CN211090353U

CN211090353U - Radiator structure of electronic element

Info

Publication number: CN211090353U
Application number: CN201920847331.7U
Authority: CN
Inventors: 蔡陆彬
Original assignee: Longchuan Hengchangyuan Electronic Technology Co ltd
Current assignee: Longchuan Hengchangyuan Electronic Technology Co ltd
Priority date: 2019-06-05
Filing date: 2019-06-05
Publication date: 2020-07-24
Anticipated expiration: 2029-06-05

Abstract

The utility model relates to a radiator technical field just discloses an electronic component radiator structure, including mount pad and aluminum plate, aluminum plate is located the top of mount pad, the aluminum plate middle part is seted up flutedly, the inside of recess is including the fan, the bottom of fan and the interior diapire swing joint of recess, aluminum plate's top is including dead slot and heat dissipation copper pipe, the dead slot is located the left side and the right side at aluminum plate top. This electronic component radiator structure, through having set up fan and heat dissipation copper pipe, it is higher when ambient temperature, when the inside heat dissipation demand of device is higher, the device can dispel the heat through forced air cooling and water-cooling dual mode, make the radiating effect of device reach better, then it is lower when ambient temperature, when the inside heat dissipation requirement of heat dissipation is lower, can close the inside liquid flow of heat dissipation copper pipe, make the device only dispel the heat through the fan, make the device at the in-process that uses, the waste of the energy has been reduced effectively.

Description

Radiator structure of electronic element

Technical Field

The utility model relates to a radiator technical field specifically is an electronic component radiator structure.

Background

Along with the improvement of circuit integration technology, the electronic element is smaller and smaller in size and larger in power consumption, so that the heat dissipation problem is more and more serious, whether the heat dissipation of the electronic element is good or not is directly determined, the stability of product operation and the service life are directly determined, in the prior art, a heat radiator is generally installed on the electronic element to solve the heat dissipation problem, the heat dissipation of some existing heat radiators is realized mainly in a liquid cooling mode or an air cooling mode, and one mode is independently adopted, so that the heat dissipation effect is not good, the heat dissipation mode cannot be adjusted in use, and when the original heat dissipation mode is still adopted when the heat dissipation requirement is not high in winter, certain energy waste can be caused.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides an electronic component radiator structure possesses two kinds of radiating modes, and can adjust the advantage of radiating mode when using, has solved current radiator and can't adjust the radiating mode when using, still takes original radiating mode when the heat dissipation requirement in winter is not very high, can cause the extravagant problem of certain energy.

The utility model provides a following technical scheme: the utility model provides an electronic component radiator structure, includes mount pad and aluminum plate, aluminum plate is located the top of mount pad, the aluminum plate middle part is seted up flutedly, the inside of recess is including the fan, the bottom of fan and the interior diapire swing joint of recess, aluminum plate's top is including dead slot and heat dissipation copper pipe, the dead slot is located the left side and the right side at aluminum plate top, the inside at the dead slot is inlayed to the heat dissipation copper pipe, the inside of mount pad is including two cavities, and two cavities are located the left side and the right side at mount pad top respectively, and the inside of two cavities all includes installation mechanism.

Preferably, the groove comprises an isolation net inside, and the side surface of the isolation net is fixedly connected with the top of the inner wall of the side surface of the groove.

Preferably, aluminum plate's bottom is including connecting seat and mounting panel, the top of connecting seat and aluminum plate's bottom fixed connection, the top of mounting panel and the bottom fixed connection of connecting seat, the bottom of mounting panel and the top swing joint of mount pad.

Preferably, the left side and the right side of the mounting plate respectively comprise a triangular block, and one opposite sides of the two triangular blocks are fixedly connected with the left side and the right side of the mounting plate respectively.

Preferably, the mounting mechanism comprises a sliding plate, a clamping rod, a connecting plate, an extrusion spring, two sliding chutes and two pulleys, the surface of the sliding plate is movably connected with the inside of the cavity, the left end of the clamping rod is fixedly connected with the right side of the sliding plate, the left end of the clamping rod is movably inserted in the cavity, the right end of the connecting rod is fixedly connected with the left side of the sliding plate, the right side of the connecting plate is fixedly connected with the left end of the connecting rod, the right end of the extrusion spring is fixedly connected with the left side of the connecting plate, the left end of the extrusion spring is fixedly connected with the inner wall on the left side of the cavity, the two sliding grooves are respectively located on the inner top wall and the inner bottom wall of the cavity, one sides, opposite to the two pulleys, are respectively movably connected with the tops and the ground steps of the two sliding plates, and one sides, far away from the sliding plates, of the two pulleys are respectively movably connected with the interiors of the two sliding grooves.

Preferably, the right side of cavity is including the through-hole, the through-hole is located the inner wall on cavity right side, the right-hand member of joint pole extends to the right side of cavity through the through-hole, and the inside swing joint of the surface of joint pole and through-hole.

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. this electronic component radiator structure, through having set up fan and heat dissipation copper pipe, it is higher when ambient temperature, when the inside heat dissipation demand of device is higher, the device can dispel the heat through forced air cooling and water-cooling dual mode, make the radiating effect of device reach better, then it is lower when ambient temperature, when the inside heat dissipation requirement of heat dissipation is lower, can close the inside liquid flow of heat dissipation copper pipe, make the device only dispel the heat through the fan, make the device at the in-process that uses, the waste of the energy has been reduced effectively.

2. This electronic component radiator structure, through having set up the mount pad, then the inside of mount pad is provided with installation mechanism, through the effect of connecting seat, mounting panel, triangle piece and installation mechanism for the top of base can be installed through the effect of mounting panel to aluminum plate's bottom, then is convenient for fix through installation mechanism, makes the device reach the effect of the installation of being convenient for when using, has solved some devices that have now and has installed the more troublesome problem when using.

Drawings

FIG. 1 is a sectional view of the present invention;

FIG. 2 is a top view of the present invention;

fig. 3 is an enlarged view of a structure shown in fig. 1 according to the present invention.

In the figure: 1. a mounting seat; 2. an aluminum plate; 3. a groove; 4. a fan; 5. an isolation net; 6. an empty groove; 7. a heat dissipation copper pipe; 8. a connecting seat; 9. mounting a plate; 10. a triangular block; 11. a cavity; 12. an installation mechanism; 1201. a slide plate; 1202. a clamping and connecting rod; 1203. a connecting rod; 1204. a connecting plate; 1205. a compression spring; 1206. a chute; 1207. a pulley; 13. and a through hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a heat sink structure for electronic components includes a mounting base 1 and an aluminum plate 2, the aluminum plate 2 is located above the mounting base 1, a groove 3 is formed in the middle of the aluminum plate 2, a fan 4 is included in the groove 3, the bottom of the fan 4 is movably connected with the inner bottom wall of the groove 3, an isolation net 5 is included in the groove 3, the side surface of the isolation net 5 is fixedly connected with the top of the inner side wall of the groove 3, the top of the aluminum plate 2 includes a hollow groove 6 and a heat dissipation copper pipe 7, the hollow groove 6 is located on the left side and the right side of the top of the aluminum plate 2, the heat dissipation copper pipe 7 is embedded in the hollow groove 6, the heat dissipation copper pipe 7 is adhered to the inner wall of the hollow groove 6 through a heat conduction adhesive, the bottom of the aluminum plate 2 includes a connecting base 8 and a mounting plate 9, the top of the connecting base 8 is fixedly connected with the, the inside of the connecting seat 8 is connected with an external circuit through a lead to ensure that the heat dissipation device can normally operate, the top of the mounting plate 9 is fixedly connected with the bottom of the connecting seat 8, the bottom of the mounting plate 9 is movably connected with the top of the mounting seat 1, the left side and the right side of the mounting plate 9 both comprise triangular blocks 10, one opposite sides of the two triangular blocks 10 are respectively fixedly connected with the left side and the right side of the mounting plate 9, the inside of the mounting seat 1 comprises two cavities 11, the two cavities 11 are respectively positioned at the left side and the right side of the top of the mounting seat 1, the inside of the two cavities 11 both comprise mounting mechanisms 12, each mounting mechanism 12 comprises a sliding plate 1201, a clamping rod 1202, a connecting rod 1203, a connecting plate 1204, an extrusion spring 1205, two sliding chutes 1206 and two pulleys 1207, the surface of the sliding plate 1201 is movably connected with the inside of the cavities 11, and the left end of, the left end of the clamping rod 1202 is movably inserted into the cavity 11, the right end of the connecting rod 1203 is fixedly connected with the left side of the sliding plate 1201, the right side of the connecting plate 1204 is fixedly connected with the left end of the connecting rod 1203, the right end of the extrusion spring 1205 is fixedly connected with the left side of the connecting plate 1204, the left end of the extrusion spring 1205 is fixedly connected with the inner wall of the left side of the cavity 11, the two sliding grooves 1206 are respectively positioned on the inner top wall and the inner bottom wall of the cavity 11, the opposite sides of the two pulleys 1207 are respectively movably connected with the tops and the ground steps of the two sliding plates 1201, the sides of the two pulleys 1207 far away from the sliding plates 1201 are respectively movably connected with the inner parts of the two sliding grooves 1206, the sliding plates 1201 can be assisted to move left and right in the cavity 11 under the action of the sliding grooves 1206 and the pulleys 1207, so that the tops of the mounting plates 9 can be fixed through, the right end of joint pole 1202 extends to the right side of cavity 11 through-hole 13, and the inside swing joint of the surface of joint pole 1202 and through-hole 13, when ambient temperature is higher, dispel the heat to the inside of device through the dual function of fan 4 and heat dissipation copper pipe 7, when ambient temperature is lower, block the work of heat dissipation copper pipe 7, only dispel the heat to the inside of device through fan 4, thereby make the device can switch the radiating mode in the in-process that uses and reach the radiating effect when, also can save the waste of the energy effectively.

