CN219592870U - Multi-layer circuit board convenient to install - Google Patents
Multi-layer circuit board convenient to install Download PDFInfo
- Publication number
- CN219592870U CN219592870U CN202320522506.3U CN202320522506U CN219592870U CN 219592870 U CN219592870 U CN 219592870U CN 202320522506 U CN202320522506 U CN 202320522506U CN 219592870 U CN219592870 U CN 219592870U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- mounting
- multilayer circuit
- fixedly connected
- movable frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of multilayer circuit board installation, and discloses a multilayer circuit board convenient to install, which comprises an installation plate, wherein a locating rack is fixedly connected to the front of the top of the installation plate, limiting grooves are formed in two sides of the top of the installation plate, limiting blocks are movably inserted into the limiting grooves, a movable rack is arranged behind the top of the installation plate and fixedly connected with the limiting blocks, a sliding groove is formed in the center of the top of the installation plate, a screw is rotatably connected to the inside of the sliding groove, a sliding block is movably inserted into the sliding groove and is in threaded connection with the screw, the top of the sliding block is fixedly connected with the movable rack, and a heat dissipation plate is arranged at the top of the installation plate, so that the multilayer circuit board body is convenient to install quickly, and the multilayer circuit board body is convenient to disassemble and assemble when the multilayer circuit board body needs to be replaced and maintained, labor is saved, and working efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of multilayer circuit board installation, in particular to a multilayer circuit board convenient to install.
Background
The multilayer circuit board is a medium layer in the middle, and wiring layers are arranged on two sides. The multilayer board is a multilayer wiring layer, a dielectric layer is arranged between every two layers, and the dielectric layer can be made thin. The multilayer circuit board has at least three conductive layers, two of which are on the outer surface and the remaining one is incorporated into the insulating board. The electrical connection between them is typically made through plated through holes in the cross section of the circuit board.
In the related art, reference may be made to chinese patent publication No. CN215301018U, specifically to a multilayer circuit board mounting structure that is convenient to disassemble and assemble. This multilayer circuit board mounting structure background art convenient to dismouting proposes: most circuit boards are fixedly installed in electronic equipment through screws, but the cost of the multilayer circuit board is higher than that of a common circuit board, the surface and the internal circuit are staggered and complicated, a working tool is required to be used for disassembling and repairing the multilayer circuit board through screw fixation, the disassembly and the assembly are complicated, the surface of the multilayer circuit board is easily scratched by the tool, and even the multilayer circuit board is damaged, so that unnecessary waste is caused.
The applicant improves the mounting structure of the circuit board in the prior art according to the problems, and meanwhile, the utility model provides a multi-layer circuit board convenient to mount to solve the problem of complex disassembly and assembly of the circuit board.
Disclosure of Invention
The utility model aims at: in order to solve the above-mentioned problems, a multi-layer circuit board is provided which is convenient to install.
The technical scheme adopted by the utility model is as follows: the utility model provides a multilayer circuit board of easy to assemble, includes the mounting panel, the place ahead fixedly connected with locating rack in top of mounting panel, the spacing groove has all been seted up to the top both sides of mounting panel, and the inside activity grafting of spacing groove has the stopper, the movable frame has been placed at the top rear of mounting panel, and movable frame and stopper fixed connection;
the sliding block is movably inserted into the sliding groove, the sliding block is in threaded connection with the screw rod, and the top of the sliding block is fixedly connected with the movable frame;
the top of mounting panel is installed the heating panel, and the inside radiating groove of having seted up of heating panel, multilayer circuit board body has been placed at the top of heating panel, and multilayer circuit board body centre gripping is between locating rack and movable rack.
In a preferred embodiment, the mounting lugs are fixedly connected below the front wall of the positioning frame and behind the mounting plate, and the mounting lugs are provided with mounting holes.
In a preferred embodiment, the positioning frame and the mounting plate are in an integral structure, and the mounting lugs, the positioning frame and the mounting plate are in an integral structure.
In a preferred embodiment, the positioning frame and the movable frame have the same specification, and the upper parts of the positioning frame and the movable frame are both L-shaped structures.
In a preferred embodiment, a threaded hole matched with the screw rod is formed in the slider, and the screw rod is in threaded connection with the threaded hole.
In a preferred embodiment, the front end of the screw is fixedly connected with a rotary hand disk, and the length and the width of the radiating plate are the same as those of the multi-layer circuit board body.
In a preferred embodiment, two sides of the front end of the multi-layer circuit board body are pressed at the bottoms of the L-shaped structures above the positioning frame and the movable frame.
In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows: the multi-layer circuit board body is convenient to install quickly and better, so that when the multi-layer circuit board body needs to be replaced and maintained, the multi-layer circuit board body is convenient to assemble and disassemble, labor is saved, and working efficiency is improved.
1. According to the utility model, the mounting plate can be mounted at the position to be used through the mounting holes formed in the mounting lugs, the position of the mounting plate can be positioned at the moment, and the movable frame can be limited and guided through the cooperation of the limiting grooves and the limiting blocks, so that the movable frame moves more stably.
