CN220325647U - Mobile phone motherboard with protective structure - Google Patents
Mobile phone motherboard with protective structure Download PDFInfo
- Publication number
- CN220325647U CN220325647U CN202322054493.4U CN202322054493U CN220325647U CN 220325647 U CN220325647 U CN 220325647U CN 202322054493 U CN202322054493 U CN 202322054493U CN 220325647 U CN220325647 U CN 220325647U
- Authority
- CN
- China
- Prior art keywords
- mobile phone
- heat
- block
- main board
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 4
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 30
- 239000010439 graphite Substances 0.000 claims abstract description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000011159 matrix material Substances 0.000 claims abstract description 16
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000013016 damping Methods 0.000 claims description 15
- 230000035939 shock Effects 0.000 claims description 14
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 7
- 239000006096 absorbing agent Substances 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Landscapes
- Telephone Set Structure (AREA)
Abstract
The utility model discloses a mobile phone motherboard with a protective structure, which comprises a mobile phone motherboard body, a clamping block, a first spring and a stabilizing mechanism, wherein a graphite substrate is arranged on the surface of the mobile phone motherboard body through the clamping block; a hollow groove is formed in the middle of the interior of the graphite matrix; through the mutual matching of the protection mechanism and the stabilizing mechanism, the protection effect can be further improved, the impact force of vibration impact to the mobile phone main board body is reduced, and the mobile phone main board body can be better supported; through the arrangement of the graphite substrate, the clamping block, the heat conducting plate, the empty slot and the heat collecting tube, most of heat conducted by the wave-state heat conducting plate is directly led out through the heat radiating hole, the heat collecting tube is close to the empty slot and is communicated with the heat radiating hole, the heat collecting tube sucks heat and then leads out to the empty slot, and the heat is collected in the empty slot and led out through the heat radiating hole again; the utility model has simple structure and convenient operation, and is worth popularizing.
Description
Technical Field
The utility model relates to the technical field of mobile phone mainboards, in particular to a mobile phone mainboard with a protection structure.
Background
Along with the rapid development of communication technology, mobile phones have become an indispensable communication tool for people, and are also increasingly important for people, so that in daily life, mobile phones are not separated, and in order to prolong the service life of mobile phones, the requirements on crashproof of the mobile phones are high, and then the most important mobile phone main boards of the mobile phones are protected.
At present, most mobile phone main board bodies are easy to make the mobile phone main board bodies receive impact when vibrating, the mobile phone main board bodies are poor in supporting force, the mobile phone main board bodies cannot be further protected, meanwhile, heat cannot be further led out, influences on the mobile phone main board bodies are easy to cause for a long time, and therefore, the mobile phone main board with the protection structure is provided.
Disclosure of Invention
The present utility model is directed to a mobile phone motherboard with a protection structure, so as to solve the problems set forth in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the mobile phone motherboard with the protection structure comprises a mobile phone motherboard body, a clamping block, a first spring and a stabilizing mechanism, wherein a graphite substrate is arranged on the surface of the mobile phone motherboard body through the clamping block; a hollow groove is formed in the middle of the interior of the graphite matrix; both sides of the empty groove are provided with wave-shaped heat conducting plates; a plurality of heat collecting pipes are equidistantly arranged on one side of the empty groove; a plurality of heat dissipation holes are distributed on the top end array of the graphite matrix; the empty groove is communicated with the radiating hole; the outer side of the graphite matrix is provided with a protection plate through a first spring; the four corners of the mobile phone main board body are provided with protection mechanisms; the stabilizing mechanism is arranged around the protection mechanism;
the stabilizing mechanism comprises a connecting plate, a spring III and a top block, and the connecting plate is fixedly arranged on the outer wall of the protection mechanism; the bottom end of the third spring is embedded in the mobile phone main board body; the top end of the third spring penetrates through the connecting plate and extends to the upper end; a top block is fixedly arranged at the top end of the third spring; the top end of the top block is provided with anti-skid patterns; the top end of the top block is flush with the top end of the protection mechanism pair.
Preferably, the protection mechanism comprises a damping block, an anti-skid damping pad, a groove, a connecting rod, a second spring, a guide rod and an L-shaped magnetic block, wherein the second spring is sleeved outside the connecting rod; the connecting rod is inserted into the damping block at a section of the mobile phone main board body; a groove is formed in the damping block; an anti-skid shock pad is arranged on the outer wall of the shock absorption block; one end of the connecting rod, which is far away from the damping block, is provided with a guide rod; an L-shaped magnetic block is arranged on the outer side of the guide rod.
Preferably, the two guide rods are arranged in a staggered manner, and the inner grooves of the two L-shaped magnetic blocks are mutually matched with the guide rods.
Preferably, the graphite substrate has a square structure; the graphite substrate is provided with a plurality of.
Preferably, the height of the heat conducting plate is consistent with the height of the graphite matrix.
The beneficial effects are that: compared with the prior art, the utility model has the beneficial effects that: through the mutual matching of the protection mechanism and the stabilizing mechanism, the protection effect can be further improved, the impact force of vibration impact to the mobile phone main board body is reduced, and the mobile phone main board body can be better supported; through graphite base member, fixture block, heat-conducting plate, empty slot, heat-collecting tube's setting, the heat of wave state's heat-conducting plate heat conduction is mostly directly derived through the louvre, and the heat-collecting tube is nearer and communicates with each other with the louvre apart from the empty slot, and heat-collecting tube inhales heat back to the empty slot department derive, and heat gathers to empty slot in and derives through the louvre once more, and the heat-collecting tube can in time adsorb the inside heat of mobile phone motherboard body, avoids heat to be at the inside accumulation of mobile phone motherboard body, improves the radiating efficiency of mobile phone motherboard body.
Drawings
Fig. 1 is a schematic diagram of the whole structure of a mobile phone motherboard with a protection structure according to the present utility model.
Fig. 2 is a schematic diagram of a protection mechanism, a stabilizing mechanism and a position structure of a mobile phone motherboard body with a protection structure according to the present utility model.
Fig. 3 is a schematic diagram of a fixture block, a heat conducting plate, a hollow groove, a heat collecting tube, a first spring, a protection plate and a heat dissipating hole kerbstone structure of a mobile phone motherboard with a protection structure according to the present utility model.
In the accompanying drawings: the mobile phone comprises a 1-mobile phone main board body, a 2-graphite substrate, a 3-clamping block, a 4-heat-conducting plate, a 5-empty slot, a 6-heat-collecting pipe, a 7-spring I, an 8-protection plate, a 9-heat-radiating hole, a 10-protection mechanism, a 101-damping block, a 102-anti-slip damping pad, a 103-groove, a 104-connecting rod, a 105-spring II, a 106-connecting rod, a 107-L-shaped magnetic block, a 11-stabilizing mechanism, a 111-connecting plate, a 112-spring III and a 113-top block.
Detailed Description
In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.
Examples
Referring to the drawings of the specification, in the embodiment of the utility model, a mobile phone motherboard with a protection structure comprises a mobile phone motherboard body 1, a clamping block 3, a spring 7 and a stabilizing mechanism 11, wherein a graphite substrate 2 is arranged on the surface of the mobile phone motherboard body 1 through the clamping block 3; a hollow groove 5 is arranged in the middle of the interior of the graphite matrix 2; both sides of the empty groove 5 are provided with wave-shaped heat conducting plates; a plurality of heat collecting pipes 6 are equidistantly arranged on one side of the empty groove 5; a plurality of heat dissipation holes 9 are distributed on the top end of the graphite matrix 2 in an array manner; the empty groove 5 is communicated with the radiating hole 9; the outer side of the graphite matrix 2 is provided with a protection plate 8 through a first spring 7; the four corners of the mobile phone main board body 1 are provided with protection mechanisms 10; the stabilizing mechanism 11 is arranged around the protecting mechanism 10; the stabilizing mechanism 11 comprises a connecting plate 111, a third spring 112 and a top block 113, and the connecting plate 111 is fixedly arranged on the outer wall of the protection mechanism 10; the bottom end of the third spring 112 is embedded in the mobile phone main board body 1; the top end of the third spring 112 extends to the upper end through the connecting plate 111; a top block 113 is fixedly arranged at the top end of the third spring 112; the top end of the top block 113 is provided with anti-skid patterns; the top end of the top block 113 is level with the top end of the protection mechanism 1 pair; the protection mechanism 10 comprises a damping block 101, an anti-skid damping pad 102, a groove 103, a connecting rod 104, a second spring 105, a guide rod 106 and an L-shaped magnetic block 107, wherein the second spring 105 is sleeved outside the connecting rod 104; the connecting rod is inserted into the shock-absorbing block 101 at a section back to the mobile phone main board body 1; a groove 103 is formed in the damping block 101; the outer wall of the shock absorption block 101 is provided with an anti-skid shock absorption pad 102; one end of the connecting rod 104, which is far away from the shock absorption block 101, is provided with a guide rod 106; an L-shaped magnetic block 107 is arranged on the outer side of the guide rod 106; the two guide rods 106 are arranged in a staggered way, and the inner grooves of the two L-shaped magnetic blocks 107 are matched with the guide rods 106; the graphite matrix 2 has a square structure; the graphite matrixes 2 are arranged in a plurality, and the graphite matrixes 2 are distributed on two sides of the middle part of the mobile phone main board body 1, so that heat dissipation can be carried out on the middle part of the mobile phone main board body 1; the height of the heat conducting plate 4 is consistent with that of the graphite matrix 2, and heat is better conducted out.
