JP2012151196A - Thermal insulation sheet - Google Patents

Thermal insulation sheet Download PDF

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Publication number
JP2012151196A
JP2012151196A JP2011007451A JP2011007451A JP2012151196A JP 2012151196 A JP2012151196 A JP 2012151196A JP 2011007451 A JP2011007451 A JP 2011007451A JP 2011007451 A JP2011007451 A JP 2011007451A JP 2012151196 A JP2012151196 A JP 2012151196A
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Japan
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heat
sheet
housing
generating component
insulation sheet
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JP2011007451A
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Japanese (ja)
Inventor
Norihiro Kawamura
典裕 河村
Hiroshi Takahashi
大志 高橋
Keiji Kawajiri
圭嗣 川尻
Kazuhiko Kubo
和彦 久保
Takeshi Kimura
猛 木村
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Panasonic Corp
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Panasonic Corp
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Priority to JP2011007451A priority Critical patent/JP2012151196A/en
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Abstract

PROBLEM TO BE SOLVED: To provide a thermal insulation sheet which dissipates heat generated from heating components and makes heat transfer to a surface more difficult.SOLUTION: A thermal insulation sheet 14 is used for an electronic apparatus including a substrate 12 in which a heating component 11 is mounted and a housing 13 housing the substrate 12. The thermal insulation sheet 14 is composed of an adhesion layer 15, a heat insulation sheet 16, a heat conduction sheet 17, and a protection layer 18 and is bonded to a position on an inner side of the housing 13, corresponding to the heating component 11, through the adhesion layer 15. The thermal insulation sheet 14 and the heating component 11 are arranged so as to face each other having a space therebetween.

Description

本発明は、携帯電話、デジタルカメラ等の内部に発熱部品を有する電子機器に用いられる熱遮断シートに関するものである。   The present invention relates to a heat shield sheet used in an electronic device having a heat generating component inside a mobile phone, a digital camera or the like.

近年携帯電話等の携帯用通信機器やデジタルカメラ等の電子機器において、機能が向上するとともに、内部での発熱量が大きくなってきている。さらにこれらの機器は小型化、薄型化が進み、機器が手や顔に触れるものについては、やけど防止のため、表面の温度が局所的に高くなることを防ぐ必要がある。そのため図３に示すように、基板４に実装した発熱部品１に熱拡散シート２を接触させ、筐体３のほうに熱を逃がすような構成が提案されている。   In recent years, in portable communication devices such as mobile phones and electronic devices such as digital cameras, functions have been improved and internal heat generation has been increasing. Furthermore, these devices are becoming smaller and thinner, and it is necessary to prevent the surface temperature from becoming locally high in order to prevent burns for devices that touch the hand or face. Therefore, as shown in FIG. 3, a configuration has been proposed in which the heat diffusion sheet 2 is brought into contact with the heat-generating component 1 mounted on the substrate 4 and heat is released to the housing 3.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。   As prior art document information related to the invention of this application, for example, Patent Document 1 is known.

特開平１０−２２９２８７号公報Japanese Patent Laid-Open No. 10-229287

上記従来の構成では、表面の温度が局所的に高くなることはある程度防止できるが、発熱量が多いと、表面の温度が上がってくるため、低温やけど等の課題が生じてくる可能性がある。本発明はこの課題に対して、表面の温度が局所的に高くなることを防止するとともに、全体としても温度が上がりにくくなる熱遮断シートを提供することを目的とする。   In the above conventional configuration, it is possible to prevent the surface temperature from becoming locally high to some extent. However, if the amount of heat generated is large, the surface temperature rises, which may cause problems such as low-temperature burns. . In view of this problem, the present invention has an object to provide a heat shield sheet that prevents the surface temperature from becoming locally high and makes it difficult to increase the temperature as a whole.

本発明は上記課題を解決するために、発熱部品を実装した基板と、この基板を収納する筐体とを備えた電子機器に用いる熱遮断シートであって、熱遮断シートは、接着層と断熱シートと熱伝導シートと保護層とからなり、熱遮断シートは、発熱部品と対向する位置の筐体の内側に接着層を介して接着され、熱遮断シートと発熱部品とは、空間を隔てて対峙するように構成したものである。   In order to solve the above-described problems, the present invention provides a heat shield sheet used in an electronic device including a substrate on which a heat-generating component is mounted and a housing that houses the substrate, and the heat shield sheet includes an adhesive layer and a heat insulating sheet. It consists of a sheet, a heat conductive sheet, and a protective layer, and the heat shield sheet is bonded to the inside of the housing at a position facing the heat generating component via an adhesive layer, and the heat shield sheet and the heat generating component are separated from each other by a space. It is configured to confront each other.

