JP2022031992A - Plate-type heat transport device and electronic device - Google Patents

Abstract

To keep a mounting height of a plate-type heat transport device low.SOLUTION: A vapor chamber 10 is a plate-type heat transport device having a first plate member 60, a second plate member 62 overlapped with the first plate member 60 to form a sealed space 64 between the first plate member 60 and itself, and a working fluid F enclosed in the sealed space 64. The first plate member 60 has a mounting hole 50 in a non-overlapping portion 72 with the second plate member 62 as viewed in a stacking direction with the second plate member 62. The second plate member 62 has a relief hole 74 concentric with the mounting hole 50. The relief hole 74 is larger in diameter than the mounting hole 50, and the first plate member 60 has the non-overlapping portion 72 inside the relief hole 74. A stud 76 is attached to a base plate 47 of a keyboard device 12. The vapor chamber 10 is attached to a main body housing 14 by a bolt 58 that is inserted into the mounting hole 50 and the stud 76.SELECTED DRAWING: Figure 4

Description

The present invention relates to a plate-type heat transport device and an electronic device including the plate-type heat transport device.

Patent Document 1 discloses a vapor chamber. Since a plate-type heat transport device such as a vapor chamber performs heat transport by utilizing, for example, a phase change of a working fluid, a high heat transport capacity can be obtained while being thin. For this reason, the plate-type heat transport device is widely used as a heat-dissipating means for electronic components mounted on electronic devices such as tablet-type or notebook-type personal computers.

As shown in FIG. 13, in the general vapor chamber 500 according to the prior art, a closed space 506 is formed between the first plate member 502 and the second plate member 504, and the working fluid is enclosed in the closed space 506. is doing. The vapor chamber 500 may be provided with a mounting hole 508. The mounting hole 508 is a hole that penetrates the first plate member 502 and the second plate member 504 with the same diameter.

In order to attach the vapor chamber 500 to the housing 510 of an electronic device, a stud 512 is provided in the housing 510. Then, the vapor chamber 500 is attached to the housing 510 by a bolt 514 that inserts the attachment hole 508 and the stud 512. The head 514a of the bolt 514 has a larger diameter than the mounting hole 508, and serves as a stopper for the vapor chamber 500.

Japanese Patent Application Laid-Open No. 2015-132399

As shown in FIG. 13, the outer diameter of the stud 512 is larger than that of the mounting hole 508, and the peripheral portion of the mounting hole 508 is placed on the seat surface of the stud 512. Then, the mounting height H of the vapor chamber 500 with respect to the housing 510 becomes the total height of the vapor chamber 500 and the stud 512.

It is desirable that the vapor chamber 500 has a large area to some extent in order to secure the heat transport capacity. However, if a large area of the vapor chamber 500 is secured in an electronic device, it may have to have a laminated structure with respect to other large components such as a keyboard, and the thickness of the electronic device as a whole tends to increase. Therefore, it is desired that the mounting height H of the vapor chamber 500 as shown in FIG. 13 is also kept low.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a plate-type heat transport device capable of keeping the mounting height low and an electronic device provided with the plate-type heat transport device. ..

In order to solve the above-mentioned problems and achieve the object, the plate-type heat transport device according to the first aspect of the present invention forms a closed space between the first plate member and the first plate member. A plate-type heat transport device including a second plate member that is overlapped with the first plate member and a working fluid that is enclosed in the closed space, wherein the first plate member is the second plate member. Has a mounting hole in a non-overlapping portion with the second plate member in the stacking direction.

The first plate member may be thicker than the second plate member. As a result, the mounting strength with respect to the mounting target is increased and stabilized.

The mounting hole may be provided in the non-overlapping portion at the end of the first plate member. This improves the degree of freedom in the position where the mounting hole is provided.

The second plate member has an escape hole concentric with the mounting hole, the diameter of the escape hole is larger than the diameter of the mounting hole, and the first plate member is inside the escape hole in the stacking direction. It may have the non-overlapping portion. A columnar mounting object can easily enter the escape hole concentric with the mounting hole.

