CN215835590U - Low-impedance multilayer circuit board - Google Patents
Low-impedance multilayer circuit board Download PDFInfo
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- CN215835590U CN215835590U CN202120953936.1U CN202120953936U CN215835590U CN 215835590 U CN215835590 U CN 215835590U CN 202120953936 U CN202120953936 U CN 202120953936U CN 215835590 U CN215835590 U CN 215835590U
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- heat dissipation
- circuit board
- multilayer circuit
- board body
- radiating
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Abstract
The utility model relates to a low-impedance multilayer circuit board, and belongs to the technical field of circuit boards. The low-impedance multilayer circuit board comprises a multilayer circuit board body and at least one heat dissipation module, wherein the heat dissipation module comprises a heat dissipation plate and two fixing blocks, the heat dissipation plate is arranged at the upper end of the multilayer circuit board body, the two fixing blocks are symmetrically arranged at the lower end of the multilayer circuit board body, and two ends of the heat dissipation plate are fixedly connected with the fixing blocks through bolts respectively; the runoff fan is embedded in the middle of the heat dissipation plate, the air outlet is formed in the side wall of the heat dissipation plate, a heat dissipation copper pipe is embedded in the heat dissipation plate, one end of the heat dissipation copper pipe is communicated with the air outlet of the runoff fan, and the other end of the heat dissipation copper pipe is communicated with the air outlet. The low-impedance multilayer circuit board can adjust the heat dissipation performance by increasing or reducing the number of the heat dissipation modules according to the actual heat dissipation requirement, is convenient and quick to install, and can meet the heat dissipation requirement of the multilayer circuit board body under various working conditions.
Description
Technical Field
The utility model relates to a low-impedance multilayer circuit board, and belongs to the technical field of circuit boards.
Background
Printed circuit boards, also known as printed circuit boards, have been widely used in the field of electronic devices as carriers of electronic components to realize the connection between the electronic components. The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board. The existing multilayer printed circuit board mostly improves the stability and the integration level by increasing the number of layers so as to increase the application range, but the existing multilayer printed circuit board can generate a large amount of heat in the running process of a circuit to cause the multilayer printed circuit board to generate an overheating situation, the situation not only can cause the damage of the circuit board, but also can cause the integral impedance of the circuit board to be increased to influence the normal running of the circuit board, and the situation can cause the performance of a product based on the multilayer printed circuit board to be greatly influenced.
At present, for solving the heat dissipation problem of multilayer printed wiring board to reduce impedance, adopt to increase the metal matrix on printed wiring board usually and realize the heat dissipation, but this kind relies on base plate self structure to dispel the heat, and often the radiating effect is unsatisfactory to circuit board overheat damage appears easily, and heat dispersion also can not adjust according to the heat dissipation demand of reality.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that aiming at the defects of the prior art, the low-impedance multilayer circuit board which has good heat dissipation effect, can effectively reduce impedance and can adjust the heat dissipation performance according to the actual heat dissipation requirement is provided.
The technical scheme provided by the utility model for solving the technical problems is as follows: a low-impedance multilayer circuit board comprises a multilayer circuit board body and at least one heat dissipation module, wherein the heat dissipation module comprises a heat dissipation plate and two fixing blocks, the heat dissipation plate is arranged at the upper end of the multilayer circuit board body, the two fixing blocks are symmetrically arranged at the lower end of the multilayer circuit board body, and two ends of the heat dissipation plate are fixedly connected with the fixing blocks through bolts respectively; the runoff fan is embedded in the middle of the heat dissipation plate, the air outlet is formed in the side wall of the heat dissipation plate, a heat dissipation copper pipe is embedded in the heat dissipation plate, one end of the heat dissipation copper pipe is communicated with the air outlet of the runoff fan, and the other end of the heat dissipation copper pipe is communicated with the air outlet.
The improvement of the technical scheme is as follows: at least one radiating fin is arranged at the upper end of the radiating plate.
The improvement of the technical scheme is as follows: the number of the radiating fins is two, and the two radiating fins are symmetrically arranged.
The improvement of the technical scheme is as follows: a heat conducting silica gel layer is arranged between the heat dissipation plate and the upper end of the multilayer circuit board body.
The improvement of the technical scheme is as follows: rubber gaskets are respectively arranged between the heat dissipation plate and the two fixing blocks.
The improvement of the technical scheme is as follows: the air outlet is provided with a dust screen.
The improvement of the technical scheme is as follows: the lower surface of the multilayer circuit board body is provided with a power supply contact.
The improvement of the technical scheme is as follows: the number of the heat dissipation modules is two, and the two heat dissipation modules are symmetrically arranged.
The utility model adopts the technical scheme that the method has the beneficial effects that:
(1) the low-impedance multilayer circuit board can effectively dissipate heat for the multilayer circuit board body through the radial flow fan and the heat dissipation copper pipe in the heat dissipation plate, so that the impedance of the multilayer circuit board body is reduced;
(2) the low-impedance multilayer circuit board can adjust the heat dissipation performance by increasing or reducing the number of the heat dissipation modules according to the actual heat dissipation requirement, is convenient and quick to install, and can meet the heat dissipation requirement of the multilayer circuit board body under various working conditions;
(3) the upper end of the radiating plate of the low-impedance multilayer circuit board is provided with at least one radiating fin, and the radiating performance of a single radiating plate can be further improved by adding the radiating fins;
(4) according to the low-impedance multilayer circuit board, the heat conducting silica gel layer is arranged between the heat dissipation plate and the upper end of the multilayer circuit board body, so that heat of the multilayer circuit board body can be effectively transferred to the heat dissipation plate, and therefore the heat dissipation performance is improved;
(5) the rubber gaskets are respectively arranged between the heat dissipation plate and the two fixing blocks of the low-impedance multilayer circuit board, so that the connection stability of the heat dissipation plate and the two fixing blocks can be enhanced, and the heat dissipation plate and the two fixing blocks are prevented from relative displacement, so that the bolt looseness caused by the relative displacement of the heat dissipation plate and the fixing blocks after the heat dissipation module is laterally stressed is prevented.
Drawings
The utility model will be further described with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of the front side structure of a low impedance multilayer circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a vertical cross-sectional structure of a low impedance multilayer circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a horizontal cross-sectional view of a heat sink plate of the low impedance multi-layer circuit board according to an embodiment of the utility model;
FIG. 4 is a schematic diagram of the back side structure of the low impedance multilayer circuit board according to the embodiment of the present invention;
wherein: 1-multilayer circuit board body, 2-heat dissipation plate, 3-runoff fan, 4-heat dissipation fins, 5-rubber gasket, 6-fixed block, 7-dustproof net, 8-bolt, 9-heat dissipation copper pipe, 10-heat conduction silica gel layer, 11-air outlet and 12-power supply contact.
Detailed Description
Examples
The low-impedance multilayer circuit board of the embodiment, as shown in fig. 1-4, comprises a multilayer circuit board body 1 and a heat dissipation module, wherein the heat dissipation module comprises a heat dissipation plate 2 and two fixing blocks 6, the heat dissipation plate 2 is arranged at the upper end of the multilayer circuit board body 1, the two fixing blocks 6 are symmetrically arranged at the lower end of the multilayer circuit board body 1, and two ends of the heat dissipation plate 2 are fixedly connected with the fixing blocks 6 through bolts 8; the runoff fan 3 is embedded in the middle of the heat dissipation plate 2, the air outlet 11 is formed in the side wall of the heat dissipation plate 2, the heat dissipation copper pipe 9 is embedded in the heat dissipation plate 2, one end of the heat dissipation copper pipe 9 is communicated with the air outlet of the runoff fan 3, and the other end of the heat dissipation copper pipe 9 is communicated with the air outlet 11.
The upper end of the heat sink 2 of the low impedance multilayer wiring board of this embodiment is provided with heat sink fins 4. The number of the radiating fins 4 is two, and the two radiating fins 4 are symmetrically arranged. A heat-conducting silica gel layer 10 is arranged between the heat dissipation plate 2 and the upper end of the multilayer circuit board body 1. Rubber gaskets 5 are respectively arranged between the heat dissipation plate 2 and the two fixing blocks 6. The air outlet is provided with a dust screen 7. The lower surface of the multilayer circuit board body 1 is provided with a power supply contact 12. The number of the heat dissipation modules is two, and the two heat dissipation modules are symmetrically arranged. The fixing block 6 is provided with a clamping part which is used for abutting against the lower end surface of the multilayer circuit board body 1.
When the low-impedance multilayer circuit board is used, the heat dissipation performance can be adjusted by increasing or reducing the number of heat dissipation modules according to the actual heat dissipation requirement, the operation is convenient and rapid, and the heat dissipation requirement of the multilayer circuit board body 1 under various working conditions can be met; the low-impedance multilayer circuit board of the embodiment can effectively dissipate heat for the multilayer circuit board body 1 through the radial flow fan 3 and the heat dissipation copper pipe 9 in the heat dissipation plate 2, so that the impedance of the multilayer circuit board body is reduced; by adding the heat radiation fins 4, the heat radiation performance of the single heat radiation plate 2 can be further improved.
The material of the heat dissipation plate 2 and the heat dissipation fins 4 of the low impedance multilayer circuit board of the embodiment is aluminum alloy.
The present invention is not limited to the above-described embodiments. All technical solutions formed by equivalent substitutions fall within the protection scope of the claims of the present invention.
Claims (8)
1. A low impedance multilayer wiring board, comprising: the radiating module comprises a multilayer circuit board body (1) and at least one radiating module, wherein the radiating module comprises a radiating plate (2) and two fixing blocks (6), the radiating plate (2) is arranged at the upper end of the multilayer circuit board body (1), the two fixing blocks (6) are symmetrically arranged at the lower end of the multilayer circuit board body (1), and two ends of the radiating plate (2) are fixedly connected with the fixing blocks (6) through bolts (8); the utility model discloses a runoff fan cooling device, including heating panel (2), air outlet (11), radiating copper pipe (9) and runoff fan (3), radiating copper pipe (9) other end with air outlet (11) intercommunication are inlayed to be equipped with runoff fan (3) in the middle part of heating panel (2), air exit (11) have been seted up to the lateral wall of heating panel (2), the embedded heat dissipation copper pipe (9) that is equipped with, the one end of heat dissipation copper pipe (9) with the air outlet intercommunication of runoff fan (3), the other end of heat dissipation copper pipe (9) with air exit (11) intercommunication.
2. The low impedance multilayer wiring board of claim 1, wherein: the upper end of the heat dissipation plate (2) is provided with at least one heat dissipation fin (4).
3. The low impedance multilayer wiring board of claim 2, wherein: the number of the radiating fins (4) is two, and the two radiating fins (4) are symmetrically arranged.
4. The low impedance multilayer wiring board of claim 1, wherein: and a heat conduction silica gel layer (10) is arranged between the heat dissipation plate (2) and the upper end of the multilayer circuit board body (1).
5. The low impedance multilayer wiring board of claim 1, wherein: rubber gaskets (5) are respectively arranged between the heat dissipation plate (2) and the two fixing blocks (6).
6. The low impedance multilayer wiring board of claim 1, wherein: the air outlet is provided with a dust screen (7).
7. The low impedance multilayer wiring board of claim 1, wherein: the lower surface of the multilayer circuit board body (1) is provided with a power supply contact (12).
8. The low impedance multilayer wiring board of claim 1, wherein: the number of the heat dissipation modules is two, and the two heat dissipation modules are symmetrically arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120953936.1U CN215835590U (en) | 2021-04-30 | 2021-04-30 | Low-impedance multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120953936.1U CN215835590U (en) | 2021-04-30 | 2021-04-30 | Low-impedance multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215835590U true CN215835590U (en) | 2022-02-15 |
Family
ID=80188559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120953936.1U Active CN215835590U (en) | 2021-04-30 | 2021-04-30 | Low-impedance multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215835590U (en) |
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2021
- 2021-04-30 CN CN202120953936.1U patent/CN215835590U/en active Active
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