JP2010251386A - Electronic apparatus with thermal diffusion member, method of manufacturing electronic apparatus with thermal diffusion member, and thermal diffusion member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus with a thermal diffusion member capable of uniformly and efficiently diffusing heat generated by a heat generating component etc., from an external surface of a housing, to provide a method of manufacturing the electronic apparatus with the thermal diffusion member, and to provide the thermal diffusion member. <P>SOLUTION: The electronic apparatus includes the thermal diffusion member 5 capable of dissipating the heat of the heat generating component 3 to the housing 1, wherein the thermal diffusion member 5 includes a thermal diffusion layer 51 and a partial insulation layer 52 and is formed in a nearly uniform thickness. The side which has the partial insulation layer 52 of the thermal diffusion member 5 is thermally coupled to an internal wall surface of the housing 1, and the side which has the diffusion layer of the thermal diffusion member 5 is thermally coupled to the heat generating component 3 (Fig.1(a)). <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  An object of the present invention is to provide an electronic device including a heat diffusing member, a method of manufacturing an electronic device including a heat diffusing member, and a heat diffusing member.

  In recent electronic devices such as mobile terminals, the temperature rise of the casing due to heat generation of internal parts has become a problem due to downsizing and thinning, and heat diffusion of heat generation of heat generation parts to the outside of the housing has become important. ing.

  FIG. 10 is a diagram showing a configuration example of thermal diffusion of heat-generating components of a portable terminal according to the related art of the present invention, and FIG. 11 is a diagram showing a surface temperature distribution of the casing of the portable terminal by the thermal diffusion shown in FIG.

  In the portable terminal shown in FIG. 10, a printed wiring board 2 in which a heat generating component 3 and another component 4 are mounted is disposed inside a housing 1. Further, the upper surface of the thermal diffusion sheet 50 is thermally connected to the upper rear surface of the housing 1, and the upper surface of the heat generating member 3 is thermally connected to a part of the lower surface of the thermal diffusion sheet 50.

  With the above configuration, the heat generated in the heat generating component 3 is conducted to the heat diffusion sheet 50 as shown by the arrow, and the heat conducted to the heat diffusion sheet 50 is thermally diffused in the surface direction, as shown in FIG. Then, heat is radiated from the inner wall at the top of the housing 1 to the outer surface of the housing through the outer wall (surface).

  12A and 12B are diagrams showing a configuration example of heat diffusion of a heat-generating component of an electronic device according to another related technology of the present invention, where FIG. 12A is a cross-sectional view and FIG. 12B is an exploded view. As shown in FIG. 12 (a), the housing 1, the substrate 2 on which the heat generating component 3 is mounted, the pressing member 17 on the inner wall surface 18 of the housing 1 corresponding to the heat generating component 3 on the housing 1, and the pressing The heat diffusion sheet 16 is coated and adhered to a region including the member 17.

  Here, the heat diffusion sheet 16 has a cut 19 that intersects the region corresponding to the heat generating component 3, and the heat diffusion sheet 16 covers the inner wall surface 18 of the housing 1 and the pressing member 17 thereon. In this case, the notch 19 spreads, and as shown in FIG. 12B, the notch 19 forms the mountain-shaped storage portion 20.

  For this reason, it is possible to suppress a gentle inclined shape from appearing in the thermal diffusion sheet 16 in the vicinity of the mountain-shaped storage unit 20 that stores the pressing member 17. In addition, the use of the heat diffusion sheet 16 made of a resin material or an anisotropic heat transfer material can gently change the surface temperature of the housing (Patent Document 1).

Japanese Patent Laid-Open No. 11-229287

  Since the heat generated inside the casing of the portable terminal or the like is radiated from the casing surface without fail, if the partial heat generation can be dispersed, the temperature of the maximum temperature portion can be reduced. However, in the thermal diffusion using the thermal diffusion sheet 50 as shown in FIG. 10, sufficient heat diffusion performance cannot be obtained due to the thinning of the casing, so that a temperature difference is generated on the surface of the casing 1 as shown in FIG. 11. The high-temperature part 13a, middle-high-temperature part 13b, and low-temperature part 13c having a large size may cause a sense of incongruity to the user, and there is a risk that only the upper part of the heat-generating component becomes extremely hot.

  This is because the thermal diffusion in the surface direction of the thermal diffusion sheet 50 cannot be made uniform, and the thermal conductivity 15 cannot be averaged as shown in FIG. This is because the temperature becomes extremely high and a high temperature portion is generated around a position where the heat generating component 3 is located on the outer surface of the upper portion of the casing 1.

  As described above, in the related art of the present invention shown in FIG. 10, although heat diffusion in the surface direction by the heat diffusion sheet 50 is possible, since heat diffusion is not uniform enough, heat is generated above the heat generating component of the housing. Concentrate.

  Further, in the related art of the present invention configured to cover the pressing member 17 shown in FIG. 12 with the heat diffusion sheet 16, it is necessary to form a cut 19 that intersects the heat diffusion sheet 16. This is not only difficult due to (flexibility), but also difficult to realize sufficient bending of the heat diffusion sheet 16 around the pressing member 17 and adhesion to the wall surface 18 of the housing. In addition, efficient heat dissipation from the heat diffusion sheet to the wall surface of the housing is also insufficient.

(Object of invention)
An object of the present invention is to solve the above problems, and an electronic device including a heat diffusing member that enables heat generated from a heat-generating component or the like to be uniformly or efficiently diffused from the outer surface of the housing, It is in providing the manufacturing method of an electronic device provided with a thermal-diffusion member, and a thermal-diffusion member.

An electronic device comprising the heat diffusing member of the present invention is an electronic device comprising a heat diffusing member that radiates the heat of the heat-generating component to the housing,
The heat diffusing member includes a heat diffusing layer and a partial heat insulating layer, is formed to have a substantially uniform thickness, and the side having the partial heat insulating layer of the heat diffusing member is thermally applied to the inner wall surface of the casing. The side having the heat diffusion layer of the heat diffusion member is thermally coupled to the heat generating component.

  The manufacturing method of an electronic device including the heat diffusion member of the present invention is a manufacturing method of an electronic device including a heat diffusion member that dissipates heat of a heat-generating component to a housing, and includes a heat diffusion layer and a partial heat insulating layer. A first step of manufacturing a heat diffusion member formed substantially uniformly, and a side having a partial heat insulating layer of the heat diffusion member is thermally coupled to an inner wall surface of the housing, and heat of the heat diffusion member is obtained. And a second step of thermally coupling the side having the diffusion layer with the heat generating component.

  The heat diffusing member of the present invention comprises a heat diffusing layer and a partial heat insulating layer, and is characterized in that the thickness is formed substantially uniformly.

  According to the present invention, the heat diffusion layer side of the heat diffusion member, which is composed of the heat diffusion layer and the partial heat insulation layer and has a substantially uniform thickness, is thermally coupled to the inner wall surface of the housing, and the heat diffusion layer side is By being thermally coupled to the heat-generating components in the housing, it is possible to dissipate heat more uniformly from the outer surface of the housing than in the case of only the heat diffusion sheet, and to efficiently diffuse the heat generation.

  Moreover, since the heat diffusing member is configured to have a substantially uniform thickness, the heat diffusing member can be closely adhered to the inner wall surface of the housing without any gap, so that heat can be efficiently radiated. Further, by forming the heat diffusing member into a sheet shape, the heat diffusing member can be mounted regardless of the shape of the wall surface of the housing, and heat can be diffused without greatly increasing the thickness of the apparatus.

  Furthermore, since the material, shape, and arrangement of each layer can be easily changed in design, it is possible to easily adjust the required diffusion performance according to the arrangement of parts and the amount of heat generated by the parts.

