CN212752325U - Mobile phone motherboard with shock attenuation and heat dissipation function - Google Patents
Mobile phone motherboard with shock attenuation and heat dissipation function Download PDFInfo
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- CN212752325U CN212752325U CN202022181597.8U CN202022181597U CN212752325U CN 212752325 U CN212752325 U CN 212752325U CN 202022181597 U CN202022181597 U CN 202022181597U CN 212752325 U CN212752325 U CN 212752325U
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- phone motherboard
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Abstract
The utility model belongs to the technical field of mobile phone main boards, and discloses a mobile phone main board with shock absorption and heat dissipation functions, which comprises a mobile phone main board body, wherein two side walls of the mobile phone main board body are symmetrically fixed with fixing strips, the middle position of the outer surface wall of the fixing strip is provided with a chute, the inside of the chute is slidably connected with a slide block matched with the chute, the outer end of the slide block is connected with a first mounting plate, the upper end and the lower end of the fixing strip are symmetrically connected with a second mounting plate, the utility model realizes the insertion installation of heat dissipation fins through the matching of the fixing plate and the slots, when the heat dissipation fins are required to be dismounted for replacement or dust removal, the heat dissipation fins can be directly pulled out, the heat dissipation fins to be replaced or dust removal can be pulled out from the slots, the dismounting is fast and convenient, time and labor are saved, in addition, the heat can be effectively accelerated to be led out and dissipated.
Description
Technical Field
The utility model belongs to the technical field of the mobile phone motherboard, concretely relates to mobile phone motherboard with shock attenuation and heat dissipation function.
Background
With the development of society and science and technology, more and more mobile phones enter the market, wherein a mobile phone motherboard is an important part of the mobile phone, and the mobile phone motherboard is a circuit board which consists of a baseband part responsible for coding, a radio frequency processing part for realizing a signal receiving and releasing function, other peripherals and a memory connecting part, and can also be called a pcb (printed circuit board).
In chinese patent with patent number cn201920519926.x, a mobile phone motherboard with shock attenuation and heat dissipation function is disclosed, describe in this patent "the fin can absorb the heat of mobile phone motherboard body output, reach radiating effect, the electrical components in the cell-phone has been protected" but heat radiation structure and mobile phone motherboard fixed connection in this patent, when certain fin damages needs to be changed or needs the deashing, be difficult to lift, comparatively waste time and energy, furthermore, the mounting structure flexibility of traditional mobile phone motherboard both sides is relatively poor, can't install according to nimble change position of needs, certain limitation has.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a mobile phone motherboard with shock attenuation and heat dissipation function to provide traditional fin and mobile phone motherboard fixed connection in solving above-mentioned background, the follow-up problem of lifting off and changing or deashing of being not convenient for, in addition, the relatively poor problem of mounting structure flexibility of traditional mobile phone motherboard both sides.
In order to achieve the above object, the utility model provides a following technical scheme: a mobile phone mainboard with shock absorption and heat dissipation functions comprises a mobile phone mainboard body, wherein fixing strips are symmetrically fixed on two side walls of the mobile phone mainboard body, a sliding groove is arranged in the middle of the outer surface wall of the fixed strip, a sliding block matched with the sliding groove is connected inside the sliding groove in a sliding manner, the outer end of the slide block is connected with a first mounting plate, the upper end and the lower end of the fixing strip are symmetrically connected with a second mounting plate, the upper end and the lower end of the mobile phone mainboard body are both connected with a fixing plate, both ends of the fixing plate are both fixedly connected with a fixing strip, and the upper surface wall of the fixing plate is provided with slots at equal intervals, the inside of the slots is inserted with radiating fins matched with the slots, one end of the radiating fin, facing the mobile phone main board body, is bonded with a heat-conducting silica gel layer through a hot melt adhesive, and one side, far away from the radiating fin, of the heat-conducting silica gel layer is in contact with the mobile phone main board body.
Preferably, sponge mats are fixed to the upper end and the lower end of the front surface wall of the mobile phone mainboard body, and two sponge mats are fixed to the upper end and the lower end of the front surface wall of the mobile phone mainboard body.
Preferably, the sponge cushion is symmetrically provided with grooves in the interior, and the grooves are internally provided with damping springs.
Preferably, the mounting holes are formed in the outer surface walls of the first mounting plate and the second mounting plate and are of circular structures.
Preferably, the cross-section of spout is isosceles trapezoid structure, and the port department width of spout is less than the width of its inside bottom.
Preferably, the inner wall of the slot is provided with anti-slip lines, and one end of the radiating fin, which is far away from the mobile phone main board body, is flush with the outer end face of the fixing strip.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses a cooperation of fixed plate and slot has realized inserting of radiating fin and has established the installation, when radiating fin changes or the deashing, can directly pull out radiating fin outward when needing to lift radiating fin off, can extract the radiating fin who treats to change or the deashing from the slot in, lift swift convenience off, labour saving and time saving, in addition, the heat conduction silica gel layer contact mobile phone motherboard body of addding can effectively accelerate thermal derivation and go.
(2) The utility model discloses a cooperation of fixed strip, spout and slider utilizes the slip of slider in the spout, has realized the swing joint of first mounting panel, can freely change first mounting panel as required and install in the position of mobile phone motherboard body both sides, and the flexibility is strong, is difficult for being eliminated.
Drawings
Fig. 1 is a front view of the present invention;
fig. 2 is a cross-sectional view of the fixing strip of the present invention;
FIG. 3 is a schematic structural view of the sponge cushion of the present invention;
fig. 4 is a top view of the fixing plate of the present invention;
FIG. 5 is an enlarged view of portion A of FIG. 1;
FIG. 6 is an enlarged view of portion B of FIG. 3;
in the figure: 1. a mobile phone mainboard body; 2. a fixing strip; 3. a fixing plate; 4. a heat dissipating fin; 5. a first mounting plate; 6. a second mounting plate; 7. a sponge cushion; 8. a slider; 9. mounting holes; 10. a chute; 11. a slot; 12. a heat conductive silica gel layer; 13. a groove; 14. a shock absorbing spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a mobile phone mainboard with shock absorption and heat dissipation functions comprises a mobile phone mainboard body 1, fixing strips 2 are symmetrically fixed on two side walls of the mobile phone mainboard body 1, a sliding groove 10 is formed in the middle position of the outer surface wall of each fixing strip 2, a sliding block 8 matched with the sliding groove 10 is connected inside the sliding groove 10 in a sliding mode, a first mounting plate 5 is connected to the outer end of the sliding block 8, the sliding of the sliding block 8 in the sliding groove 10 is utilized to realize the movable connection of the first mounting plate 5, the positions, on two sides of the mobile phone mainboard body 1, of the first mounting plate 5 can be freely changed according to needs to be mounted, the flexibility is strong, the elimination is not easy, a second mounting plate 6 is symmetrically connected to the upper end and the lower end of each fixing strip 2, fixing plates 3 are connected to the upper end and the lower end of each mobile phone mainboard body 1, two ends of each fixing plate 3 are fixedly connected with the fixing strips 2, slots 11 are formed in, radiating fin 4 has heat conduction silica gel layer 12 towards the one end of mobile phone motherboard body 1 through the hot melt adhesive bonding, one side that radiating fin 4 was kept away from to heat conduction silica gel layer 12 contacts with mobile phone motherboard body 1, when radiating fin 4 is changed or the deashing is lifted off to needs, radiating fin 4 can directly be pulled out outward, radiating fin 4 that can treat to change or the deashing is extracted from slot 11, it is swift convenient to lift off, time saving and labor saving, in addition, the heat conduction silica gel layer 12 contact mobile phone motherboard body 1 who adds, can effectively accelerate thermal derivation and go away.
In order to realize the buffering shock attenuation performance of this mobile phone motherboard to reduce the damage degree when shaking, in this embodiment, preferred, the front surface wall upper and lower end all is fixed with foam-rubber cushion 7 before mobile phone motherboard body 1, and foam-rubber cushion 7 is fixed with two altogether.
In order to further increase the damping performance of the buffer, in this embodiment, preferably, the sponge pad 7 is symmetrically provided with grooves 13 inside, and the damping springs 14 are installed inside the grooves 13.
In order to ensure the stability of the installation of the main board of the mobile phone, in this embodiment, preferably, the mounting holes 9 are formed in the outer surface walls of the first mounting plate 5 and the second mounting plate 6, and the mounting holes 9 are of a circular structure.
In order to avoid the sliding block 8 from falling off from the port of the sliding chute 10, in this embodiment, preferably, the cross section of the sliding chute 10 is an isosceles trapezoid structure, and the width of the port of the sliding chute 10 is smaller than the width of the inner bottom end thereof.
