CN214128272U - Food preparation machine that radiating effect is good - Google Patents
Food preparation machine that radiating effect is good Download PDFInfo
- Publication number
- CN214128272U CN214128272U CN202022289397.4U CN202022289397U CN214128272U CN 214128272 U CN214128272 U CN 214128272U CN 202022289397 U CN202022289397 U CN 202022289397U CN 214128272 U CN214128272 U CN 214128272U
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- circuit board
- solder
- drive device
- power drive
- heat
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- 235000013305 food Nutrition 0.000 title claims abstract description 30
- 230000000694 effects Effects 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 238000009434 installation Methods 0.000 claims abstract description 51
- 229910000679 solder Inorganic materials 0.000 claims description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 239000011889 copper foil Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 52
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 description 33
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 238000003466 welding Methods 0.000 description 12
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010411 cooking Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 235000013322 soy milk Nutrition 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a food preparation machine that radiating effect is good, including the host computer, set up the circuit board in the host computer and set up in the culinary art container of host computer, be equipped with the machined part in the culinary art container, still include power drive device, the circuit board forms the installation department with the laminating of power drive device and the radiating part in succession with the installation department. The power drive device pastes the installation department on the circuit board, the heat that the power drive device produced can transmit to installation department fast, the radiating part links to each other with the installation department, and radiating part department is not provided with electronic components, therefore, the temperature of radiating part department can be less than the heat of installation department, the heat of installation department can transmit to radiating part department, and the radiating part exposes outside, the heat of radiating part department can give off to the external world fast, realize the heat dissipation of power drive device, and dispel the heat through the structure of circuit board self, can enough reduce the installation space of power drive device on the circuit board, reduce the installation cost of power drive device.
Description
Technical Field
The utility model belongs to the food processing device field, concretely relates to food preparation machine that radiating effect is good.
Background
In the existing food processor, a circuit board is usually arranged in a host, a large number of components are arranged on the circuit board, the components generate power consumption in a power-on state and enable the temperature of the components to rise, if the temperature is not lowered in time, the performance of the components can be influenced when the temperature rises to exceed the rated temperature of the components, and even the whole components are failed.
In order to give off the heat that components and parts during operation produced to the external world fast, to the great components and parts of calorific capacity, the supporting radiator of installing usually, components and parts pass through the screw fastening on the radiator of aluminium material, make the installation cost of components and parts increase, and the radiator need carry out holistic cover to the components and parts that carry out the heat dissipation, can occupy great circuit board space, not only hinder the installation of all the other components and parts, and simultaneously, the circuit board that has the radiator is when installing to the host computer, also can occupy great space in the host computer, be unfavorable for the miniaturization of host computer.
SUMMERY OF THE UTILITY MODEL
To foretell not enough, the utility model provides a food preparation machine that the radiating effect is good, this food preparation machine can dispel the heat in the space of rational utilization circuit board.
The utility model discloses a realize through following technical scheme:
the utility model provides a food preparation machine that radiating effect is good, includes the host computer, sets up the circuit board in the host computer and sets up in the culinary art container of host computer, is equipped with the machined part in the culinary art container, still includes power drive device, and the circuit board forms the installation department with the laminating of power drive device and the radiating part in succession with the installation department. The power driver laminates the installation department on the circuit board, the heat that the power driver produced can transmit to installation department fast, the radiating part links to each other with the installation department, and radiating part department is not provided with electronic components, therefore, the temperature of radiating part department can be less than the heat of installation department, the heat of installation department can transmit to radiating part department, and the radiating part exposes outside, the heat of radiating part department can give off to the external world fast, realize the heat dissipation of power driver, and dispel the heat through the structure of circuit board self, need not to set up the supporting heat radiation structure with the power driver, can enough reduce the installation space of power driver on the circuit board, reduce the installation cost of power driver, also can save the space that the circuit board took when installing to the host computer, be favorable to food processor's miniaturization.
Furthermore, the heat dissipation part is provided with a plurality of windowing soldering tin areas, and a heat dissipation space is formed between each windowing soldering tin area and the adjacent windowing soldering tin area. Through setting up windowing soldering tin district, and each windowing soldering tin district is disconnected between, has increased the surface area with external contact for radiating speed, simultaneously, through windowing soldering tin district, also can increase the electric current on the circuit board.
Furthermore, the plurality of windowing soldering tin areas are arranged along the width direction of the heat dissipation part to form a windowing soldering tin area group, and are arranged along the length direction of the heat dissipation part to form a plurality of rows of windowing soldering tin area groups. The plurality of windowing soldering tin areas are arranged in a matrix mode, the heat dissipation area is increased, excessive soldering tin is not sucked while heat dissipation is guaranteed, and the cost is reduced.
Furthermore, the area of the windowing soldering tin area is 2-6mm2. If the area is too small, the heat dissipation effect is not obvious, if the area is too large, the cost is increased, and each windowing soldering tin area is easily fused with the adjacent windowing soldering tin area, so that the heat dissipation area is reduced.
Further, the circuit board has a soldering layer coated with a metal foil, and the mounting portion and the heat dissipation portion are formed on the soldering layer. The power driving device is connected to the welding layer through the welding tin in a welding mode, the power driving device is fixed, the welding layer is covered with the metal foil, the heat conductivity coefficient of metal is high, and heat generated at the power driving device can be dissipated to the outside rapidly through transmission.
Further, the metal foil is a copper foil, and the copper foil is arranged around the power driving device. The heat that power driver produced can transmit to copper foil department all around, and thermal transfer speed is faster, and the radiating effect is better.
Further, the area of the copper foil is 200-600 mm2And the thickness is not less than 35 um. If the area of the copper foil is too small, the heat dissipation effect is poor, the heat generated by the power driving device cannot be dissipated to the outside in time, and the copper foilIf the area is too large, although the heat dissipation can be accelerated, the circuit board occupies too much space, if the thickness of the copper foil is too small, the fixing strength of the power driving device and the copper foil is reduced, and the heat dissipation efficiency is also reduced.
Further, the circuit board further comprises a solder mask layer surrounding the solder layer, and the solder mask layer is covered with a solder resist. The welding is only carried out on the part needing to be welded, so that the waste of welding flux is avoided, soldering tin can be prevented from being attached to a copper wire which does not need to be welded, the insulation deterioration and corrosion caused by external environmental factors such as dust, moisture and the like are prevented, and meanwhile, the high-insulation performance is achieved, and the safety is good.
Furthermore, the food processor also comprises a driving circuit with a power driving device and a motor component electrically connected with the driving circuit, the processed parts are a stirring knife and a heating component electrically connected with the driving circuit, and the motor component drives the stirring knife. The heat dissipation is carried out through the structure of the circuit board, the extra increase of occupied space of a radiator is avoided, the circuit board is not required to be limited in installation mode when being installed, the circuit board can be vertically arranged in a host, or can be horizontally arranged in the host, and the height of the host is reduced.
Further, the power driving device is a thyristor. The small-power control device has the advantages of small volume, high efficiency and long service life, and can be used as a high-power driving device in an automatic control system to realize the control of high-power equipment by using a low-power control.
Drawings
Fig. 1 is a partial schematic diagram illustrating an exemplary embodiment of a circuit board according to the present invention;
fig. 2 is a partial schematic diagram illustrating another exemplary embodiment of a circuit board according to the present invention;
fig. 3 is a schematic view illustrating the connection between the solder layer and the metal foil according to the present invention.
Reference numerals:
1. circuit board, 11, installation department, 12, heat dissipation portion, 121, windowing soldering tin region, 13, welding layer, 14, metal foil, 15, solder mask, 2, power drive device.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that the terms of orientation such as left, right, up, down, front and back in the embodiments of the present invention are only relative concepts or are referred to the normal use state of the product, i.e. the traveling direction of the product, and should not be considered as limiting.
In addition, it should be noted that the dynamic terms such as "relative movement" mentioned in the embodiments of the present invention include not only a change in position but also a movement in which a state changes without a relative change in position such as rotation or rolling.
