CN217849764U - Good heat dissipation's hot-pressing welding copper base high frequency circuit board - Google Patents
Good heat dissipation's hot-pressing welding copper base high frequency circuit board Download PDFInfo
- Publication number
- CN217849764U CN217849764U CN202221435719.4U CN202221435719U CN217849764U CN 217849764 U CN217849764 U CN 217849764U CN 202221435719 U CN202221435719 U CN 202221435719U CN 217849764 U CN217849764 U CN 217849764U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- main part
- board main
- heat dissipation
- electrode group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 22
- 239000010949 copper Substances 0.000 title claims abstract description 22
- 238000003466 welding Methods 0.000 title claims abstract description 12
- 238000007731 hot pressing Methods 0.000 title 1
- 238000005057 refrigeration Methods 0.000 claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 238000001816 cooling Methods 0.000 claims abstract description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 15
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 238000009423 ventilation Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 abstract description 3
- 238000010168 coupling process Methods 0.000 abstract description 3
- 238000005859 coupling reaction Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 13
- 241000883990 Flabellum Species 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a circuit board technical field, and disclose a good heat dissipation's hot press welding copper base high frequency circuit board, including last circuit board main part and lower circuit board main part, go up and fix jointly between circuit board main part and the lower circuit board main part and be equipped with the heat conduction disk, the equal fixedly connected with heat transfer pole of two lateral walls of heat conduction disk heteropleural, the common rigid coupling of lateral wall of going up circuit board main part and lower circuit board main part has the installing frame, two lateral walls of installing frame heteropleural are all fixed the grafting and have the semiconductor refrigeration piece, the system cold junction of two semiconductor refrigeration pieces all is located the inside setting of installing frame. The circuit board cooling device has the advantages that the limitation on the circuit board is small under the condition that the circuit board main body can be effectively cooled, the normal work of the circuit board cannot be influenced, meanwhile, the work of the cooling part can be automatically controlled according to the temperature, and the energy-saving effect is good.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a hot-press welding copper-based high-frequency circuit board with good heat dissipation performance.
Background
The circuit board makes the circuit miniaturized and visualized, plays an important role in the batch production of fixed circuits and the optimization of the layout of electric appliances, and the circuit board has various types, including a single-sided board, a double-sided board and a multilayer circuit board, a hard circuit board and a flexible circuit board, and one of the circuit boards is a copper-based circuit board subjected to thermocompression bonding.
The special publication No. CN215421343U discloses a thermocompression bonding copper-based high-frequency circuit board with good heat dissipation performance, which comprises a first main circuit board, wherein connecting columns are fixedly mounted at four corners of the upper end of the first main circuit board, a radiator is fixedly mounted at the upper end of the first main circuit board, a heat dissipation auxiliary assembly is fixedly mounted at the lower end of the first main circuit board, and a second main circuit board is fixedly mounted at the upper ends of the four connecting columns; the heat dissipation fan blades, the heat radiator and other components are arranged between the first main body circuit board and the second main body circuit board, so that better heat dissipation can be achieved, the heat dissipation fan blades occupy a larger space of the circuit board, the circuit board is greatly limited, and the heat dissipation fan blades and other components can vibrate during working and are not beneficial to daily work of the circuit board, so that the heat-pressure welding copper-based high-frequency circuit board with good heat dissipation performance is provided.
SUMMERY OF THE UTILITY MODEL
The purpose of this application is in order to solve among the prior art set up components such as heat dissipation flabellum, radiator between the circuit board, though can accomplish better heat dissipation, but its own occupation the great space of circuit board, the restriction to the circuit board is great, and components such as heat dissipation flabellum also can produce the vibration at the during operation, are unfavorable for the problem of the daily work of circuit board, and the hot-press bonding copper base high frequency circuit board of a good heat dissipation who provides.