Further, the electronic device according to the second aspect of the present invention includes the above-mentioned plate-type heat transport device, the plate-type heat transport device, and a heating element provided so as to be heat transferable.

In this case, a housing having a stud attached to the inner surface thereof is provided, and the plate-type heat transport device is attached to the housing by a bolt that inserts the mounting hole and the stud, and the plate-type heat transport device is attached to the housing in the stacking direction. Of the plate-type heat transport device, only the non-overlapping portion may overlap with the bolt.

According to the above aspect of the present invention, since the first plate member has a mounting hole in the non-overlapping portion with the second plate member in the stacking direction view with the second plate member, the second plate member is a stud. The mounting height of the vapor chamber can be kept low by the height of the second plate member and the closed space.

FIG. 1 is a plan view showing a vapor chamber according to an embodiment and an electronic device according to an embodiment. FIG. 2 is an exploded perspective view showing the internal structure of the main body housing. FIG. 3 is a bottom view schematically showing the internal structure of the main body housing. FIG. 4 is a schematic cross-sectional view taken along the line IV-IV in FIG. FIG. 5 is a top view of the vapor chamber. FIG. 6 is a bottom view of the vapor chamber. FIG. 7 is an exploded perspective view of the vapor chamber, the graphite sheet and the substrate. FIG. 8 is a cross-sectional view of the mounting holes, studs and their surroundings in the vapor chamber. FIG. 9 is a plan view of the mounting hole in the vapor chamber and its surroundings. FIG. 10 is a cross-sectional view of a mounting hole, a stud, and its periphery in the vapor chamber according to the first modification. FIG. 11 is a cross-sectional view of a mounting hole, a stud, and its periphery in the vapor chamber according to the second modification. FIG. 12 is a cross-sectional view of a mounting hole, a stud, and its periphery in the vapor chamber according to the third modification. FIG. 13 is a cross-sectional view of a mounting hole, a stud, and its periphery in a vapor chamber according to the prior art.

Hereinafter, embodiments of the plate-type heat transport device and the electronic device including the plate-type heat transport device according to the present invention will be described in detail with reference to the drawings. The present invention is not limited to this embodiment.

FIG. 1 is a plan view showing a vapor chamber 10 according to an embodiment of the plate-type heat transport device of the present invention and an electronic device 11 according to an embodiment of the present invention. In the present embodiment, the electronic device 11 which is a notebook PC is exemplified, but other than this, for example, a desktop PC, a tablet PC, a smartphone, a mobile phone, an electronic personal organizer, or the like may be used. The electronic device 11 has a vapor chamber 10 inside. First, the electronic device 11 will be described.

As shown in FIG. 1, the electronic device 11 includes a main body housing 14 provided with a keyboard device 12 and a touch pad 13, and a display housing 18 provided with a display 16. The display housing 18 is rotatably connected to the rear end portion 14a of the main body housing 14 via a pair of left and right hinges 20, 20.

FIG. 1 is a view looking down at an electronic device 11 in which a display housing 18 is opened from a main body housing 14 by a hinge 20 and used as a usage mode. Hereinafter, based on the direction in which the display 16 of the electronic device 11 in the usage pattern shown in FIG. 1 is visually recognized from the front, the front side of the main body housing 14 is the front side, the back side is the rear side, the thickness direction is up and down, and the width direction is left and right. I will explain it by calling it.

The display housing 18 is electrically connected to the main body housing 14 by a wiring (not shown) that has passed through the hinge 20. The display 16 is, for example, a liquid crystal display.

FIG. 2 is an exploded perspective view showing the internal structure of the main body housing 14. In FIG. 2, the keyboard device 12 is shown in a simplified plate shape, and the touch pad 13 is not shown.

As shown in FIGS. 1 and 2, the main body housing 14 is a thin box-shaped housing formed by the upper surface cover 22 and the lower surface cover 24.

The upper surface cover 22 is a plate-shaped member in which a wall serving as a side wall of the main body housing 14 is formed so as to project around four circumferences. The upper surface cover 22 constitutes the upper surface and the four peripheral side surfaces of the main body housing 14. The bottom cover 24 is a plate-shaped member that constitutes the bottom surface of the main body housing 14.