Finally, it is noted that when an element is referred to as being "on" or "disposed" to another element, it can be on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
A food processor with good heat dissipation effect comprises a host machine, a circuit board 1 arranged in the host machine and a cooking container arranged in the host machine, wherein a workpiece is arranged in the cooking container, a partial schematic diagram of the circuit board can refer to fig. 1, the food processor also comprises a power driving device 2, and the circuit board 1 is provided with an installation part 11 attached to the power driving device 2 and a heat dissipation part 12 connected with the installation part 11; the circuit board 1 is a support body of an electronic component and a carrier for electrical connection, for a power driving device 2 arranged on the circuit board 1, the heat generation amount is large, in order to avoid that the performance of the power driving device 2 is affected by the overhigh temperature inside the power driving device 2, even the power driving device 2 fails, therefore, the heat in the power driving device 2 needs to be timely dissipated, the power driving device 2 is attached to an installation part 11 on the circuit board 1, the heat generated by the power driving device 2 can be rapidly transmitted to the installation part 11, a heat dissipation part 12 is connected with the installation part 11, and no electronic component is arranged at the heat dissipation part 12, therefore, the temperature at the heat dissipation part 12 is lower than that at the installation part 11, the heat of the installation part 11 can be transmitted to the heat dissipation part 12, the heat dissipation part 12 is exposed outside, and the heat at the heat dissipation part 12 can be rapidly dissipated to the outside, realize power drive device 2's heat dissipation, and dispel the heat through the structure of circuit board 1 self, need not to set up the heat radiation structure who forms a complete set with power drive device 2, can enough reduce the installation space of power drive device 2 on circuit board 1, reduce the installation cost of power drive device 2, the space that circuit board 1 took when installing to the host computer also can be saved, be favorable to food preparation machine's miniaturization, and simultaneously, to being located power drive device 2 electronic components all around, the partial heat that its produced also can transmit to radiating part 12, also dispel the heat with the electronic components to power drive device 2 annex through radiating part 12, guarantee that the holistic radiating effect of circuit board 1 is good.
The food processor also comprises a driving circuit with a power driving device 2 and a motor component electrically connected with the driving circuit, the processed parts are a stirring knife and a heating component electrically connected with the driving circuit, and the motor component drives the stirring knife; circuit board 1 is as food preparation machine's control core spare, can control the stirring sword and realize eating the smashing of material, the heating of material is realized to control heating element, in case damage, food preparation machine then can not work, and food preparation machine gradually to the miniaturization, portable development, dispel the heat through 1 self structure of circuit board, avoid additionally increasing radiator occupation space, and circuit board 1 when the installation, need not limitation mounting means, circuit board 1 both can vertical setting in the host computer, perhaps, also can the level set up in the host computer, reduce the host computer height.
For food processors, it can be a food processor, a wall breaking machine, a soymilk machine, a cooker, an air fryer, etc.
The power driving device 2 is a silicon controlled rectifier; the controllable silicon cooling device has the advantages that the size is small, the efficiency is high, the service life is long, the controllable silicon cooling device can be used as a high-power driving device in an automatic control system, high-power equipment can be controlled by using a low-power control, when the controllable silicon is cooled, a radiator does not need to be arranged on the controllable silicon to cover the controllable silicon to cool the controllable silicon, the installation cost of the controllable silicon is reduced, and a large space of a circuit board 1 does not need to be occupied; of course, the Power driver 2 may also be other components with large heat generation quantity, such as a rectifier bridge, an ipm (intelligent Power module) module, etc., mounted on the circuit board 1, and for other electronic components with small heat generation quantity, the heat can be timely dissipated to the outside after being generated.
The silicon controlled rectifier can be selected to BTB24A model, it reduces to switch on the pressure, it is little to generate heat, the current pressure drop that flows through 4A is about 1V, and the silicon controlled rectifier produces 4V 1A at full power during operation and is become the power loss of 4W, if not add the heat dissipation processing, the silicon controlled rectifier can be overtemperature and damage, the heat of silicon controlled rectifier during operation PN junction passes through installation department 11, the heat of installation department 11 department is reaching heat dissipation portion 12 department, the heat of heat dissipation portion 12 department finally gives off the heat to the external world.
