CN210168358U - Low-impedance multilayer circuit board - Google Patents
Low-impedance multilayer circuit board Download PDFInfo
- Publication number
- CN210168358U CN210168358U CN201920205525.7U CN201920205525U CN210168358U CN 210168358 U CN210168358 U CN 210168358U CN 201920205525 U CN201920205525 U CN 201920205525U CN 210168358 U CN210168358 U CN 210168358U
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- China
- Prior art keywords
- circuit board
- multilayer circuit
- board body
- low impedance
- sliding
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- Expired - Fee Related
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- 239000000428 dust Substances 0.000 claims abstract description 22
- 230000001681 protective effect Effects 0.000 claims description 9
- 230000003139 buffering effect Effects 0.000 abstract description 7
- 238000009825 accumulation Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses an low impedance multilayer circuit board, the utility model provides an low impedance multilayer circuit board, including the multilayer circuit board body, the both sides of multilayer circuit board body all are equipped with the protection piece, one side that the protection piece is close to the multilayer circuit board body is equipped with the slot, the both ends of multilayer circuit board body extend to in two slots respectively, two buffer blocks of the equal fixedly connected with in upper and lower both sides of multilayer circuit board body, one side and the slot inside wall fixed connection of multilayer circuit board body are kept away from to the buffer block, two be equipped with two fixed plates, two between the protection piece the fixed plate is located the both sides of multilayer circuit board body respectively, it has four spouts to be the rectangle distribution in the fixed plate. The utility model discloses a buffering and dustproof mechanism's setting makes the antidetonation of multilayer circuit board prevent falling with the promotion of dirt-proof ability, prevents effectively that the circuit board from receiving the damage, reduces the dust accumulation to the convenient clearance of dust screen.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to low impedance multilayer circuit board.
Background
The market for circuit board panels is constantly evolving, which benefits from two major aspects of power. Firstly, the market space of the circuit board plate application industry is continuously expanded, and the application of the communication industry and the notebook computer industry is promoted, so that the market of a high-end multilayer circuit board is rapidly increased, and the application proportion reaches 50 percent at present. Simultaneously, the proportion of digital line board is also obviously increased for colour TV, cell-phone, automotive electronics to make the space of circuit board trade constantly expand, for this reason patent number CN 201720275839.5's utility model discloses a low impedance multilayer circuit board, including the multilayer circuit board body, the multilayer circuit board body includes a plurality of unit circuit board body. This low impedance multilayer circuit board reasonable in design avoids punching or damaging the individual layer circuit board when installing, avoids other object direct contact to multilayer circuit board body when the installation, through the design of heat dissipation strip, improves the radiating efficiency, the thickness of reasonable control green oil structural layer to reduce the whole impedance of multilayer circuit board body, the performance of improvement multilayer circuit board body has very high practicality.
The utility model discloses a though reduce the whole impedance of multilayer circuit board body, improved the radiating effect, nevertheless the antidetonation of circuit board is prevented falling, makes internal damage easily when the circuit board bumps, and dustproof effect is poor, accumulates the performance that the dust influences the circuit board for a long time.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In order to overcome prior art not enough, provide a low impedance multilayer circuit board now, through buffering and dustproof mechanism's setting, make the antidetonation of multilayer circuit board prevent falling with the promotion of dirt-proof ability, prevent effectively that the circuit board from receiving the damage, reduce the dust accumulation to the convenient clearance of dust screen.
(II) technical scheme
The utility model discloses a following technical scheme realizes: the utility model provides a low-impedance multilayer circuit board, which comprises a multilayer circuit board body, wherein both sides of the multilayer circuit board body are provided with protective blocks, one side of the protective block, which is close to the multilayer circuit board body, is provided with slots, both ends of the multilayer circuit board body respectively extend into the two slots, both the upper side and the lower side of the multilayer circuit board body are fixedly connected with two buffer blocks, one side of the buffer block, which is far away from the multilayer circuit board body, is fixedly connected with the inner side walls of the slots, two fixed plates are arranged between the protective blocks, the two fixed plates are respectively positioned on both sides of the multilayer circuit board body, four chutes are distributed in the fixed plates in a rectangular manner, sliders are slidably connected in the chutes, springs are fixedly connected between the sliders and the inner side walls of the chutes, one side of the sliders, which is far away from the springs, is, the one end that the slider was kept away from to the kelly runs through the fixed plate and extends to in the card hole, the kelly is sliding connection with the fixed plate, be equipped with the opening in the fixed plate, fixedly connected with dust screen in the opening.
Furthermore, the buffer block is made of rubber.
Furthermore, the upper side and the lower side of the protection block are both provided with mounting holes.
Furthermore, a telescopic rod is fixedly connected between one side of the sliding block, which is far away from the clamping rod, and the inner side wall of the sliding groove.
Furthermore, the upper end and the lower end of the sliding block are both provided with grooves, balls are arranged in the grooves, and the balls are abutted to the inner side walls of the sliding grooves.
