CN218182195U

CN218182195U - Mounting structure for power chip

Info

Publication number: CN218182195U
Application number: CN202221080707.4U
Authority: CN
Inventors: 吴毅起; 林宇
Original assignee: GUANGZHOU REACH MICRO-ELECTRONICS TECHNOLOGY CO LTD
Current assignee: GUANGZHOU REACH MICRO-ELECTRONICS TECHNOLOGY CO LTD
Priority date: 2022-04-25
Filing date: 2022-04-25
Publication date: 2022-12-30
Anticipated expiration: 2032-04-25

Abstract

The utility model discloses a mounting structure for power chip relates to power chip installation technical field, and to present power chip when using, when dismantling and changing to it, the operation is comparatively troublesome to and when dismantling, damage the chip easily, reduced chip life's problem, the following scheme is proposed now, and it includes the mounting panel, the top of mounting panel is provided with fixed subassembly, fixed subassembly swing joint has the bottom plate, the top of bottom plate is provided with power chip, power chip's top is provided with the apron. The device not only can convenient to use person be quick dismantle power chip, and avoided causing the damage to power chip, prolonged its life, can also dispel the heat to the power chip of operation in-process, avoid the high temperature, influence power chip's working effect.

Description

Mounting structure for power chip

Technical Field

The utility model relates to a power chip installs technical field, especially relates to a mounting structure for power chip.

Background

In the world, with the rapid development of science and technology, people have no way to leave electronic equipment. The power management chip plays the roles of conversion, distribution, detection and other power management of the power in the electronic equipment system. The power management chip is indispensable to the electronic system, and the performance of the power management chip has a direct influence on the performance of the whole electronic system. The CPU power supply amplitude recognition module is mainly responsible for recognizing the CPU power supply amplitude, generating corresponding short moment waves and pushing a post-stage circuit to output power.

When the power chip is used, the power chip is usually welded, an auxiliary external tool is needed when the power chip is needed to be disassembled and replaced, the power chip is troublesome, and the power chip is easy to damage when being disassembled due to small size of the power chip, so that the service life of the power chip is shortened.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of mounting structure for power chip to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a mounting structure for a power supply chip comprises a mounting plate, wherein a fixing assembly is arranged above the mounting plate, the fixing assembly is movably connected with a bottom plate, the power supply chip is arranged above the bottom plate, and a cover plate is arranged above the power supply chip;

the fixed subassembly includes the fixed block, the top at the mounting panel is installed to the fixed block, the top swing joint of fixed block has the spread groove, the fixed block is kept away from one side of bottom plate and has been seted up the draw-in groove, the draw-in groove activity joint has the fixture block, the connecting rod is installed to the opposite side of fixture block, connecting rod swing joint has the activity groove, the connecting rod extends to the outside of apron, the outside that the connecting rod is close to fixture block one end is provided with spacing spring.

Preferably, the connecting groove is formed in the bottom of the cover plate, and the movable groove is formed in the side wall of one side of the connecting groove.

Preferably, the top of mounting panel is provided with the stopper, stopper swing joint has the spacing groove, the bottom at the bottom plate is seted up in the spacing groove.

Preferably, a placing groove is formed above the bottom plate, and pin grooves are formed in two sides of the placing groove.

Preferably, the power chip is placed in the placing groove, pins are mounted on two sides of the power chip, and the pins are movably connected with the pin grooves.

Preferably, the inside of apron is provided with the fin, the both sides of fin all are connected with the heat dissipation strip, the heat dissipation strip extends to the outside of apron.

Preferably, a heat dissipation plate is arranged below the heat dissipation plate, a heat dissipation groove is arranged above the heat dissipation plate, and the heat dissipation groove is formed above the cover plate.

Preferably, a filter screen is arranged in the heat dissipation groove.

Preferably, the telescopic link is installed to the below of heating panel, the outside of telescopic link is provided with connecting spring, the lower extreme of connecting spring and telescopic link all is connected with the briquetting.

Preferably, a protective pad is arranged below the pressing block and is a rubber pad.

The utility model has the advantages that:

1. the device is through fixed block, fixture block, connecting rod and the spacing spring that sets up for fix the apron, use through fixed block and stopper, spacing groove cooperation, carry on spacingly to the bottom plate, the quick power chip of the person of being convenient for use dismantles, and through the setting of bottom plate and apron, has avoided causing the damage to power chip, has prolonged its life.

2. The device is through fin and the heat dissipation strip that sets up for power chip to the operation in-process dispels the heat, avoids the high temperature, influences power chip's working effect, and through telescopic link, coupling spring and the briquetting that sets up, is convenient for fix power chip's position, prevents to remove at pin welded in-process, influences the effect of installation.

In conclusion, the device not only can be convenient for the user to dismantle power chip fast, and has avoided causing the damage to power chip, has prolonged its life, can also dispel the heat to the power chip of operation in-process, avoids the high temperature, influences power chip's working effect.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic structural view of the present invention in front view.

Fig. 3 is a schematic structural view of the present invention when it is seen from the bottom.

Fig. 4 is a schematic structural diagram of a front cross-section of the present invention.

Fig. 5 is a schematic structural diagram of a point a in fig. 4 according to the present invention.

Reference numbers in the figures: 1. mounting a plate; 2. a fixing component; 201. a fixed block; 202. connecting grooves; 203. a card slot; 204. a clamping block; 205. a connecting rod; 206. a limiting spring; 207. a movable groove; 3. a limiting block; 4. a limiting groove; 5. a base plate; 6. a placement groove; 7. a pin slot; 8. a power supply chip; 9. a pin; 10. a cover plate; 11. a heat sink; 12. a heat dissipating strip; 13. a connecting spring; 14. a telescopic rod; 15. pressing into blocks; 16. a protective pad; 17. a heat dissipation plate; 18. a heat dissipation groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1, fig. 2 and fig. 3 show, this embodiment provides a mounting structure for power chip, including mounting panel 1, mounting panel 1's top is provided with fixed subassembly 2, be used for carrying out the position limit to apron 10 fixed, mounting panel 1's top is provided with

stopper

3, 3 swing joint of stopper have spacing groove 4, use through stopper 3 and spacing groove 4's cooperation, be used for spacing bottom plate 5, spacing groove 4 sets up in bottom plate 5's bottom, 2 swing joint of fixed subassembly have bottom plate 5, standing groove 6 has been seted up to bottom plate 5's top, the both sides of standing groove 6 are provided with pin groove 7, power chip 8 places in standing groove 6, pin 9 is installed to power chip 8's both sides, pin 9 swing joint has pin groove 7, bottom plate 5's top is provided with power chip 8, power chip 8's top is provided with apron 10, be used for protecting power chip 8.

As shown in fig. 1, fig. 2, fig. 4 and fig. 5, the fixing assembly 2 includes a fixing block 201, the fixing block 201 is installed above the mounting plate 1, the upper portion of the fixing block 201 is movably connected with a connecting groove 202, the connecting groove 202 is opened at the bottom of the cover plate 10, one side of the fixing block 201 away from the bottom plate 5 is provided with a clamping groove 203, the clamping groove 203 is movably clamped with a clamping block 204, the other side of the clamping block 204 is provided with a connecting rod 205, the connecting rod 205 is movably connected with a movable groove 207, the movable groove 207 is opened on the side wall of one side of the connecting groove 202, the connecting rod 205 extends to the outside of the cover plate 10, the outside of one end of the connecting rod 205 close to the clamping block 204 is provided with a limiting spring 206, the connecting rod 205 is pulled outwards to drive the clamping block 204 to move into the movable groove 207, so that the connecting groove 202 below the cover plate 10 is clamped with the upper end of the fixing block 201, the connecting rod 205 is released, the clamping block 204 is clamped into the clamping groove 203 provided at the upper end of the fixing block 201, and limits the cover plate 10.

As shown in fig. 1, 3 and 4, a heat dissipation fin 11 is disposed inside the cover plate 10, heat dissipation strips 12 are connected to both sides of the heat dissipation fin 11, the heat dissipation strips 12 extend to the outside of the cover plate 10, a heat dissipation plate 17 is disposed below the heat dissipation fin 11, a heat dissipation groove 18 is disposed above the heat dissipation fin 11, the heat dissipation groove 18 is disposed above the cover plate 10, a filter screen is disposed in the heat dissipation groove 18, when the power chip 8 operates, heat generated by the power chip is absorbed by the heat dissipation fin 11 through the heat dissipation plate 17, the heat dissipation fin 11 dissipates heat through the heat dissipation strips 12 connected to both sides of the heat dissipation fin and the heat dissipation groove 18 disposed above the heat dissipation fin, and the filter screen disposed in the heat dissipation groove 18 is used for preventing dust and the like from falling in.