上記構成により、発熱部品から出た熱を分散するとともに表面に伝えにくくすることができる。   With the above configuration, it is possible to disperse the heat generated from the heat generating component and make it difficult to transmit to the surface.

本発明の一実施の形態における熱遮断シートを用いた電子機器の断面図Sectional drawing of the electronic device using the heat insulation sheet in one embodiment of this invention 本発明の一実施の形態における別の熱遮断シートを用いた電子機器の断面図Sectional drawing of the electronic device using another heat insulation sheet in one embodiment of this invention 従来の電子機器の断面図Cross-sectional view of conventional electronic equipment

以下、本発明の一実施の形態における熱遮断シートについて、図面を参照しながら説明する。   Hereinafter, a heat shielding sheet according to an embodiment of the present invention will be described with reference to the drawings.

図１は本発明の一実施の形態の熱遮断シートを用いた電子機器の断面図である。ＩＣ等の発熱部品１１を実装した基板１２を筐体１３に収納したものであって、発熱部品１１と対向する位置の筐体１３の内側に、発熱部品１１と空間を隔てて熱遮断シート１４が接着されている。熱遮断シート１４は、筐体１３側から、接着層１５、断熱シート１６、熱伝導シート１７、保護層１８が積層されて構成されている。断熱シート１６と熱伝導シート１７、熱伝導シート１７と保護層１８は、両面テープや粘着剤等により接着されている。   FIG. 1 is a cross-sectional view of an electronic apparatus using a heat shield sheet according to an embodiment of the present invention. A substrate 12 on which a heat generating component 11 such as an IC is mounted is housed in a housing 13, and a heat shielding sheet 14 is provided inside the housing 13 at a position facing the heat generating component 11 with a space from the heat generating component 11. Is glued. The heat shield sheet 14 is configured by laminating an adhesive layer 15, a heat insulating sheet 16, a heat conductive sheet 17, and a protective layer 18 from the housing 13 side. The heat insulating sheet 16 and the heat conductive sheet 17, and the heat conductive sheet 17 and the protective layer 18 are bonded with a double-sided tape, an adhesive, or the like.

接着層１５には厚さ約３０μｍの両面テープを用い、断熱シート１６には厚さ約５０μｍの不織布や発泡体樹脂等を用い、熱伝導シート１７には厚さ約２５μｍの熱分解グラファイトシートを用い、保護層１８には厚さ約１２．５μｍのポリエチレンテレフタレート（ＰＥＴ）フィルムや、ポリイミドフィルム等を用いている。また発熱部品１１と熱遮断シート１４とは、約０．５ｍｍの空間が設けられている。ここで断熱シート１６は、絶縁性を有し、空隙率が１５％以上のものであり、不織布やガラスクロスのように繊維により形成されることにより、空隙が存在するもの、発泡体樹脂のように、シート形成時に空隙を発生させるもの、樹脂フィルムにパンチングや、レーザー光を用いて微細な貫通穴を設け空気層を形成したものが考えられる。この空隙には気体が存在する場合はもちろん、この表面層を密閉し内部の空間を真空状態にする事により、より熱伝導率を低く抑えることが出来る。さらにこの断熱シート１６には接着層１５よりも熱伝導率が低いシートを用いることが重要である。   A double-sided tape having a thickness of about 30 μm is used for the adhesive layer 15, a non-woven fabric or foam resin having a thickness of about 50 μm is used for the heat insulating sheet 16, and a pyrolytic graphite sheet having a thickness of about 25 μm is used for the heat conductive sheet 17. Used as the protective layer 18 is a polyethylene terephthalate (PET) film having a thickness of about 12.5 μm, a polyimide film, or the like. Further, the heat generating component 11 and the heat shielding sheet 14 are provided with a space of about 0.5 mm. Here, the heat insulating sheet 16 has an insulating property and a porosity of 15% or more, and is formed of fibers such as a nonwoven fabric or a glass cloth, so that there are voids, such as a foam resin. In addition, it is conceivable to generate a void during sheet formation, or to punch a resin film or provide a fine through hole using a laser beam to form an air layer. In addition to the presence of gas in this gap, the thermal conductivity can be further reduced by sealing this surface layer and making the internal space vacuum. Further, it is important to use a sheet having a lower thermal conductivity than the adhesive layer 15 as the heat insulating sheet 16.