In order to achieve the purpose, the following technical scheme is adopted in the application:
the utility model provides a good heat dissipation's hot press welding copper base high frequency circuit board, includes circuit board main part and circuit board main part down, go up circuit board main part and fix jointly between the circuit board main part down and be equipped with the heat conduction circle piece, two equal fixedly connected with heat transfer rod of two lateral walls of the different side of heat conduction circle piece, the common fixed rigid coupling of lateral wall of going up circuit board main part and circuit board main part down has the installing frame, two equal fixed pegging graft of two lateral walls of the different side of installing frame has the semiconductor refrigeration piece, two the refrigeration end of semiconductor refrigeration piece all is located the inside setting of installing frame, and the refrigeration end of two semiconductor refrigeration pieces all is connected with the rod end of homonymy heat transfer rod, a plurality of louvres have all been seted up to two lateral walls of the different side of installing frame.
By adopting the technical scheme, the semiconductor refrigeration piece can be used for dissipating heat between the upper circuit board main body and the lower circuit board main body, the heat dissipation through components such as a fan is not needed, no noise and vibration are generated during use, the occupied space is small, the use limitation of the circuit board is small, heat at the central position can be quickly led out for heat dissipation, and the heat between the upper circuit board main body and the lower circuit board main body is prevented from gathering and being incapable of being dissipated.
Preferably, a cavity is formed in the heat conduction round block, a piston is slidably connected inside the cavity, expansion liquid is filled in a position, below the piston, inside the cavity, of the cavity, a first electrode group is fixedly connected to the upper end of the cavity, a cushion block is fixedly connected to the upper cavity wall of the cavity, a second electrode group corresponding to the first electrode group in position is fixedly connected to the lower end of the cushion block, the semiconductor refrigeration pieces are connected with the first electrode group and the second electrode group, and springs are fixedly arranged on two sides of the lower end of the piston and two sides of the lower cavity wall of the cavity.
By adopting the technical scheme, the opening and closing of the two semiconductor refrigerating pieces can be automatically controlled according to the temperature through the expansion liquid, and the energy-saving effect is better.
Preferably, a plurality of fins are fixedly connected to the lower end face of the lower circuit board main body, and a plurality of lateral vent holes are formed in the side wall of each fin.
By adopting the technical scheme, a certain heat dissipation gap is kept at the lower side when the circuit board main body is installed, and heat dissipation can be facilitated by the cooling fins and the lateral ventilation holes.
Preferably, the upper end of the piston is fixedly connected with an iron block, the upper cavity wall of the cavity is fixedly connected with an electromagnet matched with the iron block, and the electromagnet is connected with the first electrode group and the second electrode group.
By adopting the technical scheme, the semiconductor refrigerating sheet or circuit can be prevented from being damaged due to the fact that the first electrode group and the second electrode group are opened and closed by the expansion liquid which reciprocates too frequently.
Preferably, an electromagnetic shielding film is fixedly arranged inside the side wall of the heat-conducting round block.
By adopting the technical scheme, the influence of the magnetic attraction of the electromagnet on the elements outside the heat-conducting round block can be eliminated.
Preferably, the lateral wall lower extreme fixedly connected with of installing frame has a plurality of installation hangers, every the equal threaded connection of lateral wall of installation hanger has the mounting screw.
By adopting the technical scheme, the installation frame can be conveniently locked and fixed.
Preferably, the side wall of the heat-conducting round block is fixedly sleeved with a plurality of heat-conducting rings.
By adopting the technical scheme, the heat conducting performance of the heat conducting round block can be improved.
Compared with the prior art, the application provides a good heat dissipation's hot-press welding copper base high frequency circuit board, possesses following beneficial effect:
1. this hot-press welding copper base high frequency heat dissipation circuit board, through the last circuit board main part that is equipped with, circuit board main part down, mutually supporting of installing frame, can regard as the hot-press welding copper base circuit board to use, through two semiconductor refrigeration pieces and a plurality of louvre that are equipped with, can utilize the semiconductor refrigeration piece to dispel the heat between the circuit board main part of going up and the circuit board main part down, need not to dispel the heat through components such as fans, noiselessness and vibration during the use, and occupation space is little, little to the use limitation of circuit board, through mutually supporting of the heat conduction round piece that is equipped with and two heat transfer poles, can lead out the heat dissipation fast with the heat that the central point put, prevent that the heat between circuit board main part and the circuit board main part down from gathering and can't the effluvium.
