CN218735140U - Circuit board with heat radiation structure - Google Patents
Circuit board with heat radiation structure Download PDFInfo
- Publication number
- CN218735140U CN218735140U CN202222318815.7U CN202222318815U CN218735140U CN 218735140 U CN218735140 U CN 218735140U CN 202222318815 U CN202222318815 U CN 202222318815U CN 218735140 U CN218735140 U CN 218735140U
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- circuit board
- refrigeration piece
- semiconductor refrigeration
- air exhaust
- heat
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Abstract
The utility model discloses a circuit board with heat radiation structure, which comprises a circuit board, the top of circuit board is equipped with the passageway of airing exhaust, the inside of passageway of airing exhaust is equipped with the miniature exhaust fan of being convenient for to air exhaust, the top of circuit board and the both sides that are located the passageway of airing exhaust are equipped with the insulating heat conduction glue A and the insulating heat conduction glue B that play the heat conduction effect respectively, the inside both ends of circuit board are inlayed respectively and are equipped with semiconductor refrigeration piece A and semiconductor refrigeration piece B. This novel multiple radiating mode of circuit board, and then the circuit board can have good heat dispersion, and life is longer, and then can produce better economic benefits, has reduced the cost of change, is fit for extensively using widely.
Description
Technical Field
The utility model relates to a circuit board technical field, in particular to circuit board with heat radiation structure.
Background
The circuit board can be called as a printed circuit board, an FPC circuit board and a flexible circuit board, the circuit board enables the circuit to be miniaturized and visualized, plays an important role in batch production of fixed circuits and optimization of electrical appliance layout, is a flexible printed circuit board which is made of polyimide or polyester film serving as a base material and has high reliability and excellent flexibility, has the characteristics of high wiring density, light weight, thin thickness and good bending property, and is widely applied to industries such as mobile phones, touch screen equipment, notebook computers, digital cameras and the like.
The utility model discloses a connect more firm individual layer circuit board, patent number CN 206790776U's utility model discloses a connect more firm individual layer circuit board, including the circuit board, the left and right sides of circuit board all is provided with the circuit board draw-in groove, the both sides that are close to the circuit board draw-in groove on the circuit board all are provided with the screwed pipe mounting hole, the inside of screwed pipe mounting hole is provided with the screwed pipe, the rear surface that is close to the circuit board on the screwed pipe is provided with the protection packing ring, the one end of the front surface of circuit board is provided with the chip mounting groove, the both sides that the front surface of circuit board is close to the chip mounting groove all are provided with chip pin mounting hole, both ends have all seted up the slipmat mounting hole about the front surface of circuit board; the screwed pipe designed in the fixing hole of the circuit board is convenient for the screw to prevent the circuit board from being damaged in the fixing process, the problem that the circuit board is easy to damage in the fixing and mounting process is solved, and the end of the screwed pipe, which is close to the electronic element, is provided with a protection ring to facilitate the protection of the circuit board.
The existing circuit board has the following defects: the radiating structure is single, so that the radiating effect is not good, the service life of the circuit board is short, and the replacement cost is increased. Therefore, a circuit board with a heat dissipation structure is provided.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a circuit board with a heat dissipation structure, which can effectively solve the problems of the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a circuit board with heat radiation structure, includes the circuit board, the top of circuit board is equipped with the passageway of airing exhaust, the inside of passageway of airing exhaust is equipped with the miniature exhaust fan of being convenient for to air exhaust, the top of circuit board and the both sides that are located the passageway of airing exhaust are equipped with the insulating heat conduction glue A and the insulating heat conduction glue B that play the heat conduction effect respectively, the inside both ends of circuit board are inlayed respectively and are equipped with semiconductor refrigeration piece A and semiconductor refrigeration piece B.
Furthermore, a wire mesh is arranged at the top of the exhaust channel, fastening screws are arranged on the outer side of the wire mesh through arranging first mounting holes, and second mounting holes corresponding to the first mounting holes are arranged on the outer side of the exhaust channel.
Further, the mounting groove has all been seted up at the inside both ends of circuit board, mounting groove and circuit board intercommunication, and the mounting groove is convenient for install semiconductor refrigeration piece A and semiconductor refrigeration piece B.
Furthermore, the heat absorption ends of the semiconductor refrigeration piece A and the semiconductor refrigeration piece B are both located inside the circuit board, and the semiconductor refrigeration piece A and the semiconductor refrigeration piece B can conduct heat inside the circuit board out of the circuit board.
Furthermore, the heat dissipation ends of the semiconductor refrigeration piece A and the semiconductor refrigeration piece B are both positioned on the outer side of the circuit board.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model relates to a circuit board with heat radiation structure, through air exhaust passageway and miniature exhaust fan, the inside miniature exhaust fan of air exhaust passageway can absorb and discharge the outside to the circuit board with the steam that the circuit board operation produced, reaches radiating purpose.
2. The utility model relates to a circuit board with heat radiation structure, through insulating heat-conducting glue A and insulating heat-conducting glue B, insulating heat-conducting glue has good heat conduction, heat dissipation function, can the heat conduction of homoenergetic to the outside of circuit board, the heat dispersion of effectual reinforcing circuit board.
3. The utility model relates to a circuit board with heat radiation structure through semiconductor refrigeration piece A and semiconductor refrigeration piece B, and semiconductor refrigeration piece A and semiconductor refrigeration piece B homoenergetic can absorb the inside heat of circuit board to with the outside of heat conduction to circuit board, realize radiating purpose.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a circuit board with a heat dissipation structure according to the present invention.
Fig. 2 is the utility model relates to a semiconductor refrigeration piece A, semiconductor refrigeration piece B and mounting groove schematic structure of circuit board with heat radiation structure.
Fig. 3 is a schematic view of a miniature exhaust fan with a circuit board having a heat dissipation structure according to the present invention.
In the figure: 1. a circuit board; 2. an air exhaust channel; 3. a wire mesh; 4. insulating heat-conducting glue A; 5. insulating heat-conducting glue B; 6. a semiconductor refrigerating sheet A; 7. a semiconductor refrigerating plate B; 8. mounting grooves; 9. a first mounting hole; 10. fastening screws; 11. a second mounting hole; 12. a micro exhaust fan; 13. an air exhaust channel.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-3, a circuit board with a heat dissipation structure includes a circuit board 1, an air exhaust channel 2 is disposed on the top of the circuit board 1, a micro exhaust fan 12 convenient for exhausting air is disposed inside the air exhaust channel 2, an insulating heat conducting adhesive A4 and an insulating heat conducting adhesive B5 which play a role in heat conduction are disposed on the top of the circuit board 1 and on two sides of the air exhaust channel 2, and a semiconductor cooling fin A6 and a semiconductor cooling fin B7 are respectively embedded in two ends of the circuit board 1.
The top of the exhaust channel 2 is provided with a wire mesh 3, the outer side of the wire mesh 3 is provided with a fastening screw 10 by forming a first mounting hole 9, and the outer side of the exhaust channel 2 is provided with a second mounting hole 11 corresponding to the first mounting hole 9.
In this embodiment, as shown in fig. 3, the wire mesh 3 can block the foreign object, so as to prevent the foreign object from colliding with the micro exhaust fan 12.
Wherein, mounting grooves 8 are respectively arranged at the two ends of the interior of the circuit board 1.
In this embodiment, as shown in fig. 2, the mounting groove 8 is communicated with the circuit board 1, and the mounting groove 8 is convenient for mounting the semiconductor chilling plate A6 and the semiconductor chilling plate B7.
The heat absorption ends of the semiconductor refrigeration piece A6 and the semiconductor refrigeration piece B7 are both located in the circuit board 1.
The heat dissipation ends of the semiconductor refrigeration piece A6 and the semiconductor refrigeration piece B7 are located on the outer side of the circuit board 1.
In this embodiment, as shown in fig. 2, the semiconductor chilling plates A6 and B7 can both conduct heat inside the circuit board 1 to the outside of the circuit board 1.
It should be noted that, the utility model relates to a circuit board with heat radiation structure, in operation, air exhaust passageway 2 and circuit board 1 intercommunication, air exhaust passageway 2 inside miniature exhaust fan 12 can produce suction, the steam that produces when running with circuit board 1 absorbs and discharges to circuit board 1's outside, reach radiating purpose, furthermore, insulating heat-conducting glue is one type of single-component room temperature vulcanization's silicone adhesive, and is convenient to use, high in bonding strength, be the elastomer after the solidification, shock resistance, characteristics such as vibrations, the condensate still has good heat conduction simultaneously, the heat dissipation function, can effectual reinforcing circuit board 1's heat dispersion, furthermore, semiconductor refrigeration piece A6 and semiconductor refrigeration piece B7 all can absorb circuit board 1 inside heat, and conduct heat to circuit board 1's outside, realize radiating purpose, through mutually supporting of above-mentioned parts, can provide multiple radiating mode for circuit board 1, can produce higher economic benefits.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. A circuit board with a heat dissipation structure, includes circuit board (1), its characterized in that: the top of circuit board (1) is equipped with air exhaust channel (2), the inside of air exhaust channel (2) is equipped with miniature exhaust fan (12) of being convenient for to air exhaust, the top of circuit board (1) and the both sides that are located air exhaust channel (2) are equipped with insulating heat conduction glue A (4) and insulating heat conduction glue B (5) that play the heat conduction effect respectively, the inside both ends of circuit board (1) are inlayed respectively and are equipped with semiconductor refrigeration piece A (6) and semiconductor refrigeration piece B (7).
2. The circuit board with a heat dissipation structure of claim 1, wherein: the top of the air exhaust channel (2) is provided with a wire mesh (3), the outer side of the wire mesh (3) is provided with fastening screws (10) by arranging first mounting holes (9), and the outer side of the air exhaust channel (2) is provided with second mounting holes (11) corresponding to the first mounting holes (9).
3. The circuit board with a heat dissipation structure of claim 1, wherein: mounting grooves (8) are formed in two ends of the interior of the circuit board (1).
4. The circuit board with a heat dissipation structure of claim 1, wherein: and the heat absorption ends of the semiconductor refrigeration piece A (6) and the semiconductor refrigeration piece B (7) are positioned in the circuit board (1).
5. The circuit board with a heat dissipation structure of claim 1, wherein: the heat dissipation ends of the semiconductor refrigeration piece A (6) and the semiconductor refrigeration piece B (7) are located on the outer side of the circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222318815.7U CN218735140U (en) | 2022-09-01 | 2022-09-01 | Circuit board with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222318815.7U CN218735140U (en) | 2022-09-01 | 2022-09-01 | Circuit board with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218735140U true CN218735140U (en) | 2023-03-24 |
Family
ID=85631918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222318815.7U Active CN218735140U (en) | 2022-09-01 | 2022-09-01 | Circuit board with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218735140U (en) |
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2022
- 2022-09-01 CN CN202222318815.7U patent/CN218735140U/en active Active
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