FIG. 1 is a diagram showing the configuration of the first exemplary embodiment of the present invention. FIG. 2 is a diagram showing a cross-sectional structure of a housing according to the second embodiment of the present invention. FIG. 3 is a diagram illustrating a configuration of the heat diffusion member of the second embodiment. FIG. 4 is a view showing the temperature distribution of the heat diffusing member of the second embodiment. FIG. 5 is a diagram showing a cross-sectional structure of a housing according to the third embodiment of the present invention. FIG. 6 is a diagram showing a cross-sectional structure of a housing according to the fourth embodiment of the present invention. FIG. 7 is a diagram showing a cross-sectional structure of a housing according to the fifth embodiment of the present invention. FIG. 8 is a view showing a cross-sectional structure of a housing according to the sixth embodiment of the present invention. FIG. 9 is a diagram showing a cross-sectional structure of a housing according to the seventh embodiment of the present invention. FIG. 10 is a diagram showing a configuration example of heat diffusion of the heat generating component of the portable terminal according to the related art of the present invention. FIG. 11 is a view showing the surface temperature distribution of the casing of the portable terminal by the thermal diffusion shown in FIG. FIG. 12 is a diagram showing a configuration example of heat diffusion of a heat generating component of an electronic device according to another related technology of the present invention.

(First embodiment)
A first embodiment of the present invention will be described below.

  FIG. 1 is a diagram showing an electronic device including a heat diffusion member of the present invention, a method of manufacturing an electronic device including a heat diffusion member, and a configuration of a first embodiment of the heat diffusion member, and (a) is a cross-sectional structure of the electronic device. (B) is a manufacturing method of an electronic device, (c) is a thermal diffusion member.

  The electronic device according to the first embodiment of the present invention is an electronic device including a heat diffusing member 5 that dissipates heat of the heat generating component 3 on the printed wiring board 2 and the like to the housing 1 as shown in FIG. The heat diffusing member 5 is composed of a heat diffusing layer 51 and a partial heat insulating layer 52. For example, the heat diffusing member 5 is formed to have a substantially uniform thickness by a heat conductive layer 53 or the like. The side having the layer 52 is thermally coupled to the inner wall surface of the housing 1, and the side having the thermal diffusion layer of the thermal diffusion member 5 is thermally coupled to the heat generating component 3.

  The electronic device manufacturing method (manufacturing method) according to the first embodiment of the present invention is a manufacturing method of an electronic device that radiates heat of a heat-generating component to a housing as shown in FIG. A first step s1 for producing a heat diffusion member comprising a partial heat insulation layer and having a substantially uniform thickness; and the side of the heat diffusion member having the partial heat insulation layer is heated on the inner wall surface of the housing. And a second step s2 in which the side having the thermal diffusion layer of the thermal diffusion member is thermally coupled to the heat-generating component.

  As shown in FIG. 1C, the heat diffusing member of the present invention includes a heat diffusing layer 51 and a partial heat insulating layer 52. The heat diffusing member has a configuration in which the thickness is formed substantially uniformly by, for example, a heat conductive layer 53 or the like. .

(Second Embodiment)
A second embodiment of the present invention will be described below. The second embodiment is a configuration example in which a temperature rise of a casing due to heat generation of electrical components is efficiently dispersed in a portable terminal such as a cellular phone.

(Description of configuration)
FIG. 2 is a diagram showing a cross-sectional structure of the casing of the mobile terminal according to the second embodiment of the present invention.

  A printed wiring board 2 in which a heat generating component 3 and a component 4 that does not generate heat or a small amount of heat generation are mounted in the housing 1 of the portable terminal of the second embodiment, and the housing 1 and the components of the printed wiring board 2 A heat diffusion member 6 is built in between.

  Here, the heat diffusing member 6 includes a heat diffusing sheet 61 as a heat diffusing layer, a heat insulating sheet 62 partially provided as a heat insulating layer, and a heat conductive sheet 63 as a heat conductive layer. The heat diffusing sheet 61 side of the diffusing member 6 is thermally connected to the heat generating component 3, and the heat insulating sheet 62 and the heat conducting sheet 61 side of the heat diffusing member 6 are thermally connected to the inner wall surface of the housing 1. That is, between the inner wall surface of the housing 1 and the heat generating component 3 and between the inner wall surface of the housing 1 and the component 4 that does not generate heat, the heat diffusion sheet 62, the heat conductive sheet 63, and the heat insulating sheet 61 are inserted. The upper surface of 3 is thermally connected to the lower surface of the thermal diffusion sheet 62.

  FIG. 3 is a view showing a detailed structure of a heat diffusion member used in the second embodiment, wherein (a) is a front view and (b) is a sectional view. When the heat diffusion sheet 61 is mounted on a portable terminal, a heat insulating sheet 62 is pasted at a location corresponding to the upper periphery of the heat generating component, and a heat conductive sheet 63 is pasted at other locations, so that the thickness is substantially uniform. It is configured as.