As shown in fig. 3 and 4, an expansion link 14 is installed below the heat dissipation plate 17, a connection spring 13 is disposed outside the expansion link 14, pressing blocks 15 are connected to the connection spring 13 and the lower end of the expansion link 14, a protection pad 16 is disposed below the pressing blocks 15, the protection pad 16 is a rubber pad, and the pressing blocks 15 and the protection pad 16 are driven to compress the power chip 8 through the expansion link 14 and the connection spring 13 to prevent the power chip from moving.

The utility model discloses a theory of operation is: when the device is used, firstly, a bottom plate 5 is aligned to a fixing block 201 and a limiting block 3 is placed on a mounting plate 1, the limiting block 3 is clamped into a limiting groove 4, meanwhile, the fixing block 201 is clamped into notches arranged at two sides of the bottom plate 5, then a power chip 8 is placed in a placing groove 6, pins 9 at two sides of the power chip 8 extend to the outside of the bottom plate 5 through pin grooves 7, then a cover plate 10 is placed above the power chip 8, a connecting rod 205 is pulled outwards to drive the clamping block 204 to move towards a movable groove 207, a connecting groove 202 below the cover plate 10 is clamped with the upper end of the fixing block 201, the connecting rod 205 is loosened, the clamping block 204 is clamped into a clamping groove 203 arranged at the upper end of the fixing block 201, the cover plate 10 is limited, and a pressing block 15 and a protective pad 16 are driven to tightly press the power chip 8 through the arrangement of a connecting spring 13 and a telescopic rod 14;

when the power chip 8 operates, the heat generated by the power chip is absorbed by the heat sink 11 through the heat sink plate 17, and the heat sink 11 dissipates the heat through the heat dissipating bars 12 connected to both sides thereof and the heat dissipating grooves 18 formed above the heat dissipating bars.

The above, only be the embodiment of the preferred of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, which are designed to be replaced or changed equally, all should be covered within the protection scope of the present invention.

Claims

1. A mounting structure for a power supply chip comprises a mounting plate (1), and is characterized in that a fixing component (2) is arranged above the mounting plate (1), the fixing component (2) is movably connected with a bottom plate (5), the power supply chip (8) is arranged above the bottom plate (5), and a cover plate (10) is arranged above the power supply chip (8);

the fixing assembly (2) comprises a fixing block (201), the fixing block (201) is installed above the mounting plate (1), a connecting groove (202) is movably connected above the fixing block (201), a clamping groove (203) is formed in one side, far away from the bottom plate (5), of the fixing block (201), the clamping groove (203) is movably clamped with a clamping block (204), a connecting rod (205) is installed on the other side of the clamping block (204), the connecting rod (205) is movably connected with a movable groove (207), the connecting rod (205) extends to the outside of the cover plate (10), and a limiting spring (206) is arranged on the outside of one end, close to the clamping block (204), of the connecting rod (205); the connecting groove (202) is formed in the bottom of the cover plate (10), and the movable groove (207) is formed in the side wall of one side of the connecting groove (202).

2. The mounting structure for the power supply chip according to claim 1, wherein a limiting block (3) is arranged above the mounting plate (1), the limiting block (3) is movably connected with a limiting groove (4), and the limiting groove (4) is formed in the bottom of the bottom plate (5).

3. The mounting structure for a power chip according to claim 1, wherein a placement groove (6) is formed above the bottom plate (5), and lead grooves (7) are formed on both sides of the placement groove (6).

4. The mounting structure for a power chip according to claim 1, wherein the power chip (8) is placed in a placement groove (6), pins (9) are mounted on two sides of the power chip (8), and the pins (9) are movably connected with pin grooves (7).

5. The mounting structure for a power supply chip according to claim 1, wherein a heat sink (11) is disposed inside the cover plate (10), heat sink strips (12) are connected to both sides of the heat sink (11), and the heat sink strips (12) extend to the outside of the cover plate (10).

6. The mounting structure for a power supply chip according to claim 5, wherein a heat dissipating plate (17) is provided below the heat dissipating plate (11), and a heat dissipating groove (18) is provided above the heat dissipating plate (11), the heat dissipating groove (18) being opened above the cover plate (10).

7. The mounting structure for a power chip as recited in claim 6, wherein a screen is provided in the heat dissipation groove (18).

8. The mounting structure for a power chip according to claim 6, wherein a telescopic rod (14) is mounted below the heat dissipation plate (17), a connecting spring (13) is disposed outside the telescopic rod (14), and a pressing block (15) is connected to the lower ends of the connecting spring (13) and the telescopic rod (14).

9. The mounting structure for a power chip according to claim 8, wherein a protection pad (16) is disposed below the pressing block (15), and the protection pad (16) is a rubber pad.