted. Proposals have been made to reduce the thickness of the structure. However, in the case of a fanless structure, it is difficult to secure a heat dissipation path and select a heat dissipation position. is the current situation.

Accordingly, one example of the problem to be solved by the present invention is to provide an information processing apparatus capable of securing sufficient heat dissipation while reducing the size and thickness of the apparatus.

The information processing device according to the first aspect of the present invention includes a first surface in contact with a heating element arranged inside a housing, a second surface opposite to the first surface, and the first surface and the second surface. a thermally conductive plate-like base plate comprising a third surface; a vapor chamber comprising a thermally conductive contact surface covering the second surface of the base plate; and a first connection connected to the third surface of the base plate. and a second connecting portion connected to the heat-conducting contact surface of the vapor chamber, the other end of the heat pipe extending to a position spaced apart from the heating element.

Further, the other end of the heat pipe of the information processing device may be connected to, for example, a heat dissipation sheet that diffuses heat at a heat dissipation position.

Further, the heat dissipation sheet of the information processing device may be arranged, for example, so as to be in surface contact with the surface of the battery arranged in the housing.

Further, the heat dissipation sheet of the information processing device may include, for example, a thermally conductive metal plate that is in surface contact with the surface of the battery.

Further, at least two heat pipes of the information processing device may be provided, for example, and the first connecting portions of the heat pipes may be connected to different third surfaces formed on the base plate.

According to the above aspect of the present invention, the heat pipe is connected to the third surface, that is, the side surface of the base plate. It is possible to suppress the influence on the thickness increase of. As a result, it is possible to suppress an increase in the thickness of the information processing device and contribute to the overall thickness reduction. In addition, since the vapor chamber and the heat pipe allow heat to be transported away from the heating element, efficient heat dissipation can be achieved even with a fanless structure.

FIG. 1 is an exemplary and schematic plan view showing the appearance of a tablet terminal device as an example of an information processing device according to an embodiment. FIG. 2 is an exemplary and schematic plan view showing a state in which the display device of the tablet terminal device of FIG. 1 is removed and the internal structure including the heat dissipation structure is exposed. FIG. 3 is an exemplary and schematic perspective view showing the heat dissipation structure of the information processing apparatus according to the embodiment. FIG. 4 is an exemplary and schematic perspective view showing the state of the heat dissipation structure shown in FIG. 3 as seen from the back side. FIG. 5 is an AA cross section of FIG. 4, and is an exemplary and schematic cross-sectional view for explaining the arrangement state and heat conduction state of the constituent members of the heat dissipation structure of the information processing apparatus according to the embodiment.

Illustrative embodiments of the invention are disclosed below. The configurations of the embodiments shown below and the actions, results, and effects brought about by the configurations are examples. The present invention can be realized by configurations other than those disclosed in the following embodiments, and at least one of various effects based on the basic configuration and derivative effects can be obtained. .

FIG. 1 is an exemplary and schematic plan view showing the appearance of a tablet terminal device 10 as an example of an information processing device according to an embodiment.

The tablet terminal device 10 includes a display device 12 such as an LCD (Liquid Crystal Display) or an OLED (Organic Light Emitting Diode). The display device 12 includes, for example, a display surface 12a covering substantially the entire surface of a thin rectangular housing 10a. On the side of the housing 10a, etc., a power switch (not shown), switches for realizing various functions such as volume adjustment, a speaker for outputting audio data, and the like are arranged. A lens unit (not shown) of an imaging unit is arranged on a part of the housing 10a on the display surface 12a side, a part of the rear surface side of the display surface 12a (the rear surface side of the housing 10a), or the like. The imaging unit is, for example, a digital camera incorporating an imaging element such as a CCD (Charge Coupled Device) or CIS (CMOS image sensor).

A display surface 12a of the display device 12 is covered with, for example, a capacitive touch panel 14 as a transparent input device. Therefore, the user of the tablet terminal device 10 can visually recognize various images (eg, icons, text, video content, etc.) displayed on the tablet terminal device 10 (display surface 12 a ) through the touch panel 14 . In addition, since the touch panel 14 is of a capacitive type, the user touches the position of the surface 14a (operation surface) of the touch panel 14 corresponding to the image displayed on the display surface 12a with a finger or a dedicated pen 16, By moving the finger or the pen 16 on the surface 14a, it is possible to select an image displayed on the display surface 12a or to draw characters, figures, etc. on the display surface 12a. In the example of FIG. 1, the pen 16 is detachably held on the side surface of the housing 10a of the tablet terminal device 10 or the like. The pen 16 can be held using a magnet, or held using a folder or the like, for example.