When radiating, be through the heat transfer to installation department 11 with power drive device 2 production, the heat transfer of installation department 11 is to exposing outside heat dissipation portion 12 afterwards, and the heat of heat dissipation portion 12 is finally dissipated to the external world, therefore, for circuit board 1, the coefficient of heat conductivity of installation department 11 and heat dissipation portion 12 department material is higher, and thermal transfer rate is faster, and is better to power drive device 2's radiating effect.
Also referring to fig. 2, the circuit board 1 has a solder layer 13 coated with a metal foil 14, and the mounting portion 11 and the heat dissipation portion 12 are formed on the solder layer 13; the power driving device 2 is welded to the welding layer 13 through soldering tin, the power driving device 2 is fixed, the welding layer 13 is covered with the metal foil 14, the heat conductivity coefficient of metal is high, and heat generated at the position of the power driving device 2 can be rapidly dissipated to the outside through transmission.
The metal foil 14 is a copper foil, and the copper foil is arranged around the power driving device 2; the heat that power drive device 2 produced can be transmitted to copper foil department all around, and thermal transfer rate is faster, and the radiating effect is better, and wherein, when installing power drive device 2, the partial welding of power drive device 2 is in installation department 11, and consequently, the copper foil encircles the partial setting that power drive device 2 is connected with installation department 11, and encircles the copper foil of power drive device 2 and mainly be the copper foil of installation department 11.
As for the heat dissipation part 12, the larger the area of the heat dissipation part 12 is, the higher the heat dissipation efficiency is, and therefore, the area of the heat dissipation part 12 is larger than that of the mounting part 11, and the copper foil at the mounting part 11 is disposed around the power driving device 2, and therefore, the heat dissipation part 12 can be similarly disposed around the mounting part 11; certainly, because the circuit board 1 still need install other electronic components, in order to make the best of the space of circuit board 1, heat dissipation portion 12 outwards extends from one side of installation department 11, and like this, the position of installing other electronic components is left in the remaining three position of power drive device 2, certainly, power drive device 2 when the installation, alright install in circuit board 1 edge, heat dissipation portion 12 like this when extending, extend towards the edge of circuit board 1 equally, avoid taking too much space that is used for the installation.
The area of the copper foil is 200-600 mm2The thickness is not less than 35 um; if the area of copper foil is the undersize, the radiating effect is poor, can't in time dispel the heat to the external world to the heat that power drive device 2 produced, if the area of copper foil is too big, though can accelerate the heat dissipation, but can occupy the too much space of circuit board 1, circuit board 1 if want to install other electronic components again, then circuit board 1's size still needs to increase, then can occupy great space in the host computer like this, of course, if the thickness of copper foil is the undersize, the fixed strength of power drive device 2 and copper foil can reduce, and the radiating efficiency also can reduce.
As shown in fig. 1, the heat dissipation portion 12 is provided with a plurality of windowed solder regions 121, and each windowed solder region 121 and the adjacent windowed solder region 121 form a heat dissipation space; through setting up windowing soldering tin district 121, and each windowing soldering tin district 121 between not continuous, increased with external surface area of contact for radiating speed, simultaneously, through windowing soldering tin district 121, also can increase the electric current on the circuit board 1.
The plurality of windowing solder regions 121 are arranged along the width direction of the heat dissipation part 12 to form a windowing solder region group, and are arranged along the length direction of the heat dissipation part 12 to form a plurality of rows of windowing solder region groups; the plurality of windowing soldering tin areas 121 are arranged in a matrix, the windowing soldering tin areas 121 in each row of windowing soldering tin area group are distributed at equal intervals, the heat dissipation area is increased, excessive soldering tin is not absorbed while heat dissipation is guaranteed, and the cost is reduced.
As shown in fig. 3, for the formed multiple rows of windowing solder land groups, each windowing solder land group may be staggered with the adjacent windowing solder land group, the multiple rows of windowing solder land groups are divided into odd rows and even rows, the windowing solder lands 121 in the odd rows are aligned in the same line along the column direction, and the corresponding windowing solder lands 121 in the even rows are aligned in the same line along the column direction.
Because heat dissipation portion 12 is in succession with installation department 11, and power drive device 2 sets up in installation department 11, therefore, the region that is close to installation department 11 in heat dissipation portion 12 more, the temperature is higher, therefore, when windowing soldering tin district 121 was arranged in heat dissipation portion 12 department, the more densely that is close to installation department 11 windowing soldering tin district 121 distributes, the region of installation department 11 is kept away from relatively, windowing soldering tin district 121's distribution can be comparatively dispersed, in order to give off the heat to the external world fast, and simultaneously, do not absorb too much soldering tin, and cost is reduced.
The area of the windowing solder region 121 is 2-6mm2(ii) a If the area is too small, the heat dissipation effect is not obvious, if the area is too large, the cost is increased, and each windowing soldering tin region 121 is easily fused with the adjacent windowing soldering tin region 121, so that the heat dissipation area is reduced.
The circuit board 1 further comprises a solder mask layer 15 surrounding the solder layer 13, the solder mask layer 15 being coated with a solder resist; the welding is only carried out on the part needing to be welded, so that the waste of welding flux is avoided, soldering tin can be prevented from being attached to a copper wire which does not need to be welded, the insulation deterioration and corrosion caused by external environmental factors such as dust, moisture and the like are prevented, and meanwhile, the high-insulation performance is achieved, and the safety is good.
The solder resist is, for example, a green oil, that is, a green solder resist ink, and can protect the wiring pattern formed on the circuit board 1 for a long period of time.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. The utility model provides a food preparation machine that radiating effect is good, includes the host computer, sets up the circuit board in the host computer and sets up in the culinary art container of host computer, is equipped with the machined part in the culinary art container, its characterized in that still includes power drive device, the circuit board form with the installation department that power drive device laminated and with the radiating part that the installation department is in succession.
2. The food processor of claim 1, wherein the heat sink portion is provided with a plurality of windowed solder regions, each of the windowed solder regions forming a heat sink space with an adjacent windowed solder region.
3. The food processor of claim 2, wherein the plurality of windowed solder regions are arranged in a width direction of the heat sink portion to form a group of windowed solder regions, and arranged in a length direction of the heat sink portion to form a plurality of rows of the group of windowed solder regions.
4. The food processor of claim 2, wherein the area of the windowed solder region is 2-6mm2。
5. The food processor of claim 1, wherein the circuit board has a metal foil clad solder layer, and the mounting portion and the heat sink portion are formed on the solder layer.
6. The food processor of claim 5, wherein the metal foil is copper foil, and wherein the copper foil is disposed around the power drive.
7. The food processor of claim 6, wherein the copper foil has an area of 200-600 mm2And the thickness is not less than 35 um.
8. The food processor of claim 5, wherein the circuit board further comprises a solder mask surrounding the solder layer, the solder mask being coated with a solder resist.
9. The food processor of claim 1, further comprising a drive circuit including the power drive device and a motor assembly electrically connected to the drive circuit, the workpiece being a stirring blade and a heating assembly electrically connected to the drive circuit, the motor assembly driving the stirring blade.
10. The food processor of claim 1, wherein the power driver is a thyristor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022289397.4U CN214128272U (en) | 2020-10-15 | 2020-10-15 | Food preparation machine that radiating effect is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022289397.4U CN214128272U (en) | 2020-10-15 | 2020-10-15 | Food preparation machine that radiating effect is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214128272U true CN214128272U (en) | 2021-09-07 |
Family
ID=77558475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022289397.4U Active CN214128272U (en) | 2020-10-15 | 2020-10-15 | Food preparation machine that radiating effect is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214128272U (en) |
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2020
- 2020-10-15 CN CN202022289397.4U patent/CN214128272U/en active Active
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Effective date of registration: 20240513 Address after: Building 2, No. 52, 22nd Street, Baiyang Street, Qiantang New District, Hangzhou City, Zhejiang Province, 310000 Patentee after: Hangzhou Jiuchuang Home Appliances Co.,Ltd. Country or region after: China Address before: 310018 No. 760 Yinhai Street, Xiasha Street, Hangzhou Economic and Technological Development Zone, Zhejiang Province Patentee before: HANGZHOU JIUYANG HOUSEHOLD ELECTRICAL APPLIANCES CO.,LTD. Country or region before: China |