CN221748644U - Circuit board and electronic device with heat dissipation structure - Google Patents
Circuit board and electronic device with heat dissipation structure Download PDFInfo
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- CN221748644U CN221748644U CN202420046403.9U CN202420046403U CN221748644U CN 221748644 U CN221748644 U CN 221748644U CN 202420046403 U CN202420046403 U CN 202420046403U CN 221748644 U CN221748644 U CN 221748644U
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Abstract
The embodiment of the utility model provides a circuit board with a heat dissipation structure and an electronic device, wherein the circuit board comprises: the circuit board comprises a circuit board main body, a radiator and a back plate, wherein heating devices are arranged on the front surface and the back surface of the circuit board main body; the radiator is contacted with at least part of heating devices arranged on the front surface of the circuit board main body and used for radiating the heating devices; the backboard is connected with the circuit board main body, the backboard is provided with a heat dissipation piece, the heat dissipation piece is contacted with at least part of heating devices arranged on the back surface of the circuit board main body, and the heat dissipation piece and the heat radiator form at least one heat dissipation link so that the heat dissipation piece can transmit heat to the heat radiator for heat dissipation. According to the circuit board provided by the embodiment, at least one heat dissipation link is formed between the heat dissipation piece arranged on the backboard and the radiator, so that heat at the back of the circuit board main body can be transmitted to the radiator positioned at the front for heat dissipation, and the heat dissipation quality and efficiency of the heat-generating devices arranged on the circuit board main body are effectively ensured.
Description
Technical Field
The present utility model relates to circuit boards, and particularly to a circuit board with a heat dissipation structure and an electronic device.
Background
The circuit board may be called a printed circuit board, and its english name may be Printed Circuit Board, so that it may be called a PCB board, and it mainly comprises pads, vias, mounting holes, wires, components, connectors, and the like.
However, in the use process of the circuit board, components on the circuit board can generate certain heat in the operation process, if the heat cannot be timely emitted, damage to electrical components can be possibly caused, and then normal operation of the electronic equipment is affected.
Disclosure of utility model
The embodiment of the utility model provides a circuit board with a heat radiation structure and an electronic device, which can perform stable heat radiation operation on heating devices positioned on two sides of the circuit board, and ensure the stable reliability of operation of electric elements.
In a first aspect, an embodiment of the present utility model provides a circuit board with a heat dissipation function, including:
The circuit board comprises a circuit board main body, wherein heating devices are arranged on the front surface and the back surface of the circuit board main body;
The radiator is contacted with at least part of heating devices arranged on the front surface of the circuit board main body and is used for radiating the heating devices;
The backboard is connected with the circuit board main body, a heat dissipation piece is arranged on the backboard and is in contact with at least part of heating devices arranged on the back surface of the circuit board main body, and the heat dissipation piece and the radiator form at least one heat dissipation link so that the heat dissipation piece can transmit heat to the radiator.
In some examples, the heat sink is embedded on the backplate and an upper surface of the heat sink is planar with an upper surface of the backplate.
In some examples, the heat spreader is in contact with at least a portion of the heat generating devices disposed on the front side of the circuit board body via a thermally conductive member.
In some examples, the heat sink is provided with at least one protruding end for connection with the heat sink, the at least one protruding end being in contact with the heat sink via a heat conducting member to form at least one heat dissipating link.
In some examples, the size of the back plate is larger than the size of the circuit board body, and a preset gap exists between the protruding end and the circuit board body.
In some examples, the heat sink includes at least one protruding end for connecting with the heat sink, the at least one protruding end is in contact with the heat sink through a heat conducting member, and a predetermined gap exists between the protruding end and the circuit board main body.
In some examples, the heat sink includes at least one first raised end disposed on the heat sink, the heat sink including at least one second raised end for contacting the first raised end, the first raised end contacting the second raised end through a heat conducting member to form at least one heat dissipating link.
In some examples, the back plate is an insulating plate and the circuit board body is mounted and connected with the back plate through an insulating layer.
In some examples, the back plate is a non-insulating plate, and the heat sink has a higher heat transfer capability than the back plate.
In some examples, the heat sink is a conduit structure composed of a thermally conductive material.
In some examples, the conduit structure is filled with a predetermined liquid.