FIG. 2 is an exemplary and schematic plan view of the tablet terminal device 10 in FIG. 1 with the display device 12 (touch panel 14) removed. The internal structure, including structure 18, is shown exposed. In this specification, the X direction, Y direction and Z direction are defined for convenience. The X direction, Y direction, and Z direction are orthogonal to each other. The X direction is defined as −X direction and +X direction along the long side of the tablet terminal device 10 (housing 10a). The Y direction is defined as −Y direction and +Y direction along the short side of the tablet terminal device 10 (housing 10a). The Z direction is defined as the −Z direction toward the back side and the +Z direction toward the front side along the thickness of the tablet terminal device 10 (housing 10a).

In FIG. 2, for example, in the left region inside the tablet terminal device 10 biased toward the -X direction, as components for driving the tablet terminal device 10, a CPU 20, a ROM (Read Only Memory), a RAM ( Random Access Memory), a storage unit such as an SSD (Solid State Drive), a flash memory, a communication interface, etc. are mounted on the substrate. In addition, the battery 22 is arranged in the right side area of the inside of the tablet terminal device 10, for example, biased in the X direction, using most of the area. Since the battery 22 is arranged on the lower surface side of the heat dissipation structure 18, only a part of the battery 22 is shown in FIG. The battery 22 is, for example, a substantially rectangular part having long sides in the X direction and short sides in the Y direction. there is Note that the arrangement of each component is an example and can be changed as appropriate. By arranging small components such as board-mounted components on one side of the housing 10a and arranging large components such as a battery on the other side of the housing 10a, the space inside the housing 10a can be effectively utilized. .

By the way, among board-mounted components, the CPU 20 can be said to be one of the heating elements that generate the most heat when the tablet terminal device 10 is driven. In order to drive the tablet terminal device 10 satisfactorily and to prevent the user from feeling uncomfortable due to excessive heat generation, it is necessary to efficiently and quickly dissipate the heat generated in the heating element such as the CPU 20. desirable. Therefore, when the tablet terminal device 10 is driven in a high load state, rapid heat dissipation is particularly important. Moreover, it is desirable that the tablet terminal device 10 continuously and smoothly dissipate heat even when it is driven under a normal load.

Therefore, in the case of the tablet terminal device 10 of the present embodiment, the heat dissipation structure 18 is provided for quickly and continuously transporting the heat generated by the heat generating element to a position spaced apart from the heat generating element. As an example, the heat dissipation structure 18 shown in FIG. 2 dissipates the heat generated by the CPU 20, which generates a large amount of heat among the components mounted on the board arranged in the left side area biased in the −X direction inside the housing 10a. The heat is transferred to the battery 22 arranged in the right side area of the housing 10a biased in the X direction. The transported heat is diffused to the surface of the battery 22 and radiated to the display device 12 side mounted in the +Z direction and the back cover (back side of the housing 10a, etc.) present in the -Z direction. ing.

FIG. 3 is an exemplary schematic perspective view showing only the heat dissipation structure 18 shown in FIG. 4 is an exemplary and schematic perspective view showing the state of the heat dissipation structure 18 shown in FIG. 3 as seen from the back side. FIG. 5 is an AA cross section of FIG. 4, which is an exemplary and schematic cross-sectional view for explaining the arrangement state and heat conduction state of each constituent member constituting the heat dissipation structure 18. As shown in FIG.

The heat dissipation structure 18 of this embodiment is mainly composed of a base plate 24, a vapor chamber 26, and a heat pipe 28, as shown in FIGS.

The base plate 24 has a first surface 24a (see FIG. 4) in contact with the CPU 20, which is one of the heating elements arranged inside the housing 10a, and a second surface 24b (see FIG. 3) on the opposite side. It is a plate-shaped member having thermal conductivity and having a third surface 24c (see FIGS. 3 and 4) that straddles the first surface 24a and the second surface 24b. The base plate 24 can be made of, for example, a metal with high thermal conductivity such as copper or aluminum, or a resin material (such as a graphite sheet) containing a thermally conductive material such as graphite. The base plate 24 is sandwiched between the CPU 20 and the vapor chamber 26 and has a function of filling the gap between the CPU 20 and the vapor chamber 26 to improve thermal conductivity.