In order to increase the inserting stability of the heat dissipation fins 4 and increase the overall aesthetic property of the mobile phone motherboard, in this embodiment, preferably, the inner wall of the slot 11 is provided with anti-slip lines, and one end of the heat dissipation fins 4 away from the mobile phone motherboard body 1 is flush with the outer end face of the fixing strip 2.
The utility model discloses a theory of operation and use flow: when the utility model is used, the mobile phone mainboard can be stably installed in the mobile phone through the first mounting plate 5 and the second mounting plate 6 which are provided with the mounting holes 9, wherein, the sliding of the sliding block 8 in the sliding groove 10 can freely change the positions of the first mounting plate 5 on the two sides of the mobile phone main board body 1 for mounting according to the requirement, the flexibility is strong, in addition, the radiating fins 4 additionally provided with the heat-conducting silica gel layer 12 contact the mobile phone main board body 1, the heat conduction and dissipation can be effectively accelerated, wherein, when the radiating fins 4 need to be dismounted for replacement or ash removal, the radiating fins 4 can be directly pulled out, the heat dissipation fins 4 to be replaced or cleaned can be pulled out from the slots 11 arranged on the fixing plate 3, the dismounting is quick and convenient, the time and the labor are saved, in addition, the spongy cushion 7 provided with the damping spring 14 can effectively buffer the vibration and reduce the looseness and damage of elements.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a mobile phone motherboard with shock attenuation and heat dissipation function which characterized in that: including the mobile phone motherboard body, the both sides wall symmetry of mobile phone motherboard body is fixed with the fixed strip, the spout has been seted up to the exterior wall intermediate position department of fixed strip, the inside sliding connection of spout has the slider rather than the looks adaptation, the outer end of slider is connected with first mounting panel, the last lower extreme symmetry of fixed strip is connected with the second mounting panel, the upper and lower end of mobile phone motherboard body all is connected with the fixed plate, the both ends of fixed plate all with fixed strip fixed connection, and the equidistant slot of having seted up of the last table wall of fixed plate, the inside of slot is inserted and is equipped with the radiating fin rather than the looks adaptation, radiating fin bonds through the hot melt adhesive towards the one end of mobile phone motherboard body and has heat conduction silica gel layer, radiating fin's one side is kept away from on the heat conduction silica gel layer.
2. The mobile phone motherboard with shock absorption and heat dissipation functions as recited in claim 1, wherein: sponge pads are fixed to the upper end and the lower end of the front surface wall of the mobile phone mainboard body, and two sponge pads are fixed to the sponge pads.
3. The mobile phone motherboard with shock absorption and heat dissipation functions as recited in claim 2, wherein: the sponge cushion is characterized in that grooves are symmetrically formed in the sponge cushion, and damping springs are mounted in the grooves.
4. The mobile phone motherboard with shock absorption and heat dissipation functions as recited in claim 1, wherein: the mounting hole has all been seted up to the outer surface wall of first mounting panel and second mounting panel, the mounting hole is circular structure.
5. The mobile phone motherboard with shock absorption and heat dissipation functions as recited in claim 1, wherein: the cross-section of spout is isosceles trapezoid structure, and the port department width of spout is less than the width of its inside bottom.
6. The mobile phone motherboard with shock absorption and heat dissipation functions as recited in claim 1, wherein: the inner wall of the slot is provided with anti-slip lines, and one end, away from the mobile phone main board body, of the radiating fin is flush with the outer end face of the fixing strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022181597.8U CN212752325U (en) | 2020-09-28 | 2020-09-28 | Mobile phone motherboard with shock attenuation and heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022181597.8U CN212752325U (en) | 2020-09-28 | 2020-09-28 | Mobile phone motherboard with shock attenuation and heat dissipation function |
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| CN212752325U true CN212752325U (en) | 2021-03-19 |
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| CN202022181597.8U Active CN212752325U (en) | 2020-09-28 | 2020-09-28 | Mobile phone motherboard with shock attenuation and heat dissipation function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115016610A (en) * | 2022-06-16 | 2022-09-06 | 深圳市凌壹科技有限公司 | Self-service terminal of finance is with shock-proof type industry control mainboard |
-
2020
- 2020-09-28 CN CN202022181597.8U patent/CN212752325U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115016610A (en) * | 2022-06-16 | 2022-09-06 | 深圳市凌壹科技有限公司 | Self-service terminal of finance is with shock-proof type industry control mainboard |
| CN115016610B (en) * | 2022-06-16 | 2023-05-02 | 深圳市凌壹科技有限公司 | Shock attenuation type industrial control mainboard for self-service finance terminal |
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