CN218633995U - A high-efficiency heat dissipation structure for a mobile phone motherboard - Google Patents

Abstract

The utility model discloses a high-efficient heat radiation structure of mobile phone motherboard, including main core and interference killing feature, both ends are provided with the sideboard about the main core, the mounting hole has been seted up to the four corners department of sideboard, the sideboard is close to the one end of mounting hole and installs the buffering subassembly that is used for buffering external force extrusion mainboard, and buffers the subassembly and include double faced adhesive tape, first rubber shock strip piece and support protruding grain, the surface of double faced adhesive tape is provided with first rubber shock strip piece, and the surface mounting of first rubber shock strip piece has the support protruding grain, the interference killing feature is located the surface of main core, the upper and lower both ends on main core surface are provided with second rubber shock strip piece. This high-efficient heat radiation structure of mobile phone motherboard adopts the setting of buffering subassembly can cushion and absorb the external force that the main core board received to avoid external force too big and damage the electronic component on the main core board, the anti-interference ability of main core board is improved in the setting of the installation accessible anti-magnetic interference pad of interference killing device.

Description

A high-efficiency heat dissipation structure for a mobile phone motherboard

technical field

The utility model relates to the technical field of mobile phone main boards, in particular to a high-efficiency heat dissipation structure for mobile phone main boards.

Background technique

The mobile phone motherboard is a board containing electronic components and interfaces, some auxiliary electronic components and circuit systems. Its main function is to integrate mobile phone operation and management. With the rapid development of electronic communication technology, mobile phones have become an indispensable communication tool for people's lives. The more functions the smart phone has, the more complex the circuit structure of its main board is, and a heat dissipation structure is needed to dissipate the heat generated by the main board when it is working.

The mobile phone motherboards on the market cannot protect the components on the motherboard well when they are squeezed by external forces. Therefore, we propose a high-efficiency heat dissipation structure for mobile phone motherboards.

Utility model content

The purpose of this utility model is to provide a high-efficiency heat dissipation structure for a mainboard of a mobile phone, so as to solve the problems raised in the above-mentioned background technology.

In order to achieve the above purpose, the utility model provides the following technical solutions: a high-efficiency heat dissipation structure for a mobile phone main board, including a main core board and an anti-jamming device, side plates are arranged at the left and right ends of the main core board, and side plates of the side plates Mounting holes are opened at the four corners, and the end of the side plate close to the mounting hole is installed with a buffer assembly for buffering the external force from extruding the main board, and the buffer assembly includes double-sided adhesive tape, a first rubber shock-absorbing bar and a supporting bump. The surface of the double-sided adhesive tape is provided with a first rubber damping bar, and the surface of the first rubber damping bar is equipped with supporting bumps, the anti-jamming device is located on the surface of the main core board, and the surface of the main core board The upper and lower ends are provided with second rubber damping bars.

Further, the first rubber damping bar and the supporting bumps are an integrated structure, and the number of the first rubber damping bar is four.

Further, the inside of the anti-interference device is provided with an elastic iron sheet, and an anti-magnetic interference pad is installed inside the anti-interference device.

Further, the outer side of the anti-jamming device is provided with protrusions, and the lower end of the anti-jamming device is installed with posts.

Further, a mounting base is provided under the post, and an insertion hole is opened on the upper surface of the mounting base.

Further, the outer surface of the main core board is provided with a polyurethane coating, and the rear surface of the main core board is installed with a substrate.

Further, the surface of the substrate is provided with a heat dissipation component for assisting the main core board to dissipate heat, and the heat dissipation component includes a graphite heat sink, a heat conduction plate and a heat dissipation hole, and a heat conduction plate is installed inside the graphite heat sink, and the graphite The surface of the heat sink is provided with heat dissipation holes.

The utility model provides a high-efficiency heat dissipation structure of a mobile phone main board, which has the following beneficial effects: the high-efficiency heat dissipation structure of the mobile phone main board adopts the setting of a buffer component to buffer and absorb the external force received by the main core board, thereby avoiding excessive external force If the electronic components on the main core board are damaged, the installation of the anti-interference device can improve the anti-interference ability of the main core board through the setting of the anti-magnetic interference pad, and at the same time, the heat generated by the main core board can be dissipated under the installation of the heat dissipation component. , to avoid shortening the service life of the electronic components on the main core board due to the influence of high temperature.

1. The utility model adopts the setting of the side plate and can pass the bolt through the installation hole to fix it in the mobile phone. The installation of the buffer assembly can fix the first rubber shock-absorbing bar with the supporting bumps on the mobile phone through the double-sided adhesive Around the side plate, when the mobile phone shell is extruded by the outside world, its supporting bumps will support the shell, and the first rubber shock-absorbing bar and the second rubber shock-absorbing bar will be affected by the self-generated elasticity. The force is buffered to avoid damage to the electronic components on the main core board due to excessive external force.

2. The utility model can replace the anti-magnetic interference pad used for a long time in the anti-jamming device through the arrangement of the elastic iron sheet, without the need to replace the anti-jamming device as a whole, which not only ensures that the anti-jamming device can work normally, but also It also saves a certain amount of resources. The design of the mounting base allows the anti-jamming device to be inserted into the jack through the post and fixed on the mounting base. Its structure is simple and it is convenient for maintenance personnel to operate it.

3. The utility model can improve the antistatic ability of the main board of the mobile phone through the setting of the polyurethane coating, avoiding the phenomenon of electric shock when the mobile phone is charging, and the installation of the heat dissipation component can be adhered to the substrate at the back end of the main board through the viscosity of the graphite heat sink Then, through the function of the internal heat conduction plate, the heat dissipated from the motherboard is guided to the surface of the graphite heat sink, and the heat will be dissipated from the heat dissipation holes on the surface, thereby performing auxiliary heat dissipation treatment on the mobile phone motherboard.

Description of drawings

Fig. 1 is the schematic diagram of the front view structure of the high-efficiency heat dissipation structure of a mobile phone motherboard of the present invention;

Fig. 2 is the three-dimensional structure schematic diagram of the anti-jamming device of the high-efficiency heat dissipation structure of a kind of mobile phone motherboard of the present invention;

Fig. 3 is a rear view structural schematic diagram of a high-efficiency heat dissipation structure of a mobile phone motherboard of the present invention.

In the figure: 1. Main core board; 2. Side board; 3. Mounting hole; 4. Buffer assembly; 401, double-sided adhesive tape; 402, first rubber damping bar; 403, support bump; 5. Anti-interference 6. The second rubber shock-absorbing bar; 7. Elastic iron sheet; 8. Anti-magnetic interference pad; 9. Bump; 10. Mounting seat; 11. Jack; 14, substrate; 15, heat dissipation component; 1501, graphite heat sink; 1502, heat conduction plate; 1503, heat dissipation hole.

Detailed ways

As shown in Figure 1, a high-efficiency heat dissipation structure of a mobile phone motherboard includes a main core board 1 and an anti-jamming device 5, the left and right ends of the main core board 1 are provided with side plates 2, and the four corners of the side plates 2 are provided with mounting holes 3. The setting of the side plate 2 can be fixed in the mobile phone through the installation hole 3 with bolts. The end of the side plate 2 close to the installation hole 3 is installed with a buffer assembly 4 for buffering the external force to squeeze the main board, and the buffer assembly 4 includes double Surface rubber 401, first rubber shock absorbing bar 402 and support convex grain 403, the surface of double-sided adhesive 401 is provided with first rubber shock absorbing bar 402, and the surface of first rubber shock absorbing bar 402 is installed with support convex grain 403, the installation of the buffer assembly 4 can fix the first rubber shock-absorbing bar 402 with the supporting convex grain 403 around the side plate 2 through the double-sided adhesive 401, when the mobile phone shell is extruded by the outside, its support The bumps 403 will support the shell, while the first rubber damping bar 402 and the second rubber damping bar 6 will buffer the force they receive due to their self-generated elasticity, so as to avoid damage to the main core board due to excessive external force 1, the anti-jamming device 5 is located on the surface of the main core board 1, and the upper and lower ends of the main core board 1 are provided with a second rubber damping strip 6, a first rubber damping strip 402 and supporting bumps 403 is an integrated structure, and the number of the first rubber damping bars 402 is four.

As shown in Figure 2, the inner side of the anti-jamming device 5 is provided with an elastic iron sheet 7, and the setting of the elastic iron sheet 7 can replace the anti-magnetic interference pad 8 used for a long time in the anti-jamming device 5 without replacing the anti-jamming device. 5 is replaced as a whole, which not only ensures that the anti-jamming device 5 can work normally, but also saves certain resources. The anti-jamming device 5 is equipped with an anti-magnetic interference pad 8, and the outside of the anti-jamming device 5 is provided with a bump 9 , the lower end of the anti-jamming device 5 is installed with a post 12, the bottom of the post 12 is provided with a mounting seat 10, and the upper surface of the mounting seat 10 is provided with a jack 11, the design of the mounting seat 10 can pass the anti-jamming device 5 through The post 12 is inserted into the socket 11 to be fixed on the mounting base 10, and its structure is simple, which is convenient for maintenance personnel to operate.