  The heat diffusion sheet 61 is made of a material having a high thermal conductivity in the plane direction and a low thermal conductivity in the thickness direction, such as a graphite sheet. For the heat conductive sheet 63, a material having high heat conductivity in all directions or thickness directions is used. For the heat insulating sheet 62, a material having a low thermal conductivity in all directions or in the thickness direction is used.

  In the configuration example shown in FIGS. 2 and 3, a heat insulating sheet 62 is disposed on and around the heat generating component 3, and a heat conductive sheet 63 is disposed on the upper portion of the component 4 that does not generate heat.

  As described above, the heat-insulating sheet 62 is disposed on and around the heat-generating component 3 of the present embodiment, and the heat-conductive sheet 63 is disposed on the non-heat-generating component 4 and the like. Compared with the case where thermal diffusion is performed only with the diffusion sheet 61, it is possible to average the temperature rise of the housing 1 and efficiently diffuse the heat.

(Description of operation)
Next, the operation of the second embodiment of the present invention will be described.

  FIG. 4 is a view showing a temperature distribution of the thermal diffusion sheet of the second embodiment. The heat generated in the heat generating component 3 is diffused in the surface direction by the heat diffusion sheet 61. Further, since the temperature distribution of the heat diffusion sheet 61 cannot be made uniform in the surface direction, the temperature distribution is higher as it is closer to the heat-generating component 3 and lower as it is farther from the heat-generating component 3, and includes the area including the region where the heat-generating component 3 is connected. The region becomes the high temperature part 11a, the periphery thereof becomes the medium high temperature part 11b, and the other region becomes the low temperature part 11c.

  In the second embodiment of the present invention, as shown in FIG. 2, since the heat insulating sheet 62 is provided between the housing 1 and the heat diffusion sheet 61 around the upper part of the heat generating component 3, the heat diffusion sheet 61 becomes high temperature. However, it is difficult for heat to be directly transmitted to the casing 1, and since there is a heat conductive sheet 63 at a place other than the upper part of the heat generating component 3, even if the heat diffusion sheet 61 is at a low temperature, the heat is not transmitted to the casing 1. Easy to communicate. Therefore, the heat generated in the casing 1 is not concentrated on the upper part of the heat generating component 3 but is distributed over the entire casing 1.

  By disposing the heat insulating sheet 62 in a range corresponding to the region of the high temperature portion 11a in this way, the amount of heat conduction from the high temperature portion 11a to the inner wall surface of the housing is suppressed, and heat is generated from the middle and high temperature portions 11b and 11c. The amount of heat conduction to the inner wall surface of the housing 1 is made efficient through the conductive sheet 63, and the heat conduction amount 15 is controlled to be uniform in a range where the heat diffusion sheet 61 is thermally connected to the inner wall surface of the housing 1. be able to.

  With the configuration and control as described above, it is possible to make the temperature distribution in the surface direction of the heat conduction amount to the housing surface uniform as shown by the length of the arrow 15 in FIG. Moreover, since the heat diffusing member 6 can be made to adhere to the inner wall surface of the housing 1 without a gap by configuring the heat diffusing member 6 to have a substantially uniform thickness, it is possible to efficiently dissipate heat.

(Third embodiment)
In 2nd Embodiment, although the example which comprised the thermal-diffusion member by the heat insulation sheet, the thermal-diffusion sheet, and the heat conductive sheet was shown, as the 3rd Embodiment of this invention, the shape of a thermal-diffusion sheet was devised and it insulated. It can be set as the structure of the thermal diffusion member using a sheet | seat and a thermal diffusion sheet.

  FIG. 5 is a diagram showing a cross-sectional structure of a mobile terminal according to the third embodiment of the present invention. The same components as those in the second embodiment are denoted by the same reference numerals.

  The heat diffusing member 7 of the third embodiment is composed of a heat diffusing sheet 71 and a heat insulating sheet 72, forming a recess in a region located in the heat generating component 3 of the heat diffusing sheet 71, and a heat insulating sheet in the region of the recess. 72 is embedded to obtain a substantially uniform thickness.

  Even in the configuration of the third embodiment, since the heat insulating sheet 72 exists above the heat generating component 3 of the heat diffusing member 7, it is possible to prevent only the casing above the heat generating component 3 from generating heat to a high temperature. Since the heat is directly transferred from the heat diffusion sheet 71 to the housing 1 in the portion where the heat insulating sheet 72 is not provided, it is possible to disperse the temperature rise of the housing 1 as in the second embodiment.

  In the third embodiment, there is an advantage that the cost can be reduced by reducing the heat conductive sheet as a heat diffusion component.

(Fourth embodiment)
As a fourth embodiment of the present invention, the heat diffusing member can be constituted by a heat diffusing sheet and a heat conducting sheet, and the heat insulating sheet can be reduced.

  FIG. 6 is a diagram showing a cross-sectional structure of a mobile terminal according to the fourth embodiment of the present invention. The same components as those in the above embodiment are indicated by the same reference numerals.

  In the fourth embodiment, the heat diffusing member 8 includes a heat diffusing sheet 81 and a heat conducting sheet 83, and the space (air) layer 82 is used as a heat insulating layer at the position of the heat generating component 3 of the heat diffusing sheet 81. Configure.

  Since the space 82 exists on the housing 1 side of the heat diffusion sheet 81 above the heat generating component 3 and the thermal conductivity of air is low, it is possible to prevent only the casing 1 above the heat generating component 3 from becoming high temperature. . In addition, a heat conductive sheet 83 is attached to other portions, and heat can easily be transmitted to the housing 1 in the portions, so that partial temperature rise of the housing 1 can be dispersed.

(Fifth embodiment)
As a fifth embodiment of the present invention, the heat diffusing member can be composed of a heat diffusing sheet and air to reduce the heat insulating sheet.

  FIG. 7 is a diagram showing a cross-sectional structure of a mobile terminal according to the fifth embodiment of the present invention. The same components as those in the above embodiment are indicated by the same reference numerals.

  In the fifth embodiment, the heat diffusing member 9 includes a heat diffusing sheet 91 and a space (air) 92 provided at the position of the heat generating component 3, and the space 92 is used as a heat insulating layer.

  The fifth embodiment also has an advantage that the cost can be reduced by reducing the heat conductive sheet as a component of thermal diffusion.

(Sixth embodiment)
The utilization form of the heat diffusing member of the present invention can be appropriately changed according to the thickness and material of the housing, the heat conduction characteristics, and the like. This is because the amount of heat transfer varies depending on the thickness and material of the housing wall. This is because the heat generation in the thermal connection region of the housing of the heat diffusing member can be made uniform.

  FIG. 8 is a view showing a cross-sectional structure of a housing according to the sixth embodiment of the present invention. The same components as those in the above embodiment are indicated by the same reference numerals. In the present embodiment, the structure of the casing wall of the casing 1 is an example in which a thick portion of the casing exists above the heat generating component 3. The heat diffusing member 10 similar to that of the third embodiment is used, and the heat insulating sheet 102 of the heat diffusing sheet 101 is disposed not at the top of the heat generating component 3 but at a location where the thickness of the housing 1 is thin. .

  In the case of such a housing structure, although the heat generated in the heat generating component 3 is diffused by the heat diffusion sheet 101, the heat is not easily transmitted to the surface of the housing in a thick portion, and in other portions where the thickness of the housing is thin. Heat inside the case is easily transferred to the surface of the case. For this reason, the temperature rise on the surface of the housing can be made uniform by adding the heat insulating sheet 102 to the portion where the thickness of the housing is thin.

  In the sixth embodiment, even if the thickness of the frame wall is the same, even when a difference in heat transfer amount occurs partially depending on the material used for the frame wall, the same is achieved by appropriately setting the position of the heat insulating sheet 102. Can be implemented.

  It is apparent that the sixth embodiment can be implemented using the heat diffusing member having the configuration of the second, fourth, and fifth embodiments.

(Seventh embodiment)
In the above embodiment, the example of each combination of the members of the heat diffusion layer, the heat insulation layer, and the heat conduction layer is shown for the heat diffusion member, but the member of the heat diffusion layer, the heat insulation layer, and the heat conduction layer for one heat diffusion member. It is possible to constitute a plurality of combinations.

  FIG. 9 is a diagram showing a cross-sectional structure of a housing according to the seventh embodiment of the present invention. The same components as those in the above embodiment are indicated by the same reference numerals. The present embodiment is an example using a heat diffusion member 11 in which a heat insulating layer of a single heat diffusion sheet is composed of a heat insulating sheet and a space. The heat diffusing member 11 includes a heat diffusing sheet 111, a heat conducting sheet 113, and a heat insulating layer, and the heat insulating layer is constituted by a heat insulating sheet 112a at the top of the heat generating component 3 and a space 112b at the position of another casing.

  It is obvious that the seventh embodiment can be similarly implemented by combining the configurations of the heat diffusion sheets of the second to fifth embodiments.

(Other embodiments)
Furthermore, the use form of the heat diffusion member of the present invention can be changed as appropriate according to the use form of the user's portable terminal or the like. For example, when a user grips a mobile terminal with his / her hand and uses it, the lower part of a part where a metal with high thermal conductivity to the hand is exposed compared to a resin case, etc. Depending on the structure of the housing (design) and the thickness of the insertable layer (sheet), such as providing a heat insulating layer (sheet), etc. Various configurations can be changed by controlling how heat is transmitted from the upper heat generating component to the housing.

  In the embodiment described above, at least one of the heat diffusion layer (sheet), the heat conduction layer (sheet), and the heat insulation layer (sheet) can be constituted by a sheet-like member, and at least one of them can be used. It can comprise so that it may serve as an adhesive tape.

  For example, if the heat diffusion member is a heat diffusion sheet member or the like by adhering a heat conductive sheet and a heat insulating sheet that also serve as a double-sided adhesive tape to the heat diffusion layer (sheet), manufacturing can be facilitated. Furthermore, it can be configured to also serve as an adhesive tape for fixing the housing 1 and the heat generating component 3.

  In addition, since the heat conductive sheet and the heat insulating sheet only need to have sufficiently different thermal conductivities, the heat conductive sheet and the heat insulating sheet are not necessarily limited to specially made sheets, but are general adhesive sheets, A sheet having a high thermal conductivity can be used as the sheet, and a sheet having a low thermal conductivity can be used as the heat insulating sheet.

  Furthermore, as a heat conductive sheet and a heat insulation sheet, it can comprise so that heat diffusion can be performed more efficiently by combining 3 or more types of sheet | seats from which heat conductivity differs.

  As described above, according to the present invention, by using a combination of a heat diffusion layer (sheet), a heat insulating layer (sheet), and a heat conductive layer (sheet), it is possible to make the surface temperature distribution of the housing uniform and more efficient. It is possible to provide a structure capable of diffusing the heat of the casing.

  In particular, by configuring the heat diffusing member as a sheet, the heat diffusing member can be installed regardless of the wall shape of the housing, and heat can be diffused without increasing the thickness of the apparatus.

  In addition, since the material, shape, and arrangement of each sheet can be easily changed, the required diffusion performance can be realized according to the component arrangement and the amount of heat generated by the components.

  The present invention can be applied to general electronic devices in addition to portable electronic devices such as mobile phones, PHS, and portable TV game machines.

1 Housing 2 Printed wiring board (board)
3 Heat-generating component 4 Component 5, 6, 7, 8, 9, 10, 11 Thermal diffusion member 15 Thermal conductivity 16, 50, 61, 71, 81, 91, 101, 111 Thermal diffusion sheet 17 Pushing member 18 Inner wall surface 19 Notch 51 Thermal diffusion layer 52 Thermal insulation layer 53 Thermal conduction layer 62, 72, 102a, 112 Thermal insulation sheet 63, 83, 113 Thermal conduction sheet 82, 92, 112b Space (air)

Claims (26)