以上のように構成することにより、発熱部品１１により発生した熱は、主として輻射により筐体１３側に伝わる。このとき発熱部品１１と対向する位置の筐体１３の内側に熱遮断シート１４が設けられているため、発熱部品１１により発生した熱は熱遮断シート１４のほうに伝わる。熱遮断シート１４に伝わった熱は、熱伝導シート１７に到達するが、熱分解グラファイトシートは厚さ方向には熱伝導率が高くないが、面方向は非常に高い熱伝導率を有しているため、熱伝導シート１７全体に広がり、局所的に高温になることを防ぐことができる。さらにその次の層には断熱シート１６が設けられているため、さらに筐体１３の方に熱が伝わりにくくなっている。従って筐体１３内部で発熱部品１１によって局所的に高温となる状態となっても、筐体１３の表面の温度上昇を防ぐことができる。   With the configuration described above, the heat generated by the heat generating component 11 is transmitted to the housing 13 side mainly by radiation. At this time, since the heat shielding sheet 14 is provided inside the housing 13 at a position facing the heat generating component 11, the heat generated by the heat generating component 11 is transmitted to the heat shielding sheet 14. The heat transmitted to the heat shield sheet 14 reaches the heat conduction sheet 17, but the pyrolytic graphite sheet does not have a high thermal conductivity in the thickness direction, but has a very high thermal conductivity in the plane direction. Therefore, it spreads to the whole heat conductive sheet 17, and it can prevent becoming high temperature locally. Further, since the heat insulating sheet 16 is provided in the next layer, heat is not easily transmitted to the housing 13. Therefore, even if the heat generation component 11 causes a locally high temperature inside the housing 13, it is possible to prevent the temperature of the surface of the housing 13 from rising.

なお、本実施の形態では保護層にＰＥＴフィルムを用いたが、表面にアルミニウム等の反射率の高い膜を形成したシートを用いても良い。このようにすることにより、発熱部品１１より輻射された熱を効率的に反射することができ、筐体１３の表面の温度上昇をさらに抑えることができる。   In this embodiment, a PET film is used for the protective layer, but a sheet having a film with a high reflectance such as aluminum formed on the surface may be used. By doing in this way, the heat radiated | emitted from the heat-emitting component 11 can be reflected efficiently, and the temperature rise of the surface of the housing | casing 13 can further be suppressed.

また、図２のように、熱伝導シート１７と断熱シート１６の位置が逆の方が表面が局所的に高温になることを防ぐ効果が高いケースも有る。   Moreover, as shown in FIG. 2, there is a case where the effect of preventing the surface from becoming locally hot is higher when the positions of the heat conductive sheet 17 and the heat insulating sheet 16 are reversed.

これは、熱遮断シート１４に伝わった熱は、断熱シート１６が設けられているため、熱伝導シート１７に到達しにくくし、熱分解グラファイトシートに伝わってしまった少量の熱を、熱分解グラファイトシートは厚さ方向には熱伝導率が高くないが、面方向は非常に高い熱伝導率を有している特性を利用し、熱伝導シート１７全体に広がり、局所的に高温になることを防ぐことができ、筐体１３の方に熱が伝わりにくくなっている。従って筐体１３内部で発熱部品１１によって局所的に高温となる状態となっても、筐体１３の表面の温度上昇を防ぐことができる。   This is because the heat transmitted to the heat shield sheet 14 is provided with the heat insulating sheet 16, so that it is difficult to reach the heat conducting sheet 17, and a small amount of heat transmitted to the pyrolytic graphite sheet is reduced. The sheet does not have a high thermal conductivity in the thickness direction, but the surface direction has a very high thermal conductivity, and spreads over the entire heat conductive sheet 17 to be locally hot. It is possible to prevent the heat from being transmitted to the housing 13. Therefore, even if the heat generation component 11 causes a locally high temperature inside the housing 13, it is possible to prevent the temperature of the surface of the housing 13 from rising.

この選択は、発熱部品１１と熱遮断シート１４の距離、断熱シート１６の断熱性能、筐体１３の熱伝導率等が複雑に絡み合った結果得られる効果であるため、図１の構成にするか、図２の構成にするかは、実機での効果確認により、選択する必要が有る。   This selection is an effect obtained as a result of complicated intertwining of the distance between the heat generating component 11 and the heat shielding sheet 14, the heat insulating performance of the heat insulating sheet 16, the heat conductivity of the housing 13, and so on. The configuration shown in FIG. 2 needs to be selected by confirming the effect on the actual machine.

また、保護層１８と断熱シート１６の間と、断熱シート１６と接着層１５の間、両方に熱伝導シートを挟むことにより、さらに筐体１３の表面の温度を均一化することができる。   Further, by sandwiching the heat conductive sheet between the protective layer 18 and the heat insulating sheet 16 and between the heat insulating sheet 16 and the adhesive layer 15, the temperature of the surface of the housing 13 can be further uniformized.