The using process comprises the following steps:
when the mobile phone main board body 1 is subjected to vibration impact, the impact force of external impact received in the middle of the mobile phone main board body 1 is reduced through the arrangement of the spring III 112 and the top block 113 in the middle of the mobile phone main board body 1, the protection mechanism 10 can be assisted to protect the mobile phone main board body 1 through the arrangement of the stabilizing mechanism 11 around the mobile phone main board body 1, the impact force is reduced, the anti-slip shock pad 102 can prevent the shock absorber block 101 from shifting to reduce the protection effect when the mobile phone main board body 1 encounters the impact vibration, meanwhile, the shock absorber block 101 is pulled by the elastic force of the spring II 105 to perform shock absorption movement, one end of the connecting rod 104 is inserted into the groove 103 corresponding to the shock absorber block 101, the beneficial condition is provided for the shock absorption of the shock absorber block 101, the connecting rod 104 is clamped in the mobile phone main board body 1 through the guide rod 106 and the L-shaped magnetic block 107, the two L-shaped magnetic blocks 107 are mutually fixed on the opposite connecting rod 104, the fixing effect is improved, the installation and the maintenance cost is reduced, the protection effect can be further improved through the mutual cooperation of the protection mechanism 10 and the stabilizing mechanism 11, the impact force brought to the mobile phone main board 1 is reduced, and the main board 1 can be better supported; when the mobile phone main board body 1 is internally provided with certain heat, the heat conducting plate 4 and the heat collecting pipe 6 conduct the heat to the graphite substrate 2, most of the heat conducted by the heat conducting plate 4 is directly led out through the heat radiating holes 9, the heat collecting pipe 6 is nearer to the empty slot 5 and is communicated with the heat radiating holes, the heat collecting pipe 6 absorbs the heat and is led out to the empty slot 5, the heat is collected into the empty slot 5 and is led out through the heat radiating holes 9 again, the heat collecting pipe 6 can timely adsorb the heat in the mobile phone main board body 1, heat accumulation in the mobile phone main board body is avoided, and the heat radiating efficiency of the mobile phone main board body 1 is improved.
In the process, the protection mechanism and the stabilizing mechanism are matched with each other, so that the protection effect can be further improved, the impact force of vibration impact to the mobile phone main board body is reduced, and the mobile phone main board body can be better supported; through the arrangement of the graphite substrate, the clamping block, the heat conducting plate, the empty slot and the heat collecting tube, most of heat conducted by the wave-state heat conducting plate is directly led out through the heat radiating hole, the heat collecting tube is close to the empty slot and is communicated with the heat radiating hole, the heat collecting tube absorbs heat and then leads out to the empty slot, the heat is collected into the empty slot and led out through the heat radiating hole again, the heat collecting tube can absorb heat in the mobile phone main board body in time, heat accumulation in the mobile phone main board body is avoided, and the heat radiating efficiency of the mobile phone main board body is improved; through the arrangement of the first spring and the protection plate, the middle part of the main board body of the mobile phone can be protected in an auxiliary mode, and meanwhile, the graphite matrix can be protected and damped; the utility model has the advantages of this application simple structure, the practicality is strong, and easy operation is worth promoting.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that modifications and improvements can be made by those skilled in the art without departing from the spirit of the present utility model, and these should also be considered as the scope of the present utility model, which does not affect the effect of the implementation of the present utility model and the utility of the patent.
Claims (5)
1. A mobile phone motherboard with protective structure, its characterized in that: the mobile phone main board comprises a mobile phone main board body, a clamping block, a first spring and a stabilizing mechanism, wherein a graphite substrate is arranged on the surface of the mobile phone main board body through the clamping block; a hollow groove is formed in the middle of the interior of the graphite matrix; both sides of the empty groove are provided with wave-shaped heat conducting plates; a plurality of heat collecting pipes are equidistantly arranged on one side of the empty groove; a plurality of heat dissipation holes are distributed on the top end array of the graphite matrix; the empty groove is communicated with the radiating hole; the outer side of the graphite matrix is provided with a protection plate through a first spring; the four corners of the mobile phone main board body are provided with protection mechanisms; the stabilizing mechanism is arranged around the protection mechanism;
the stabilizing mechanism comprises a connecting plate, a spring III and a top block, and the connecting plate is fixedly arranged on the outer wall of the protection mechanism; the bottom end of the third spring is embedded in the mobile phone main board body; the top end of the third spring penetrates through the connecting plate and extends to the upper end; a top block is fixedly arranged at the top end of the third spring; the top end of the top block is provided with anti-skid patterns; the top end of the top block is flush with the top end of the protection mechanism pair.
2. The mobile phone motherboard with a protection structure according to claim 1, wherein: the protection mechanism comprises a damping block, an anti-skid damping pad, a groove, a connecting rod, a second spring, a guide rod and an L-shaped magnetic block, wherein the second spring is sleeved outside the connecting rod; the connecting rod is inserted into the damping block at a section of the mobile phone main board body; a groove is formed in the damping block; an anti-skid shock pad is arranged on the outer wall of the shock absorption block; one end of the connecting rod, which is far away from the damping block, is provided with a guide rod; an L-shaped magnetic block is arranged on the outer side of the guide rod.
3. The mobile phone motherboard with a protection structure according to claim 2, wherein: the two guide rods are arranged in a staggered mode, and the inner grooves of the two L-shaped magnetic blocks are matched with the guide rods.
4. The mobile phone motherboard with a protection structure according to claim 1, wherein: the graphite matrix is of a square structure; the graphite substrate is provided with a plurality of.
5. The mobile phone motherboard with a protection structure according to claim 1, wherein: the height of the heat conducting plate is consistent with that of the graphite matrix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322054493.4U CN220325647U (en) | 2023-08-02 | 2023-08-02 | Mobile phone motherboard with protective structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322054493.4U CN220325647U (en) | 2023-08-02 | 2023-08-02 | Mobile phone motherboard with protective structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220325647U true CN220325647U (en) | 2024-01-09 |
Family
ID=89412810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322054493.4U Active CN220325647U (en) | 2023-08-02 | 2023-08-02 | Mobile phone motherboard with protective structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220325647U (en) |
-
2023
- 2023-08-02 CN CN202322054493.4U patent/CN220325647U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210156710U (en) | Laser device | |
| CN213459934U (en) | Shock absorption type connecting device for lithium ion battery module and box body | |
| CN110970586A (en) | New forms of energy are shock attenuation heat abstractor for battery | |
| CN220325647U (en) | Mobile phone motherboard with protective structure | |
| CN206148134U (en) | Hard disk shock -absorbing device | |
| CN107479676B (en) | Heat radiation structure with shock-absorbing function for computer | |
| CN215342861U (en) | Battery mounting structure | |
| CN212381593U (en) | Durable large-scale switch radiator of high-efficient graphite alkene heat dissipation | |
| CN104589811A (en) | Shakeproof heat dissipating printer with free movement | |
| CN211352823U (en) | Anti-seismic copper-clad plate easy to install | |
| CN113097600A (en) | Heat-engine and electric energy storage combined frequency modulation battery box cooling device | |
| CN209784922U (en) | Industrial computer damping base | |
| CN213017480U (en) | Installation device of high-speed laser module | |
| CN218633995U (en) | High-efficient heat radiation structure of mobile phone motherboard | |
| CN214146420U (en) | Rubber shock pad structure for automobile radiator | |
| CN211231419U (en) | Buffer device on silicon-aluminum alloy box body | |
| CN213602942U (en) | Intelligent food equipment data acquisition module | |
| CN213847339U (en) | Antidetonation LED power | |
| CN217359974U (en) | Impact-proof shell device of fuel cell polling instrument | |
| CN214579760U (en) | Mechanical and electrical equipment double-damping fixed stress piece | |
| CN217108010U (en) | Impact-resistant shock-insulation damping for military and civil dual-purpose electronic cabinet system | |
| CN215580706U (en) | Possesses explosion-proof new energy automobile motor casing of antidetonation | |
| CN215529593U (en) | 4G module with shock-absorbing function | |
| CN108468749B (en) | Damping device for multifunctional novel printing machine | |
| CN214757236U (en) | Protection device for computer switcher |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |