CN216357476U

CN216357476U - Blind hole conduction multilayer circuit board

Info

Publication number: CN216357476U
Application number: CN202122985184.XU
Authority: CN
Inventors: 郭军平; 黄丹丹; 黄凤玲
Original assignee: Shenzhen Yonghuayu Electronics Co ltd
Current assignee: Shenzhen Yonghuayu Electronics Co ltd
Priority date: 2021-12-01
Filing date: 2021-12-01
Publication date: 2022-04-19
Anticipated expiration: 2031-12-01

Abstract

The utility model discloses a blind hole conduction multilayer circuit board which comprises a first circuit board and a second circuit board, wherein circuit layers are arranged at the upper ends of the first circuit board and the second circuit board, a plurality of blind holes are formed in the front parts and the rear parts of the upper ends of the first circuit board and the second circuit board, fixing devices are arranged at the left ends and the right ends of the first circuit board and the second circuit board together, heat dissipation devices are arranged at the middle parts and the right ends of the left ends of the first circuit board and the second circuit board together, a heat conduction device is arranged at the lower end of the second circuit board, and three through holes are formed in the middle part and the right part of the upper end of the first circuit board. According to the blind hole conduction multilayer circuit board, double heat dissipation can be carried out on the circuit board through the heat dissipation device and the heat conduction device, the heat dissipation performance of the circuit board is improved, the service life of the circuit board is prolonged, the workload of operators is reduced through the fixing device, and the installation quality of the multilayer circuit board is improved.

Description

Blind hole conduction multilayer circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a blind hole conduction multilayer circuit board.

Background

The circuit board enables the circuit to be miniaturized and visualized, plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances, and has the characteristics of high wiring density, light weight, thin thickness and good bending property. Especially, with the development of technology, the living standard of people is improved, electronic products are also integrated into our lives, and the circuit board is an indispensable part of the electronic products and has an important position. 1. The existing multilayer circuit board has general heat dissipation, and because the circuit board is arranged in an electronic product, the temperature of the circuit board during working can be increased, only the circuit board is difficult to dissipate heat, and the overhigh temperature not only can normally use the circuit board, but also can damage the circuit board and influence the service life of the circuit board; 2. the existing multilayer circuit board is not well fixed during installation, and particularly when the circuit board is manually attached, the labor is wasted, and deviation possibly occurs during the attachment of the circuit board, so that the quality of the circuit board is affected.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a blind hole conduction multilayer circuit board which can effectively solve the problems in the background technology.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a blind hole switches on multilayer circuit board, includes first circuit board and second circuit board, the circuit layer is all installed to first circuit board and second circuit board upper end, a plurality of blind hole has all been opened to first circuit board and second circuit board upper end front portion and upper end rear portion, fixing device is installed jointly to first circuit board and second circuit board left end and right-hand member, heat abstractor is all installed jointly in first circuit board and second circuit board left end middle part and right-hand member middle part, heat-transfer device is installed to second circuit board lower extreme, three through-hole has all been opened to first circuit board upper end middle part and upper end right part.

Preferably, heat abstractor includes mount and mounting panel, mount upper end mid-mounting has miniature fan, the draw-in groove has all been opened at mount right-hand member front portion and right-hand member rear portion, the mounting panel is provided with two, two the screw is all installed No. one in mounting panel upper end middle part, two L type cardboard, two are all installed to mounting panel upper end left part No. two the screw is all installed No. two to L type cardboard right-hand member, two the mounting panel passes through L type cardboard and installs respectively at mount right-hand member front portion and right-hand member rear portion, the mount is installed at first circuit board and second circuit board right-hand member middle part.

Preferably, fixing device includes the fixed block, the fixed block is provided with four groups, and every group fixed block sets up to two, and four group fixed block upper ends all have opened the screw hole, and fixed screw is all installed to four group fixed block upper ends, and four groups fixed block are installed respectively at first circuit board and second circuit board left end front portion, left end rear portion, right-hand member front portion and right-hand member rear portion.

Preferably, the heat-conducting device includes the glue layer, the heat-conducting layer is installed to glue layer lower extreme, the heat conduction graphite flake is installed to the heat-conducting layer lower extreme, the glue layer is installed at second circuit board lower extreme.

Preferably, the L-shaped clamping plate and the clamping groove correspond to each other in position from left to right.