2. This hot-press welding copper base high frequency heat dissipation circuit board, through the piston that is equipped with, inflation liquid, cushion, first electrode group, second electrode group and two springs mutually support, can be according to opening and close of the high low automatic control two semiconductor refrigeration pieces of temperature, possess better energy-conserving effect.
The part that does not relate to in the device all is the same with prior art or can adopt prior art to realize, and this application can carry out under the effective radiating condition of circuit board main part, and is less to the limitation of circuit board, can not influence the normal work of circuit board, can be simultaneously according to the work of the high low automatic control radiating part of temperature, and energy-conserving effectual.
Drawings
Fig. 1 is a schematic structural view of a thermocompression bonding copper-based high-frequency circuit board with good heat dissipation performance according to the present application;
FIG. 2 is a schematic view of the internal structure of the heat-conducting round block in FIG. 1;
fig. 3 is a side view of fig. 1.
In the figure: 1. an upper circuit board main body; 2. a lower circuit board main body; 3. a heat-conducting round block; 4. a heat transfer rod; 5. installing a frame; 6. a semiconductor refrigerating sheet; 7. heat dissipation holes; 8. a piston; 9. a first electrode group; 10. cushion blocks; 11. a second electrode group; 12. a spring; 13. a heat sink; 14. a lateral vent; 15. an iron block; 16. an electromagnet; 17. an electromagnetic shielding film; 18. mounting a hanging lug; 19. mounting screws; 20. a heat conducting ring.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments.
Referring to fig. 1-3, a good heat dissipation's hot press welding copper base high frequency circuit board, including last circuit board main part 1 and lower circuit board main part 2, it is equipped with heat conduction round piece 3 to go up jointly to fix between circuit board main part 1 and the lower circuit board main part 2, the equal fixedly connected with heat transfer pole 4 of two lateral walls of 3 different sides of heat conduction round piece, the common rigid coupling of lateral wall of going up circuit board main part 1 and lower circuit board main part 2 has installed frame 5, two lateral walls of 5 different sides of installation frame all fix the grafting and have semiconductor refrigeration piece 6, the refrigeration end of two semiconductor refrigeration pieces 6 all is located the inside setting of installation frame 5, and the refrigeration end of two semiconductor refrigeration pieces 6 all is connected with the rod end of homonymy heat transfer pole 4, a plurality of louvres 7 have all been seted up to two lateral walls of 5 different sides of installation frame.
The cavity is formed in the heat conducting circular block 3, the piston 8 is connected to the inside of the cavity in a sliding mode, expansion liquid is filled in the position, located below the piston 8, in the cavity, the first electrode group 9 is fixedly connected to the upper end of the cavity, the cushion block 10 is fixedly connected to the upper cavity wall of the cavity, the second electrode group 11 corresponding to the first electrode group 9 is fixedly connected to the lower end of the cushion block 10, the two semiconductor refrigerating pieces 6 are connected with the first electrode group 9 and the second electrode group 11, springs 12 are fixedly arranged on two sides of the lower end of the piston 8 and two sides of the lower cavity wall of the cavity, when the heat conducting circular block 3 absorbs heat between the upper circuit board main body 1 and the lower circuit board main body 2, the temperature of the internal expansion liquid can be increased, the expansion liquid expands when heated, pressure on the lower side of the cavity can be increased, the piston 8 can be pushed to move upwards under the action of the pressure until the first electrode group 9 abuts against the second electrode group 11, the lines of the two semiconductor refrigerating pieces 6 can be connected, and direct current can be introduced into the semiconductor refrigerating pieces 6 to enable the semiconductor pieces 6 to work to dissipate heat, wherein the heat through the first electrode group 9 and the second electrode group 11, the known liquid expansion liquid is a mature technology which is not capable of being used as a liquid.
The lower end face of the lower circuit board main body 2 is fixedly connected with a plurality of cooling fins 13, a plurality of lateral ventilation holes 14 are formed in the side wall of each cooling fin 13, a certain heat dissipation gap can be kept at the lower side of the lower circuit board main body 2 during installation through the cooling fins 13, and the cooling fins 13 and the lateral ventilation holes 14 are utilized to facilitate heat dissipation.
Piston 8's upper end fixedly connected with iron plate 15, the last cavity wall fixedly connected with of cavity and iron plate 15 assorted electro-magnet 16, electro-magnet 16 is connected with first electrode group 9 and second electrode group 11, after first electrode group 9 and second electrode group 11 switch-on, electro-magnet 16 switches on with the circuit when also, electro-magnet 16 circular telegram work produced magnetic attraction this moment, can adsorb iron plate 15, thereby can fix piston 8, wherein electro-magnet 16's magnetic attraction is under the inflation pressure thrust effect of inflation liquid, be greater than two spring 12's elasticity restoring force, only after the whole condensation of inflation liquid is liquid, because disappearance of inflation pressure thrust, electro-magnet 16's magnetic attraction is less than spring 12's elasticity restoring force this moment, thereby piston 8 can move down the restoration under the effect of dragging of spring 12, through this kind of setting, can prevent that the too frequent reciprocal first electrode group 9 of messenger and second electrode group 11 of inflation liquid from opening and close and lead to semiconductor refrigeration piece 6 or circuit damage.
The inside fixed electromagnetic shield membrane 17 that is equipped with of lateral wall of heat conduction circle piece 3, through electromagnetic shield membrane 17, can eliminate the magnetic attraction of electro-magnet 16 and influence the component in the heat conduction circle piece 3 outside.
A plurality of installation hangers 18 are fixedly connected to the lower end of the side wall of the installation frame 5, installation screws 19 are connected to the side wall of each installation hanger 18 in a threaded mode, and the installation frame 5 can be conveniently locked and fixed through the arrangement.
The side wall of the heat conduction round block 3 is fixedly sleeved with a plurality of heat conduction rings 20, and through the arrangement, the heat conduction performance of the heat conduction round block 3 can be improved.
In this application, during the use, through installing frame 5, can be with last circuit board main part 1 with circuit board main part 2 installation is fixed down, two semiconductor refrigeration pieces 6 work, can in time shift the heat between last circuit board main part 1 and the circuit board main part 2 to the heat dissipation end from the refrigeration end, and through the cooperation of heat conduction round block 3 and two heat transfer poles 4, can with the center between last circuit board main part 1 and the circuit board main part 2 department heat conduct fast to the refrigeration end of two semiconductor refrigeration pieces 6 dispel the heat, the radiating effect is improved, prevent that the heat from gathering at central point.
The above description is only for the preferred embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art should be considered to be within the scope of the present application, and all equivalent substitutions and changes according to the technical solutions and the inventive concepts of the present application should be covered by the scope of the present application.
Claims (7)
1. The utility model provides a good heat dissipation's hot press welding copper base high frequency circuit board, includes circuit board main part (1) and circuit board main part (2) down, a serial communication port, go up circuit board main part (1) and fix jointly between circuit board main part (2) down and be equipped with heat conduction circle piece (3), two equal fixedly connected with heat transfer rod (4) of lateral wall of heat conduction circle piece (3) heteropleural, it has installing frame (5) to go up circuit board main part (1) and the common fixed cover of lateral wall of circuit board main part (2) down, two lateral walls of installing frame (5) heteropleural all are fixed to be pegged graft and are had semiconductor refrigeration piece (6), two the refrigeration end of semiconductor refrigeration piece (6) all is located the inside setting of installing frame (5), and the refrigeration end of two semiconductor refrigeration pieces (6) all is connected with the rod end of homonymy heat transfer rod (4), a plurality of louvres (7) have all been seted up to two lateral walls of installing frame (5) heteropleural.
2. The thermocompression bonding copper-based high frequency circuit board with good heat dissipation performance according to claim 1, wherein a cavity is formed inside the heat conducting round block (3), a piston (8) is slidably connected inside the cavity, an expansion liquid is filled inside the cavity at a position below the piston (8), a first electrode group (9) is fixedly connected to an upper end of the cavity, a cushion block (10) is fixedly connected to an upper cavity wall of the cavity, a second electrode group (11) corresponding to the first electrode group (9) is fixedly connected to a lower end of the cushion block (10), the two semiconductor cooling plates (6) are both connected to the first electrode group (9) and the second electrode group (11), and springs (12) are fixedly arranged on both sides of a lower end of the piston (8) and both sides of a lower cavity wall of the cavity.
3. The thermocompression bonding copper-based high-frequency circuit board with good heat dissipation performance according to claim 1, characterized in that a plurality of heat dissipation fins (13) are fixedly connected to the lower end surface of the lower circuit board main body (2), and a plurality of lateral ventilation holes (14) are opened on the side wall of each heat dissipation fin (13).
4. The thermocompression bonding copper-based high frequency circuit board with good heat dissipation as claimed in claim 2, wherein an iron block (15) is fixedly connected to the top end of the piston (8), an electromagnet (16) matching with the iron block (15) is fixedly connected to the upper cavity wall, and the electromagnet (16) is connected to the first electrode group (9) and the second electrode group (11).
5. The thermocompression bonding copper-based high-frequency circuit board with good heat dissipation performance according to claim 1, characterized in that the electromagnetic shielding film (17) is fixed inside the side wall of the heat-conducting round block (3).
6. The thermocompression bonding copper-based high-frequency circuit board with good heat dissipation performance according to claim 1, characterized in that a plurality of mounting lugs (18) are fixedly connected to the lower end of the side wall of the mounting frame (5), and a mounting screw (19) is screwed to the side wall of each mounting lug (18).
7. The thermocompression bonded copper-based high frequency circuit board with good heat dissipation as set forth in claim 1, wherein the side wall of the heat conductive circular block (3) is fixedly fitted with a plurality of heat conductive circular rings (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221435719.4U CN217849764U (en) | 2022-06-09 | 2022-06-09 | Good heat dissipation's hot-pressing welding copper base high frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221435719.4U CN217849764U (en) | 2022-06-09 | 2022-06-09 | Good heat dissipation's hot-pressing welding copper base high frequency circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217849764U true CN217849764U (en) | 2022-11-18 |
Family
ID=84024754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221435719.4U Expired - Fee Related CN217849764U (en) | 2022-06-09 | 2022-06-09 | Good heat dissipation's hot-pressing welding copper base high frequency circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217849764U (en) |
-
2022
- 2022-06-09 CN CN202221435719.4U patent/CN217849764U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107504726B (en) | Electric control board assembly of refrigerating device and refrigerating device | |
| CN111148389B (en) | Electric automation equipment mounting base | |
| CN105890066A (en) | Cooling device for circuit board of outdoor unit of variable frequency air conditioner and electric control box of outdoor unit of variable frequency air conditioner | |
| CN106941772B (en) | Double-stage independent liquid-gas double-channel natural cooling data center heat dissipation system | |
| CN217849764U (en) | Good heat dissipation's hot-pressing welding copper base high frequency circuit board | |
| CN216217857U (en) | Control cabinet for electric automatization | |
| CN213152468U (en) | Circuit board assembly capable of dissipating heat quickly | |
| CN112469252A (en) | Efficient cooling assembly suitable for micro-miniature photoelectric pod electronic unit | |
| CN215577398U (en) | High-efficient radiating shoe-pad machine control by temperature change display device | |
| CN209516804U (en) | A kind of radiating motor device | |
| CN110582189B (en) | Heat pipe type temperature control cabinet using heat pipe as heat conducting element | |
| CN210328410U (en) | Gain amplifier's heat radiation structure | |
| JPH0233096Y2 (en) | ||
| CN111442419A (en) | Electrical apparatus box structure and air condensing units | |
| CN2500014Y (en) | Self cooling type thyrister cut-in and cut-off capacitor device | |
| CN220570898U (en) | Radiator for cooling household appliances | |
| CN219893691U (en) | Heat abstractor for microelectronic components and parts | |
| CN211090353U (en) | Radiator structure of electronic element | |
| CN220271853U (en) | External computer host heat abstractor | |
| CN213340350U (en) | Accurate temperature control structure of high-power chip | |
| CN217788140U (en) | Transformer mounting bracket | |
| CN217770766U (en) | High-temperature-resistant street lamp case | |
| CN217693575U (en) | Optical fiber UDAS near-end machine | |
| CN210040180U (en) | Heat radiation structure for automobile power amplifier integrated circuit | |
| CN219981354U (en) | Video monitoring host capable of rapidly radiating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20221118 |