本発明に係る熱遮断シートは、発熱部品から出た熱を分散するとともに表面に伝えにくくすることができ、産業上有用である。   The heat shield sheet according to the present invention is industrially useful because it can disperse the heat emitted from the heat-generating component and make it difficult to transmit to the surface.

１１ 発熱部品
１２ 基板
１３ 筐体
１４ 熱遮断シート
１５ 接着層
１６ 断熱シート
１７ 熱伝導シート
１８ 保護層 DESCRIPTION OF SYMBOLS 11 Heat generating component 12 Board | substrate 13 Housing | casing 14 Thermal insulation sheet 15 Adhesion layer 16 Thermal insulation sheet 17 Thermal conductive sheet 18 Protective layer

Claims (3)

発熱部品を実装した基板と、この基板を収納する筐体とを備えた電子機器に用いる熱遮断シートであって、前記熱遮断シートは、接着層と断熱シートと熱伝導シートと保護層とからなり、前記熱遮断シートは、前記発熱部品と対向する位置の前記筐体の内側に前記接着層を介して接着され、前記熱遮断シートと前記発熱部品とは、空間を隔てて対峙していることを特徴とする熱遮断シート。  A heat shielding sheet used for an electronic device including a substrate on which a heat generating component is mounted and a housing for housing the substrate, wherein the heat shielding sheet includes an adhesive layer, a heat insulating sheet, a heat conductive sheet, and a protective layer. The heat shield sheet is bonded to the inside of the housing at a position facing the heat generating component via the adhesive layer, and the heat shield sheet and the heat generating component face each other with a space therebetween. A heat shielding sheet characterized by that. 前記熱伝導シートにグラファイトシートを用いたことを特徴とする請求項１記載の熱遮断シート。 The heat insulation sheet according to claim 1, wherein a graphite sheet is used as the heat conduction sheet. 前記保護層の表面を反射膜としたことを特徴とする請求項１記載の熱遮断シート。 The heat shielding sheet according to claim 1, wherein the surface of the protective layer is a reflective film.
JP2011007451A 2011-01-18 2011-01-18 Thermal insulation sheet Pending JP2012151196A (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014211221A (en) * 2013-04-22 2014-11-13 大日本印刷株式会社 Heat insulation member
WO2015059855A1 (en) * 2013-10-21 2015-04-30 パナソニックＩｐマネジメント株式会社 Thermal insulation sheet and method for producing same
JP2015088575A (en) * 2013-10-30 2015-05-07 パナソニックＩｐマネジメント株式会社 Heat insulation sheet and thermal insulation structure using the same
JP2015088538A (en) * 2013-10-29 2015-05-07 パナソニックＩｐマネジメント株式会社 Thermal insulation sheet and thermal insulation structure using the same
JP2015122360A (en) * 2013-12-20 2015-07-02 日東電工株式会社 Heat diffusing film and electronic device
JP2015138825A (en) * 2014-01-21 2015-07-30 ビッグテクノス株式会社 Thermal insulation structure of electronic device
CN105472947A (en) * 2015-12-15 2016-04-06 联想(北京)有限公司 Electronic device
US11206747B1 (en) 2020-09-25 2021-12-21 Panasonic Intellectual Property Management Co., Ltd. Heat release device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014211221A (en) * 2013-04-22 2014-11-13 大日本印刷株式会社 Heat insulation member
WO2015059855A1 (en) * 2013-10-21 2015-04-30 パナソニックＩｐマネジメント株式会社 Thermal insulation sheet and method for producing same
JPWO2015059855A1 (en) * 2013-10-21 2017-03-09 パナソニックＩｐマネジメント株式会社 Insulation sheet and manufacturing method thereof
US10244657B2 (en) 2013-10-21 2019-03-26 Panasonic Intellectual Property Management Co., Ltd. Thermal insulation sheet and method for producing same
JP2015088538A (en) * 2013-10-29 2015-05-07 パナソニックＩｐマネジメント株式会社 Thermal insulation sheet and thermal insulation structure using the same
JP2015088575A (en) * 2013-10-30 2015-05-07 パナソニックＩｐマネジメント株式会社 Heat insulation sheet and thermal insulation structure using the same
JP2015122360A (en) * 2013-12-20 2015-07-02 日東電工株式会社 Heat diffusing film and electronic device
JP2015138825A (en) * 2014-01-21 2015-07-30 ビッグテクノス株式会社 Thermal insulation structure of electronic device
WO2015111301A1 (en) * 2014-01-21 2015-07-30 ビッグテクノス株式会社 Heat-insulating structure for electronic apparatus
CN105472947A (en) * 2015-12-15 2016-04-06 联想(北京)有限公司 Electronic device
US11206747B1 (en) 2020-09-25 2021-12-21 Panasonic Intellectual Property Management Co., Ltd. Heat release device

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