The upper surface of the upper surface cover 22 is formed by an opening 26, a front cover portion 22a, a keyboard device 12, and left and right side cover portions 22c and 22d. The opening 26 is a rectangular opening provided near the center of the top cover 22 and on which the keyboard device 12 is arranged. That is, the opening 26 is the installation position of the keyboard device 12. The front cover portion 22a is a plate portion located on the front side of the opening 26 and extending in the left-right direction. An opening in which the touch pad 13 is arranged is formed in the center of the front cover portion 22a in the left-right direction. The rear cover portion 22b is a plate portion located on the rear side of the opening 26 and extending in the left-right direction. The width of the rear cover portion 22b in the front-rear direction is smaller than that of the front cover portion 22a. The left and right side cover portions 22c and 22d are narrow plate portions that are located on the left and right side portions of the opening 26 and extend in the front-rear direction. For example, when the keyboard device 12 is arranged so as to substantially fill the left and right widths of the top cover 22, the side cover portions 22c and 22d have a line shape having almost no width, or are omitted.

FIG. 3 is a bottom view schematically showing the internal structure of the main body housing 14. FIG. 3 is a schematic view of the inside of the main body housing 14 from the inner surface side of the upper surface cover 22 with the lower surface cover 24 removed. FIG. 4 is a schematic cross-sectional view taken along the line IV-IV in FIG.

As shown in FIGS. 2 and 3, a CPU (heating element) 28, a substrate 30, a battery device 32, and a vapor chamber 10 are housed inside the main body housing 14.

The CPU 28 is a central processing unit mounted on a substrate 30 and performing operations related to main control and processing of the electronic device 11. The CPU 28 is one of the largest heating elements among electronic components mounted in the main body housing 14. The vertical thickness (plate thickness) of the CPU 28 is, for example, 0.85 mm.

The substrate 30 is a PCB (printed circuit board) on which various electronic components 38 such as a GPU (Graphics Processing Unit), a memory, and a capacitor are mounted in addition to the CPU 28. The substrate 30 is screwed and fixed to the inner surface of the rear cover portion 22b of the upper surface cover 22 by using a pair of front and rear mounting holes 30a provided at both ends. In the substrate 30, the upper surface 30b serves as a mounting surface for the upper surface cover 22, and the lower surface 30c serves as a mounting surface for the CPU 28 and the electronic components 38. Some electronic components 38 may be mounted on the upper surface 30b. The substrate 30 has a strip shape that is narrow in the front-rear direction and extends to substantially the left-right width of the main body housing 14 in the left-right direction. Most of the substrate 30 is arranged at a position where it overlaps below the rear cover portion 22b. In the case of the present embodiment, only a part of the front ends of the substrate 30 overlaps the lower part of the keyboard device 12 (see FIG. 3). The substrate 30 may be configured in an arrangement and shape that does not completely overlap the lower part of the keyboard device 12 but overlaps only the lower part of the rear cover portion 22b. The plate thickness of the substrate 30 is, for example, 0.65 mm.

The battery device 32 is a rechargeable battery that serves as a power source for the electronic device 11. A pair of left and right battery devices 32 are provided at positions overlapping below the front cover portion 22a of the top cover 22 serving as a palm rest. In the case of the present embodiment, since the touch pad 13 is provided in the center of the front cover portion 22a, the battery device 32 is provided on the left and right side portions thereof, respectively. In the case of a structure or the like in which the touch pad 13 is not provided, the battery device 32 may have a shape extending to the full width of the front cover portion 22a. By arranging the battery device 32 at a position overlapping the front cover portion 22a, a large volume can be secured.

As shown in FIG. 4, the keyboard device 12 is arranged in a state of being exposed on the upper surface of the main body housing 14 via the opening 26. The keyboard device 12 may have a structure other than that of the present embodiment, which is attached to the opening 26 of the upper surface cover 22 to be a frame from below. It may be a structure to be placed. The keyboard device 12 is, for example, an assembly component provided with a key top 44, a guide mechanism 45, a membrane sheet 46, and a base plate (housing) 47 in order from the top. The key top 44 is a component that serves as an operation unit that the user presses and operates. The guide mechanism 45 is a pantograph mechanism that guides the key top 44 vertically on the upper surface side of the base plate 47. A set of the key top 44 and the guide mechanism 45 constitutes one key (key switch) 48, and a plurality of keys 48 are installed on the upper surface side of the base plate 47 in a predetermined arrangement.

The keyboard device 12 may be a membrane type or the like that does not have a guide mechanism 45. The membrane sheet 46 is a switch sheet that emits a signal corresponding to each key type by being pressed by a rubber dome or the like (not shown) to close the contacts when the key top 44 is pressed. The base plate 47 is a member that forms the bottom surface of the keyboard device 12, is a thin plate-shaped member such as stainless steel, and has appropriate strength. Further, the base plate 47 is a support member that supports the membrane sheet 46, the key 48, and the like as the base of the keyboard device 12, and also serves as a housing that supports the vapor chamber 10. The base plate 47 is fixed (for example, fastened with bolts) to the main body housing 14 and is integrated.

Next, the vapor chamber 10 will be described. 5 is a top view of the vapor chamber 10, FIG. 6 is a bottom view of the vapor chamber 10, and FIG. 7 is an exploded perspective view of the vapor chamber 10, the graphite sheet 54, and the substrate 30. The vapor chamber 10 is a component that diffuses heat from the CPU 28 into its volume range, and stores and dissipates heat.

As shown in FIGS. 5 to 7, the vapor chamber 10 has a heat radiating portion 10a, a heat receiving portion 10b, six mounting holes 50, and two leaf springs 52a and 52b. A graphite sheet 54 is attached to the back surface of the vapor chamber 10. The graphite sheet 54 is a thin sheet and has high thermal conductivity and an electromagnetic wave shielding function. The graphite sheet 54 is provided with relief portions 54a and 54b at portions overlapping the mounting holes 50 and the leaf springs 52a and 52b in a plan view.

The heat radiating portion 10a is a horizontally long portion having a large area, and most of the outer shape thereof is arranged at a position overlapping below the keyboard device 12 (see FIG. 2). As described above, the heat radiating portion 10a extends to the portion overlapping below the keyboard device 12, and a large area is secured, so that the heat transporting capacity is high. The heat radiating unit 10a may be provided with a notch 10aa so as to avoid interference with other parts in the electronic device 11.

The heat receiving portion 10b is a small rectangular portion protruding from substantially the center of the rear side of the heat radiating portion 10a in FIG. 7. The heat receiving portion 10b is arranged below the rear cover portion 22b (see FIG. 2) in the electronic device 11. The heat receiving portion 10b is connected to the lower surface of the CPU 28 in the substrate 30 so as to be heat transferable with the heat receiving plate 56 interposed therebetween. In FIG. 7, parts other than the CPU 28 and detailed shapes of the substrate 30 are omitted.

The heat receiving plate 56 is a metal plate having high thermal conductivity such as copper or aluminum, and the plate thickness thereof is, for example, 0.5 mm. The heat receiving plate 56 is a component for ensuring the adhesion between the vapor chamber 10 and the CPU 28 and improving the heat transfer coefficient. The heat receiving plate 56 may be greased on the contact surface with the CPU 28 in order to improve the adhesion and thermal conductivity. The heat receiving plate 56 may be omitted.

The vapor chamber 10 receives heat from the CPU 28 at the heat receiving unit 10b, and heat-transports the heat to the heat radiating unit 10a having a large area to dissipate heat. Although the names of the heat radiating unit 10a and the heat receiving unit 10b are separated for convenience of explanation, they do not need to be clearly distinguished and are actually an integrated configuration. The heat receiving unit 10b also has a heat dissipation function according to the area.

The leaf springs 52a and 52b are members provided on the back surface of the heat receiving portion 10b and applying an elastic force to the heat receiving portion 10b to bring them into close contact with the CPU 28. The leaf springs 52a and 52b are elastic plates having one end provided near the center of the back surface of the heat receiving portion 10b and the other end slightly inclined downward, and the tip abutting element is the heat receiving portion 10b and the lower surface cover 24 (FIG. An elastic force is generated with (see 4), and an elastic force is stably applied to the heat receiving portion 10b.

Due to the relationship between the position of the CPU 28 on the substrate 30 and the position and size of the other electronic components 38, the vapor chamber 10 is not a simple rectangle, but has a shape in which a small heat receiving portion 10b protrudes from a wide heat radiating portion 10a. Further, according to this shape, the elastic force due to the leaf springs 52a and 52b acts almost only on the heat receiving portion 10b, and the heat receiving portion 10b is slightly elastically deformed with respect to the heat radiating portion 10a and easily adheres to the CPU 28. Become. When a heating element (for example, GPU) is present in the electronic device 11 in addition to the CPU 28, a plurality of heat receiving units 10b may be provided according to the number of heating elements.

The mounting hole 50 is a portion through which the bolt 58 is inserted to mount the vapor chamber 10 to the base plate 47 (see FIG. 4). The six mounting holes 50 are provided in the heat radiating portion 10a so as to be appropriately separated from each other. A washer 80 is combined with the bolt 58. The bolt 58 includes screws and the like.

FIG. 8 is a cross-sectional view of the mounting hole 50, the stud 76 and its periphery in the vapor chamber 10, and FIG. 9 is a plan view of the mounting hole 50 and its periphery in the vapor chamber 10. Note that FIGS. 8 and 10 to 12, which will be described later, are shown upside down from FIG. As shown in FIGS. 8 and 9, the vapor chamber 10 is overlapped with the first plate member 60 so as to form a closed space 64 between the first plate member 60 and the first plate member 60. It is a plate type heat transport device including a plate member 62 and a working fluid F enclosed in a closed space 64.

The closed space 64 is a flow path through which the enclosed working fluid F flows while undergoing a phase change. As the working fluid F, for example, water, CFC substitutes, CFCs, acetone, butane and the like are used. The working fluid F evaporates and diffuses and moves by heat from the CPU 28, which is a heating element, in the closed space 64, dissipates heat and condenses, and then repeats a phase change of returning to the endothermic position with respect to the CPU 28 to perform heat transport.

In the closed space 64, a plurality of columns 70 are arranged at predetermined intervals. Each column 70 projects from the inner surface of the first plate member 60, for example, and abuts on the inner surface of the second plate member 62. Each column 70 prevents the closed space 64 from being crushed by an external force. For example, a mesh member is interposed between the tip surface of each column 70 and the inner surface of the second plate member 62. Illustration of the mesh member is omitted. The mesh member is, for example, a mesh obtained by knitting a thin metal wire into a cotton shape. The mesh member is a part that serves as a wick for feeding the condensed working fluid F by a capillary phenomenon. The support column 70 may be omitted.

The first plate member 60, the second plate member 62, and the closed space 64 are formed sufficiently thin, and the vapor chamber 10 composed of these is also thin. The thickness of the first plate member 60, the second plate member 62, and the enclosed space 64 is, for example, 0.3 mm, respectively. In this case, the thickness of the vapor chamber 10 is 0.6 mm.

The outer peripheral portion of the first plate member 60 and the second plate member 62 is connected via the outer edge member 66, and the periphery of the mounting hole 50 is further connected via the round edge member 68. That is, the closed space 64 is a space whose upper and lower sides are covered with the first plate member 60 and the second plate member 62, and the periphery thereof is covered with the outer edge material 66 and the round edge member 68. The outer edge member 66 and the round edge member 68 have the same height. The outer edge member 66 may be replaced by, for example, a thin flange obtained by crushing and joining each edge portion of the first plate member 60 and the second plate member 62 in the plate thickness direction.

The second plate member 62 forms an escape hole 74 together with the inner peripheral end of the round edge member 68. The round edge member 68 and the escape hole 74 are provided concentrically with the mounting hole 50. The escape hole 74 is formed to have a larger diameter than the mounting hole 50, the bolt 58, the washer 80, and the stud 76. Since the relief hole 74 is formed, the stud 76 and the washer 80 can enter the space surrounded by the relief hole 74, and the mounting height H of the vapor chamber 10 with respect to the base plate 47 can be increased accordingly. It can be kept low. Further, since the escape hole 74 is provided concentrically with the mounting hole 50, the columnar stud 76 can easily enter.