In this embodiment, the base plate 24 includes a leaf spring S that presses the first surface 24a of the base plate 24 against the contact surface of the CPU 20 (for example, the upper surface when mounted on a substrate). As shown in FIG. 4 and the like, in the case of this embodiment, leaf springs S are provided at four locations. A fixing hole Sa is formed on one end side of each leaf spring S. As shown in FIG. Then, it is fixed to the substrate or the like by a fastening member Sb (see FIG. 2) such as a screw inserted into the fixing hole Sa. The other end side of the leaf spring S abuts against the second surface 24b of the base plate 24, presses the base plate 24 against the CPU 20 using the springiness of the leaf spring S, and improves adhesion and heat resistance between the base plate 24 and the CPU 20. Improves conductivity.

The vapor chamber 26 includes a heat conducting contact surface 26a covering the second surface 24b of the base plate 24, as shown in FIGS. As shown in FIG. 5, the vapor chamber 26 is a hollow structure having an outer wall 26b made of thin metal foil such as copper or aluminum. etc.). By bringing the heat-conducting contact surface 26a of the vapor chamber 26 into contact with the surface of the heat source (in this case, the second surface 24b of the base plate 24 to which heat has been transferred from the CPU 20), the working fluid inside becomes vaporized vapor, and the internal space is expanded. It moves at high speed toward low temperature areas. Then, the vaporized operating liquid comes into contact with the outer wall portion 26b of the low temperature portion and is cooled and liquefied. The liquefied working liquid returns to the high temperature part due to capillary action. By repeating this process, the vapor chamber 26 transports heat from the high temperature section to the low temperature section.

The heat pipe 28 has a first connection portion 28a connected to the third surface 24c of the base plate 24 and a second connection portion 28a connected to the heat conducting contact surface 26a of the vapor chamber 26, as shown in FIGS. and a portion 28b in a first end region portion 28c on the one end side. A second end region portion 28d extending to a position spaced apart from the heating element (CPU 20) is provided on the other end side of the heat pipe 28 opposite to the first end region portion 28c. That is, the heat pipe 28 is an elongate tubular member having a first end region 28c at a high temperature portion where the heat generating element exists and a second end region 28d at a low temperature portion away from the heat generating element. .

The structure of the heat pipe 28 and the principle of heat transport are similar to those of the vapor chamber 26 . The heat pipe 28 is, for example, a tubular member made of metal with high thermal conductivity such as copper or aluminum. The inner wall of the heat pipe 28 has a capillary structure. A small amount of working fluid (for example, pure water) is sealed inside the heat pipe 28 in a decompressed state. When one end of the heat pipe 28 is heated, the working fluid immediately evaporates inside the reduced pressure, absorbing heat by transferring latent heat. The evaporated working fluid turns into a steam flow and moves to the low temperature side at high speed. The moved vapor touches the inner wall on the low temperature side and returns to the liquid while transferring heat (release of heat due to latent heat of condensation). The working fluid that has returned to liquid returns to the high temperature side (original position) along the capillary structure. The heat pipe 28 can repeat the above-described operation to transport heat from the high temperature section to the low temperature section.

As shown in FIGS. 4 and 5, the heat pipe 28 is thermally connected to the third surface 24c of the base plate 24. As shown in FIG. That is, the heat pipes 28 are connected to the side surfaces of the base plate 24 . As a result, when the heat dissipating structure 18 composed of the base plate 24, the vapor chamber 26, and the heat pipe 28 is attached to the CPU 20, which is a heating element, the thickness of the heat pipe 28 is added to the lamination thickness in the Z direction. can be avoided. In other words, the heat dissipation structure 18 suppresses an increase in the thickness in the Z direction with respect to the CPU 20 while ensuring the heat dissipation performance for rapid heat transport, thereby realizing a thin structure. As a result, it is possible to contribute to the thinning of the tablet terminal device 10 while ensuring and improving the heat dissipation characteristics of the tablet terminal device 10 . In FIG. 5, the thickness of the base plate 24 in the Z direction and the thickness of the heat pipe 28 in the Z direction are substantially the same. It may be equal to or less than the thickness of Also, the width of the heat pipe 28 in the Y direction can be appropriately set according to the required heat transport capacity (heat absorption capacity).

Moreover, since the vapor chamber 26 covers the entire base plate 24 (CPU 20 ), the heat generated by the CPU 20 can be smoothly and widely distributed throughout the vapor chamber 26 . As a result, it is possible to suppress the formation of hot spots due to the heat generated by the CPU 20 . Furthermore, the heat pipe 28 has a first connection portion 28a thermally connected to the third surface 24c (side surface) of the base plate 24, and a second connection portion 28b thermally connected to the heat conducting contact surface 26a of the vapor chamber 26. It is Therefore, the heat pipe 28 absorbs the heat generated by the CPU 20 through the base plate 24 and efficiently transfers the heat from the first end region 28c on one side to the second end region 28d on the other side. can be transported. In addition, the heat pipe 28 absorbs heat generated in the CPU 20 diffused in the vapor chamber 26, and efficiently transfers the heat from the first end region 28c to the second end region 28d. .

Further, as shown in FIG. 5, the heat pipe 28 is arranged so as to be in contact with the base plate 24 and to be wrapped in the vapor chamber 26, so that the heat generated by the CPU 20 is effectively absorbed and the heat pipe 28 is Heat transport capacity can be effectively utilized. Therefore, it is possible to more effectively suppress the formation of hot spots around the CPU 20 . That is, in the heat dissipation structure 18, the heat pipes 28 are arranged such that the heat transport capability of the heat pipes 28 can be sufficiently exhibited. In this way, since heat can be efficiently transported by the vapor chamber 26 and the heat pipe 28 that are in contact with the base plate 24, even if the tablet terminal device 10 (CPU 20) with a fanless structure is driven in an overloaded state, the heat can be effectively dissipated. can be done effectively and quickly. In other words, it is possible to use the fanless tablet terminal device 10 (CPU 20) for a long time in an overloaded state. Moreover, even when the tablet terminal device 10 (CPU 20) having a fanless structure is driven under a normal load state, good heat dissipation can be performed smoothly.

In addition, in the case of the present embodiment, an example in which two heat pipes 28 are provided is shown. The two heat pipes 28 are connected to different third surfaces 24c of the base plate 24 at first connection portions 28a. As shown in FIG. 4, one side portion 24c1 of the substantially rectangular base plate 24 is connected to the first connection portion 28a of one heat pipe 28A. A side portion 24c2 of the base plate 24 facing the side portion 24c1 is connected to the first connection portion 28a of the other heat pipe 28B. By connecting the two heat pipes 28A and 28B to opposite positions of the base plate 24 in this way, compared to the case of connecting the two heat pipes 28A and 28B to positions close to the base plate 24 (for example, the adjacent third surface 24c), the base plate 24 can be efficiently absorbed, and quick and smooth heat transport can be realized. Further, as shown in FIGS. 2, 4, etc., the second end region 28d of the heat pipe 28A and the second end region 28d of the heat pipe 28B are routed to separate positions in the Y direction. there is As a result, the transported heat can be radiated from positions separated from each other, and it is easy to avoid concentration of heat distribution due to heat radiation.

The number of heat pipes 28 arranged can be changed as appropriate, and may be one or three or more. When connecting the first connecting portion 28a of the heat pipe 28 to the third surface 24c of the base plate 24, the position is not limited to that shown in FIG. It may be connected to the third surface 24c at another position, and similar effects can be obtained.

Further, in the case of the heat dissipation structure 18 of the present embodiment, a heat dissipation sheet for more efficiently diffusing heat at the heat dissipation position (heat transport destination) is provided on the other end side (second end region portion 28d) of the heat pipe 28. , for example, a graphite sheet 30 is connected. The graphite sheet 30 is a thin sheet of graphite (plumbago), which is an allotrope of carbon, and has high thermal conductivity in the planar direction.

The heat transported by the heat pipe 28 is transferred to the graphite sheet 30 and diffused, and radiated to the back cover side of the housing 10a through the surface of the battery 22. As shown in FIG. Similarly, the heat transferred to the graphite sheet 30 is transferred to the display device 12 attached to the housing 10a and radiated. As described above, the battery 22 is a large component in the housing 10a, has a large surface area, and generates less heat than the CPU 20 and the like during operation. be able to. Therefore, the heat transported from the high-temperature part such as the CPU 20 can be easily absorbed, smoothly diffused, and released.

As shown in FIGS. 2 and 4, a graphite sheet 30A is connected to the second end region 28d of the heat pipe 28A. A graphite sheet 30B is connected to the second end region 28d of the heat pipe 28B. As a result, the heat transported through the heat pipe 28A diffuses from the +Y direction side to the surface direction of the graphite sheet 30A through the graphite sheet 30A, and the heat transported through the heat pipe 28B diffuses into the graphite sheet 30A. 30B, it diffuses in the plane direction of the graphite sheet 30B from the -Y direction side. As a result, rapid heat diffusion can be easily performed over a wide range, and the formation of hot spots such as hot spots at the destination of heat transfer can be suppressed. Moreover, heat can be diffused substantially evenly and over a wide range with respect to the battery 22 with which the graphite sheet 30A contacts and the battery 22 with which the graphite sheet 30B contacts. becomes difficult. As a result, uneven deterioration of the battery 22 can be easily suppressed, and deterioration of the battery 22 attached to the tablet terminal device 10 can be suppressed as a whole.

In the case of the heat dissipation structure 18 of the present embodiment, the graphite sheet 30 (heat dissipation sheet) may be provided with a metal plate in order to further improve heat dissipation efficiency. As shown in FIG. 4, as an example, a graphite sheet 30C is provided in a state of being connected to the graphite sheet 30A, and a metal plate 32 made of copper, aluminum, or the like having high thermal conductivity is connected to the graphite sheet 30C. It is That is, the graphite sheet 30</b>C has the metal plate 32 in surface contact with the surface of the battery 22 . The metal plate 32 can absorb the heat transported to the graphite sheet 30</b>C and promote the diffusion and heat dissipation of the heat to the battery 22 . In addition, in the case of FIG. 4, the metal plate 32 is arranged on a part of the graphite sheet 30C, but it may be arranged on the entire surface of the graphite sheet 30C. Moreover, in the case of FIG. 4, a part of the metal plate 32 protrudes from the graphite sheet 30C and is formed so as to be connectable to parts other than the battery 22 as well. As a result, the metal plate 32 can transport the heat transported by the heat pipe 28A not only to the battery 22, but also to the members around the battery 22, the wall surface of the housing 10a, etc., further improving the high thermal efficiency. be able to. In this embodiment, the graphite sheet 30C including the metal plate 32 is connected only to the graphite sheet 30A side. It can be appropriately selected depending on (heat distribution, etc.). For example, the metal plate 32 may be connected to the graphite sheet 30B side, or may be connected to both sides, and similar effects can be obtained. Moreover, the metal plate 32 may be attached to the graphite sheet 30A or the graphite sheet 30B, and the same effect can be obtained.

As described above, the tablet terminal device 10 of this embodiment includes the base plate 24 , the vapor chamber 26 and the heat pipes 28 . The base plate 24 has a first surface 24a in contact with, for example, the CPU 20 as a heating element arranged inside the housing 10a, a second surface 24b on the opposite side, and a third surface bridging the first surface 24a and the second surface 24b. It is a plate-shaped member having heat conductivity and a surface 24c. The vapor chamber 26 is a member having a heat-conducting contact surface covering the second surface 24b of the base plate 24. As shown in FIG. The heat pipe 28 has a first connection portion 28a connected to the third surface 24c of the base plate 24 and a second connection portion 28b connected to the heat-conducting contact surface 26a of the vapor chamber 26 on one end side, The other end extends to a position spaced apart from the heating element (for example, CPU 20). According to this configuration, when the heat dissipating structure 18 composed of the base plate 24, the vapor chamber 26, and the heat pipes 28 is attached to the CPU 20, which is a heating element, the thickness of the heat pipes 28 is added to the thickness in the stacking direction. can be avoided. As a result, it is possible to suppress an increase in the thickness of the heat dissipation structure 18 with respect to the heating element, thereby contributing to a reduction in the thickness of the heat dissipation structure 18 and thus a reduction in the thickness of the tablet terminal device 10 . In addition, since the vapor chamber 26 and the heat pipe 28 enable heat transfer to a position away from the heating element (CPU 20), efficient heat dissipation can be achieved even in the case of a fanless structure.