The working principle is that when the device is used and the outside temperature is higher, the inside of the device is radiated by the double functions of the fan 4 and the radiating copper pipe 7, when the outside temperature is lower, the work of the heat dissipation copper pipe 7 is blocked, the inside of the device is dissipated only through the fan 4, when the device is installed, the mounting plate 9 is placed at the top of the mounting seat 1, the aluminum plate 2 is pressed downwards, so that the mounting plate 9 moves downwards at the top of the mounting seat 1, the inclined surfaces of the two triangular blocks 10 then press against the inclined surfaces of the clamping bars 1202, so that the clamping bars 1202 move towards the interior of the cavity, when the bottom of the mounting plate 9 is in contact with the top of the mounting socket 1, by the elastic force of the pressing spring 1205, the slide plate 1201 is moved to a side close to the mounting plate 9, the catch rod 1202 is moved outward from the inside of the cavity 11, and then the top of the mounting plate 9 is fixed by the catch rod 1202.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An electronic component radiator structure, includes mount pad (1) and aluminum plate (2), its characterized in that: aluminum plate (2) are located the top of mount pad (1), aluminum plate (2) middle part is seted up fluted (3), the inside of recess (3) is including fan (4), the bottom of fan (4) and the interior diapire swing joint of recess (3), the top of aluminum plate (2) is including dead slot (6) and heat dissipation copper pipe (7), dead slot (6) are located the left side and the right side at aluminum plate (2) top, heat dissipation copper pipe (7) are inlayed in the inside of dead slot (6), the inside of mount pad (1) is including two cavities (11), and two cavities (11) are located the left side and the right side at mount pad (1) top respectively, and the inside of two cavities (11) all includes installation mechanism (12).

2. A heat sink structure for electronic components according to claim 1, wherein: the inner part of the groove (3) comprises an isolation net (5), and the side surface of the isolation net (5) is fixedly connected with the top of the inner wall of the side surface of the groove (3).

3. A heat sink structure for electronic components according to claim 1, wherein: the bottom of aluminum plate (2) is including connecting seat (8) and mounting panel (9), the top of connecting seat (8) and the bottom fixed connection of aluminum plate (2), the top of mounting panel (9) and the bottom fixed connection of connecting seat (8), the bottom of mounting panel (9) and the top swing joint of mount pad (1).

4. A heat sink structure for electronic components according to claim 3, wherein: the left side and the right side of the mounting plate (9) comprise triangular blocks (10), and one sides of the two triangular blocks (10) which are opposite are fixedly connected with the left side and the right side of the mounting plate (9) respectively.

5. A heat sink structure for electronic components according to claim 1, wherein: the mounting mechanism (12) comprises a sliding plate (1201), a clamping rod (1202), a connecting rod (1203), a connecting plate (1204), an extrusion spring (1205), two sliding chutes (1206) and two pulleys (1207), the surface of the sliding plate (1201) is movably connected with the inside of the cavity (11), the left end of the clamping rod (1202) is fixedly connected with the right side of the sliding plate (1201), the left end of the clamping rod (1202) is movably inserted into the inside of the cavity (11), the right end of the connecting rod (1203) is fixedly connected with the left side of the sliding plate (1201), the right side of the connecting plate (1204) is fixedly connected with the left end of the connecting rod (1203), the right end of the extrusion spring (1205) is fixedly connected with the left side of the connecting plate (1204), the left end of the extrusion spring (1205) is fixedly connected with the left inner wall of the cavity (11), and the two sliding chutes (1206) are respectively positioned on the inner top wall and the inner bottom wall of the cavity (11), the opposite sides of the two pulleys (1207) are respectively movably connected with the tops of the two sliding plates (1201) and the ground step, and the sides of the two pulleys (1207) far away from the sliding plates (1201) are respectively movably connected with the insides of the two sliding grooves (1206).

6. The heat sink structure for electronic components of claim 5, wherein: the right side of cavity (11) is including through-hole (13), through-hole (13) are located the inner wall on cavity (11) right side, the right-hand member of joint pole (1202) passes through-hole (13) and extends to the right side of cavity (11), and the inside swing joint of the surface of joint pole (1202) and through-hole (13).