CN216531912U

CN216531912U - Interference-free multilayer wiring regionalized circuit board

Info

Publication number: CN216531912U
Application number: CN202122934992.3U
Authority: CN
Inventors: 刘志江; 刘云强; 余鑫
Original assignee: Dongguan Changda Circuit Board Co ltd
Current assignee: Dongguan Changda Circuit Board Co ltd
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2022-05-13
Anticipated expiration: 2031-11-26

Abstract

The utility model discloses an interference-free multilayer wiring regionalized circuit board which comprises a substrate, wherein a first wiring layer is arranged at the upper end of the substrate, a second wiring layer is arranged at the lower end of the substrate, anti-interference devices are jointly arranged at the upper end of the first wiring layer and the lower end of the second wiring layer, heat conducting devices are jointly arranged at the front end and the rear end of the substrate, mounting frame bodies are respectively arranged at the left end and the right end of the substrate, and a damping device is respectively arranged at one end of each of two mounting frame body raw material substrates. According to the interference-free multilayer wiring regionalized circuit board, the stability of the device is improved by installing the damping device, the damping is carried out through the clamping spring when the multilayer circuit board is shaken, the abrasion of the multilayer circuit board is reduced, the interference of noise waves to the multilayer circuit board is reduced through the wave absorbing plate on the anti-interference device, and the heat radiation efficiency of the multilayer circuit board is improved through double heat conduction of the heat radiation device to the multilayer circuit board.

Description

Interference-free multilayer wiring regionalized circuit board

Technical Field

The utility model relates to the technical field of multilayer circuit boards, in particular to an interference-free multilayer wiring regionalized circuit board.

Background

The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electrical appliance layout. The common circuit board is divided into single-sided wiring and double-sided wiring, commonly called single-sided board and double-sided board, the wiring of the circuit board required in the high-end electronic product is more and more complex, and due to the restriction of product space design factors, people more and more use multilayer circuit boards. 1. Most of the existing multilayer circuit boards are fixedly installed through screws, and the multilayer circuit boards are easily damaged and easily loosened when being subjected to external impact; 2. the existing multilayer circuit board has poor electromagnetic resistance, and is greatly influenced by external electromagnetism especially in some precise application occasions, so that the use effect of the existing multilayer circuit board is influenced; 3. the conventional multilayer circuit board is formed by combining a plurality of single-layer circuit boards, so that the conventional multilayer circuit board is more easily overheated when working for a long time.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide an interference-free multilayer wiring regionalized circuit board which can effectively solve the problems in the background technology.

In order to realize the purpose, the utility model adopts the technical scheme that:

the utility model provides an interference-free regional circuit board of multilayer wiring, includes the base plate, No. one the routing layer is installed to the base plate upper end, No. two routing layers are installed to the base plate lower extreme, anti jamming unit is installed jointly to No. one routing layer upper end and No. two routing layer lower extremes, heat-transfer device is installed jointly to base plate front end and rear end, the installation support body, two are all installed to base plate left end and right-hand member installation damping device is all installed to the one end of installation support body raw materials base plate.

Preferably, installation damping device includes L type mounting panel, L type mounting panel is provided with four, four L type mounting panel upper end is all opened there is the mounting groove, four the installation screw is all installed to L type mounting panel right-hand member, the chucking spring is all installed to the installation screw left end, installation support body right-hand member is opened there are four draw-in grooves, four L type mounting panel passes through the chucking spring and installs at the installation support body right-hand member.

Preferably, the anti-jamming unit includes that one number inhales the wave plate and two numbers inhale the wave plate, one number inhales the wave plate and two numbers inhale the one end that the wave plate corresponds and all install the adhesive layer, one number inhales the wave plate and two numbers inhale the wave plate and install respectively in a routing layer upper end and two numbers routing layer lower extreme.

Preferably, the heat-conducting device includes a heating panel and No. two heating panels, No. four conducting strips are installed to heating panel rear end, No. two conducting strips are installed to No. two heating panel front ends, No. one heating panel and No. two heating panels are installed at base plate front end and rear end respectively.

Preferably, the clamping spring and the clamping groove are consistent in size and correspond to each other in position left and right.

Preferably, the first heat dissipation plate is installed between the substrate and the second wiring layer, and the second heat dissipation plate is installed between the substrate and the first wiring layer.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the interference-free multilayer wiring regionalized circuit board, the L-shaped mounting plate on the mounting damping device is fixed through the mounting groove, the mounting screw on the L-shaped mounting plate is rotated, the clamping spring on the mounting screw is screwed into the mounting frame body through the clamping groove, the mounting screw is not in contact with the mounting frame body, the mounting frame body is clamped and fixed through the clamping spring, the multilayer circuit board is fixed along with the mounting screw, and through the design of the plurality of L-shaped mounting plates, the stability of the device is improved, and when the multilayer circuit board is shaken, the damping is realized through the clamping spring, so that the abrasion of the multilayer circuit board is reduced.

2. The interference-free multilayer wiring regionalized circuit board is arranged at the upper end and the lower end of the multilayer circuit board through the wave absorbing plate on the anti-jamming device, the wave absorbing plate is a functional composite material mainly absorbing electromagnetic waves, the back-and-forth reflection of the electromagnetic waves in the shielding cavity is eliminated, the interference of clutter on self equipment is reduced, and the disturbance and the injury of electromagnetic radiation on surrounding equipment and personnel are also effectively prevented.

3. According to the non-interference multilayer wiring regional circuit board, the first heat conducting sheet on the heat conducting device is arranged between the substrate and the second wiring layer, and the second heat conducting sheet is arranged between the substrate and the first wiring layer, so that double heat conduction is performed between the multilayer circuit boards, and then the first heat radiating plate and the second heat radiating plate are used for heat radiation, so that the heat radiation efficiency of the multilayer circuit board is improved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a non-interfering multi-layer wiring regionalized circuit board of the present invention;

FIG. 2 is a schematic view showing the overall structure of a device for mounting a vibration damper for a non-interfering multilayer wiring regionalized wiring board of the present invention;

FIG. 3 is a schematic diagram of the overall structure of an interference-free anti-jamming device of a multi-layer wiring regionalized circuit board of the utility model;

fig. 4 is a schematic view of the overall structure of a heat conduction device of a non-interference multi-layer wiring regionalized circuit board of the utility model.

In the figure: 1. a substrate; 2. installing a damping device; 3. an anti-jamming device; 4. a heat conducting device; 5. a first wiring layer; 6. a second wiring layer; 7. installing a frame body; 20. an L-shaped mounting plate; 21. mounting grooves; 22. mounting screws; 23. a chucking spring; 24. a card slot; 30. a first wave absorbing plate; 31. a second wave absorbing plate; 32. an adhesive layer; 40. a first heat dissipation plate; 41. a second heat dissipation plate; 42. a first heat-conducting sheet; 43. and a second heat conducting sheet.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, an interference-free multilayer wiring regionalization circuit board comprises a substrate 1, a wiring layer 5 is installed at the upper end of the substrate 1, a wiring layer 6 is installed at the lower end of the substrate 1, an anti-interference device 3 is installed at the upper end of the wiring layer 5 and the lower end of the wiring layer 6, a heat conduction device 4 is installed at the front end and the rear end of the substrate 1, installation frame bodies 7 are installed at the left end and the right end of the substrate 1, and installation damping devices 2 are installed at one ends of the two installation frame bodies 7, namely the raw material substrate 1.

The installation damping device 2 comprises L-shaped installation plates 20, four L-shaped installation plates 20 are arranged, installation grooves 21 are formed in the upper ends of the four L-shaped installation plates 20, installation screws 22 are installed at the right ends of the four L-shaped installation plates 20, clamping springs 23 are installed at the left ends of the installation screws 22, four clamping grooves 24 are formed in the right ends of installation frame bodies 7, the four L-shaped installation plates 20 are installed at the right ends of the installation frame bodies 7 through the clamping springs 23 and are fixed through the L-shaped installation plates 20 through the installation grooves 21, then, by screwing the mounting screw 22 on the L-shaped mounting plate 20, the clamping spring 23 on the mounting screw 22 is screwed into the mounting frame body 7 through the clamping groove 24, thereby fixing the multilayer circuit board, not only improving the stability of the device through the design of a plurality of L-shaped mounting plates 20, and when the multilayer circuit board is shaken, the chucking spring 23 is used for absorbing shock, so that the abrasion of the multilayer circuit board is reduced.

The anti-interference device 3 comprises a wave absorbing plate 30 and a wave absorbing plate 31, a bonding layer 32 is installed at one end corresponding to the wave absorbing plate 30 and the wave absorbing plate 31, the wave absorbing plate 30 and the wave absorbing plate 31 are installed at the upper end of the routing layer 5 and the lower end of the routing layer 6 respectively, the wave absorbing plate is a functional composite material mainly absorbing electromagnetic waves, the back-and-forth reflection of the electromagnetic waves in the shielding cavity is eliminated, and therefore the interference of clutter on self equipment is reduced.

Heat transfer device 4 includes a heating panel 40 and No. two heating panels 41, four conducting strips 42 are installed No. one to heating panel 40 rear end, four conducting strips 43 are installed No. two to No. two heating panels 41 front ends, install respectively at base plate 1 front end and rear end with No. two heating panels 41 to a heating panel 40, install between base plate 1 and No. two layers of wiring 6 through conducting strip 42, No. two conducting strips 43 are installed between base plate 1 and No. one layer of wiring 5, thereby to dual heat conduction between multilayer circuit board, dispel the heat by a heating panel 40 and No. two heating panels 41 again, thereby multilayer circuit board's radiating efficiency has been improved.

The chucking spring 23 and the chucking groove 24 are identical in size and correspond in position to each other from left to right.

First heat dissipation plate 40 is installed between substrate 1 and No. two wiring layers 6, and second heat dissipation plate 41 is installed between substrate 1 and No. one wiring layer 5.

The utility model is a non-interference multilayer wiring regionalized circuit board, firstly fixing the L-shaped mounting plate 20 on the mounting damping device 2 by the mounting groove 21, then screwing the mounting screw 22 on the L-shaped mounting plate 20, screwing the chucking spring 23 on the mounting screw 22 into the mounting frame body 7 by the clamping groove 24, thereby fixing the multilayer circuit board, through the design of a plurality of L-shaped mounting plates 20, not only improving the stability of the device, but also damping the vibration by the chucking spring 23 when the multilayer circuit board is shaken, reducing the abrasion, simultaneously when the multilayer circuit board works, mounting the upper end and the lower end of the multilayer circuit board by the wave absorbing plate on the anti-interference device 3, eliminating the back-and-forth reflection of the electromagnetic wave in the shielding cavity by the wave absorbing plate which is a functional composite material mainly absorbing the electromagnetic wave, reducing the interference of clutter to the device, therefore, the anti-interference performance of the multilayer circuit board is improved, the first heat conducting sheet 42 on the heat conducting device 4 is arranged between the substrate 1 and the second wiring layer 6, and the second heat conducting sheet 43 is arranged between the substrate 1 and the first wiring layer 5, so that double heat conduction is carried out between the multilayer circuit boards, and then the first heat radiating plate 40 and the second heat radiating plate 41 are used for heat radiation, and the heat radiation efficiency of the multilayer circuit board is improved.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A non-interfering multilayer wiring regionalized wiring board comprising a substrate (1), characterized in that: no. one routing layer (5) is installed to base plate (1) upper end, No. two routing layers (6) are installed to base plate (1) lower extreme, anti jamming unit (3) are installed jointly to a routing layer (5) upper end and No. two routing layers (6) lower extreme, heat abstractor (4) are installed jointly to base plate (1) front end and rear end, installation support body (7), two are all installed to base plate (1) left end and right-hand member installation support body (7) raw materials base plate's (1) one end all installs installation damping device (2).

2. A non-interfering multilayer wiring regionalized wiring board according to claim 1, characterized in that: installation damping device (2) are including L type mounting panel (20), L type mounting panel (20) are provided with four, four mounting groove (21) have all been opened to L type mounting panel (20) upper end, four installation screw (22) are all installed to L type mounting panel (20) right-hand member, chucking spring (23) are all installed to installation screw (22) left end, erection support body (7) right-hand member is opened there are four draw-in grooves (24), four L type mounting panel (20) are installed at erection support body (7) right-hand member through chucking spring (23).

3. A non-interfering multilayer wiring regionalized wiring board according to claim 1, characterized in that: anti jamming unit (3) inhale wave plate (30) and inhale wave plate (31) No. two including one, inhale wave plate (30) and inhale one end that wave plate (31) correspond No. two and all install adhesive layer (32), inhale wave plate (30) and inhale wave plate (31) No. two and install respectively in a routing layer (5) upper end and No. two routing layer (6) lower extreme.

4. A non-interfering multilayer wiring regionalized wiring board according to claim 1, characterized in that: heat-transfer device (4) include heating panel (40) and No. two heating panels (41), four conducting strips (42) are installed to heating panel (40) rear end, four conducting strips (43) are installed to No. two heating panels (41) front end, install respectively at base plate (1) front end and rear end heating panel (40) and No. two heating panels (41).

5. A non-interfering multilayer wiring regionalized wiring board according to claim 2, characterized in that: the clamping spring (23) and the clamping groove (24) are consistent in size and correspond to each other in position left and right.

6. The interference-free multilayer wiring regionalized wiring board of claim 4, characterized in that: the first heat-conducting fin (42) is arranged between the substrate (1) and the second wiring layer (6), and the second heat-conducting fin (43) is arranged between the substrate (1) and the first wiring layer (5).