The bolt 58 has a head 58a, a male screw portion 58b, and a flange 58c. The flange 58c is provided at the end of the head 58a and is a portion protruding in the outer diameter direction. The stud 76 is a cylindrical member having a female screw portion 76a and is fixed to the base plate 47 of the keyboard device 12. The stud 76 is made of metal, for example, and has an appropriate strength. The stud 76 includes a boss and the like. The male threaded portion 58b of the bolt 58 is screwed into the female threaded portion 76a and fixed to the stud 76. The washer 80 is used to prevent the bolt 58 from coming off, and is sandwiched between the head 58a and the stud 76. The washer 80 may be of a type that does not come off from the male screw portion 58b of the bolt 58.

The mounting hole 50 has a larger diameter than the head 58a and a smaller diameter than the flange 58c and the washer 80. The head 58a is formed to be slightly thicker than the first plate member 60. Therefore, the peripheral portion of the mounting hole 50 is arranged with a narrow vertical gap G between the flange 58c and the washer 80, and the flange 58c serves as a stopper for the vapor chamber 10. Due to the provision of the gap G, the vapor chamber 10 is allowed to be slightly warped. Further, the vapor chamber 10 has a slight degree of freedom of movement in the vertical direction, and the heat receiving portion 10b (see FIG. 4) easily adheres to the CPU 28. Depending on the conditions, the gap G may be eliminated.

The mounting hole 50 formed in the first plate member 60 has a smaller diameter than the escape hole 74 formed by the second plate member 62 together with the round edge member 68. That is, the first plate member 60 and the second plate member 62 have a different shape, and the first plate member 60 has a different shape from the second plate member 62 in the stacking direction view with the second plate member 62 (see FIG. 9). The non-overlapping portion 72 has a mounting hole 50. The stacking direction of the first plate member 60 and the second plate member 62 corresponds to the vertical direction of the main body housing 14. The first plate member 60 has a non-overlapping portion 72 inside the relief hole 74 in the stacking direction. Only the non-overlapping portion 72 of the vapor chamber 10 overlaps with the bolt 58 in the stacking direction.

In the vapor chamber 10 configured in this way, the non-overlapping portion 72 has a mounting hole 50, and the second plate member 62 has a relief hole 74. Therefore, the second plate member 62 is a mounting target. The stud 76 and the washer 80 can be avoided, and the mounting height H of the vapor chamber 10 can be suppressed to be low by the height of the second plate member 62 and the closed space 64. Further, the structure of the mounting hole 50 and the escape hole 74 is simple and does not increase the cost.

Further, as shown in FIG. 4, the stud 76 is fixed to the lower surface of the base plate 47 in the keyboard device 12 (for example, by pressure welding or crimping), and the vapor chamber 10 is arranged below the keyboard device 12. Therefore, the area of the heat radiating portion 10a can be increased according to the wide area under the keyboard device 12. Further, although the heat radiating portion 10a and the keyboard device 12 are arranged in a laminated manner, the mounting height H can be suppressed to a low level, so that the thickness of the main body housing 14 can be suppressed. The base plate 47 is a part of the housing, and the stud 76 is attached to the inner surface of the housing.

(First modification)
In the following description, the same components as those of the vapor chamber 10 and the electronic device 11 will be designated by the same reference numerals, and detailed description thereof will be omitted.

FIG. 10 is a cross-sectional view of the mounting hole 50, the stud 76, and the periphery thereof in the vapor chamber 10A according to the first modification. In the vapor chamber 10A, the first plate member 60a corresponds to the first plate member 60 described above. The first plate member 60a is thicker than the second plate member 62. As a result, the mounting strength to the bolt 58 is increased and stabilized. In addition, the strength of the vapor chamber 10A as a whole is increased and distortion is reduced. Further, the first plate member 60a is on the side in contact with the CPU 28, and the heat capacity increases according to the thickness to improve the cooling capacity.

(Second modification)
FIG. 11 is a cross-sectional view of the mounting hole 50, the stud 76, and the periphery thereof in the vapor chamber 10B according to the second modification. In the vapor chamber 10B, the non-overlapping portion 72 between the first plate member 60 and the second plate member 62 is formed at the end of the first plate member 60, and the mounting hole 50 is the non-overlapping portion 72 at this end. It is provided in. In the vapor chamber 10B, the escape hole 74 is not formed, but the space between the non-overlapping portion 72 and the base plate 47 is an escape portion for avoiding the stud 76 and the washer 80. According to such a vapor chamber 10B, the degree of freedom in the position where the mounting hole 50 is provided is improved. Further, the vapor chamber 10B is further stabilized by providing the mounting hole 50 at the end portion.

(Third modification example)
FIG. 12 is a cross-sectional view of the mounting hole 50, the stud 76, and the periphery thereof in the vapor chamber 10C according to the third modification. The vapor chamber 10C is provided with a non-overlapping portion 84 and a stepped portion 84a as compared with the vapor chamber 10B. The non-overlapping portion 84 is an end portion of the first plate member 60 like the non-overlapping portion 72, and is a portion that does not overlap with the second plate member 62. The non-overlapping portion 84 protrudes from the end portion of the heat radiating portion 10a and is connected to the non-overlapping portion 72 via the stepped portion 84a. The mounting hole 50 is provided in the non-overlapping portion 72. The non-overlapping portion 72 is arranged at a position closer to the base plate 47 than the non-overlapping portion 84 due to the stepped portion 84a. According to such a vapor chamber 10C, it is possible to provide a difference in height between the heat radiating portion 10a and the mounting hole 50 based on the layout conditions.

In each of the above embodiments, the stud 76 is fixed to the base plate 47, but the stud 76 may be fixed to the main body housing 14 or the bottom cover 24. In the electronic device 11, other heat radiating means (for example, a fan) may be used in combination with the vapor chambers 10, 10A to 10C.

The present invention is not limited to the above-described embodiment, and it is needless to say that the present invention can be freely changed without departing from the gist of the present invention.

10, 10A, 10B, 10C Vapor chamber 10a Heat dissipation part 10b Heat receiving part 11 Electronic device 12 Keyboard device 14 Main body housing 28 CPU (heating element)
30 Board 47 Base plate (housing)
50 Mounting holes 52a, 52b Leaf spring 58 Bolt 58a Head 58b Male threaded part 58c Flange 60, 60a First plate member 62 Second plate member 64 Sealed space 66 Outer edge material 68 Round edge material 72, 84 Non-overlapping part 74 Escape hole 76 Stud 76a Female thread 80 Washer F Working fluid

Claims (6)

1st plate member and
A second plate member that is overlapped with the first plate member so as to form a closed space between the first plate member and the first plate member.
A plate-type heat transport device comprising a working fluid enclosed in the enclosed space.
The plate-type heat transport device is characterized in that the first plate member has a mounting hole in a non-overlapping portion with the second plate member in a stacking direction view with the second plate member. The plate-type heat transport device according to claim 1.
A plate-type heat transport device characterized in that the first plate member is thicker than the second plate member. The plate-type heat transport device according to claim 1 or 2.
The plate-type heat transport device, wherein the mounting hole is provided in the non-overlapping portion at the end portion of the first plate member. The plate-type heat transport device according to claim 1 or 2.
The second plate member has an escape hole concentric with the mounting hole.
A plate-type heat transport device characterized in that the diameter of the clearance hole is larger than the diameter of the mounting hole, and the first plate member has the non-overlapping portion inside the clearance hole in the stacking direction. An electronic device comprising the plate-type heat transport device according to any one of claims 1 to 4, and the plate-type heat transport device and a heating element provided so as to be heat transferable. The electronic device according to claim 5.
With a housing with studs attached to its inner surface,
The plate-type heat transport device is attached to the housing by a bolt that inserts the mounting hole and the stud, and only the non-overlapping portion of the plate-type heat transport device overlaps with the bolt in the stacking direction. An electronic device characterized by being.

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