Furthermore, one end of the clamping rod, which is far away from the sliding block, is of a semicircular structure.
(III) advantageous effects
Compared with the prior art, the utility model, following beneficial effect has:
1) during the use, prevent through the protection piece that multilayer circuit board body from receiving the damage, play the absorbing effect of buffering through the buffer block, further protect multilayer circuit board body, can prevent effectively through the dust screen that the dust accumulation from on multilayer circuit board body, when needing to clear up the dust screen, directly take off the fixed plate can, the back of finishing the clearance, put the fixed plate back to the normal position, drive the slider under the effect of spring restoring force, the slider drives the kelly, it is downthehole to make the kelly extend to the card, fix the position of fixed plate. The utility model improves the shock resistance, falling resistance and dust resistance of the multilayer circuit board by arranging the buffering and dust prevention mechanism, effectively prevents the circuit board from being damaged, reduces dust accumulation, and facilitates the cleaning of the dust screen;
2) simultaneously, the buffer block has certain buffer capacity for the rubber material, can reduce multilayer circuit board body and receive vibrations influence, and the mounting hole can convenience of customers installs multilayer circuit board body, and the telescopic link can strengthen the stationarity when the slider slides, and the ball can reduce the frictional force between slider and the spout inside wall, reduces sliding resistance, and the one end that the slider was kept away from to the kelly is semicircle type structure, can make things convenient for the fixed plate to put into between two protection pieces.
Drawings
Fig. 1 is a schematic structural diagram of a low impedance multilayer circuit board according to the present invention.
Fig. 2 is a schematic view of a top view structure of a low impedance multi-layer circuit board fixing plate according to the present invention.
Fig. 3 is a schematic diagram of a structure at a position a of the low impedance multilayer circuit board provided by the present invention.
1-protective block, 2-multilayer circuit board body, 3-dust screen, 4-fixing plate, 5-mounting hole, 6-slot, 7-buffer block, 8-clamping rod, 9-ball, 10-spring, 11-telescopic rod, 12-sliding groove and 13-sliding block.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in figures 1-3, a low impedance multilayer circuit board comprises a multilayer circuit board body 2, wherein two sides of the multilayer circuit board body 2 are respectively provided with a protective block 1 for protecting, one side of the protective block 1 close to the multilayer circuit board body 2 is provided with a slot, two ends of the multilayer circuit board body 2 respectively extend into the two slots 6, two buffer blocks 7 are fixedly connected to the upper and lower sides of the multilayer circuit board body 2 for buffering and damping, one side of the buffer block 7 far away from the multilayer circuit board body 2 is fixedly connected with the inner side walls of the slots 6, two fixing plates 4 are arranged between the two protective blocks 1 for installing a dust screen 3, the two fixing plates 4 are respectively arranged at two sides of the multilayer circuit board body 2, four sliding grooves 12 are distributed in the fixing plates 4 in a rectangular shape, sliding blocks 13 are installed, sliding blocks 13 are slidably connected in the sliding grooves 12 for driving, fixedly connected with spring 10 between slider 13 and the spout inside wall, in order to make the kelly 8 automatic extend to the card downthehole, one side fixedly connected with kelly 8 that spring 10 was kept away from to slider 13, in order to fix the position of fixed plate 4, be equipped with the card hole corresponding with kelly 8 on the lateral wall of protection piece 1, the one end that slide 13 was kept away from to kelly 8 runs through fixed plate 4 and extends to the card downthehole, kelly 8 is sliding connection with fixed plate 4, be equipped with the opening in the fixed plate 4, fixedly connected with dust screen 3 in the opening, in order to play dustproof effect.
Wherein, the buffer block 7 is the rubber material, be used for reducing multilayer circuit board body 3 and receive the vibrations influence, the upper and lower both sides of two protection pieces 1 all are equipped with mounting hole 5, be used for convenience of customers to install multilayer circuit board body 3, slider 13 keeps away from fixedly connected with telescopic link 11 between one side of kelly 8 and the 12 inside walls of spout, stationarity when being used for reinforcing slider 13 to slide, slider 13's upper and lower both ends all are equipped with the recess, be equipped with ball 9 in the recess, ball 9 offsets with 12 inside walls of spout, be used for reducing the frictional force between slider 13 and the 12 inside walls of spout, reduce sliding resistance, the one end that slider 13 was kept away from to kelly 8 is semicircle type structure, be used for making things convenient for fixed plate 4 to put.
The utility model provides a low impedance multilayer circuit board, during the use, prevent through protection piece 1 that multilayer circuit board body 2 from receiving the damage, play buffering absorbing effect through buffer block 7, further protect multilayer circuit board body 2, can prevent effectively through dust screen 3 that the dust accumulation is on multilayer circuit board body 2, when needing to clear up dust screen 3, directly take off fixed plate 4 can, the back finishes in the clearance, put back the normal position with fixed plate 4, drive slider 13 under the effect of spring 10 restoring force, slider 13 drives kelly 8, make kelly 8 extend to in the kelly, fix the position of fixed plate 4. The utility model discloses a buffering and dustproof mechanism's setting makes the antidetonation of multilayer circuit board prevent falling with the promotion of dirt-proof ability, prevents effectively that the circuit board from receiving the damage, reduces the dust accumulation to the convenient clearance of dust screen.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the spirit and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made by the technical solution of the present invention by those skilled in the art should fall into the protection scope of the present invention, and the technical contents claimed by the present invention have been fully recorded in the claims.
Claims (6)
1. A low impedance multilayer wiring board, includes multilayer wiring board body (2), its characterized in that: the protective block (1) is arranged on each of two sides of the multilayer circuit board body (2), one side, close to the multilayer circuit board body (2), of each protective block (1) is provided with a slot, two ends of the multilayer circuit board body (2) extend into the two slots (6) respectively, two buffer blocks (7) are fixedly connected to each of the upper side and the lower side of the multilayer circuit board body (2), one side, far away from the multilayer circuit board body (2), of each buffer block (7) is fixedly connected with the inner side wall of each slot (6), two fixing plates (4) are arranged between the two protective blocks (1), the two fixing plates (4) are respectively positioned on two sides of the multilayer circuit board body (2), four sliding grooves (12) are distributed in the fixing plates (4) in a rectangular mode, sliding blocks (13) are connected in the sliding grooves (12) in a sliding mode, and springs (10) are fixedly connected between, one side fixedly connected with kelly (8) of spring (10) are kept away from in slider (13), be equipped with on the lateral wall of protection piece (1) with the corresponding card hole of kelly (8), the one end that slider (13) were kept away from in kelly (8) runs through fixed plate (4) and extends to the card downthehole, kelly (8) are sliding connection with fixed plate (4), be equipped with the opening in fixed plate (4), fixedly connected with dust screen (3) in the opening.
2. The low impedance multilayer wiring board of claim 1, wherein: the buffer block (7) is made of rubber.
3. The low impedance multilayer wiring board of claim 1, wherein: and mounting holes (5) are formed in the upper side and the lower side of each of the two protection blocks (1).
4. The low impedance multilayer wiring board of claim 1, wherein: and a telescopic rod (11) is fixedly connected between one side of the sliding block (13) far away from the clamping rod (8) and the inner side wall of the sliding groove (12).
5. The low impedance multilayer wiring board of claim 1, wherein: the upper end and the lower end of the sliding block (13) are respectively provided with a groove, a ball (9) is arranged in each groove, and the ball (9) is abutted to the inner side wall of the sliding groove (12).
6. The low impedance multilayer wiring board of claim 1, wherein: one end of the clamping rod (8) far away from the sliding block (13) is of a semicircular structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920205525.7U CN210168358U (en) | 2019-02-18 | 2019-02-18 | Low-impedance multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920205525.7U CN210168358U (en) | 2019-02-18 | 2019-02-18 | Low-impedance multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210168358U true CN210168358U (en) | 2020-03-20 |
Family
ID=69787753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920205525.7U Expired - Fee Related CN210168358U (en) | 2019-02-18 | 2019-02-18 | Low-impedance multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210168358U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566410A (en) * | 2020-12-03 | 2021-03-26 | 合肥开关厂有限公司 | Loop on-line monitoring device for protector |
| CN112672530A (en) * | 2020-12-14 | 2021-04-16 | 广德通灵电子有限公司 | Low-impedance four-layer circuit board and manufacturing process thereof |
| CN113115512A (en) * | 2021-04-08 | 2021-07-13 | 广德通灵电子有限公司 | Multilayer circuit board of large-aperture bonding pad and manufacturing process thereof |
-
2019
- 2019-02-18 CN CN201920205525.7U patent/CN210168358U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566410A (en) * | 2020-12-03 | 2021-03-26 | 合肥开关厂有限公司 | Loop on-line monitoring device for protector |
| CN112672530A (en) * | 2020-12-14 | 2021-04-16 | 广德通灵电子有限公司 | Low-impedance four-layer circuit board and manufacturing process thereof |
| CN112672530B (en) * | 2020-12-14 | 2024-01-26 | 广德通灵电子有限公司 | Low-impedance four-layer circuit board and manufacturing process thereof |
| CN113115512A (en) * | 2021-04-08 | 2021-07-13 | 广德通灵电子有限公司 | Multilayer circuit board of large-aperture bonding pad and manufacturing process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200610 Address after: 351100 Putian City Hanjiang District of Fujian high tech Development Zone Patentee after: Putian xinhongyi Electronic Technology Co.,Ltd. Address before: No.8, Tonghua South Road, Xialu District, Huangshi City, Hubei Province 435000 Patentee before: Zhang Zhengyong |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200320 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |