CN115016610B

CN115016610B - Shock attenuation type industrial control mainboard for self-service finance terminal

Info

Publication number: CN115016610B
Application number: CN202210682470.5A
Authority: CN
Inventors: 吴丰义; 冯芸; 陈桢
Original assignee: Shenzhen Lingyi Technology Co ltd
Current assignee: Shenzhen Lingyi Technology Co ltd
Priority date: 2022-06-16
Filing date: 2022-06-16
Publication date: 2023-05-02
Anticipated expiration: 2042-06-16
Also published as: CN115016610A

Abstract

A damping type industrial control main board for a financial self-service terminal belongs to the technical field of industrial control main boards, and aims to solve the problem that the existing industrial control main board only has a board layer structure and components and parts, cannot well protect a board body, and is easy to damage; secondly, can't provide fine shock attenuation effect, when vibrating, damage to the plate body is very big, leads to the life-span low, influences the use. The stability of whole mainboard makes its structure more firm, is difficult for the rupture, effectively protects the corner of mainboard structure, reduces the damage of friction to mainboard structure, improves protection efficiency, increases mainboard structure's life, makes mainboard structure quick return with reset spring cooperation, reduces the damage of vibration to mainboard structure, effectively improves shock-proof buffer effect, can carry out vertical installation and transverse installation as required, the adjustment of being convenient for, improves the suitability of installation, dispels the heat through the air current, improves whole radiating efficiency, prevents that the temperature from crossing scalds and leading to the mainboard to burn out.

Description

Shock attenuation type industrial control mainboard for self-service finance terminal

Technical Field

The invention relates to the technical field of industrial control mainboards, in particular to a shock-absorbing industrial control mainboard for a financial self-service terminal.

Background

The industrial control main board is a main board applied to industrial occasions, is adopted by industrial computers, can adapt to a wide-temperature environment according to requirements, can adapt to a severe environment, can work for a long time under high load and the like.

1. However, the existing industrial control main board only has a board layer structure and components, and cannot well protect a board body, so that the board body is easy to damage;

2. secondly, can't provide fine shock attenuation effect, when vibrating, damage to the plate body is very big, leads to the life-span low, influences the use.

Disclosure of Invention

The invention aims to provide a vibration-damping type industrial control main board for a financial self-service terminal, which has the advantages that the stability of the whole main board is improved, the structure of the whole main board is firmer, the main board is not easy to break, the corners of the main board structure are effectively protected, the damage of friction to the main board structure is reduced, the protection efficiency is improved, the service life of the main board structure is prolonged, the main board structure is quickly reset by matching with a reset spring, the damage of vibration to the main board structure is reduced, the vibration-damping effect is effectively improved, the main board can be vertically and transversely installed according to the installation requirement, the adjustment is convenient, the installation suitability is improved, the integral heat dissipation efficiency is improved through air flow heat dissipation, and the main board burning out caused by excessive heat is prevented, so that the problems in the background technology are solved.

In order to achieve the above purpose, the present invention provides the following technical solutions:

the utility model provides a self-service terminal of finance is with shock attenuation type industrial control mainboard, includes the mainboard structure, the processing chip is installed to the tin soldering on the up end of mainboard structure, is provided with the components and parts of being connected with the processing chip on the mainboard structure all around of processing the chip, the cladding has protection damping device on the four sides of mainboard structure, and protection damping device's the outside is provided with mounting structure.

Further, the mainboard structure includes the base plate, go up the PTEE film piece, go up the kraft layer, go up the copper foil layer, lower PTEE film piece, lower kraft layer and lower copper foil layer, the upper and lower below of base plate is provided with PTEE film piece and lower PTEE film piece respectively, go up the top of PTEE film piece and be provided with the kraft layer, the laminating of the top of going up the kraft layer is provided with the copper foil layer, the below of lower PTEE film piece is provided with lower kraft layer, the below of lower kraft layer is provided with lower copper foil layer, protection damping device includes the cladding gum cover, external offset, the inscription groove has been seted up to the inner of cladding gum cover, the inscription groove cover is covered on the corner of mainboard structure in the cladding gum cover, the cladding gum cover in the four sides of mainboard structure is provided with external offset, external offset cladding sets up in the outer seat, be provided with damper between external offset and the external seat, the base plate, go up the PTEE film layer, go up the kraft layer, go up the copper foil layer, down PTEE film layer, down between PTEE film layer and the lower copper foil layer, the compression moulding, the PTEE film layer, upper and lower copper foil layer, the cladding of lower copper foil layer, the cladding film layer.

Further, a plurality of groups of tin welding points are soldered on the upper surface of the main board structure, the tin welding points are used for pin welding of the components, and the components are connected with the processing chip in series.

Further, the protection damping device comprises a coating rubber sleeve, an external rubber plate, an internal connecting groove, a damping component and an external connecting seat, wherein the internal connecting groove is formed in the inner end of the coating rubber sleeve, the coating rubber sleeve is internally covered on corners of the main board structure through the internal connecting groove, the external rubber plate is arranged in the coating rubber sleeve on the outer sides of four sides of the main board structure in a coating mode, the external rubber plate is arranged in the external connecting seat in a coating mode, and the damping component is arranged between the external rubber plate and the external connecting seat.

Further, the cladding grillage is connected in the below extension of cladding gum cover, cladding grillage setting is in the below of mainboard structure, mainboard structure below welding has multiunit oblique heat dissipation aluminum plate, the inner of cladding grillage is provided with the baffle, the baffle is connected with oblique heat dissipation aluminum plate bottom, the fresh air inlet has been seted up on the baffle, the louvre has been seted up on the cladding grillage four walls of baffle top, the baffle below is provided with radiator fan, radiator fan cup joints on driving motor's output, driving motor fixes in cladding grillage bottom.

Further, the damping component comprises a limiting plate, a supporting rod, a buffer spring, a reset spring and a buffer groove, wherein the buffer groove is formed in the inner end of the external rubber plate, the limiting plate is arranged in the buffer groove, a slot hole for the supporting rod to penetrate is formed in the limiting plate, the supporting rod above the slot hole is sleeved with the buffer spring, and one end of the supporting rod below the slot hole is connected with the reset spring.

Further, the mounting structure comprises a fixing structure and an inscription structure, the fixing structure is fixed on the inner wall of the shell of the financial self-service terminal, the inscription structure is fixed on the protection damping device, the fixing structure and the inscription structure are provided with two groups, and the fixing structure and the inscription structure are respectively mounted at two ends of the protection damping device.

Further, the fixed knot constructs including installation curb plate, grafting seat and grafting groove, and the both sides at the grafting seat are fixed to the installation curb plate, and the grafting groove has been seted up to the inside of grafting seat, and grafting groove and inscription structure are inserted and are connected.

Further, the inscription structure includes solid fixed ring, plug rod, inscription bearing, clamping ring and plugboard, and the rear and the plug rod of plugboard are connected, and gu fixed ring fixes at protection damping device side, and gu fixed ring intra-annular is provided with inscription bearing, and inscription bearing cover is covered on the plug rod, has cup jointed the clamping ring on the plug rod.

Further, clamping strips which are clamped with the inscribed bearing are arranged on two sides of the inserting rod, the inserting rod is movably inserted and connected with the inscribed bearing, a clamping block is arranged on the outer side of the clamping hoop, and a clamping groove corresponding to the clamping block of the clamping hoop is arranged at the inner end of the fixing ring.

Compared with the prior art, the invention has the beneficial effects that:

1. the damping type industrial control main board for the financial self-service terminal is characterized in that a lower copper foil layer is arranged below a lower kraft layer, a substrate, an upper PTEE film piece, the upper kraft layer, the upper copper foil layer, the lower PTEE film piece, the lower kraft layer and the lower copper foil layer are formed by compression, a plurality of groups of tin welding spots are soldered on the upper surface of a main board structure, the tin welding spots are used for pin welding of components, the components are connected with a processing chip in series, the stability of the whole main board is improved by compression of a multi-layer board, and the structure of the main board is firmer and is not easy to break.

2. According to the damping type industrial control main board for the financial self-service terminal, the external rubber plates are arranged in the coating rubber sleeves on the outer sides of the four sides of the main board structure in a coating mode, the external rubber plates are arranged in the outer connecting seats in a coating mode, the damping components are arranged between the external rubber plates and the external connecting seats, the edges of the main board structure are coated by the coating rubber sleeves, the edges of the main board structure are effectively protected, damage of friction to the main board structure is reduced, protection efficiency is improved, and service life of the main board structure is prolonged.

3. According to the shock-absorbing type industrial control main board for the financial self-service terminal, the partition board is connected with the bottom end of the inclined heat-dissipating aluminum plate, the air inlet is formed in the partition board, the heat-dissipating holes are formed in the four walls of the cladding plate frame above the partition board, the heat-dissipating fan is arranged below the partition board and is sleeved on the output end of the driving motor, the driving motor is fixed at the bottom end of the cladding plate frame, the driving motor drives the heat-dissipating fan to rotate, the heat-dissipating fan enters the cladding plate frame above the cladding plate frame through the air inlet in the partition board, the internal inclined heat-dissipating aluminum plate is subjected to blowing and heat dissipation, and after heat is effectively conducted, the overall heat-dissipating efficiency is improved through air flow heat dissipation, and the main board is prevented from being burnt out due to excessive heat.

4. The damping type industrial control main board for the financial self-service terminal is provided with the buffering groove which is formed in the inner end of the external rubber plate, the limiting plate is arranged in the buffering groove, the limiting plate is provided with the slot hole for penetration of the supporting rod, the supporting rod above the slot hole is sleeved with the buffering spring, one end of the supporting rod below the slot hole is connected with the reset spring, during vibration, the coating rubber sleeve and the external rubber plate drive the supporting rod to press down, the buffering spring is extruded, and meanwhile, the buffering spring acts against the force and is matched with the reset spring to enable the main board structure to reset rapidly, damage of vibration to the main board structure is reduced, and the shockproof buffering effect is effectively improved.

5. According to the shock-absorbing type industrial control main board for the financial self-service terminal, the inscription bearing is arranged in the fixing ring, the inscription bearing is sleeved on the inserting rod, the clamping hoop is sleeved on the inserting rod, clamping bars which are clamped with the inscription bearing are arranged on two sides of the inserting rod, the inserting rod is movably inserted and connected with the inscription bearing, a clamping block is arranged on the outer side of the clamping hoop, a clamping groove corresponding to the clamping block of the clamping hoop is arranged at the inner end of the fixing ring, the inserting plate is inserted into the inserting groove, one end of the inserting groove is sealed for limiting, when the installation angle is required to be adjusted, the inserting rod moves forwards to drive the clamping hoop to be taken out from the fixing ring, the inserting rod is rotated to drive the clamping hoop to rotate together, and when the inserting rod is vertically and vertically adjusted, the clamping hoop is clamped through the clamping groove, vertical installation and horizontal installation can be conveniently carried out according to the installation requirement, and the installation adaptability is improved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present invention;

FIG. 2 is a schematic diagram of a motherboard structure according to the present invention;

FIG. 3 is an enlarged view of the invention at A of FIG. 2;

FIG. 4 is a cross-sectional view of a protective shock absorbing device according to the present invention;

FIG. 5 is a cross-sectional view of a cladding panel frame of the present invention;

FIG. 6 is an enlarged view of the invention at B of FIG. 4;

FIG. 7 is a schematic view of the mounting structure of the present invention;

FIG. 8 is a schematic view of a fastening structure according to the present invention;

fig. 9 is a partial exploded view of the mounting structure of the present invention.

In the figure: 1. a main board structure; 11. a substrate; 12. upper PTEE film piece; 13. coating a kraft paper layer; 14. coating a copper foil layer; 15. lower PTEE film piece; 16. a lower kraft layer; 17. a lower copper foil layer; 18. a tin solder joint; 19. oblique heat dissipation aluminum plate; 2. a processing chip; 21. a component; 3. a protection damping device; 31. coating a rubber sleeve; 311. cladding plate frame; 312. a partition plate; 313. a heat radiation fan; 314. a driving motor; 32. externally connecting a rubber plate; 33. an inscription groove; 34. a shock absorbing assembly; 341. a limiting plate; 342. a support rod; 343. a buffer spring; 344. a return spring; 345. a buffer tank; 35. an outer joint seat; 4. a mounting structure; 41. a fixed structure; 411. installing a side plate; 412. a socket; 413. a plug-in groove; 42. an inscription structure; 421. a fixing ring; 422. inserting a connecting rod; 423. inscribing a bearing; 424. a clamping ring; 425. a plug board.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Referring to fig. 1, a vibration-damping type industrial control main board for a financial self-service terminal comprises a main board structure 1, a processing chip 2 is mounted on the upper end surface of the main board structure 1 in a soldering manner, components 21 connected with the processing chip 2 are arranged on the main board structure 1 around the processing chip 2, a protection vibration damper 3 is coated on four sides of the main board structure 1, and a mounting structure 4 is arranged on the outer side of the protection vibration damper 3.

Referring to fig. 2-3, the motherboard structure 1 includes a substrate 11, an upper PTEE film sheet 12, an upper kraft layer 13, an upper copper foil layer 14, a lower PTEE film sheet 15, a lower kraft layer 16 and a lower copper foil layer 17, wherein the upper and lower sides of the substrate 11 are respectively provided with the upper PTEE film sheet 12 and the lower PTEE film sheet 15, the upper portion of the upper PTEE film sheet 12 is provided with the upper kraft layer 13, the upper copper foil layer 14 is attached to the upper portion of the upper kraft layer 13, the lower portion of the lower PTEE film sheet 15 is provided with the lower kraft layer 16, the lower copper foil layer 17 is provided below the lower kraft layer 16, the substrate 11, the upper PTEE film sheet 12, the upper kraft layer 13, the upper copper foil layer 14, the lower PTEE film sheet 15, the lower kraft layer 16 and the lower copper foil layer 17 are pressed and formed, a plurality of tin solder joints 18 are soldered on the upper surface of the motherboard structure 1, and a plurality of tin solder joints 18 are used for soldering pins of the components 21, and the components 21 are all connected with the processing chip 2 in series, the motherboard is firmly pressed, and the entire motherboard structure is more stable, and the motherboard is not easy to break.

Referring to fig. 4, the protection and shock absorption device 3 includes a coating gum cover 31, an external gum plate 32, an internal connecting groove 33, a shock absorption component 34 and an external connecting seat 35, the internal connecting groove 33 is formed at the inner end of the coating gum cover 31, the coating gum cover 31 is covered on the corners of the main board structure 1 through the internal connecting groove 33, the coating gum cover 31 on the outer sides of four sides of the main board structure 1 is internally provided with the external gum plate 32, the external gum plate 32 is coated and arranged in the external connecting seat 35, the shock absorption component 34 is arranged between the external gum plate 32 and the external connecting seat 35, the coating gum cover 31 is coated on the corners of the main board structure 1, the corners of the main board structure 1 are effectively protected, the damage of friction to the main board structure 1 is reduced, the protection efficiency is improved, and the service life of the main board structure 1 is prolonged.

Referring to fig. 5, the lower portion of the coating rubber sleeve 31 extends to connect the coating plate frame 311, the coating plate frame 311 is disposed below the main board structure 1, a plurality of groups of oblique heat dissipation aluminum plates 19 are welded below the main board structure 1, a partition plate 312 is disposed at the inner end of the coating plate frame 311, the partition plate 312 is connected with the bottom end of the oblique heat dissipation aluminum plates 19, an air inlet is disposed on the partition plate 312, heat dissipation holes are disposed on four walls of the coating plate frame 311 above the partition plate 312, a heat dissipation fan 313 is disposed below the partition plate 312, the heat dissipation fan 313 is sleeved on the output end of the driving motor 314, the driving motor 314 is fixed at the bottom end of the coating plate frame 311, the driving motor 314 drives the heat dissipation fan 313 to rotate, and enters the coating plate frame 311 above the air inlet on the partition plate 312 to blow and dissipate heat to the internal oblique heat dissipation aluminum plates 19.

Referring to fig. 6, the damping component 34 includes a limiting plate 341, a supporting rod 342, a buffer spring 343, a return spring 344 and a buffer groove 345, the buffer groove 345 is formed at the inner end of the external rubber plate 32, the limiting plate 341 is mounted in the buffer groove 345, a slot hole for the penetration of the supporting rod 342 is formed in the limiting plate 341, the supporting rod 342 above the slot hole is covered with the buffer spring 343, one end of the supporting rod 342 below the slot hole is connected with the return spring 344, when in vibration, the coating rubber sleeve 31 and the external rubber plate 32 drive the supporting rod 342 to press down, the buffer spring 343 is extruded, and meanwhile, the buffer spring 343 acts against the reverse force, and the buffer spring 343 cooperates with the return spring 344 to enable the main board structure 1 to reset rapidly, so that damage of vibration to the main board structure 1 is reduced, and the vibration-proof and buffering effect is effectively improved.

Referring to fig. 7-9, the mounting structure 4 includes a fixing structure 41 and an inscription structure 42, the fixing structure 41 is fixed on the shell inner wall of the self-service financial terminal, the inscription structure 42 is fixed on the protection damping device 3, the fixing structure 41 and the inscription structure 42 are provided with two groups, install the both ends at the protection damping device 3 respectively, the fixing structure 41 includes mounting side plate 411, socket 412 and jack groove 413, the both sides at socket 412 are fixed to the mounting side plate 411, the inside of socket 412 has seted up jack groove 413, jack groove 413 and inscription structure 42 are connected in a plugging manner, the inscription structure 42 includes solid fixed ring 421, jack rod 422, inscription bearing 423, clamp ring 424 and jack plate 425, the rear and the jack rod 422 of jack plate 425 are connected, gu fixed ring 421 is fixed at the protection damping device 3 side, be provided with the inscription bearing 423 in the solid fixed ring 421, the inscription bearing 423 is sleeved on the jack rod 422, the clamp rod 422 has cup jointed the clamp ring 424, the clamp bar with the inscription bearing 423 joint is provided with on both sides, the clamp bar 422 is connected in the movable plug groove with the jack bearing 423, the inside of clamp ring 424 has the clamp ring 424, the clamp ring 424 is provided with the clamp ring 424 outside, install the jack ring 421 and the jack groove is required to rotate the jack ring is adjusted to be connected in a vertical direction, the jack ring is required to be adjusted, the jack ring is required to be inserted in a vertical direction, and the jack groove is adjusted, and is required to be inserted into the jack groove is adjusted, and is adjusted in a vertical direction.

In summary, the shock-absorbing type industrial control motherboard for the self-service financial terminal provided by the invention is characterized in that the lower copper foil layer 17 is arranged below the lower kraft layer 16, the substrate 11, the upper PTEE film piece 12, the upper kraft layer 13, the upper copper foil layer 14, the lower PTEE film piece 15, the lower kraft layer 16 and the lower copper foil layer 17 are pressed and formed, a plurality of groups of tin welding spots 18 are soldered on the upper surface of the motherboard structure 1, the tin welding spots 18 are used for welding pins of the components 21, the components 21 are connected with the processing chip 2 in series, the multi-layer board is pressed, the stability of the whole motherboard is improved, the motherboard structure is firmer and is not easy to break, the external glue board 32 is coated and arranged in the coating glue sheath 31 on the four sides of the motherboard structure 1, the shock-absorbing component 34 is arranged between the external glue board 32 and the external glue sheath 35, the coating glue sheath 31 coats corners of the motherboard structure 1, effectively protects corners of the main board structure 1, reduces damage to the main board structure 1 caused by friction, improves protection efficiency, prolongs service life of the main board structure 1, connects the baffle 312 with the bottom end of the inclined heat radiation aluminum plate 19, sets up an air inlet on the baffle 312, sets up heat radiation holes on four walls of the cladding plate frame 311 above the baffle 312, sets up a heat radiation fan 313 below the baffle 312, the heat radiation fan 313 is sleeved on an output end of a driving motor 314, the driving motor 314 is fixed at the bottom end of the cladding plate frame 311, the driving motor 314 drives the heat radiation fan 313 to rotate, enters the cladding plate frame 311 above through the air inlet on the baffle 312, blows and radiates the inside inclined heat radiation aluminum plate 19, effectively conducts heat, then radiates heat through air flow, improves overall heat radiation efficiency, prevents the main board from burning out caused by temperature scalding, the buffer groove 345 is set up at the inner end of the external adhesive plate 32, the buffer groove 345 is internally provided with the limiting plate 341, the limiting plate 341 is provided with the slotted hole through which the supporting rod 342 penetrates, the supporting rod 342 above the slotted hole is sleeved with the buffer spring 343, one end of the supporting rod 342 below the slotted hole is connected with the reset spring 344, when in vibration, the coating rubber sleeve 31 and the external rubber plate 32 drive the supporting rod 342 to press down, the buffer spring 343 is extruded, and meanwhile, the buffer spring 343 acts in reverse force, the buffer spring 344 is matched with the reset spring 344 to enable the main board structure 1 to reset rapidly, damage of vibration to the main board structure 1 is reduced, the vibration buffer effect is effectively improved, the inner connecting bearing 423 is arranged in the fixed ring 421, the inner connecting bearing 423 is sleeved on the inserting rod 422, the clamping hoop 424 is sleeved on the inserting rod 422, clamping bars are arranged on two sides of the inserting rod 422 and are connected with the inner connecting bearing 423 in a movable inserting mode, a clamping block is arranged on the outer side of the clamping hoop 424, the inner end of the fixed ring 421 is provided with a clamping groove corresponding to the clamping block of the clamping hoop 424, the inserting plate 425 is inserted into the inserting groove 413, one end of the inserting groove 413 is used for limiting, when a mounting angle needs to be adjusted, the inserting rod 422 is driven to rotate, the clamping ring 424 is driven to rotate vertically and can be mounted from the clamping ring 422 to the fixing hoop 424, and the mounting hoop can be conveniently adjusted vertically and rotated, and the mounting hoop can be conveniently and vertically adjusted.

The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should be covered by the protection scope of the present invention by making equivalents and modifications to the technical solution and the inventive concept thereof.

Claims

1. A self-service terminal of finance is with shock attenuation type industry control mainboard, its characterized in that: including mainboard structure (1), tin soldering installs on the up end of mainboard structure (1) handles chip (2), is provided with components and parts (21) of being connected with processing chip (2) on mainboard structure (1) all around of processing chip (2), the cladding has protection damping device (3) on the four sides of mainboard structure (1), the outside of protection damping device (3) is provided with mounting structure (4), mounting structure (4) include fixed knot constructs (41) and inscription constructs (42), fixed knot constructs (41) are fixed on the shell inner wall of self-service terminal of finance, inscription constructs (42) are fixed on protection damping device (3), fixed knot constructs (41) and inscription constructs (42) set up two sets of, install both ends at protection damping device (3) respectively, fixed knot constructs (41) including installation curb plate (411), grafting seat (412) and grafting groove (413), the both sides at grafting seat (412) are fixed, grafting groove (413) are seted up to the inside of grafting seat (412), grafting groove (413) is connected with inscription constructs (42) grafting, inscription constructs (42) and is fixed on protection damping device (3), inscription constructs (42) including fixed ring (424), pinboard (423), pinboard (425) and pinboard (425), the rear of the plug board (425) is connected with the plug rod (422), the fixed ring (421) is fixed at the side end of the protection damping device (3), an inscription bearing (423) is arranged in the fixed ring (421), the inscription bearing (423) is sleeved on the plug rod (422), a clamping hoop (424) is sleeved on the plug rod (422), clamping strips which are clamped with the inscription bearing (423) are arranged at two sides of the plug rod (422), the plug rod (422) is movably inserted and connected with the inscription bearing (423), a clamping block is arranged at the outer side of the clamping hoop (424), and a clamping groove corresponding to the clamping block of the clamping hoop (424) is arranged at the inner end of the fixed ring (421);

the protection damping device (3) comprises a coating rubber sleeve (31), an external rubber plate (32), an internal connecting groove (33), a damping component (34) and an external connecting seat (35), wherein the internal connecting groove (33) is formed in the inner end of the coating rubber sleeve (31), the coating rubber sleeve (31) on the four sides of the main board structure (1) is covered by the internal connecting groove (33), the external rubber plate (32) is covered by the coating rubber sleeve (31) on the four sides of the main board structure (1), the external connecting seat (35), the damping component (34) is arranged between the external connecting rubber plate (32) and the external connecting seat (35), the damping component (34) comprises a limiting plate (341), a supporting rod (342), a buffer spring (343), a buffer spring (344) and a buffer groove (345), the inner end of the external connecting rubber plate (32) is provided with the limiting plate (341), the limiting plate (341) is arranged in the buffer groove (345), the supporting rod (342) above the limiting plate (341) is covered by the supporting rod, and one end of the lower part (342) is connected with the buffer spring (343).

2. The shock absorbing industrial control main board for a financial self-service terminal according to claim 1, wherein: the mainboard structure (1) comprises a substrate (11), an upper PTEE film piece (12), an upper kraft paper layer (13), an upper copper foil layer (14), a lower PTEE film piece (15), a lower kraft paper layer (16) and a lower copper foil layer (17), wherein the upper and lower parts of the substrate (11) are respectively provided with the upper PTEE film piece (12) and the lower PTEE film piece (15), the upper part of the upper PTEE film piece (12) is provided with the upper kraft paper layer (13), the upper copper foil layer (14) is attached to the upper part of the upper kraft paper layer (13), the lower part of the lower PTEE film piece (15) is provided with the lower kraft paper layer (16), the lower part of the lower kraft paper layer (16) is provided with the lower copper foil layer (17), and the substrate (11), the upper PTEE film piece (12), the upper kraft paper layer (13), the upper copper foil layer (14), the lower PTEE film piece (15), the lower kraft paper layer (16) and the lower copper foil layer (17) are subjected to compression molding.

3. The shock absorbing industrial control main board for a financial self-service terminal according to claim 1, wherein: the upper surface of the main board structure (1) is soldered with a plurality of groups of tin welding spots (18), the tin welding spots (18) are used for pin welding of components (21), and the components (21) are connected with the processing chip (2) in series.

4. The shock absorbing industrial control main board for a financial self-service terminal according to claim 1, wherein: cladding grillage (311) are connected in the below extension of cladding gum cover (31), cladding grillage (311) set up in the below of mainboard structure (1), the welding of mainboard structure (1) below has multiunit oblique shape heat dissipation aluminum plate (19), the inner of cladding grillage (311) is provided with baffle (312), baffle (312) are connected with oblique shape heat dissipation aluminum plate (19) bottom, the fresh air inlet has been seted up on baffle (312), the louvre has been seted up on cladding grillage (311) all around of baffle (312) top, baffle (312) below is provided with radiator fan (313), radiator fan (313) cup joint on the output of driving motor (314), driving motor (314) are fixed in cladding grillage (311) bottom.