CN218041436U

CN218041436U - Cooling device of smart phone

Info

Publication number: CN218041436U
Application number: CN202222125957.1U
Authority: CN
Inventors: 马汉武; 杨欢欢; 何文君; 杨明权
Original assignee: Huizhou Sanjun Technology Co ltd
Current assignee: Huizhou Sanjun Technology Co ltd
Priority date: 2022-08-12
Filing date: 2022-08-12
Publication date: 2022-12-13
Anticipated expiration: 2032-08-12

Abstract

The utility model relates to a heat sink of smart mobile phone, including protection machanism, protection machanism includes protecting crust, mounting groove and through-hole, quantity is five mounting groove has been seted up in the left side of protecting crust, the top and the bottom of protecting crust have all been seted up one end and have been run through and extend to the inside through-hole of protecting crust, protection machanism's inside is provided with cooling body, cooling body's right side demountable installation has the smart mobile phone body, the left side fixed mounting of smart mobile phone body has one end and cooling body magnetic adsorption's second magnet ring, protection machanism's inside is provided with positioning mechanism, positioning mechanism includes reset spring and stripper plate. This heat sink of smart mobile phone through the setting of protection machanism, positioning mechanism and dustproof mechanism, makes dustproof apron and protecting crust be convenient for carry out the dismouting, so, is showing and is promoting the whole cleaning efficiency of heat sink, avoids the dust influence cooling effect as far as possible, has made things convenient for the use.

Description

Cooling device of smart phone

Technical Field

The utility model relates to a cell-phone cooling technical field specifically is a heat sink of smart mobile phone.

Background

Along with the frequent shopping, games, entertainment and the like of smart phones, the mobile phone is heated due to the high-load operation of a mobile phone processor, the heat is reduced, the frequency is lowered, the mobile phone is stuck and the service life of the mobile phone is prolonged due to the heat of the mobile phone, various mobile phone cooling devices are researched and developed along with the improvement of living standard, the heat dissipation efficiency is improved, and the condition that the mobile phone is excessively hot is greatly relieved.

At the realization this application in-process, the inventor discovers that there is following problem at least in this technique, all can be provided with the fan among the current smart mobile phone heat sink and cool down, use too long back when the heat sink, the fan can bring in a large amount of dust in the outside, make the dust adhere to and influence the cooling effect, nevertheless the heat sink is fixed through the screw mostly, be not convenient for carry out the dismouting and clear up its inside and fan, and need use tool dismouting clearance, waste time and energy, inefficiency, so need further improve.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a heat sink of smart mobile phone possesses advantages such as the dismouting clearance of being convenient for, has solved the problem that current smart mobile phone heat sink dismouting clearance of being convenient for influenced the cooling effect.

In order to achieve the above object, the utility model provides a following technical scheme: a cooling device of a smart phone comprises a protection mechanism, wherein a cooling mechanism is arranged inside the protection mechanism, a smart phone body is detachably mounted on the right side of the cooling mechanism, a second magnet ring with one end magnetically adsorbed with the cooling mechanism is fixedly mounted on the left side of the smart phone body, a positioning mechanism is arranged inside the protection mechanism, a dustproof mechanism is arranged on the left side of the protection mechanism, a limiting block is fixedly mounted inside the protection mechanism, and a cooling fan is fixedly mounted on the left side of the cooling mechanism;

protection machanism includes protecting crust, mounting groove and through-hole, quantity is five mounting grooves is seted up in the left side of protecting crust, the top and the bottom of protecting crust have all been seted up one end and have been run through and extend to the inside through-hole of protecting crust, positioning mechanism includes reset spring and stripper plate, the inner wall right side fixed mounting of mounting groove has reset spring, reset spring's left side fixed mounting has the stripper plate, stopper fixed mounting is at the inner wall of mounting groove.

Further, cooling body includes copper sheet heat-conducting plate, semiconductor refrigeration piece, fin and first magnet ring, the right side fixed mounting of protecting crust has the copper sheet heat-conducting plate, the right side of copper sheet heat-conducting plate inlays the first magnet ring that is equipped with one end second magnet ring magnetic adsorption, the left side fixed mounting of copper sheet heat-conducting plate has the semiconductor refrigeration piece, the left side fixed mounting of semiconductor refrigeration piece has one end and protecting crust fixed connection's fin.

Further, dustproof mechanism includes dust cover, L type fixture block and louvre, the left side demountable installation of protecting crust has dust cover, dust cover's right side fixed mounting has quantity to be five and one end extends to the inside L type fixture block of mounting groove, dust cover's left side is seted up one end and is run through and extend to the inside louvre of dust cover.

Furthermore, the L-shaped fixture block is in contact with the extrusion plate, and the outer wall of the extrusion plate is in contact with the inner wall of the mounting groove.

Furthermore, the limiting block is located inside the L-shaped clamping block, and the L-shaped clamping block is matched with the installation groove.

Further, the outer wall of fin and the inner wall fixed connection of protecting crust, radiator fan fixed mounting is in the left side of fin, the through-hole is located the fin left side.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

1. this heat sink of smart mobile phone through the setting of protection machanism, positioning mechanism and dustproof mechanism, makes dustproof apron and protecting crust be convenient for carry out the dismouting, so, is showing and is promoting the whole cleaning efficiency of heat sink, avoids the dust influence cooling effect as far as possible, has made things convenient for the use.

2. This smart mobile phone's heat sink through the setting of cooling body and second magnet ring, is showing and promotes the cooling effect, also makes the whole device of being convenient for fix with the smart mobile phone body simultaneously, and does not influence its use, has made things convenient for the use.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged view of the point A of FIG. 1 according to the present invention;

fig. 3 is a left sectional view of the protection mechanism of the present invention.

In the figure: the smart phone comprises a protection mechanism 1, a protection shell 11, a mounting groove 12, a through hole 13, a cooling mechanism 2, a copper sheet heat conducting plate 21, a semiconductor refrigerating sheet 22, a radiating fin 23, a first magnet ring 24, a smart phone body 3, a second magnet ring 4, a positioning mechanism 5, a return spring 51, a squeezing plate 52, a dustproof mechanism 6, a dustproof cover plate 61, a clamping block of type L, radiating holes 63, a limiting block 7 and a radiating fan 8.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-3, a cooling device for a smart phone in this embodiment includes a protection mechanism 1, a cooling mechanism 2 is disposed inside the protection mechanism 1, a smart phone body 3 is detachably mounted on the right side of the cooling mechanism 2, a second magnet ring 4 with one end magnetically adsorbed to the cooling mechanism 2 is fixedly mounted on the left side of the smart phone body 3, a positioning mechanism 5 is disposed inside the protection mechanism 1, a dustproof mechanism 6 is disposed on the left side of the protection mechanism 1, a limiting block 7 is fixedly mounted inside the protection mechanism 1, and a cooling fan 8 is fixedly mounted on the left side of the cooling mechanism 2.

In this embodiment, protection machanism 1 includes protecting crust 11, mounting groove 12 and through-hole 13, and quantity is five mounting groove 12 is seted up to the left side of protecting crust 11, and one end is all seted up to the top and the bottom of protecting crust 11 and is run through and extend to the inside through-hole 13 of protecting crust 11.

Specifically, the arrangement of the through holes 13 enables the heat dissipation fan 8 to better stir the air inside the protective shell 11, so that the heat dissipation rate is increased.

In this embodiment, the cooling mechanism 2 includes a copper sheet heat-conducting plate 21, a semiconductor refrigeration piece 22, a heat sink 23 and a first magnet ring 24, the right side fixed mounting of the protective shell 11 has the copper sheet heat-conducting plate 21, the right side of the copper sheet heat-conducting plate 21 is embedded with the first magnet ring 24 with one end being magnetically adsorbed by the second magnet ring 4, the left side fixed mounting of the copper sheet heat-conducting plate 21 has the semiconductor refrigeration piece 22, the left side fixed mounting of the semiconductor refrigeration piece 22 has the heat sink 23 with one end being fixedly connected with the protective shell 11, the outer wall of the heat sink 23 is fixedly connected with the inner wall of the protective shell 11, the heat-dissipating fan 8 is fixedly mounted on the left side of the heat sink 23, and the through hole 13 is located on the left side of the heat sink 23.

Specifically, the copper sheet heat-conducting plate 21 conducts the temperature emitted by the mobile phone to the semiconductor refrigeration sheet 22, so that the heat is conducted to the radiating fin 23 through the left side, and meanwhile, the radiating fan 8 takes the heat emitted by the radiating fin 23 out of the protective shell 11 through the radiating holes 63, so that the cooling effect is remarkably improved.

The second magnet ring 4 and the first magnet ring 24 are arranged to facilitate the copper sheet heat conducting plate 21 to be mounted on the smartphone body 3 through the second magnet ring 4.

In this embodiment, positioning mechanism 5 includes reset spring 51 and stripper plate 52, and the inner wall right side fixed mounting of mounting groove 12 has reset spring 51, and reset spring 51's left side fixed mounting has stripper plate 52, and stripper plate 52's outer wall and mounting groove 12 inner wall contact, and stopper 7 fixed mounting is at the inner wall of mounting groove 12.

Specifically, since the return spring 51 has elastic potential energy, when the L-shaped latch 62 is rotated to the outside of the stopper 7, the return spring 51 fixes the L-shaped latch 62 to the pressing plate 52, so that the dust-proof cover 61 is fixed to the protective shell 11.

In this embodiment, dustproof mechanism 6 includes dustproof cover plate 61, L type fixture block 62 and louvre 63, the left side demountable installation of protecting sheathing 11 has dustproof cover plate 61, the right side fixed mounting of dustproof cover plate 61 has quantity to be five and one end extends to the inside L type fixture block 62 of mounting groove 12, L type fixture block 62 contacts with stripper plate 52, stopper 7 is located the inside of L type fixture block 62, L type fixture block 62 and mounting groove 12 looks adaptation, dustproof cover plate 61's left side is seted up one end and is run through and extend to the inside louvre 63 of dustproof cover plate 61.

Specifically, the arrangement of the L-shaped clamping block 62 enables the dustproof cover plate 61 to be fixed and detached with the protective shell 11 conveniently, and the overall cleaning efficiency of the cooling device is remarkably improved.

The working principle of the above embodiment is as follows:

(1) When the cooling device is used, the L-shaped clamping block 62 is pressed towards the right side to extrude the extrusion plate 52 and compress the reset spring 51, the dustproof cover plate 61 is rotated clockwise at the moment, the L-shaped clamping block 62 moves clockwise to the limit of the installation groove 12, so that the limiting block 7 is not received any more, at the moment, when the hand does not apply force to the right side any more, the extrusion plate 52 ejects the L-shaped clamping block 62 out towards the left side due to the elastic potential energy of the reset spring 51, the dustproof cover plate 61 is separated from the protective shell 11, the dustproof cover plate 61 and the protective shell 11 are convenient to detach and clean, after cleaning is completed, the L-shaped clamping block 62 is restored, after the L-shaped clamping block 62 is rotated to the outside of the limiting block 7, a user releases his hand, and the reset spring 51 fixes the L-shaped clamping block 62 to the extrusion plate 52 due to the elastic potential energy of the reset spring 51, so that the dustproof cover plate 61 is fixed with the protective shell 11, the overall cleaning efficiency of the cooling device is obviously improved, and the effect of dust is avoided as much as possible;

(2) In use, carry out magnetic adsorption through first magnet ring 24 and second magnet ring 4, make copper sheet heat-conducting plate 21 stabilize in the left side of smart mobile phone body 3, at this moment, semiconductor refrigeration piece 22 is given in the temperature conduction that copper sheet heat-conducting plate 21 gived off the cell-phone, make it give fin 23 with heat conduction through the left side, and simultaneously, radiator fan 8 takes the heat that fin 23 gived off out of protective housing 11 inside through louvre 63, show and promote the cooling effect, it is fixed with smart mobile phone body 3 also to make the whole being convenient for of device simultaneously, and do not influence its use.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat sink of smart mobile phone, includes protection machanism (1), its characterized in that: a cooling mechanism (2) is arranged inside the protection mechanism (1), a smart phone body (3) is detachably mounted on the right side of the cooling mechanism (2), a second magnet ring (4) with one end magnetically adsorbed to the cooling mechanism (2) is fixedly mounted on the left side of the smart phone body (3), a positioning mechanism (5) is arranged inside the protection mechanism (1), a dustproof mechanism (6) is arranged on the left side of the protection mechanism (1), a limiting block (7) is fixedly mounted inside the protection mechanism (1), and a cooling fan (8) is fixedly mounted on the left side of the cooling mechanism (2);

protection machanism (1) is including protecting crust (11), mounting groove (12) and through-hole (13), quantity is five mounting groove (12) is seted up in the left side of protecting crust (11), one end is all seted up to the top and the bottom of protecting crust (11) and is run through and extend to inside through-hole (13) of protecting crust (11), positioning mechanism (5) are including reset spring (51) and stripper plate (52), the inner wall right side fixed mounting of mounting groove (12) has reset spring (51), the left side fixed mounting of reset spring (51) has stripper plate (52), stopper (7) fixed mounting is at the inner wall of mounting groove (12).

2. The cooling device for the smart phone according to claim 1, wherein: cooling body (2) include copper sheet heat-conducting plate (21), semiconductor refrigeration piece (22), fin (23) and first magnet ring (24), the right side fixed mounting of protecting crust (11) has copper sheet heat-conducting plate (21), the right side of copper sheet heat-conducting plate (21) inlays first magnet ring (24) that are equipped with one end second magnet ring (4) magnetic adsorption, the left side fixed mounting of copper sheet heat-conducting plate (21) has semiconductor refrigeration piece (22), the left side fixed mounting of semiconductor refrigeration piece (22) has one end and protecting crust (11) fixed connection's fin (23).

3. The cooling device for the smart phone according to claim 2, wherein: dustproof mechanism (6) are including dustproof cover board (61), L type fixture block (62) and louvre (63), the left side demountable installation of protecting crust (11) has dustproof cover board (61), the right side fixed mounting of dustproof cover board (61) has quantity to be five and one end extends to mounting groove (12) inside L type fixture block (62), one end is seted up in the left side of dustproof cover board (61) and is run through and extend to dustproof cover board (61) inside louvre (63).

4. The cooling device of the smart phone according to claim 3, wherein: the L-shaped fixture block (62) is in contact with the extrusion plate (52), and the outer wall of the extrusion plate (52) is in contact with the inner wall of the installation groove (12).

5. The cooling device of the smart phone according to claim 3, wherein: the limiting block (7) is located inside the L-shaped clamping block (62), and the L-shaped clamping block (62) is matched with the mounting groove (12).

6. The cooling device for the smart phone according to claim 2, wherein: the outer wall of fin (23) and the inner wall fixed connection of protecting crust (11), radiator fan (8) fixed mounting is in the left side of fin (23), through-hole (13) are located fin (23) left side.