2. According to the utility model, the screw is driven to rotate by rotating the hand disk, and at the moment, the screw drives the sliding block and the movable frame to move in position, so that the multi-layer circuit board body can be clamped and positioned between the movable frame and the positioning frame, the multi-layer circuit board body can be supported and heat-dissipating effects can be achieved through the heat dissipation plate and the heat dissipation groove, and meanwhile, the multi-layer circuit board body can be clamped and positioned more stably under the support of the heat dissipation plate.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is an exploded view of the structure of the present utility model;
FIG. 3 is an enlarged schematic view of the structure of the area A in FIG. 2 according to the present utility model.
The marks in the figure: 1-a mounting plate; 2-a positioning frame; 3-mounting ears; 4-mounting holes; 5-a limit groove; 6-limiting blocks; 7-a movable frame; 8-a chute; 9-a screw; 10-sliding blocks; 11-rotating the hand plate; 12-a heat dissipation plate; 13-a heat sink; 14-a multilayer circuit board body.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described in the following in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
A multi-layered circuit board of an embodiment of the present utility model, which is convenient to install, will be described in detail with reference to fig. 1 to 3.
Referring to fig. 1-2, a multi-layer circuit board convenient to install, including mounting panel 1, the place ahead fixedly connected with locating rack 2 in top of mounting panel 1, locating rack 2 and mounting panel 1 are integrated into one piece structure, equal fixedly connected with installation ear 3 in the front wall below of locating rack 2 and mounting panel 1 rear, installation ear 3 and locating rack 2 and mounting panel 1 are integrated into one piece structure, have seted up mounting hole 4 on the installation ear 3, through the mounting hole 4 of seting up on the installation ear 3, can install mounting panel 1 in the position that needs to use, can fix a position the position of mounting panel 1 this moment.
Referring to fig. 1-2, the two sides of the top of the mounting plate 1 are provided with limit grooves 5, the inside of the limit grooves 5 is movably inserted with limit blocks 6, a movable frame 7 is placed at the rear of the top of the mounting plate 1, the movable frame 7 is fixedly connected with the limit blocks 6, the specification of the positioning frame 2 is identical to that of the movable frame 7, the positioning frame 2 and the upper part of the movable frame 7 are of L-shaped structures, and the movable frame 7 can be limited and guided through the cooperation of the limit grooves 5 and the limit blocks 6, so that the movable frame 7 moves more stably.
Referring to fig. 1-3, a sliding groove 8 is formed in the center of the top of the mounting plate 1, a screw rod 9 is rotatably connected to the inside of the sliding groove 8, a sliding block 10 is movably inserted into the sliding groove 8, the sliding block 10 is in threaded connection with the screw rod 9, a threaded hole matched with the screw rod 9 is formed in the sliding block 10, the screw rod 9 is in threaded connection with the threaded hole, the top of the sliding block 10 is fixedly connected with the movable frame 7, a rotary hand disc 11 is fixedly connected to the front end of the screw rod 9, the screw rod 9 is driven to rotate through the rotary hand disc 11, and at the moment, the screw rod 9 drives the sliding block 10 and the movable frame 7 to move in position, so that the multilayer circuit board body 14 can be clamped and positioned between the movable frame 7 and the positioning frame 2.
Referring to fig. 1-2, a heat dissipation plate 12 is installed at the top of the mounting plate 1, a heat dissipation groove 13 is formed in the heat dissipation plate 12, a multi-layer circuit board body 14 is placed at the top of the heat dissipation plate 12, the multi-layer circuit board body 14 is clamped between the positioning frame 2 and the movable frame 7, the heat dissipation plate 12 and the multi-layer circuit board body 14 are identical in length and width, two sides of the front end of the multi-layer circuit board body 14 are pressed at the bottoms of the L-shaped structures above the positioning frame 2 and the movable frame 7, the multi-layer circuit board body 14 can be supported and dissipated through the heat dissipation plate 12 and the heat dissipation groove 13, and meanwhile, the multi-layer circuit board body 14 is clamped and positioned stably under the support of the heat dissipation plate 12.
The utility model has the advantages that: the multilayer circuit board body 14 is convenient to install quickly, so that when the multilayer circuit board body 14 needs to be replaced and maintained, the multilayer circuit board body 14 is convenient to disassemble and assemble, labor is saved, and working efficiency is improved.
Working principle: when the multilayer circuit board body 14 is installed, the installation lug 3 which is firstly arranged on the installation lug 3 can position the installation plate 1 and the installation lug 3 at the position which needs to be used, the heat dissipation plate 12 which is matched with the multilayer circuit board body 14 is arranged at the top of the installation plate 1, at the moment, the heat dissipation plate 12 is positioned between the positioning frame 2 and the movable frame 7, the multilayer circuit board body 14 is placed at the top of the heat dissipation plate 12, the screw 9 drives the sliding block 10 and the movable frame 7 to move in position through rotating the rotating hand disk 11, the multilayer circuit board body 14 can be clamped and positioned between the movable frame 7 and the positioning frame 2, meanwhile, the multilayer circuit board body 14 can be supported and heat dissipation effect can be achieved through the heat dissipation plate 12 and the heat dissipation groove 13, and meanwhile, the multilayer circuit board body 14 is clamped and positioned more stably under the support of the heat dissipation plate 12.
