CN214046119U - Novel multilayer heat dissipation type circuit board - Google Patents
Novel multilayer heat dissipation type circuit board Download PDFInfo
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- CN214046119U CN214046119U CN202022984645.7U CN202022984645U CN214046119U CN 214046119 U CN214046119 U CN 214046119U CN 202022984645 U CN202022984645 U CN 202022984645U CN 214046119 U CN214046119 U CN 214046119U
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- circuit board
- heat dissipation
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- fixing frame
- cooling
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Abstract
The utility model discloses a belong to circuit board technical field, specifically be a novel multilayer heat dissipation type circuit board, including circuit board device and heat abstractor, heat abstractor includes the bottom plate, bottom plate top both ends fixed mounting mount one, the left side a mount right side outer wall fixed connection attach fitting, the attach fitting is equipped with three groups from top to bottom, the bottom the attach fitting top outer wall fixed connection support, the support bottom with bottom plate top fixed connection, middle part attach fitting top fixed mounting temperature sensor, a mount bottom inner wall fixed mounting radiator fan one, radiator fan one top is equipped with radiator fan two, the beneficial effects of the utility model are that: the circuit board drives air to flow rapidly through the exhaust fan, so that hot air is discharged in time, air is blown from left to right through the first cooling fan and the second cooling fan to perform air cooling, and the cooling speed is improved.
Description
Technical Field
The utility model relates to a heat dissipation type circuit board technical field, concretely relates to novel multilayer heat dissipation type circuit board.
Background
The circuit board is divided into a single panel, a double-sided board and a multilayer circuit board according to the number of layers, and the three large classified multilayer boards are printed boards which are formed by laminating more than three conductive pattern layers and insulating materials between the conductive pattern layers at intervals, and the conductive patterns between the conductive pattern layers are interconnected according to requirements.
The prior art has the following defects: the existing multilayer heating panel can generate larger heat when continuously operating due to the support of continuously providing energy by using electric power, often causes serious heating of equipment due to unreasonable arrangement of a heat dissipation structure, is inconvenient for normal use, and also can seriously affect the service life of a circuit board due to untimely heat dissipation, thereby increasing the possibility of early damage.
Therefore, it is necessary to invent a novel multi-layer heat dissipation circuit board.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model provides a novel multilayer heat dissipation type circuit board through setting up heat abstractor, utilizes temperature sensor to carry out temperature detection to the circuit board region in real time, when the temperature surpassed preset safe temperature, then takes out the regional hot-air of circuit board through the drive air discharge fan, starts radiator fan one simultaneously and carries out the forced air cooling with radiator fan two, transmits the outside through the fin with the temperature to the radiating problem of multilayer circuit board.
In order to achieve the above object, the present invention provides the following technical solutions: a novel multilayer heat dissipation type circuit board comprises a circuit board device and a heat dissipation device, wherein the heat dissipation device comprises a bottom plate, a first fixing frame is fixedly installed at two ends of the top of the bottom plate, a first right side outer wall of the first fixing frame is fixedly connected with an installation joint at the left side, three groups are arranged above and below the installation joint, a bottom part is fixedly connected with a support at the top of the installation joint, the bottom part of the support is fixedly connected with the top of the bottom plate, a temperature sensor is fixedly installed at the top of the installation joint, a first heat dissipation fan is fixedly installed on the inner wall of the bottom of the first fixing frame, a second heat dissipation fan is arranged at the top of the first heat dissipation fan, a dust screen is arranged on the second heat dissipation fan and the right side of the first heat dissipation fan, the dust screen is fixedly installed at the right side end of the first fixing frame, an exhaust fan is fixedly installed on the inner wall of the right side of the first fixing frame, two groups are arranged above and below the exhaust fan, the dust screen is arranged on the left side of the exhaust fan, the right side dust screen fixed mounting is at a left side inner wall of mount.
Preferably, the circuit board device comprises a first circuit board, two ends of the first circuit board are inserted into the end part of the mounting connector at the bottom, the bottom of the first circuit board is fixedly connected with a radiating fin, and the area of the radiating fin is consistent with that of the bottom of the first circuit board.
Preferably, the bottom of the radiating fin is fixedly connected with fins which are uniformly distributed at the bottom of the radiating fin.
Preferably, a second circuit board is arranged at the top of the first circuit board, two ends of the second circuit board are fixedly inserted in the middle of the end portion of the mounting joint, a cooling box is arranged on the inner wall of the second circuit board, a filling hole is formed in the top of the second circuit board, and the filling hole extends into the cooling box.
Preferably, the top of the second circuit board is provided with a third circuit board, and two ends of the third circuit board are fixedly inserted into the end part of the mounting joint at the top.
Preferably, the heat dissipation device further comprises a second fixing frame, two ends of the second fixing frame are fixedly installed at two ends of the installation connector, the top of the second fixing frame is located above the third circuit board, a third heat dissipation fan is fixedly installed at the bottom of the second fixing frame, and the third heat dissipation fan is provided with four groups.
The utility model has the advantages that:
1. the radiating fins are arranged at the bottoms of the first circuit boards, the fins are arranged at the bottoms of the radiating fins, and heat is conducted through contact, so that heat of the first circuit boards can be conveniently led out of the first circuit boards in time, and the radiating effect is improved;
2. through setting up radiator fan one, radiator fan two and air discharge fan cooperation and using, make circuit board drive air flow fast through the air discharge fan to in time discharge hot-air, blow the air through radiator fan one, radiator fan two from left to right and carry out the forced air cooling, improved radiating speed.
Drawings
Fig. 1 is a front view provided by the present invention;
fig. 2 is a schematic view of a structure of a circuit board provided by the present invention;
FIG. 3 is a schematic structural view of a second circuit board provided by the present invention;
fig. 4 is a schematic structural view of the heat dissipation device provided by the present invention;
fig. 5 is a schematic structural diagram of embodiment 2 provided by the present invention.
In the figure: the circuit board device 100, the first circuit board 110, the heat sink 120, the heat conducting plate 121, the fins 122, the second circuit board 130, the cooling box 131, the filling hole 132, the third circuit board 140, the heat sink 200, the bottom plate 210, the first fixing frame 220, the mounting connector 221, the bracket 222, the temperature sensor 230, the first heat sink fan 240, the second heat sink fan 250, the dust screen 260, the exhaust fan 270, the second fixing frame 280 and the third heat sink fan 290.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Example 1:
referring to fig. 1-4, the present invention provides a novel multi-layer heat dissipation type circuit board, including a circuit board device 100 and a heat dissipation device 200, specifically, the heat dissipation device 200 includes a bottom board 210, a first fixing frame 220 is fixedly installed at two ends of the top of the bottom board 210, a first left side of the first fixing frame 220 is fixedly connected with a first installation connector 221 on the right outer wall, three sets of upper and lower installation connectors 221 are provided, the bottom of the first installation connector 221 is fixedly connected with a bracket 222 on the top outer wall, the bottom of the bracket 222 is fixedly connected with the top of the bottom board 210, the middle of the first installation connector 221 is fixedly installed with a temperature sensor 230 on the top, a first 220 bottom inner wall of the first fixing frame is fixedly installed with a first cooling fan 240, a second cooling fan 250 is provided on the top of the first cooling fan 240, a dust screen 260 is provided on the right side of the second cooling fan 250 and the first cooling fan 240, the dust screen 260 is fixedly installed at the right end of the first fixing frame 220, an exhaust fan 270 is fixedly mounted on the inner wall of the first fixing frame 220 on the right side, two groups of exhaust fans 270 are arranged above and below, a dust screen 260 is arranged on the left side of each exhaust fan 270, and the dust screen 260 on the right side is fixedly mounted on the inner wall of the left side of the first fixing frame 220;
the circuit board device 100 has the function of mounting circuit components, the heat dissipation device 200 has the function of dissipating heat of the circuit board device 100, the bottom plate 210 is made of a metal copper plate, the metal copper has good heat dissipation performance, the bottom plate 210 has the function of mounting the heat dissipation device 200, the first fixing frame 220 has the function of mounting the first heat dissipation fan 240 and the second heat dissipation fan 250, the mounting connector 221 has the function of inserting and mounting the first circuit board 110, the second circuit board 130 and the third circuit board 140, the temperature sensor 230 is made in JP05-BB5D, the temperature sensor 230 has the function of detecting the temperature of the area of the circuit board device 100, so that the rotating speeds of the first heat dissipation fan 240, the second heat dissipation fan 250 and the exhaust fan 270 are conveniently adjusted according to the temperature condition, the first heat dissipation fan 240 and the second heat dissipation fan 250 have the function of air cooling and heat dissipation on the circuit board device 100, the dust screen 260 has the function of preventing dust, and the exhaust fan 270 is made in LH-50S, the exhaust fan 270 has the function of increasing the air flow rate and quickly taking away hot air, so that the heat dissipation performance is improved;
further, the circuit board device 100 includes a first circuit board 110, two ends of the first circuit board 110 are inserted into the end portions of the bottom mounting connectors 221, the bottom of the first circuit board 110 is fixedly connected with a heat sink 120, the heat sink 120 has the same size as the bottom of the first circuit board 110, specifically, the first circuit board 110 has an effect of mounting electronic components, and the heat sink 120 has an effect of conducting heat, so that heat at the bottom of the first circuit board 110 can be conveniently released, and the surface temperature of the first circuit board 110 can be reduced;
further, the bottom of the heat sink 120 is fixedly connected with the fins 122, and the fins 122 are uniformly distributed at the bottom of the heat sink 120, specifically, the heat sink 120 and the fins 122 are made of metal aluminum, the metal aluminum has good heat dissipation performance and is more economical, and the fins 122 have the functions of increasing the surface area of the heat sink 120 and improving the heat dissipation effect;
further, a second circuit board 130 is arranged at the top of the first circuit board 110, two ends of the second circuit board 130 are fixedly inserted at the end of the mounting connector 221 at the middle part, a cooling box 131 is arranged on the inner wall of the second circuit board 130, a filling hole 132 is arranged at the top of the second circuit board 130, the filling hole 132 extends into the cooling box 131, specifically, the second circuit board 130 has the function of mounting electronic components and printed circuits, the cooling box 131 has the function of filling cooling liquid for heat dissipation, and the filling hole 132 has the function of facilitating filling of the cooling liquid;
further, a third circuit board 140 is disposed on the top of the second circuit board 130, two ends of the third circuit board 140 are fixedly inserted into the end of the mounting connector 221, and specifically, the third circuit board 140 has an effect of mounting electronic components and printed circuits.
The utility model discloses a use as follows: when the utility model is used, a person skilled in the art installs electronic components and circuits on the top of the first circuit board 110, the second circuit board 130 and the third circuit board 140, fixes the bottom board 210 to the inner wall of the equipment casing through bolts, installs the first fixing frame 220 at the left and right ends of the top of the bottom board 210, installs the first cooling fan 240 and the second cooling fan 250 on the inner wall of the first fixing frame 220 at the left side, installs the exhaust fan 270 on the inner wall of the first fixing frame 220 at the right side, inserts the first circuit board 110, the second circuit board 130 and the third circuit board 140 at the end part of the installation joint 221, fills cooling liquid in the cooling box 131, installs the temperature sensor 230 on the top of the installation joint 221 for temperature detection, and drives the first cooling fan 240, the second cooling fan 250 and the exhaust fan 270 to work to cool and dissipate heat of the circuit board device 100 when the detected temperature exceeds the preset safe temperature, the heat of the top of the first circuit board 110 is conducted to the fins 122 through the heat conducting plate 121 for heat dissipation.
Example 2:
referring to fig. 5, the present invention provides a novel multilayer heat dissipation type circuit board, which includes a second fixing frame 280 and a third heat dissipation fan 290;
further, the heat dissipation device 200 further includes a second fixing frame 280, two ends of the second fixing frame 280 are fixedly installed at two ends of the installation connector 221, the top of the second fixing frame 280 is located above the third circuit board 140, a third heat dissipation fan 290 is fixedly installed at the bottom of the second fixing frame 280, four sets of the third heat dissipation fans 290 are arranged, the second fixing frame 280 has an effect of installing the third heat dissipation fan 290, and the third heat dissipation fan 290 has an effect of performing air cooling and heat dissipation on the top of the third circuit board 140.
The utility model discloses a use as follows: in using the present invention, one skilled in the art would attach the electronic components and circuits to the top of the first circuit board 110, the second circuit board 130, and the third circuit board 140, fix the bottom plate 210 to the inner wall of the device housing by bolts, then, the second fixing frame 280 is installed at the left and right ends of the top of the bottom plate 210, the third cooling fan 290 is installed on the inner wall of the second fixing frame 280, then the exhaust fan 270 is installed on the inner wall of the first right side fixing frame 220, the first circuit board 110, the second circuit board 130 and the third circuit board 140 are inserted into the end part of the installation joint 221, the cooling tank 131 is filled with a cooling fluid, and then a temperature sensor 230 is installed on the top of the installation joint 221 for temperature detection, and when the detected temperature exceeds a preset safety temperature, the first cooling fan 240, the second cooling fan 250 and the exhaust fan 270 are driven to work to cool and dissipate the heat of the circuit board device 100, the heat of the top of the first circuit board 110 is conducted to the fins 122 through the heat conducting plate 121 for heat dissipation.
The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of the claimed invention as far as possible.
Claims (6)
1. A novel multilayer heat dissipation type circuit board comprises a circuit board device (100) and a heat dissipation device (200), and is characterized in that: the heat dissipation device (200) comprises a bottom plate (210), wherein a first fixing frame (220) is fixedly installed at two ends of the top of the bottom plate (210), a first fixing frame (220) is fixedly connected to the outer wall of the right side of the first fixing frame (220) at the left side, a mounting joint (221) is vertically provided with three groups, a first mounting joint (221) is fixedly connected to the outer wall of the top of the mounting joint (222) at the bottom, the bottom of the support (222) is fixedly connected to the top of the bottom plate (210), a temperature sensor (230) is fixedly installed at the top of the mounting joint (221) at the middle part, a first cooling fan (240) is fixedly installed on the inner wall of the bottom of the first fixing frame (220), a second cooling fan (250) is arranged at the top of the first cooling fan (240), a dust screen (260) is arranged on the right sides of the second cooling fan (250) and the first cooling fan (240), and the dust screen (260) is fixedly installed at the end of the right side of the first fixing frame (220), the right side mount (220) inner wall fixed mounting air discharge fan (270), air discharge fan (270) are equipped with two sets ofly from top to bottom, air discharge fan (270) left side is equipped with dust screen (260), right side dust screen (260) fixed mounting is at mount (220) left side inner wall.
2. The novel multilayer heat dissipation type circuit board of claim 1, characterized in that: the circuit board device (100) comprises a first circuit board (110), two ends of the first circuit board (110) are inserted into the bottom of the first circuit board (110), the end part of the mounting connector (221) is connected with the bottom of the first circuit board (110), the radiating fin (120) is fixedly connected with the bottom of the first circuit board (110), and the area of the radiating fin (120) is consistent with that of the bottom of the first circuit board (110).
3. The novel multilayer heat dissipation type circuit board of claim 2, characterized in that: the bottom of the radiating fin (120) is fixedly connected with fins (122), and the fins (122) are uniformly distributed at the bottom of the radiating fin (120).
4. The novel multilayer heat dissipation type circuit board of claim 2, characterized in that: the top of the first circuit board (110) is provided with a second circuit board (130), two ends of the second circuit board (130) are fixedly inserted in the middle of the end portion of the mounting connector (221), the inner wall of the second circuit board (130) is provided with a cooling box (131), the top of the second circuit board (130) is provided with a filling hole (132), and the filling hole (132) extends into the cooling box (131).
5. The novel multilayer heat dissipation type circuit board of claim 4, characterized in that: and a third circuit board (140) is arranged at the top of the second circuit board (130), and two ends of the third circuit board (140) are fixedly inserted at the end part of the mounting connector (221) at the top.
6. The novel multilayer heat dissipation type circuit board of claim 1, characterized in that: the heat dissipation device (200) further comprises a second fixing frame (280), two ends of the second fixing frame (280) are fixedly installed at two ends of the installation connector (221), the top of the second fixing frame (280) is located above the third circuit board (140), a third heat dissipation fan (290) is fixedly installed at the bottom of the second fixing frame (280), and four sets of the third heat dissipation fan (290) are arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022984645.7U CN214046119U (en) | 2020-12-11 | 2020-12-11 | Novel multilayer heat dissipation type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022984645.7U CN214046119U (en) | 2020-12-11 | 2020-12-11 | Novel multilayer heat dissipation type circuit board |
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| Publication Number | Publication Date |
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| CN214046119U true CN214046119U (en) | 2021-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022984645.7U Active CN214046119U (en) | 2020-12-11 | 2020-12-11 | Novel multilayer heat dissipation type circuit board |
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| CN (1) | CN214046119U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114916124A (en) * | 2022-04-19 | 2022-08-16 | 厦门新锐创意电子科技有限公司 | Aluminum-based multilayer printed circuit board capable of rapidly dissipating heat and manufacturing method thereof |
-
2020
- 2020-12-11 CN CN202022984645.7U patent/CN214046119U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114916124A (en) * | 2022-04-19 | 2022-08-16 | 厦门新锐创意电子科技有限公司 | Aluminum-based multilayer printed circuit board capable of rapidly dissipating heat and manufacturing method thereof |
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