An electronic device including a heat diffusing member that radiates heat from a heat-generating component to a housing,
The heat diffusing member includes a heat diffusing layer and a partial heat insulating layer, is formed to have a substantially uniform thickness, and the side having the partial heat insulating layer of the heat diffusing member is thermally applied to the inner wall surface of the casing. An electronic apparatus comprising: a heat-diffusing component and a heat-diffusing component that is thermally coupled to the heat-diffusing member. The electronic device according to claim 1, wherein a heat conductive layer is formed in a portion other than the partial heat insulating layer of the heat diffusion member. The electronic device according to claim 1, wherein a partial heat insulating layer of the machine heat diffusion member is formed on an inner side including one surface of the heat diffusion layer. The partial heat insulating layer of the heat diffusing member is formed so as to make uniform the temperature distribution on the outer wall surface of the housing in which the heat diffusing member is thermally coupled. The electronic device according to claim 1. The electronic device according to claim 4, wherein a partial heat insulating layer of the heat diffusing member is formed in a region including the heat generating component in the housing. 6. The electronic apparatus according to claim 1, wherein a partial heat insulating layer of the heat diffusion member is formed as an air layer. The electronic device according to claim 2, wherein at least one of the heat diffusion layer, the heat insulating layer, and the heat conductive layer is formed of a sheet-like member. The electronic device according to claim 7, wherein the sheet-like member has a function of an adhesive tape. 9. The electronic apparatus according to claim 1, wherein the electronic apparatus is a portable terminal. A method of manufacturing an electronic device including a heat diffusing member that radiates heat of a heat generating component to a housing,
A first step of manufacturing a heat diffusion member comprising a heat diffusion layer and a partial heat insulation layer and having a substantially uniform thickness; and the side of the heat diffusion member having the partial heat insulation layer is disposed inside the casing. A method of manufacturing an electronic device comprising: a second step of thermally coupling to a wall surface and thermally coupling a side having the thermal diffusion layer of the thermal diffusion member to the heat generating component. The method of manufacturing an electronic device according to claim 10, wherein in the first step, a heat conductive layer is formed in a portion other than the partial heat insulating layer of the heat diffusing member. The method of manufacturing an electronic device according to claim 10, wherein in the first step, a partial heat insulating layer of the heat diffusion member is formed on an inner side including one surface of the heat diffusion layer. The method of manufacturing an electronic device according to any one of claims 10 to 12, wherein, in the second step, the temperature distribution of the outer wall surface of the housing in which the heat diffusion member is thermally coupled is made uniform. . 14. The method of manufacturing an electronic device according to claim 13, wherein in the second step, a partial heat insulating layer of the heat diffusing member is thermally coupled to the heat generating component in the housing. 15. The method of manufacturing an electronic device according to claim 11, wherein in the first step, a partial heat insulating layer of the heat diffusing member is formed as an air layer. The said 1st process includes the process of forming at least any one of the said thermal-diffusion layer, a heat insulation layer, or a heat conductive layer with a sheet-like member, The claim in any one of Claims 11-15 characterized by the above-mentioned. Manufacturing method of electronic equipment. The method of manufacturing an electronic device according to claim 16, wherein the sheet-like member has a function of an adhesive tape. A heat diffusing member comprising a heat diffusing layer and a partial heat insulating layer and having a substantially uniform thickness. The heat diffusing member according to claim 18, wherein a heat conductive layer is formed in a portion other than the partial heat insulating layer. The heat diffusion member according to claim 18, wherein the partial heat insulating layer is formed inside including one surface of the heat diffusion layer. The side having the partial heat insulating layer can be coupled to the inner wall surface of the housing of the electronic device, and the side having the heat diffusion layer can be coupled to a heat generating component in the housing of the electronic device, The heat diffusing member according to any one of claims 18 to 20, wherein the heat diffusing member can dissipate heat. The heat diffusion member according to claim 21, wherein the heat insulation layer is formed so as to uniformize a temperature distribution of an outer wall surface of the casing. 23. The heat diffusing member according to claim 18, wherein the heat insulating layer can be thermally coupled to a region including the heat generating component in the housing. 24. The heat diffusing member according to claim 18, wherein the partial heat insulating layer is formed as an air layer. The thermal diffusion member according to any one of claims 19 to 23, wherein at least one of the thermal diffusion layer, the heat insulating layer, and the thermal conductive layer is formed of a sheet-like member. 26. The heat diffusing member according to claim 25, wherein the sheet-like member has a function of an adhesive tape.

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