As shown in Figure 3, the outer surface of the main core board 1 is provided with a polyurethane coating 13. The setting of the polyurethane coating 13 can improve the antistatic ability of the main board of the mobile phone, and avoid the phenomenon of electric shock when the mobile phone is charging. A substrate 14 is installed on the rear surface, and the surface of the substrate 14 is provided with a heat dissipation assembly 15 for assisting the main core board 1 in dissipating heat. A heat conduction plate 1502 is installed, and the surface of the graphite heat sink 1501 is provided with heat dissipation holes 1503. The installation of the heat dissipation assembly 15 can be adhered to the substrate 14 at the rear end of the motherboard through the viscosity of the graphite heat sink 1501, and then through the internal heat conduction plate 1502 The role of the motherboard is to guide the heat emitted by the motherboard into the surface of the graphite heat sink 1501. At this time, the heat will be emitted from the heat dissipation holes 1503 on the surface, thereby performing auxiliary heat dissipation treatment on the mobile phone motherboard.

To sum up, when using the high-efficiency heat dissipation structure of the main board of the mobile phone, the main core board 1 is fixed in the mobile phone through the mounting hole 3 on the side board 2 according to the structure shown in Figure 1-3. Insert the bolt into the mounting hole 3 to install it. After installation, the anti-jamming device 5 can be inserted into the mounting base 10 with the socket 11 through the post 12 at the bottom, so that the anti-jamming device 5 can be inserted Fix it on the main core board 1, and then fix the first rubber damping strip 402 and the second rubber damping strip 6 on the main core board 1 and the side plate 2 respectively through double-sided adhesive 401, and then they can be The mobile phone shell is installed, when the mobile phone shell is extruded by external force, the support bump 403 on the first rubber damping bar 402 will support the shell, and the first rubber damping bar 402 and the second rubber damping bar 402 The shock-absorbing bar 6 will buffer and absorb the extrusion force of the shell due to its own elasticity, thereby protecting the electronic components on the main core board 1, and the main board of the mobile phone will generate a certain amount of heat when it is working. At this time, the substrate 14 The graphite heat sink 1501 on the top will concentrate the heat generated on the surface of the graphite heat sink 1501 due to the function of the internal heat conduction plate 1502, and then the heat will be dissipated from the heat dissipation holes 1503 on the surface, thereby affecting the main core board 1 Auxiliary heat dissipation treatment is carried out. If the anti-jamming device 5 is found to be ineffective, the mobile phone shell can be removed, and the elastic iron sheet 7 on the anti-jamming device 5 is broken from a curved shape to a vertical shape, and then the internal parts can be removed. The anti-magnetic interference pad 8 is taken out, and a new anti-magnetic interference pad 8 is replaced to ensure that the anti-interference device 5 can work normally.

Claims (7)

1. The utility model provides a high-efficient heat radiation structure of mobile phone motherboard, includes main core (1) and interference killing feature (5), its characterized in that, both ends are provided with sideboard (2) about main core (1), mounting hole (3) have been seted up to the four corners department of sideboard (2), one end that sideboard (2) are close to mounting hole (3) is installed and is used for buffering external force and extrude buffering subassembly (4) of mainboard, and buffers subassembly (4) and includes double faced adhesive tape (401), first rubber shock absorber strip piece (402) and support protruding grain (403), the surface of double faced adhesive tape (401) is provided with first rubber shock absorber strip piece (402), and the surface mounting of first rubber shock absorber strip piece (402) has support protruding grain (403), interference killing feature (5) are located the surface of main core (1), the upper and lower both ends on main core (1) surface are provided with second rubber shock absorber strip piece (6).

2. The efficient heat dissipation structure for mobile phone motherboard as claimed in claim 1, wherein said first rubber shock-absorbing bar (402) and said supporting protrusion (403) are of an integrated structure, and the number of the first rubber shock-absorbing bar (402) is four.

3. The efficient heat dissipation structure for mobile phone motherboards according to claim 1, wherein the elastic iron sheet (7) is disposed inside the anti-interference unit (5), and an anti-magnetic interference pad (8) is installed inside the anti-interference unit (5).

4. The efficient heat dissipation structure for mobile phone motherboards according to claim 1, wherein the external side of the anti-interference unit (5) is provided with a bump (9), and the lower end of the anti-interference unit (5) is installed with an insertion post (12).

5. The efficient heat dissipation structure for the mobile phone motherboard according to claim 4, wherein a mounting seat (10) is disposed below the plug column (12), and the upper surface of the mounting seat (10) is provided with a plug hole (11).

6. The efficient heat dissipation structure of mobile phone motherboard according to claim 1, wherein the outer surface of said main core board (1) is provided with a polyurethane coating (13), and the rear surface of said main core board (1) is mounted with a substrate (14).

7. The efficient heat dissipation structure of a mobile phone motherboard according to claim 6, wherein the surface of the substrate (14) is provided with a heat dissipation component (15) for assisting the main core board (1) in dissipating heat, and the heat dissipation component (15) comprises a graphite heat sink (1501), a heat conductive plate (1502) and heat dissipation holes (1503), the heat conductive plate (1502) is installed inside the graphite heat sink (1501), and the heat dissipation holes (1503) are opened on the surface of the graphite heat sink (1501).

Images