Preferably, the positions of each group of fixed blocks correspond up and down.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the blind hole conduction multilayer circuit board, the circuit board is blown by the micro fan on the heat dissipation device, so that the heat dissipation of the circuit board can be realized, dust accumulation on the surface of the circuit board can be reduced, the heat conduction graphite flake on the heat conduction device has unique crystal grain orientation and conducts heat uniformly along two directions, the ultrahigh heat conduction performance within the range of 150 plus 1500W/m.K is realized in the plane, the heat dissipation performance of the circuit board is improved through double heat dissipation of the heat dissipation device and the heat conduction device, the L-shaped clamping plate is clamped on the fixing frame by the second screw, when the circuit board needs to be disassembled or assembled, the second screw is rotated, and the circuit board and the fixing frame can be taken out together.

2. According to the blind hole conduction multilayer circuit board, the fixing screws on the fixing device are connected with the fixing blocks on the first circuit board and the second circuit board through the screw holes, so that the first circuit board and the second circuit board are fixed, and glue is introduced through the through holes, so that the first circuit board and the second circuit board are installed and fixed, the workload of operators is reduced, and the installation quality of the multilayer circuit board is improved.

Drawings

FIG. 1 is a schematic view of an overall structure of a blind via multi-layer circuit board according to the present invention;

FIG. 2 is a schematic view of an overall structure of a heat dissipation device with a multi-layer circuit board connected by blind holes according to the present invention;

FIG. 3 is a schematic view of the overall structure of a fixing device for a blind via multi-layer circuit board according to the present invention;

fig. 4 is a schematic view of an overall structure of a heat conduction device for a blind via multi-layer circuit board according to the present invention.

In the figure: 1. a first circuit board; 2. a heat sink; 3. a fixing device; 4. a heat conducting device; 5. a second circuit board; 6. a circuit layer; 7. blind holes; 8. a through hole; 20. a fixed mount; 21. mounting a plate; 22. a micro fan; 23. a card slot; 24. an L-shaped clamping plate; 25. a first screw; 26. a second screw; 30. a fixed block; 31. a screw hole; 32. fixing screws; 40. a glue layer; 41. a heat conductive layer; 42. a thermally conductive graphite sheet.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a blind hole switches on multilayer circuit board, including first circuit board 1 and second circuit board 5, circuit layer 6 is all installed to first circuit board 1 and second circuit board 5 upper end, first circuit board 1 and second circuit board 5 upper end front portion and upper end rear portion have all been opened a plurality of blind hole 7, fixing device 3 is installed jointly to

first circuit board

1 and 5 left ends of second circuit board and right-hand member, heat abstractor 2 is all installed jointly in

first circuit board

1 and 5 left end middle parts of second circuit board and right-hand member middle part, heat conduction device 4 is installed to 5 lower extremes of second circuit board, three through-hole 8 has all been opened to 1 upper end middle part of first circuit board and upper end right part.

The heat dissipation device 2 comprises a fixed frame 20 and two mounting plates 21, wherein a micro fan 22 is arranged in the middle of the upper end of the fixed frame 20, clamping grooves 23 are formed in the front part of the right end and the rear part of the right end of the fixed frame 20, two mounting plates 21 are arranged, a first screw 25 is arranged in the middle of the upper end of each mounting plate 21, an L-shaped clamping plate 24 is arranged in the left part of the upper end of each mounting plate 21, a second screw 26 is arranged at the right end of each L-shaped clamping plate 24, the two mounting plates 21 are respectively arranged in the front part of the right end and the rear part of the right end of the fixed frame 20 through the L-shaped clamping plates 24, the fixed frame 20 is arranged in the middle of the right end of the first circuit board 1 and the right end of the second circuit board 5, the circuit boards are blown by the micro fan 22, not only can be dissipated heat of the circuit boards, but also can reduce dust accumulated on the surfaces of the circuit boards, meanwhile, the L-shaped clamping plates 24 are clamped on the fixed frame 20 by the second screws 26, when the circuit boards need to be disassembled or assembled, the second screw 26 is screwed, and the circuit board and the fixing frame 20 are taken out together, so that the device is simple in structure and high in dismounting and mounting efficiency; the fixing device 3 comprises four fixing blocks 30, the four fixing blocks 30 are arranged, each fixing block 30 is divided into two groups, screw holes 31 are formed in the upper ends of the four fixing blocks 30, fixing screws 32 are arranged at the upper ends of the four fixing blocks 30, the four fixing blocks 30 are respectively arranged at the front parts of the left ends, the rear parts of the left ends, the front parts of the right ends and the rear parts of the right ends of the first circuit board 1 and the second circuit board 5, and are connected with the fixing blocks 30 on the first circuit board 1 and the second circuit board 5 through the fixing screws 32 and the screw holes 31, so that the first circuit board 1 and the second circuit board 5 are fixed, and glue is guided in through the through holes 8, so that the circuit boards are fixedly installed, the workload of operators is reduced, and the installation quality of the multilayer circuit boards is improved; the heat conduction device 4 comprises a glue layer 40, a heat conduction layer 41 is arranged at the lower end of the glue layer 40, a heat conduction graphite flake 42 is arranged at the lower end of the heat conduction layer 41, the glue layer 40 is arranged at the lower end of the second circuit board 5, the heat conduction graphite flake 42 has unique crystal grain orientation, heat is uniformly conducted along two directions, and ultrahigh heat conduction performance is achieved in the plane, so that the heat dissipation performance of the circuit board is improved; the L-shaped clamping plate 24 and the clamping groove 23 are mutually corresponding left and right; each set of fixed blocks 30 corresponds up and down.

It should be noted that the utility model is a blind hole conduction multilayer circuit board, connect with the fixed block 30 on the first circuit board 1 and the second circuit board 5 by the screw hole 31 through the fixed screw 32 at first, thus fix the first circuit board 1 and the second circuit board 5, then introduce the glue through the through hole 8, thus finish the installation and fixation to the circuit board, not only lighten the operating personnel's work load, have improved the installation quality of multilayer circuit board, when the circuit board is installed and worked, blow to the circuit board through the miniature fan 22 on the heat dissipating double-fuselage 2, not only can dispel the heat to the circuit board, and can also reduce the dust and pile up on the surface of circuit board, at the same time, through L-shaped cardboard 24 is clamped on the fixed mount 20 by the second screw 26, when the circuit board needs to be dismantled or installed, rotate the second screw 26, take out the circuit board and fixed mount 20 together, the device is simple in structure, high in dismounting and mounting efficiency, and when the micro fan 22 blows air, the heat conducting graphite sheet 42 on the heat conducting device 4 has unique crystal grain orientation, conducts heat uniformly along two directions, and has ultrahigh heat conducting performance in the plane, so that the heat radiating performance of the circuit board is improved.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a blind hole switches on multilayer circuit board, includes first circuit board (1) and second circuit board (5), its characterized in that: circuit layer (6) are all installed to first circuit board (1) and second circuit board (5) upper end, a plurality of blind hole (7) have all been opened to first circuit board (1) and second circuit board (5) upper end front portion and upper end rear portion, fixing device (3) are installed jointly to first circuit board (1) and second circuit board (5) left end and right-hand member, heat abstractor (2) are all installed jointly in first circuit board (1) and second circuit board (5) left end middle part and right-hand member middle part, heat conduction device (4) are installed to second circuit board (5) lower extreme, three through-hole (8) have all been opened to first circuit board (1) upper end middle part and upper end right part.

2. The blind via multilayer wiring board of claim 1, wherein: heat abstractor (2) are including mount (20) and mounting panel (21), mount (20) upper end mid-mounting has micro-fan (22), draw-in groove (23) have all been opened to mount (20) right-hand member front portion and right-hand member rear portion, mounting panel (21) are provided with two, two screw (25) are all installed at mounting panel (21) upper end middle part, two L type cardboard (24) are all installed to mounting panel (21) upper end left part, two screw (26) No. two are all installed to L type cardboard (24) right-hand member, two mounting panel (21) are installed respectively at mount (20) right-hand member front portion and right-hand member rear portion through L type cardboard (24), mount (20) are installed at first circuit board (1) and second circuit board (5) right-hand member middle part.

3. The blind via multilayer wiring board of claim 1, wherein: fixing device (3) are including fixed block (30), fixed block (30) are provided with four groups, and every group fixed block (30) sets up to two, and screw hole (31) have all been opened to four groups fixed block (30) upper ends, and fixed screw (32) are all installed to four groups fixed block (30) upper ends, and four groups fixed block (30) are installed respectively at first circuit board (1) and second circuit board (5) left end front portion, left end rear portion, right-hand member front portion and right-hand member rear portion.

4. The blind via multilayer wiring board of claim 1, wherein: heat-conducting device (4) are including glue layer (40), heat-conducting layer (41) are installed to glue layer (40) lower extreme, heat-conducting graphite piece (42) are installed to heat-conducting layer (41) lower extreme, glue layer (40) are installed at second circuit board (5) lower extreme.

5. The blind via multilayer wiring board of claim 2, wherein: the L-shaped clamping plate (24) and the clamping groove (23) are mutually corresponding left and right.

6. The blind via multilayer wiring board of claim 3, wherein: and the positions of each group of fixed blocks (30) are up and down corresponding.