In some examples, the heat sink is mounted to the front upper end of the circuit board body by a detachable connection.
In some examples, the circuit board body is fixed between an upper clamping plate and the back plate, the upper clamping plate is located between the circuit board body and the heat sink, and the circuit board body is detachably mounted on the substrate through the upper clamping plate and the back plate.
In a second aspect, an embodiment of the present utility model provides an electronic device, including:
a substrate;
the circuit board with heat dissipation function of the first aspect is at least one, and the circuit board is detachably mounted on the substrate.
According to the circuit board with the heat radiation structure and the electronic device, when the heat generating devices are arranged on the front side and the back side of the circuit board main body, at least part of the heat generating devices on the front side of the circuit board main body are subjected to heat radiation operation through the heat radiating parts arranged on the back plate, and at least one heat radiation link can be formed between the heat radiating parts and the heat radiator, so that when the heat radiating parts are subjected to heat radiation operation on at least part of the heat generating devices on the back side of the circuit board main body, heat can be transmitted to the heat radiator on the front side to be subjected to heat radiation operation, and therefore the heat radiation quality and efficiency of the heat generating devices arranged on the circuit board main body are effectively guaranteed, and the safety and reliability of the circuit board are further guaranteed.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a circuit board with a heat dissipation structure according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of a circuit board with a heat dissipation structure according to an embodiment of the present utility model;
Fig. 3 is a schematic structural diagram III of a circuit board with a heat dissipation structure according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a circuit board with a heat dissipation structure according to an embodiment of the present utility model;
Fig. 5 is a schematic structural diagram of a heat dissipation element disposed on a back plate according to an embodiment of the present utility model;
Fig. 6 is a schematic structural diagram of a circuit board with a heat dissipation structure according to an embodiment of the present utility model;
fig. 7 is a schematic structural diagram of a circuit board with a heat dissipation structure according to an embodiment of the present utility model;
fig. 8 is a schematic structural diagram seventh of a circuit board with a heat dissipation structure according to an embodiment of the present utility model;
Fig. 9 is a schematic structural diagram eight of a circuit board with a heat dissipation structure according to an embodiment of the present utility model;
fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present utility model;
Fig. 11 is a schematic structural diagram of a circuit board with heat dissipation function according to an embodiment of the present utility model.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In describing embodiments of the present utility model, the terms "mounted," "connected," "secured," and the like are to be construed broadly, as the term "connected" may be a fixed connection, a removable connection, or an integral connection, for example. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.
In the description of the embodiments of the present utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the embodiments of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the embodiments of the present utility model.
The terms "comprises" and "comprising" and any variations thereof, in the description and claims, are intended to cover a non-exclusive inclusion, such that a device that comprises a sequence of steps or structures is not necessarily limited to those structures or steps that are expressly listed or inherent to such process or device but may include other steps or structures not expressly listed or inherent to such process or device.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the embodiments of the present utility model, the meaning of "plurality" is at least two, for example, two, three, etc., unless specifically defined otherwise.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Fig. 1 is a schematic structural diagram of a circuit board with a heat dissipation structure according to an embodiment of the present utility model; referring to fig. 1, the present embodiment provides a circuit board with a heat dissipation structure, where the circuit board can perform stable heat dissipation operation on a component that generates heat, and specifically, the circuit board may include: the circuit board comprises a circuit board main body 1, a radiator 3 positioned at the upper end of the circuit board main body 1 and a backboard 4 positioned at the lower end of the circuit board main body 1, and specifically:
The circuit board comprises a circuit board main body 1, wherein heating devices 2 are arranged on the front surface and the back surface of the circuit board main body 1;
a heat sink 3 in contact with at least part of the heat generating devices 2 disposed on the front surface of the circuit board main body 1 for performing a heat dissipating operation on the heat generating devices 2;
The backboard 4 is connected with the circuit board main body 1, the backboard 4 is provided with the heat dissipation piece 5, the heat dissipation piece 5 is contacted with at least part of the heating devices 2 arranged on the back surface of the circuit board main body 1, and the heat dissipation piece 5 and the heat radiator 3 form at least one heat dissipation link, so that the heat dissipation piece 5 can transmit heat to the heat radiator 3 for heat dissipation.
The circuit board main body 1 may be a circuit board for carrying one or more components, where the carried components may include a heat generating device and a non-heat generating device, and the heat generating device may refer to a component with larger power and larger heat generating amount, for example: resistors, chips, transistors, etc.; non-heat generating devices may refer to components with less power and less heat generation, such as: capacitance, switching elements, potentiometers, inductances, etc.
For the heat generating device 2 disposed on the wiring board main body 1, it may be disposed together on one side of the wiring board main body 1, for example: all the heat generating devices 2 may be disposed (soldered) on the front or back of the circuit board main body 1, and at this time, in order to be able to ensure the stable reliability of the operation of the heat generating devices 2, a heat sink 3 for realizing a heat radiating operation may be disposed on the same side of the heat generating devices 2 during the operation of the heat generating devices 2.
When the heat generating devices 2 are disposed on two sides of the circuit board main body 1, that is, the front side and the back side of the circuit board main body 1 may be disposed with a plurality of heat generating devices 2, where the front side of the circuit board main body 1 may be a side disposed with a plurality of components, and the back side of the circuit board main body 1 may be a side disposed with a plurality of components, and of course, for the front side and the back side of the circuit board main body 1, those skilled in the art may flexibly configure according to specific application scenarios or application requirements, as long as the front side and the back side of the circuit board main body 1 can be distinguished. In addition, the number of heat generating devices 2 located on the front side is the same as or different from the number of heat generating devices 2 located on the back side, i.e., the number of heat generating devices 2 located on the front side may be greater than or less than the number of heat generating devices 2 located on the back side.
In order to ensure that the heat generating devices 2 located at two sides of the circuit board main body 1 can all stably operate, structures for implementing heat dissipation operation may be disposed at two sides of the circuit board main body 1, for example: as shown in fig. 1, when the number of the heat generating devices 2 is 3, two heat generating devices 2 may be disposed on the front surface of the circuit board body 1, and another heat generating device 2 may be disposed on the back surface of the circuit board body 1, at this time, in order to ensure stable operation of the heat generating devices 2 located on the front surface of the circuit board body 1, a heat sink 3 may be disposed on the upper side of the circuit board body 1, the heat sink 3 may be disposed on the upper end of the front surface of the circuit board body 1, wherein the heat sink 3 may be mounted on the upper end of the front surface of the circuit board body 1 through a detachable connection member, which may include at least one of: bolts, studs, screws, etc., not only facilitate the operations of removing, replacing, and maintaining the heat sink 3 and the circuit board body 1, but also reduce the cost of maintaining the circuit board.
For the disposed heat sink 3, the heat sink 3 may be in contact with at least part of the heat generating device 2 disposed on the front surface of the circuit board body 1, and in some examples, the heat sink 3 may be directly abutted against at least part of the heat generating device 2 disposed on the front surface of the circuit board body 1, or the heat sink 3 may be abutted against at least part of the heat generating device 2 disposed on the front surface of the circuit board body 1 through a heat conductive member, so as to be capable of performing a heat dissipating operation on the at least part of the heat generating device 2.
In addition, the heat dissipation contact surface of the heat sink 3 may be a regular plane for abutting against the heat generating devices 2, in this case, the upper surfaces of all the heat generating devices 2 are the same plane or different planes for at least one heat generating device 2 on the front surface of the circuit board main body 1, and when the upper surfaces of all the heat generating devices 2 on the front surface of the circuit board main body 1 are the same plane, the heat sink 3 may abut against all the heat generating devices 2, and the heat sink 3 may perform a heat dissipation operation for all the heat generating devices 2 on the front surface of the circuit board main body 1.
The upper surfaces of all the heat generating devices 2 located on the front surface of the circuit board main body 1 may be not only the same plane, but also different planes, as shown in fig. 2, the upper planes of all the heat generating devices 2 located on the front surface of the circuit board main body 1 may respectively form two different planes, namely, a plane 1 and a plane 2, and since the heat dissipation contact surface of the heat sink 3 is a regular plane for abutting against the heat generating devices 2, the heat sink 3 at this time may abut against the upper surface of a part of the heat generating devices 2 located on the front surface of the circuit board main body 1, so as to be capable of performing a heat dissipation operation on the part of the heat generating devices 2.
In addition, for the heat sink 3, the heat radiation contact surface of the heat sink 3 may be not only a regular plane for abutting against the heat generating device 2, but also an irregular plane for abutting against the heat generating device 2, and as shown in fig. 3, the contact surface of the heat sink 3 for abutting against the heat generating device 2 may include the heat radiation contact surface 1 and the heat radiation contact surface 2, and the heat radiation contact surface 1 and the heat radiation contact surface 2 may be different planes, and in this case, if the upper surfaces of all the heat generating devices 2 located on the front surface of the circuit board main body 1 are the same plane, the heat sink 3 may abut against only a part of the heat generating devices 2 located on the front surface of the circuit board main body 1, so that the heat radiation operation of a part of the heat generating devices 2 disposed on the front surface of the circuit board main body 1 may be realized.
Correspondingly, referring to fig. 4, when the heat dissipation contact surface of the heat sink 3 is an irregular plane for abutting against the heat generating devices 2, if the upper surfaces of all the heat generating devices 2 located on the front surface of the circuit board main body 1 are different planes, the heat sink 3 may abut against all the heat generating devices 2, that is, the heat dissipation contact surface 1 may abut against the upper surface of the heat generating device 2 located on the left side, and the heat dissipation contact surface 2 may abut against the upper surface of the heat generating device 2 located on the right side, so that heat dissipation operation on all the heat generating devices 2 disposed on the front surface of the circuit board main body 1 may be implemented.
It should be noted that, for the heat generating devices 2 disposed on the circuit board main body 1, a designer may flexibly configure or adjust specific numbers and specific structural features of the heat generating devices 2 according to specific application requirements or scene requirements, and after the heat generating devices 2 disposed on the circuit board main body 1 are determined, in order to ensure quality and efficiency of heat dissipation of the heat dissipating devices 2, a heat dissipation contact surface of the heat sink 3 may be configured based on specific structural features of the heat generating devices 2, so that the heat dissipation contact surface of the heat sink 3 may be ensured to contact as many heat generating devices 2 as possible, so that heat dissipation operation may be performed on more heat generating devices 2.
In addition, for the circuit board main body 1, since the front and the back of the circuit board main body 1 are both provided with the heat generating device 2, the configured heat sink 3 may perform a heat dissipating operation on at least part of the heat generating device 2 disposed on the front of the circuit board main body 1, and for the heat generating device 2 disposed on the back of the circuit board main body 1, in order to ensure the stable reliability of operation of the heat generating device 2 disposed on the back of the circuit board main body 1, a back plate 4 may be connected to the lower end of the circuit board main body 1, wherein the back plates 4 made of different materials may be installed and connected to the circuit board main body 1 in different manners, and in some examples, the back plate 4 may be an insulating plate, and the circuit board main body 1 at this time may be installed and connected to the back plate 4 through an insulating layer. Or in some examples, the back plate 4 may be a non-insulating plate, and in particular, the back plate 4 may be a metal plate, where in order to ensure that the heat dissipation element 5 located on the circuit board main body 1 can quickly and stably dissipate heat generated by the heat generating device 2, the heat conduction capability of the heat dissipation element 5 is higher than that of the back plate 4.
As for the heat sink 5 that may be provided on the back plate 4 for performing a heat radiating operation, the heat sink 5 may be implemented as a pipe structure composed of a heat conductive material or as a solid block structure composed of a heat conductive material, which may include at least one of: copper, iron, aluminum, etc., specifically, when the heat dissipation member 5 is implemented as a pipe structure made of a heat conductive material, the heat dissipation member 5 of the pipe structure may be embedded on the back plate 4, as shown in fig. 5, and in order to be able to improve heat dissipation quality and effect, the heat dissipation member 5 of the pipe structure is filled with a predetermined liquid, which may be implemented as water, hot oil, silicone oil, etc.
For the heat dissipation element 5 arranged on the back plate 4, the heat dissipation element 5 can be in contact with at least part of the heating device 2 disposed on the back surface of the circuit board main body 1, specifically, the heat dissipation element 5 can be in contact with at least part of the heating device 2 through the heat conduction element, and because the heat dissipation element 5 is arranged on the back plate 4, the heat dissipation element 5 and the heat radiator 3 can form at least one heat dissipation link, so that the heat dissipation element 5 can transmit heat to the heat radiator 3 for heat dissipation operation, and therefore heat dissipation quality and effect are effectively ensured.
On the other hand, the specific implementation manner in which the heat dissipation element 5 is disposed on the back plate 4 is not limited in this embodiment, for example: the heat sink 5 may be disposed on the back plate 4 by a connector or an adhesive, and at this time, the heat sink 5 may be fixedly disposed on the upper surface of the back plate 4. Further, since the back plate 4 is mounted and connected to the circuit board main body 1, it is preferable that the heat sink 5 is embedded in the back plate 4 and the upper surface of the heat sink 4 is flush with the upper surface of the back plate 4 in order to minimize the influence of the heat sink 5 on the mounting and connecting operation of the back plate 4 and the circuit board main body 1.
In the circuit board with the heat dissipation structure provided in this embodiment, when the heat generating devices 2 are disposed on the front side and the back side of the circuit board main body 1, at least part of the heat generating devices 2 on the front side of the circuit board main body 1 are subjected to heat dissipation operation by the heat sink 3, and at least part of the heat generating devices 2 disposed on the back side of the circuit board main body 1 are subjected to heat dissipation operation by the heat sink disposed on the back plate 4, since at least one heat dissipation link can be formed between the heat sink 5 and the heat sink 3, when the heat sink 5 is subjected to heat dissipation operation on at least part of the heat generating devices 2 disposed on the back side of the circuit board main body 1, heat can be transferred to the heat sink 3 disposed on the front side to perform heat dissipation operation, so that the heat dissipation quality and efficiency of the heat generating devices 2 disposed on the circuit board main body 1 are effectively ensured, and the stability and reliability of the circuit board are further ensured.
Fig. 6 is a schematic structural diagram of a circuit board with a heat dissipation structure according to an embodiment of the present utility model; on the basis of the above embodiment, referring to fig. 6, the present embodiment does not limit at least one heat dissipation link formed by the heat dissipation element 5 and the heat dissipation device 3, in some examples, the heat dissipation element 5 may contact the heat dissipation device 3 through the protruding end 501 provided, at this time, at least one protruding end 501 for connecting with the heat dissipation device 3 is provided on the heat dissipation element 5, and at least one protruding end 501 contacts the heat dissipation device 3 through the heat conduction element to form at least one heat dissipation link.
In addition, in order to ensure the normal operation of the circuit board, the size of the back plate 4 may be larger than the size of the circuit board main body 1, and in order to stably achieve that the heat dissipation member 5 may form a heat dissipation link with the heat sink 3 through the at least one protruding end 501, a preset gap may exist between the protruding end 501 and the circuit board main body 1, and the preset gap may refer to a gap existing between the edge of the protruding end 501 and the edge of the circuit board main body 1, that is, a distance between the edge of the protruding end 501 and the edge of the circuit board main body 1 may be larger than 0.
For the protruding ends 501 arranged on the heat dissipation element 5, the number of the protruding ends 501 can be one or more, and the protruding ends 501 can be integrally or fixedly connected with the heat dissipation element, so that in order to ensure the heat transfer effect, the protruding ends 501 can be contacted with the heat dissipation element 3 through the heat conduction element, thereby at least one heat dissipation link can be formed, specifically, when the number of the protruding ends 501 is more than one, the protruding ends 501 can be contacted with the heat dissipation element 3 through the heat conduction element, thereby forming a plurality of heat dissipation links, and the heat dissipation operation can be performed on the heat generation element 2 through the plurality of heat dissipation links, thereby effectively ensuring the heat dissipation quality and effect of the heat generation element 2 on the circuit board main body 1.
Fig. 7 is a schematic structural diagram of a circuit board with a heat dissipation structure according to an embodiment of the present utility model; on the basis of the above embodiment, referring to fig. 7, at least one heat dissipation link formed by the heat dissipation element 5 and the heat dissipation element 3 may be contacted with the heat dissipation element 3 not only through the protruding end 501 provided in the heat dissipation element 5 but also through the protruding end 301 provided in the heat dissipation element 3 to form at least one heat dissipation link, specifically, the heat dissipation element 3 includes at least one protruding end 301 for connecting with the heat dissipation element 5, the at least one protruding end 301 is contacted with the heat dissipation element 5 through the heat conduction element 6, and a predetermined gap exists between the protruding end 301 and the circuit board main body 1.
In order to ensure the normal operation of the circuit board, the size of the back plate 4 may be larger than the size of the circuit board main body 1, and in order to stably achieve that the heat dissipation element 5 may form a heat dissipation link with the heat sink 3 through at least one protruding end 301, a preset gap may exist between the protruding end 301 and the circuit board main body 1, and the preset gap may refer to a gap existing between an edge of the protruding end 301 and an edge of the circuit board main body 1, that is, a distance between an edge of the protruding end 301 and an edge of the circuit board main body 1 may be larger than 0.
For the protruding ends 301 arranged on the radiator 3, the number of the protruding ends 301 can be one or more, and the protruding ends 301 can be integrally or fixedly connected with the radiator 3, so that in order to ensure the heat transfer effect, the protruding ends 301 can be contacted with the radiator 3 through the heat conducting members 6, thereby forming at least one heat dissipation link, specifically, when the number of the protruding ends 301 is more than one, the protruding ends 301 can be respectively contacted with the radiator 3 through the heat conducting members 6, thereby forming a plurality of heat dissipation links, and the heat dissipation operation can be performed on the heat generating device 2 positioned on the back of the circuit board main body 1 through the plurality of heat dissipation links, so that the flexible diversity of the realization of the heat dissipation links is ensured, and the heat dissipation quality and effect of the heat generating device 2 on the circuit board main body 1 based on the heat dissipation links are effectively ensured.
Fig. 8 is a schematic structural diagram seventh of a circuit board with a heat dissipation structure according to an embodiment of the present utility model; on the basis of the above embodiment, referring to fig. 8, the heat dissipation link may be implemented not only by forming at least one heat dissipation link with the heat sink 3 by the protruding end provided on the heat sink 5 or forming at least one heat dissipation link with the heat sink 5 by the protruding end provided on the heat sink 3, but also by forming at least one heat dissipation link by the protruding end provided on the heat sink 5 and the heat sink 3, at which time, at least one first protruding end 501 is provided on the heat sink 5, the heat sink 3 includes at least one second protruding end 301 for contacting with the first protruding end 501, and the first protruding end 501 contacts with the second protruding end 301 through the heat conductive member 6 to form at least one heat dissipation link.
In order to ensure the flexible reliability of the heat dissipation link, the heat dissipation link may be realized by contacting the heat dissipation element 5 with the protruding end disposed on the heat dissipation element 3, contacting the heat dissipation element 3 with the protruding end disposed on the heat dissipation element 5, and contacting the second protruding end 301 disposed on the heat dissipation element 3 with the first protruding end 501 disposed on the heat dissipation element 5, where the first protruding end 501 may be integrally disposed with the heat dissipation element 5 or connected by a connecting element, similarly, the second protruding end 301 may be designed together with the heat dissipation element 3 or connected by a connecting element, so long as the first protruding end 501 may be ensured to be stably connected with the heat dissipation element 5, and the second protruding end 301 may be stably connected with the heat dissipation element 3, which is not described herein.
Specifically, for the heat dissipation element 5 disposed on the back plate 4, the structure and the number of the heat dissipation elements 5 may be flexibly configured according to the structural features between the back plate 4 and the circuit board main body 1, especially for the number of the protruding ends 501 disposed on the heat dissipation element 5, the number of the first protruding ends 501 disposed on the heat dissipation element 5 may be at least one, and corresponding, in order to enable the heat dissipation element 5 to form at least one heat dissipation link with the heat dissipation device 3, at least one second protruding end 301 for contacting with the first protruding ends 501 may be disposed on the heat dissipation device 3, that is, the number of the second protruding ends 301 may be the same as the number of the first protruding ends 501, and the contact surface of the second protruding ends 301 corresponds to the contact surface of the first protruding ends 501, so that not only the stable reliability of generating the at least one heat dissipation link may be ensured, but also the quality and the effect of dissipating heat to the heat generating device 2 based on the heat dissipation link may be ensured.
Fig. 9 is a schematic structural diagram eight of a circuit board with a heat dissipation structure according to an embodiment of the present utility model; on the basis of the above embodiment, referring to fig. 9, for the circuit board main body 1, since the rigidity of the circuit board main body 1 is relatively high, in order to avoid the situation that the circuit board main body 1 is damaged when the circuit board main body 1 is installed and connected, in order to ensure the safety degree of the circuit board main body 1 when the circuit board is installed and configured, the circuit board main body 1 may be fixed between the upper clamping plate 7 and the back plate 4, the upper clamping plate 7 is located between the circuit board main body 1 and the radiator 3, and the circuit board main body 1 is detachably mounted on the substrate (not shown) through the upper clamping plate 7 and the back plate 4, it should be noted that not only one circuit board main body 1 may be mounted on the substrate, but also a plurality of circuit board main bodies 1 may be mounted, and in particular, the number of the circuit board main bodies 1 disposed on the substrate may be flexibly configured and adjusted according to the application requirement or design requirement, so that an electronic device for realizing the preset function may be generated.
Fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present utility model; referring to fig. 10, the present embodiment provides an electronic device, which may include:
A substrate 200;
The circuit board 201 with heat dissipation function in the above embodiment has at least one circuit board 201, and the circuit board 201 is detachably mounted on the substrate 200.
The specific shape structure, implementation function and implementation effect of the circuit board 201 in this embodiment are similar to those of the circuit board in the above embodiment, and specific reference may be made to the above description, and details are not repeated here.
In the electronic device of the embodiment, the circuit board 201 with the heat dissipation function is configured on the substrate 200, so that the electronic device with the preset function can be realized, and the circuit board 2 has the heat dissipation structure, so that the running stability and reliability of the circuit board 201 are effectively ensured, the use safety and reliability of the electronic device are further improved, and the practicability of the electronic device is further improved.
In a specific application, referring to fig. 11, taking a heat pipe as a heat dissipation element 5 and taking a circuit board corresponding to an OCP acceleration unit (OCP Accelerator Module, abbreviated as OAM) corresponding to a parallel processing unit (Parallel Processing Unit, abbreviated as PPU) as a circuit board main body 1 as an example, the application embodiment provides a circuit board corresponding to an OAM module, and the provided circuit board, through embedding the heat pipe 5 in a structural back plate 4 of the OAM module, can transfer heat of a heating device 2 disposed in the back of the OAM circuit board to a top radiator 3 through the heat pipe 5, so that the problems of complex assembly and poor maintainability of a conventional back side heat dissipation scheme can be solved. Specifically, the circuit board may include:
An OAM wiring board body 1, wherein a heating device 2 is disposed on both the front and back sides of the OAM wiring board body 1, and the OAM wiring board body 1 is fixed between an upper clamping plate (not shown in the figure) and a back plate 4;
The radiator 3 is positioned at the upper end of the front surface of the OAM circuit board main body 1, is abutted with the heating device 2 arranged on the front surface of the circuit board main body 1 through a heat conducting material and is used for radiating the heating device 2;
The backboard 4 is detachably connected with the circuit board main body 1, the heat pipe 5 is embedded in the backboard 4, the upper surface of the heat pipe 5 and the upper surface of the backboard 4 are in the same plane, the heat pipe 5 is abutted against at least part of the heating device 2 arranged on the back of the circuit board main body 1, the length, the shape and the path of the heat pipe 5 can be flexibly adjusted according to the specific structure and the layout of the components on the OAM circuit board main body 1, and at least one heat dissipation link is formed between the heat dissipation piece 5 and the heat radiator 3, so that the heat dissipation piece 5 transmits heat to the heat radiator 3 for heat dissipation.
The substrate 8, the OAM wiring board body 1 is mounted on the substrate 8 through the back plate 4, and at least one OAM wiring board body 1 is disposed on the substrate 8 to realize a predetermined function.
It should be noted that, the contact position or contact surface between the heat pipe on the back plate 4 and the top radiator 3 may be flexibly set or adjusted according to the structural space of the components on the circuit board main body 1 and the heat dissipation requirement, in some examples, the heat pipe may be designed at any one or more of four ends of the circuit board main body 1, and the heat pipe may be made of other materials with strong thermal conductivity, for example: copper blocks, aluminum blocks and the like, and the boss structure contacted by the heat pipe 5 and the radiator 3 can be a boss structure on the radiator 3 or a boss structure of the heat pipe 5 on the backboard, so that the flexible reliability of the circuit board design is ensured.
The circuit board provided by the embodiment of the application can conduct the heat of the bottom heating device 2 of the circuit board main body 1 to the radiator 3 on the top surface to radiate through the heat pipe 5 or other high-heat metal materials embedded in the back plate 4, the radiating scheme is simple and reliable, the top radiating scheme is adopted, the radiating quality is high-efficient, meanwhile, the radiating structure, the base plate and the back plate are decoupled from each other, so that the base plate is not required to be grooved, the maintenance is convenient, the heat conducting material is not required to be replaced when the components are replaced and maintained, the subsequent maintainability is good, the flexible reliability of the circuit board is effectively ensured, and the practicability of the circuit board is further ensured.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (14)
1. The utility model provides a circuit board with heat radiation structure which characterized in that includes:
The circuit board comprises a circuit board main body, wherein heating devices are arranged on the front surface and the back surface of the circuit board main body;
The radiator is contacted with at least part of heating devices arranged on the front surface of the circuit board main body and is used for radiating the heating devices;
The backboard is connected with the circuit board main body, a heat dissipation piece is arranged on the backboard, the heat dissipation piece is in contact with at least part of heating devices arranged on the back surface of the circuit board main body, and the heat dissipation piece and the radiator form at least one heat dissipation link so that the heat dissipation piece can transmit heat to the radiator to dissipate heat.
2. The circuit board of claim 1, wherein,
The heat dissipation piece is embedded on the backboard, and the upper surface of the heat dissipation piece and the upper surface of the backboard are in the same plane.
3. The circuit board of claim 1, wherein the heat sink is in contact with at least a portion of the heat generating devices disposed on the front surface of the circuit board body via a heat conductive member.
4. The circuit board of claim 1, wherein the heat sink is provided with at least one protruding end for connection to the heat sink, the at least one protruding end being in contact with the heat sink via a heat conducting member to form at least one heat dissipating link.
5. The circuit board of claim 4, wherein the back plate has a size greater than the size of the circuit board body, and wherein a predetermined gap exists between the protruding end and the circuit board body.
6. The circuit board of claim 1, wherein the heat sink comprises at least one protruding end for connection with the heat sink, the at least one protruding end is in contact with the heat sink through a heat conducting member, and a predetermined gap exists between the protruding end and the circuit board body.
7. The circuit board of claim 1, wherein the heat sink has at least one first bump end disposed thereon, the heat sink having at least one second bump end for contacting the first bump end, the first bump end contacting the second bump end through a heat conductive member to form at least one heat sink link.
8. The circuit board of any one of claims 1-7, wherein the back plate is an insulating plate, and the circuit board body is mounted and connected to the back plate through an insulating layer.
9. The circuit board of any one of claims 1-7, wherein the back plate is a non-insulating plate and the heat sink has a higher heat transfer capability than the back plate.
10. The circuit board of any one of claims 1-7, wherein the heat sink is a conduit structure comprised of a thermally conductive material.
11. The circuit board of claim 10, wherein the conduit structure is filled with a predetermined liquid.
12. The circuit board of any one of claims 1-7, wherein the heat sink is mounted to the front upper end of the circuit board body by a detachable connector.
13. The circuit board of any one of claims 1-7, wherein,
The circuit board main body is fixed between the upper clamping plate and the back plate, the upper clamping plate is positioned between the circuit board main body and the radiator, and the circuit board main body is detachably arranged on the substrate through the upper clamping plate and the back plate.
14. An electronic device, comprising:
a substrate;
The wiring board with a heat dissipation structure as defined in any one of claims 1 to 13, wherein the number of the wiring boards is at least one, and the wiring boards are detachably mounted on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420046403.9U CN221748644U (en) | 2024-01-08 | 2024-01-08 | Circuit board and electronic device with heat dissipation structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420046403.9U CN221748644U (en) | 2024-01-08 | 2024-01-08 | Circuit board and electronic device with heat dissipation structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250008698A1 (en) * | 2023-06-30 | 2025-01-02 | Advanced Micro Devices, Inc. | Systems and methods for server level cooling |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250008698A1 (en) * | 2023-06-30 | 2025-01-02 | Advanced Micro Devices, Inc. | Systems and methods for server level cooling |
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