CN213280217U - Inlay copper circuit board with heat dissipation function - Google Patents

Inlay copper circuit board with heat dissipation function Download PDF

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Publication number
CN213280217U
CN213280217U CN202022549715.6U CN202022549715U CN213280217U CN 213280217 U CN213280217 U CN 213280217U CN 202022549715 U CN202022549715 U CN 202022549715U CN 213280217 U CN213280217 U CN 213280217U
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China
Prior art keywords
heat dissipation
circuit board
upper cover
base
copper
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CN202022549715.6U
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Chinese (zh)
Inventor
李争军
刘立冬
熊雪刚
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Huizhou Yingfan Industrial Co ltd
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Huizhou Yingfan Industrial Co ltd
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Priority to CN202022549715.6U priority Critical patent/CN213280217U/en
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Abstract

The utility model discloses a copper-embedded circuit board with heat dissipation function, which belongs to the technical field of electronic products and comprises a base, wherein an upper cover is arranged at the top of the base, a base plate is arranged inside the upper cover, a fixed plate is arranged below the base plate, heat dissipation holes are arranged inside the fixed plate, a heat insulation shell is arranged inside the base, a heat dissipation fan is arranged at the center inside the heat insulation shell, and the bottom of the heat dissipation fan is connected with an air suction pipe; compared with the prior art, through establishing the fan in the base is inside, can improve and carry out the omnidirectional heat dissipation to the circuit board in the upper cover, make the heat degree in it discharge, improve the radiating efficiency in it, through setting up the radiator-grid, can improve the certain radiating effect to the circuit board in the upper cover, when can making the circuit board high temperature through the sensor, come to transmit the signal to the warning light through it, warn, through thermal-insulated shell, can effectually carry out thermal-insulated effect to the base.

Description

Inlay copper circuit board with heat dissipation function
Technical Field
The utility model relates to an electronic product technical field specifically is a inlay copper circuit board with heat dissipation function.
Background
The circuit board can be called as a printed circuit board or a printed circuit board, and a PCB and an FPC circuit board (the FPC circuit board is also called as a flexible circuit board which is a flexible printed circuit board made of polyimide or polyester film as a base material and has the characteristics of high reliability and excellent flexibility, high wiring density, light weight, thin thickness and good bending property) and a rigid-flexible printed circuit board, the birth and development of the FPC and the PCB promote a new product of the rigid-flexible printed circuit board. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.
At present, generally, a circuit board is cooled by arranging a plurality of holes, so that the circuit board is cooled at a low speed, the circuit board in the circuit board is easily softened and short-circuited, the cooling efficiency is low, and economic loss is easily caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an inlay copper circuit board with heat dissipation function, through at the inside fan that establishes of base, can improve the circuit board to in the upper cover and carry out the omnidirectional heat dissipation, make the heat in it discharge, improve the radiating efficiency in it, through setting up the radiator-grid, can improve the certain radiating effect to the circuit board in the upper cover, through the sensor, when can making the circuit board high temperature, come to transmit signal to the warning light through it, warn, through thermal-insulated shell, can effectually carry out thermal-insulated effect to the base.
To solve the problems set forth in the background art described above.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an inlay copper circuit board with heat dissipation function, includes the base, the top installation upper cover of base, the inside of upper cover is equipped with the base plate, the below of base plate is equipped with the fixed plate, the inside of fixed plate is equipped with the louvre, the inside of base is equipped with thermal-insulated shell, the inside center installation heat dissipation fan of thermal-insulated shell, the aspiration channel is connected to the bottom of heat dissipation fan, the radiator-grid is installed at the top both ends of upper cover, the top installation circuit component of base plate, first screw hole is seted up at the inside both ends of base plate.
Preferably, the two ends of the top of the base are fixedly connected with the mounting seat, and the top of the mounting seat is provided with the rubber gasket.
Preferably, a second threaded hole is formed in the mounting seat, and an internal insertion screw of the second threaded hole is fixed to the mounting seat through the first threaded hole.
Preferably, a temperature sensor is installed at the right end of the inside of the upper cover, alarm lamps are fixedly connected to two ends of the top of the upper cover, and the temperature sensor is electrically connected with the alarm lamps through a matching circuit of the MCU unit.
Preferably, the two ends of the bottom of the upper cover are fixedly connected with clamping blocks, the clamping blocks are clamped with clamping grooves matched with the clamping blocks, and the two ends of the top of the base are provided with the clamping grooves.
Preferably, the center of the top surface of the upper cover is provided with a viewing window.
Compared with the prior art, the beneficial effects of the utility model are that:
compared with the prior art, through establishing the fan inside the base, can improve and carry out the omnidirectional heat dissipation to the circuit board in the upper cover, make the heat degree in it discharge, improve the radiating efficiency in it, through setting up the radiator-grid, can improve the certain radiating effect to the circuit board in the upper cover, through the sensor, when can making the circuit board high temperature, come to transmit the signal to the warning light through it, warn, through thermal-insulated shell, can effectually carry out thermal-insulated effect to the base.
Drawings
FIG. 1 is a schematic view of the copper-embedded circuit board of the present invention;
FIG. 2 is a schematic view of the structure of the upper cover of the present invention;
fig. 3 is an enlarged schematic view of a region a in fig. 1.
In the figure: 1. a base; 2. an upper cover; 3. an alarm light; 4. a substrate; 5. a circuit element; 6. a screw; 7. a second threaded hole; 8. a temperature sensor; 9. a rubber gasket; 10. a mounting seat; 11. a thermally insulating shell; 12. a fixing plate; 13. heat dissipation holes; 14. a heat dissipation fan; 15. an air suction pipe; 16. an observation window; 17. a heat-dissipating web; 18. a clamping block; 19. a card slot; 20. a first threaded hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a technical solution: a copper-embedded circuit board with a heat dissipation function comprises a base 1, wherein an upper cover 2 is installed at the top of the base 1, the upper cover 2 mainly enables a circuit board to be fixed in the upper cover 2 and also plays a role of protecting the circuit board inside, a base plate 4 is arranged inside the upper cover 2, the base plate 4 mainly enables a circuit element 5 on the base plate 4 to be placed, the circuit element 5 generates electricity and transmits signals, a fixing plate 12 is arranged below the base plate 4, the fixing plate 12 mainly enables a heat dissipation fan 14 to emit incoming wind and conduct the heat dissipation function on the circuit board inside the upper cover 2 through a heat dissipation hole 13 in the fixing plate, the heat dissipation efficiency is improved, and the speed of heat dissipation is higher than that of natural heat dissipation;
the fixing plate 12 is internally provided with heat dissipating holes 13, the heat dissipating holes 13 expand the range of the wind blown by the heat dissipating fan 14 to dissipate heat comprehensively from the substrate 4 (circuit board) inside the upper cover 2, thereby easily improving the heat dissipating efficiency, and preventing the substrate 4 from being damaged and causing economic loss due to high temperature, the base 1 is internally provided with the heat insulating housing 11, the heat insulating housing 11 mainly plays a role of heat insulation to prevent over-high temperature and further diffusion to damage the base 1, the heat dissipating fan 14 is installed at the center inside the heat insulating housing 11, the heat dissipating fan 14 dissipates heat from the substrate 4 inside the heat dissipating fan 14 by sucking the outside air by starting the heat dissipating fan 14, the bottom of the heat dissipating fan 14 is connected with an air suction pipe 15, the air suction pipe 15 mainly absorbs the outside air, heat dissipating nets 17 are installed at two ends of the top of the upper cover 2, and the heat dissipating nets 17 mainly dissipate the wind blown by the heat dissipating fan 14 inside the, wind is discharged through the heat dissipation net 17 in the upper cover 2, the circuit element 5 is mounted at the top of the substrate 4, the circuit element 5 mainly enables the substrate 4 to work, high surface temperature is easy to generate due to long-time work, the substrate 4 is damaged, the first threaded holes 20 are formed in two ends of the inner part of the substrate 4, and the first threaded holes 20 mainly enable the screws 6 to fix the substrate 4 in the first threaded holes 20;
the mounting seats 10 are fixedly connected to two ends of the top of the base 1, the mounting seats 10 mainly facilitate the fixed mounting of the substrate 4 and avoid direct contact with the base 1, the rubber gaskets 9 are mounted on the tops of the mounting seats 10, and the rubber gaskets 9 mainly play a role in protecting the substrate 4 when the substrate 4 is fixed on the mounting seats 10, so that the substrate 4 is prevented from being easily clamped;
a second threaded hole 7 is formed in the mounting seat 10, an inserting screw 6 in the second threaded hole 7 is fixed on the mounting seat through a first threaded hole 20, and the base plate 4 and the mounting seat 10 are fixedly connected through the screw 6 in a threaded manner, so that the base plate 4 is prevented from shifting easily during operation, short circuit and other dangerous phenomena are prevented;
the temperature sensor 8 is mounted at the right end inside the upper cover 2, the temperature sensor 8 is PT100 in type, the temperature generated when the substrate 4 works is mainly detected, the substrate 4 is prevented from being damaged due to overhigh temperature, economic loss is caused, the alarm lamps 3 are fixedly connected to the two ends of the top of the upper cover 2, the alarm lamps 3 play a role in warning, the temperature sensor 8 is electrically connected with the alarm lamps 3 through the MCU, and signals are transmitted through the temperature sensor 8, so that the alarm lamps 3 warn through warning;
the bottom both ends fixed connection fixture block 18 of upper cover 2, fixture block 18 mainly makes on the upper cover 2 joint unable adjustment base 1, can conveniently maintain base plate 4 in it, fixture block 18 joint with it assorted draw-in groove 19, draw-in groove 19 mainly makes fixture block 18 fix to it in, draw-in groove 19 is seted up at base 1's top both ends, the top surface center of upper cover 2 is equipped with observation window 16, observation window 16 mainly is convenient for observe the work attitude of base plate 4.
The working principle is as follows: when the circuit component is used, when the circuit component 5 on the substrate 4 works for a long time, the phenomenon of overhigh temperature is generated, the air suction pipe 15 absorbs external air suction by opening the heat dissipation fan 14, the air flows into the upper cover 2 through the heat dissipation holes 13 in the fixing plate 12 to dissipate heat of the substrate 4, the temperature of the substrate 4 is reduced, the damage is prevented, the heat dissipation efficiency of the substrate 4 is improved, the temperature of a circuit board can be monitored through the temperature sensor 8, the overhigh temperature is prevented, and the warning is performed through the warning lamp 3.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides an inlay copper circuit board with heat dissipation function, includes base (1), its characterized in that: the utility model discloses a heat dissipation device for the automobile seat, including base plate (4), upper cover (2) is installed at the top of base (1), the inside of upper cover (2) is equipped with base plate (4), the below of base plate (4) is equipped with fixed plate (12), the inside of fixed plate (12) is equipped with louvre (13), the inside of base (1) is equipped with thermal-insulated shell (11), the inside center installation heat dissipation fan (14) of thermal-insulated shell (11), aspiration channel (15) are connected to the bottom of heat dissipation fan (14), radiator-grid (17) are installed at the top both ends of upper cover (2), circuit component (5) are installed at the top of base plate (4), first screw hole (20) are seted up at the inside both ends of base plate (.
2. The copper-embedded circuit board with the heat dissipation function as recited in claim 1, wherein: the rubber gasket is characterized in that mounting seats (10) are fixedly connected to two ends of the top of the base (1), and rubber gaskets (9) are mounted on the top of the mounting seats (10).
3. The copper-embedded circuit board with the heat dissipation function as recited in claim 2, wherein: and a second threaded hole (7) is formed in the mounting seat (10), and a screw (6) inserted into the second threaded hole (7) is fixed to the mounting seat through a first threaded hole (20).
4. The copper-embedded circuit board with the heat dissipation function as recited in claim 1, wherein: temperature sensor (8) are installed to the inside right-hand member of upper cover (2), top both ends fixed connection warning light (3) of upper cover (2), temperature sensor (8) pass through MCU unit cooperation circuit and warning light (3) electric connection.
5. The copper-embedded circuit board with the heat dissipation function as recited in claim 1, wherein: the bottom two ends of the upper cover (2) are fixedly connected with clamping blocks (18), the clamping blocks (18) are clamped with clamping grooves (19) matched with the clamping blocks, and the clamping grooves (19) are formed in the top two ends of the base (1).
6. The copper-embedded circuit board with the heat dissipation function as recited in claim 1, wherein: an observation window (16) is arranged in the center of the top of the upper cover (2).
CN202022549715.6U 2020-11-06 2020-11-06 Inlay copper circuit board with heat dissipation function Active CN213280217U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022549715.6U CN213280217U (en) 2020-11-06 2020-11-06 Inlay copper circuit board with heat dissipation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022549715.6U CN213280217U (en) 2020-11-06 2020-11-06 Inlay copper circuit board with heat dissipation function

Publications (1)

Publication Number Publication Date
CN213280217U true CN213280217U (en) 2021-05-25

Family

ID=75953607

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022549715.6U Active CN213280217U (en) 2020-11-06 2020-11-06 Inlay copper circuit board with heat dissipation function

Country Status (1)

Country Link
CN (1) CN213280217U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114158180A (en) * 2021-10-08 2022-03-08 中国安全生产科学研究院 Driver with heat dissipation function and infrared detector applying same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114158180A (en) * 2021-10-08 2022-03-08 中国安全生产科学研究院 Driver with heat dissipation function and infrared detector applying same
CN114158180B (en) * 2021-10-08 2023-09-05 中国安全生产科学研究院 Driver with heat dissipation function and infrared detector applying driver

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