The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (7)
1. The utility model provides a multilayer circuit board of easy to assemble, includes mounting panel (1), its characterized in that: the positioning device is characterized in that a positioning frame (2) is fixedly connected to the front of the top of the mounting plate (1), limiting grooves (5) are formed in two sides of the top of the mounting plate (1), limiting blocks (6) are movably inserted into the limiting grooves (5), a movable frame (7) is placed at the rear of the top of the mounting plate (1), and the movable frame (7) is fixedly connected with the limiting blocks (6);
a sliding groove (8) is formed in the center of the top of the mounting plate (1), a screw (9) is rotationally connected in the sliding groove (8), a sliding block (10) is movably inserted in the sliding groove (8), the sliding block (10) is in threaded connection with the screw (9), and the top of the sliding block (10) is fixedly connected with the movable frame (7);
the top of mounting panel (1) is installed heating panel (12), and inside heat dissipation groove (13) of having seted up of heating panel (12), multilayer circuit board body (14) have been placed at the top of heating panel (12), and multilayer circuit board body (14) centre gripping is between locating rack (2) and movable rack (7).
2. A multi-layer circuit board for easy installation as defined in claim 1, wherein: the mounting lugs (3) are fixedly connected below the front wall of the positioning frame (2) and behind the mounting plate (1), and mounting holes (4) are formed in the mounting lugs (3).
3. A multi-layer circuit board for easy installation as claimed in claim 2, wherein: the locating rack (2) and mounting panel (1) are integrated into one piece, and mounting ear (3) and locating rack (2) and mounting panel (1) are integrated into one piece.
4. A multi-layer circuit board for easy installation as defined in claim 1, wherein: the specification of the locating frame (2) is the same as that of the movable frame (7), and the upper parts of the locating frame (2) and the movable frame (7) are L-shaped structures.
5. A multi-layer circuit board for easy installation as defined in claim 1, wherein: the slider (10) is internally provided with a threaded hole matched with the screw rod (9), and the screw rod (9) is in threaded connection with the threaded hole.
6. A multi-layer circuit board for easy installation as defined in claim 5, wherein: the front end of the screw rod (9) is fixedly connected with a rotary hand disc (11), and the length and the width of the radiating plate (12) are the same as those of the multilayer circuit board body (14).
7. A multi-layer circuit board for easy installation as defined in claim 6, wherein: the two sides of the front end of the multilayer circuit board body (14) are pressed at the bottoms of the L-shaped structures above the locating frame (2) and the movable frame (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320522506.3U CN219592870U (en) | 2023-03-17 | 2023-03-17 | Multi-layer circuit board convenient to install |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320522506.3U CN219592870U (en) | 2023-03-17 | 2023-03-17 | Multi-layer circuit board convenient to install |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219592870U true CN219592870U (en) | 2023-08-25 |
Family
ID=87687647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320522506.3U Active CN219592870U (en) | 2023-03-17 | 2023-03-17 | Multi-layer circuit board convenient to install |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219592870U (en) |
-
2023
- 2023-03-17 CN CN202320522506.3U patent/CN219592870U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203722971U (en) | Ceramic radiating fin with high thermal conductivity | |
| CN101039566A (en) | Heat abstractor and electronic device using the same | |
| CN112394772A (en) | Solid state disk tray and radiator unit | |
| CN219592870U (en) | Multi-layer circuit board convenient to install | |
| CN216600202U (en) | HDI circuit board of high performance high density | |
| CN215871957U (en) | Fine circuit flexible circuit board combining thick gold, immersion gold and OSP | |
| CN111836463B (en) | Circuit board shielding protective cover body easy to disassemble and maintain | |
| CN212544164U (en) | Exhaust fan control circuit board convenient to heat dissipation | |
| CN212163991U (en) | Multilayer PCB board fixing device | |
| CN218006605U (en) | High multilayer high heat dissipation PCB board based on metal-based material | |
| CN220733091U (en) | Double-sided radiating PCB circuit board | |
| CN2884804Y (en) | Fan-less extendable industrial rack | |
| CN216357476U (en) | Blind hole conduction multilayer circuit board | |
| CN221829347U (en) | Thick copper multilayer circuit board | |
| CN221151622U (en) | Porous heat dissipation circuit board structure | |
| CN216451593U (en) | Composite heat-conducting PCB | |
| CN212544402U (en) | Corrosion-resistant radiating fin | |
| CN213694335U (en) | Stable form control scheme board | |
| CN221598435U (en) | Circuit board shell with heat dissipation function | |
| CN220228411U (en) | Novel notebook heat dissipation frame | |
| CN220457634U (en) | Double-sided PCB circuit board | |
| CN219514404U (en) | Insulating substrate of control cabinet | |
| CN219068446U (en) | High-temperature-resistant and folding-resistant double-sided circuit board | |
| CN221283034U (en) | Pulse direct current coating power supply for standard 3U chassis installation | |
| TW201304669A (en) | Heat dissipating apparatus for storage |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |