CN218633995U - High-efficient heat radiation structure of mobile phone motherboard - Google Patents
High-efficient heat radiation structure of mobile phone motherboard Download PDFInfo
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- CN218633995U CN218633995U CN202221270880.0U CN202221270880U CN218633995U CN 218633995 U CN218633995 U CN 218633995U CN 202221270880 U CN202221270880 U CN 202221270880U CN 218633995 U CN218633995 U CN 218633995U
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- heat dissipation
- rubber shock
- interference
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Abstract
The utility model discloses a high-efficient heat radiation structure of mobile phone motherboard, including main core and interference killing feature, both ends are provided with the sideboard about the main core, the mounting hole has been seted up to the four corners department of sideboard, the sideboard is close to the one end of mounting hole and installs the buffering subassembly that is used for buffering external force extrusion mainboard, and buffers the subassembly and include double faced adhesive tape, first rubber shock strip piece and support protruding grain, the surface of double faced adhesive tape is provided with first rubber shock strip piece, and the surface mounting of first rubber shock strip piece has the support protruding grain, the interference killing feature is located the surface of main core, the upper and lower both ends on main core surface are provided with second rubber shock strip piece. This high-efficient heat radiation structure of mobile phone motherboard adopts the setting of buffering subassembly can cushion and absorb the external force that the main core board received to avoid external force too big and damage the electronic component on the main core board, the anti-interference ability of main core board is improved in the setting of the installation accessible anti-magnetic interference pad of interference killing device.
Description
Technical Field
The utility model relates to a mobile phone motherboard technical field specifically is a mobile phone motherboard's high-efficient heat radiation structure.
Background
The mobile phone mainboard is a board containing electronic components and interfaces, some auxiliary electronic components and a circuit system, and the main function of the mobile phone is to integrate the operation management of the mobile phone, along with the rapid development of electronic communication technology, the mobile phone becomes a communication tool essential for the life of people, the more the functions of the intelligent machine, the more complex the corresponding circuit structure of the mainboard, and the heat generated by the mainboard can be dissipated by a heat dissipation structure in the working process of the mainboard.
The mobile phone mainboard on the market has the problem that elements on the mainboard cannot be well protected when being extruded by external force, and therefore, a high-efficiency heat dissipation structure of the mobile phone mainboard is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a mobile phone motherboard's high-efficient heat radiation structure to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a high-efficient heat radiation structure of mobile phone motherboard, includes main core and interference killing feature, both ends are provided with the sideboard about the main core, the mounting hole has been seted up to the four corners department of sideboard, the sideboard is close to the one end of mounting hole and installs the buffering subassembly that is used for buffering external force extrusion mainboard, and buffers the subassembly and include double faced adhesive tape, first rubber shock attenuation strip piece and support protruding grain, the surface of double faced adhesive tape is provided with first rubber shock attenuation strip piece, and the surface mounting of first rubber shock attenuation strip piece has the support protruding grain, the interference killing feature is located the surface of main core, the upper and lower both ends on main core surface are provided with second rubber shock attenuation strip piece.
Furthermore, the first rubber shock-absorbing strip blocks and the supporting convex particles are of an integrated structure, and the number of the first rubber shock-absorbing strip blocks is four.
Furthermore, the inboard of interference killing feature is provided with the elasticity iron sheet, the internally mounted of interference killing feature has the anti-magnetic interference pad.
Furthermore, the outside of anti-interference ware is provided with the lug, the lower extreme of anti-interference ware is installed and is inserted the post.
Furthermore, a mounting seat is arranged below the inserting column, and a jack is formed in the upper surface of the mounting seat.
Further, a polyurethane coating is arranged on the outer surface of the main core plate, and a substrate is arranged on the rear surface of the main core plate.
Further, the surface of base plate is provided with the radiator unit who is used for supplementary main core to carry out the heat dissipation, and radiator unit includes graphite fin, heat-conducting plate and louvre, the internally mounted of graphite fin has the heat-conducting plate, the louvre has been seted up on the surface of graphite fin.
The utility model provides a mobile phone motherboard's high-efficient heat radiation structure possesses following beneficial effect: this high-efficient heat radiation structure of mobile phone motherboard adopts the external force that the setting of buffering subassembly can receive the main core board to cushion and absorb, thereby avoid external force too big and harm the electronic component on the main core board, the anti-interference ability of main core board is improved in setting up of the installation accessible anti-magnetic interference pad of interference killer, can distribute away the heat that the main core board produced under the installation of radiator unit simultaneously, electronic component on the main core board has shortened life because of the influence of high temperature.
1. The utility model discloses an adopt the setting accessible bolt of sideboard to pass the mounting hole and fix it in the cell-phone, the installation accessible double faced adhesive tape of buffering subassembly will have the first rubber shock attenuation stick piece that supports protruding grain and fix around the sideboard, when cell phone case receives external extrusion, it supports protruding grain and can support the shell, and first rubber shock attenuation stick piece and second rubber shock attenuation stick piece can cushion its power that receives because of the elasticity of self-generating, avoid too big and damage the electronic component on the main core board of external force.
2. The utility model discloses a setting up of elasticity iron sheet can be confronted with the anti-magnetic interference pad that uses for a long time in the interference unit and change, and need not wholly change the interference unit, has so both guaranteed that the interference unit can normally work, has also practiced thrift certain resource simultaneously, and the design of mount pad can be inserted in the jack with the interference unit through inserting the post, fixes it on the mount pad, and its simple structure makes things convenient for maintenance personal to operate it.
3. The utility model discloses a setting up of polyurethane coating can improve the antistatic ability of mobile phone motherboard, avoid the cell-phone to take place the phenomenon of electric shock often charging, the viscidity of radiator unit's installation accessible graphite fin is with its adhesion on the base plate of mainboard rear end, then the surface of graphite fin is led into with the heat that the mainboard gived off through the effect of the heat-conducting plate of inside, at this moment the heat just can distribute away from the radiating hole department on surface to carry out supplementary heat dissipation to the mobile phone motherboard and handle.
Drawings
Fig. 1 is a schematic front view of the efficient heat dissipation structure of the mobile phone motherboard according to the present invention;
fig. 2 is a schematic view of a three-dimensional structure of an anti-interference device of a high-efficiency heat dissipation structure of a mobile phone motherboard according to the present invention;
fig. 3 is the utility model relates to a high-efficient heat radiation structure's of mobile phone motherboard rear view structure schematic diagram.
In the figure, 1, a main core plate; 2. a side plate; 3. mounting holes; 4. a buffer assembly; 401. double-sided adhesive tape; 402. a first rubber bumper bar; 403. supporting the convex particles; 5. an anti-jamming device; 6. a second rubber shock-absorbing bar block; 7. an elastic iron piece; 8. an anti-magnetic interference pad; 9. a bump; 10. a mounting seat; 11. a jack; 12. inserting a column; 13. a polyurethane coating; 14. a substrate; 15. a heat dissipating component; 1501. a graphite heat sink; 1502. a heat conducting plate; 1503. and (4) radiating holes.
Detailed Description
As shown in fig. 1, a high-efficient heat radiation structure of mobile phone motherboard, including main core board 1 and interference preventer 5, both ends are provided with sideboard 2 about main core board 1, mounting hole 3 has been seted up at four corners of sideboard 2, sideboard 2 sets up accessible bolt and passes mounting hole 3 and fix it in the cell-phone, sideboard 2 is close to the one end of mounting hole 3 and installs buffer assembly 4 that is used for buffering external force extrusion mainboard, and buffer assembly 4 includes double faced adhesive tape 401, first rubber shock-absorbing strip piece 402 and support protruding grain 403, the surface of double faced adhesive tape 401 is provided with first rubber shock-absorbing strip piece 402, and the surface mounting of first rubber shock-absorbing strip piece 402 has support protruding grain 403, the installation accessible double faced adhesive tape 401 of buffer assembly 4 will have the first rubber shock-absorbing strip piece 402 that supports protruding grain 403 to fix around sideboard 2, when the cell-phone shell receives external extrusion, it supports protruding grain and can support the shell, and first rubber shock-absorbing strip piece 402 and second rubber shock-absorbing strip piece 6 can cushion its elasticity that receives because of self-birth to the power, avoid passing through the damage to the electronic shock-absorbing strip piece 1 on the surface of main core board 1, and the first rubber shock-absorbing strip piece 402 are provided with the first rubber shock-absorbing strip piece 1 and the second rubber shock-absorbing strip piece 5.
As shown in fig. 2, the inner side of the anti-interference device 5 is provided with an elastic iron sheet 7, the elastic iron sheet 7 can be used for replacing an anti-magnetic interference pad 8 used for a long time in the anti-interference device 5, the anti-interference device 5 does not need to be replaced integrally, thus the anti-interference device 5 can normally work, and meanwhile certain resources are saved, the anti-magnetic interference pad 8 is arranged inside the anti-interference device 5, a bump 9 is arranged outside the anti-interference device 5, an inserting column 12 is installed at the lower end of the anti-interference device 5, a mounting seat 10 is arranged below the inserting column 12, a jack 11 is formed in the upper surface of the mounting seat 10, the anti-interference device 5 can be inserted into the jack 11 through the inserting column 12 and is fixed on the mounting seat 10, the structure is simple, and the maintenance personnel can operate the anti-interference device conveniently.
As shown in fig. 3, a polyurethane coating 13 is disposed on an outer surface of a main core 1, the arrangement of the polyurethane coating 13 can improve the antistatic capability of a mobile phone motherboard, and avoid an electric shock phenomenon when a mobile phone is charged, a substrate 14 is mounted on a rear surface of the main core 1, a heat dissipation assembly 15 for assisting the main core 1 in dissipating heat is disposed on a surface of the substrate 14, and the heat dissipation assembly 15 includes a graphite heat dissipation sheet 1501, a heat conduction sheet 1502 and heat dissipation holes 1503, the heat conduction sheet 1502 is mounted inside the graphite heat dissipation sheet 1501, the heat dissipation holes 1503 are disposed on a surface of the graphite heat dissipation sheet 1501, the heat dissipation assembly 15 can be attached to the substrate 14 at the rear end of the motherboard by the viscosity of the graphite heat dissipation sheet 1501, and then the heat dissipated by the main board is guided into the surface of the graphite heat dissipation sheet 1501 under the action of the internal heat conduction sheet 1502, and then the heat is dissipated from the heat dissipation holes 1503 on the surface, thereby performing an auxiliary heat dissipation process on the mobile phone motherboard.
In summary, when the efficient heat dissipation structure of the mobile phone motherboard is used, according to the structure shown in fig. 1-3, the main core board 1 is fixed in the mobile phone through the mounting hole 3 on the side board 2, at this time, a user can insert a bolt into the mounting hole 3 to mount the bolt, after mounting, the anti-interference device 5 can be inserted into the mounting seat 10 with the insertion hole 11 through the insertion column 12 at the bottom, so that the anti-interference device 5 can be fixed on the main core board 1, then the first rubber shock-absorbing strip block 402 and the second rubber shock-absorbing strip block 6 are respectively fixed on the main core board 1 and the side board 2 through the double-sided adhesive 401, after fixing, the mobile phone housing can be mounted, when the mobile phone housing is pressed by an external force, the supporting convex particles 403 on the first rubber shock-absorbing strip block 402 support the housing, the first rubber shock-absorbing strip block 402 and the second rubber shock-absorbing strip block 6 buffer and absorb the pressing force of the housing due to their own elasticity, thereby protecting the electronic components on the main core board 1, and when the mobile phone motherboard is in operation, the graphite heat dissipation plate 1502 can be used, the graphite heat dissipation plate 1501 can be removed, and the graphite heat dissipation plate 5 can be removed from the anti-interference device, so that the anti-interference effect of the anti-interference device 5 can be better.
Claims (7)
1. The utility model provides a high-efficient heat radiation structure of mobile phone motherboard, includes main core (1) and interference killing feature (5), its characterized in that, both ends are provided with sideboard (2) about main core (1), mounting hole (3) have been seted up to the four corners department of sideboard (2), one end that sideboard (2) are close to mounting hole (3) is installed and is used for buffering external force and extrude buffering subassembly (4) of mainboard, and buffers subassembly (4) and includes double faced adhesive tape (401), first rubber shock absorber strip piece (402) and support protruding grain (403), the surface of double faced adhesive tape (401) is provided with first rubber shock absorber strip piece (402), and the surface mounting of first rubber shock absorber strip piece (402) has support protruding grain (403), interference killing feature (5) are located the surface of main core (1), the upper and lower both ends on main core (1) surface are provided with second rubber shock absorber strip piece (6).
2. The efficient heat dissipation structure for mobile phone motherboard as claimed in claim 1, wherein said first rubber shock-absorbing bar (402) and said supporting protrusion (403) are of an integrated structure, and the number of the first rubber shock-absorbing bar (402) is four.
3. The efficient heat dissipation structure for mobile phone motherboards according to claim 1, wherein the elastic iron sheet (7) is disposed inside the anti-interference unit (5), and an anti-magnetic interference pad (8) is installed inside the anti-interference unit (5).
4. The efficient heat dissipation structure for mobile phone motherboards according to claim 1, wherein the external side of the anti-interference unit (5) is provided with a bump (9), and the lower end of the anti-interference unit (5) is installed with an insertion post (12).
5. The efficient heat dissipation structure for the mobile phone motherboard according to claim 4, wherein a mounting seat (10) is disposed below the plug column (12), and the upper surface of the mounting seat (10) is provided with a plug hole (11).
6. The efficient heat dissipation structure of mobile phone motherboard according to claim 1, wherein the outer surface of said main core board (1) is provided with a polyurethane coating (13), and the rear surface of said main core board (1) is mounted with a substrate (14).
7. The efficient heat dissipation structure of a mobile phone motherboard according to claim 6, wherein the surface of the substrate (14) is provided with a heat dissipation component (15) for assisting the main core board (1) in dissipating heat, and the heat dissipation component (15) comprises a graphite heat sink (1501), a heat conductive plate (1502) and heat dissipation holes (1503), the heat conductive plate (1502) is installed inside the graphite heat sink (1501), and the heat dissipation holes (1503) are opened on the surface of the graphite heat sink (1501).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221270880.0U CN218633995U (en) | 2022-05-25 | 2022-05-25 | High-efficient heat radiation structure of mobile phone motherboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221270880.0U CN218633995U (en) | 2022-05-25 | 2022-05-25 | High-efficient heat radiation structure of mobile phone motherboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218633995U true CN218633995U (en) | 2023-03-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221270880.0U Active CN218633995U (en) | 2022-05-25 | 2022-05-25 | High-efficient heat radiation structure of mobile phone motherboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218633995U (en) |
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2022
- 2022-05-25 CN CN202221270880.0U patent/CN218633995U/en active Active
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