A graphite sheet 30 (radiation sheet) that diffuses heat at the heat radiation position is connected to the other end of the heat pipe 28 (second end region 28d). According to this configuration, for example, the heat transported via the heat pipe 28 is diffused in the plane direction of the graphite sheet 30 . As a result, rapid heat diffusion can be easily performed over a wide range, and the formation of hot spots such as hot spots at the destination of heat transfer can be suppressed.

Further, the graphite sheet 30 (heat radiation sheet) is arranged so as to be in surface contact with the surface of the battery 22 arranged inside the housing 10a. According to this configuration, for example, in the housing 10a, the heat transported from the high temperature section such as the CPU 20 is absorbed by the battery 22, which is a component having a relatively large surface area and generating less heat than the high temperature section such as the CPU 20. The heat can be smoothly diffused to dissipate the heat.

Also, the graphite sheet 30C (radiating sheet) includes a thermally conductive metal plate 32 that is in surface contact with the surface of the battery 22 . According to this configuration, for example, the metal plate 32 can absorb the heat transported to the graphite sheet 30</b>C and promote the diffusion and heat dissipation of the heat to the battery 22 .

At least two heat pipes 28 are provided, and the first connecting portions 28a of the heat pipes 28 are connected to different third surfaces 24c formed on the base plate 24, respectively. According to this configuration, for example, by connecting a plurality of heat pipes 28 to different third surfaces 24c of the base plate 24, heat can be efficiently absorbed from the base plate 24, and rapid and smooth heat transport can be realized.

In addition, in the above-described embodiment, the tablet terminal device 10 is shown as an example of the information processing device. In another example, the configuration of the present embodiment can be applied to any information processing device that requires thinness, such as a notebook computer, a smart phone, or a mobile phone, and similar effects can be obtained. be able to.

While embodiments and variations of the invention have been described, these embodiments and variations are provided by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the scope of the invention described in the claims and equivalents thereof.

DESCRIPTION OF SYMBOLS 10... Tablet terminal device, 10a... Housing, 12... Display device, 18... Heat dissipation structure, 20... CPU (heat generating element), 22... Battery, 24... Base plate, 24a... First surface, 24b... Second surface, 24c...Third surface 26...Vapor chamber 26a...Heat conduction contact surface 26b...Outer wall part 28, 28A, 28B...Heat pipe 28a...First connection part 28b...Second connection part 28c...First end region 28d second end region 30, 30A, 30B, 30C graphite sheet (diffusion sheet) 32 metal plate;

The information processing device according to the first aspect of the present invention includes a first surface in contact with a heating element arranged inside a housing, a second surface opposite to the first surface, and the first surface and the second surface. a thermally conductive plate-like base plate comprising a third surface; a vapor chamber comprising a thermally conductive contact surface covering the second surface of the base plate; and a first connection connected to the third surface of the base plate. and a second connecting portion connected to the heat-conducting contact surface of the vapor chamber, the other end of the heat pipe extending to a position spaced apart from the heating element. At least two heat pipes are provided, and the first connection portions of the heat pipes are respectively connected to different third surfaces formed on the base plate.

Claims (5)

A thermally conductive plate having a first surface in contact with a heat generating element arranged inside a housing, a second surface opposite to the first surface, and a third surface straddling the first surface and the second surface. a base plate of
a vapor chamber comprising a heat-conducting contact surface overlying the second surface of the base plate;
A first connecting portion connected to the third surface of the base plate and a second connecting portion connected to the heat-conducting contact surface of the vapor chamber are provided on one end side, and the other end side is connected to the heating element. a heat pipe extending to a spaced location;
An information processing device. 2. The information processing apparatus according to claim 1, wherein said other end of said heat pipe is connected to a heat dissipation sheet that diffuses heat at a heat dissipation position. 3. The information processing apparatus according to claim 2, wherein said heat dissipation sheet is arranged so as to be in surface contact with a surface of a battery arranged in said housing. 4. The information processing apparatus according to claim 3, wherein said heat radiation sheet comprises a thermally conductive metal plate in surface contact with said surface of said battery. 5. Any one of claims 1 to 4, wherein at least two heat pipes are provided, and the first connecting portions of the heat pipes are respectively connected to different third surfaces formed on the base plate. The information processing device according to the item.

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